JP2001272636A - Laser beam machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser beam machining device using the Fourier transform capable of applying processing by cutting zero-order light and projecting only a desired optical image to a target. SOLUTION: The laser beam machining device 10 is provided with a space optical modulator 20, a hologram pattern writing means 40 for writing a hologram pattern in the space optical modulator 20, a projection means 50 for being made incident readout light on the space optical modulator 20, a Fourier lens 60 for performing the Fourier transform of the readout light in which phase modulation is performed by the reflection type space optical modulator 20 and a shielding means 70 for cutting zero-order light placed on the optical path of the readout light from the Fourier lens 60 to a target T.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing apparatus using a Fourier transform for performing a Fourier transform on light phase-modulated by a spatial light modulator and irradiating an obtained optical image to a target for processing.

[0002]

2. Description of the Related Art There are two types of spatial light modulators widely used in laser processing devices, such as an intensity modulation type and a phase modulation type. Particularly in the fields of optical information processing and hologram processing, the latter phase modulation type is used. Is promising. This is because, unlike the intensity modulation type, the phase modulation type spatial light modulator can increase the light use efficiency.

[0003] As a laser processing apparatus using the phase modulation type spatial light modulator, there is an optical marking apparatus disclosed in, for example, Japanese Patent Application Laid-Open No. 6-2080888. In this optical marking device, a phase distribution is displayed on a spatial light modulator, a laser beam is projected, the laser beam is phase-modulated according to the phase distribution, and the modulated light is Fourier-transformed by a Fourier lens, and a predetermined optical signal is applied to the surface of the sample. A desired pattern is stamped by forming and reproducing an image.
As described above, in this marking device, the use efficiency of light is increased by using the Fourier transform.

[0004]

However, when the laser light is phase-modulated by a phase distribution or the like and the modulated light is subjected to Fourier transform, a zero-order light appears on the Fourier surface in addition to a desired pattern. In addition to the desired pattern, the processed surface is also irradiated with zero-order light, and there is a problem that an unintended part is also processed at the same time.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a laser processing apparatus using Fourier transform capable of cutting a zero-order light and irradiating a target with only a desired optical image for processing.

[0006]

According to the present invention, there is provided a laser processing apparatus comprising: a spatial light modulator; hologram pattern writing means for writing a hologram pattern on the spatial light modulator; and read light incident on the spatial light modulator. , A Fourier lens for Fourier-transforming the read light phase-modulated by the spatial light modulator, and for cutting the zero-order light arranged on the optical path of the read light from the Fourier lens to the target. And a shielding means.

[0007] In this laser processing apparatus, the reading light incident on the spatial light modulator is phase-modulated by the hologram pattern. Then, the phase-modulated readout light is Fourier-transformed by a Fourier lens. Then, a desired optical image and zero-order light are formed. At this time, since the shielding means for cutting the zero-order light is arranged on the optical path of the reading light from the Fourier lens to the target,
The zero-order light is cut by the shielding means, and the target is irradiated with only a desired optical image and processed.

Further, the laser processing apparatus of the present invention has a spatial light modulator, hologram pattern writing means for writing a hologram pattern on the spatial light modulator, and a light projecting device for inputting read light to the spatial light modulator. Means, a Fourier lens for Fourier-transforming the readout light phase-modulated by the spatial light modulator, an imaging lens for imaging the readout light Fourier-transformed by the Fourier lens on a predetermined surface of the target, And shielding means for cutting the zero-order light arranged on the optical path of the read light from the lens to the imaging lens.

In this laser processing apparatus, the readout light incident on the spatial light modulator is phase-modulated by the hologram pattern. Then, the phase-modulated readout light is Fourier-transformed by a Fourier lens, and a desired optical image and zero-order light are formed. Then, after the 0th-order light is cut off by the shielding means, only a desired optical image is irradiated on a predetermined surface of the target by the imaging lens to be processed.

Further, the laser processing apparatus of the present invention further comprises an object shape recognizing means for acquiring three-dimensional information of the target, and the hologram pattern writing means comprises a three-dimensional object of the target acquired by the object shape recognizing means. It may have a structure capable of generating a hologram pattern matching the shape of the target based on the information. With this configuration, the hologram pattern writing unit can generate a hologram pattern for forming a three-dimensional pattern so as to match the shape of the target based on the three-dimensional information of the target acquired by the object shape recognition unit. Therefore, the possibility that the target is irradiated with the distorted pattern is reduced, and more accurate processing can be performed.

Further, the laser processing apparatus of the present invention further comprises an object position recognizing means for acquiring the position information of the target, and the hologram pattern writing means comprises a means for adding the position information of the target acquired by the object position recognizing means. A hologram pattern that matches the position of the target based on the hologram pattern. With this configuration, even when the position of the target to be processed is shifted from the desired position, the hologram pattern writing unit matches the target position based on the target position information acquired by the object position recognition unit. Since a hologram pattern can be generated, accurate processing can be performed without depending on a change in the position of the target.

[0012]

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the same components are denoted by the same reference numerals, and redundant description will be omitted. (First Embodiment) FIG. 1 is a plan view schematically showing a configuration of a laser processing apparatus 10 according to a first embodiment of the present invention.

As shown in the figure, a laser processing apparatus 10 is a reflection type spatial light modulator (SLM) 20, a hologram pattern writing means 40, a light projecting means 50, a Fourier lens 60, and a device for cutting zero-order light. 0th-order light shielding plate 70
And

The SLM 20 is a phase modulation type spatial light modulator using a parallel alignment nematic liquid crystal as a light modulation material. As shown in FIG. 2, the SLM 20 has an AR coating 21 on the incident surface of the writing light for preventing unnecessary reflection of the writing light.
Is provided with a glass substrate 22 which has been subjected to. A photoconductive layer 24 made of amorphous silicon (a-Si) whose resistance changes according to the intensity of the incident light via the ITO 23 is provided on a surface opposite to the incident surface of the glass substrate 22, and a dielectric multilayer. A mirror layer 25 made of a film is laminated.

The SLM 20 further includes a glass substrate 27 having an AR coating 26 formed on the read light incident surface. An ITO 28 is laminated on the surface of the glass substrate 27 opposite to the incident surface, and alignment layers 29 and 30 are provided on the mirror layer 25 and the ITO 28, respectively. Then, these alignment layers 29, 30
Are connected to each other via a frame-shaped spacer 31,
The light modulating layer 32 is formed by filling a nematic liquid crystal in the frame of the spacer 31 and providing a liquid crystal layer. This alignment layer 2
According to 9 and 30, the nematic liquid crystal in the light modulation layer 32 is aligned parallel or perpendicular to the surface of the alignment layers 29 and 30. A drive device 33 for applying a predetermined voltage is connected between the two ITOs 23 and 28.

As shown in FIG. 1, a hologram pattern writing means 40 is disposed on the side of the SLM 20 having the above-described structure on which writing light is incident.

The hologram pattern writing means 40
A light source 41 for emitting writing light, a transmission type liquid crystal television 42 for displaying an image of the writing light, a writing electric signal generator 43 for controlling image display on the transmission type liquid crystal television 42, An imaging lens 44 for imaging an image signal included in the writing light on the photoconductive layer 24 of the SLM 20 is provided.

The electric signal generator 43 for writing obtains a hologram pattern which reproduces an optical image to be actually irradiated onto the sample T when the Fourier transform is performed, and displays the hologram pattern on the liquid crystal television 42. Alternatively, the writing electric signal generator 43 may call out hologram pattern data for a desired optical image created in advance and stored in storage means such as a memory, and display the data on the liquid crystal television 42. In this way, the writing electrical signal generator 43 can display the hologram pattern on the liquid crystal television 42 only by reading the data of the hologram pattern stored in the storage means. That is,
Since the trouble of creating a hologram pattern from a desired optical image can be omitted, it is possible to rewrite the hologram pattern in the reflective spatial light modulator 20 at a video rate.

On the other hand, on the side of the SLM 20 on which the readout light is incident, a light projecting means 50 is arranged on an optical axis inclined by an angle θ with respect to the normal in the normal to the incident surface. Note that the normal surface refers to a surface that includes any of the incident optical axis, the reflected optical axis, and the normal line of the mirror when the linearly polarized light enters the mirror and is reflected.

The light projecting means 50 includes a laser light source 51 for emitting readout light, a lens 52 for expanding readout light emitted from the laser light source 51, and adjusting the expanded readout light to parallel light. And a collimating lens 53.

A Fourier lens 60 for Fourier transforming the read light phase-modulated by the hologram pattern is disposed on the reflected light path of the read light.

Here, the laser processing apparatus 10 according to the present embodiment is provided with a zero-order light shielding plate 70 for cutting the zero-order light on the optical path of the reading light from the Fourier lens 60 to the sample T. There is a feature in the point.

That is, in the laser processing apparatus 10 according to the present embodiment, the phase modulation is performed on the optical path of the readout light from the Fourier lens 60 to the sample T and immediately before the sample T as shown in FIGS. A 0th-order light shielding plate 70 for cutting the 0th-order light generated as a result of Fourier transform of the readout light is arranged. As shown in FIG.
Since the next-order light appears at a fixed position, the zero-order light shielding plate 70 is arranged as shown in FIG.
As shown in (b), it is arranged and fixed so as to cover only that part.

The material and structure of the zero-order light shielding plate 70 can be arbitrarily determined as long as it can shield the zero-order light. For example, the zero-order light shielding plate 70 may be formed of an iron plate, or may be formed by depositing a metal on a glass plate.

Next, the operation of the laser processing apparatus 10 will be described.

First, when an optical image to be actually irradiated and processed on the sample T is input to the electric signal generator 43 for writing, the hologram pattern corresponding to the desired optical image is obtained in the electric signal generator 43 for writing. And
The hologram pattern is displayed on the liquid crystal television 42.

Next, the writing light is emitted from the light source 41 on the writing light side toward the liquid crystal television 42. Then, the image information of the hologram pattern is written into the writing light when passing through the liquid crystal television 42. The writing light having this image information is imaged on the photoconductive layer 24 of the SLM 20 by the imaging lens 44. Both ITO23 of SLM20,
An AC voltage of several volts is applied by the driving device 33 during the period 28, but the electrical impedance of the photoconductive layer 24 changes depending on the pixel position depending on the image written on the photoconductive layer 24. As a result, the voltage division of the voltage applied to the light modulation layer 32 differs depending on the pixel position.

On the other hand, a linearly polarized readout light is emitted from the laser light source 51. Then, the reading light is transmitted through the lens 52,
The light is adjusted to a parallel light by the collimating lens 53. At this time, the light is incident on the light modulation layer 32 of the SLM 20 as P-polarized light. As described above, since the voltage division of the voltage applied to the light modulation layer 32 differs depending on the pixel position, the inclination of the liquid crystal molecules changes according to this voltage. At this time, the orientation direction of the liquid crystal molecules changes within the normal plane. As a result, the refractive index of the light modulation layer 32 changes depending on the pixel position. Light modulation layer 3
The read light incident on the light source 2 is phase-modulated by the change in the refractive index, reflected by the mirror layer 25, and output again from the incident surface.

Then, the phase-modulated readout light is Fourier-transformed by the Fourier lens 60, a desired optical image is formed and reproduced, and a predetermined portion of the sample T is irradiated. At this time, since the zero-order light shielding plate 70 is disposed immediately before the sample T, the zero-order light generated as a result of Fourier transform of the readout light is shielded by the shielding plate 70. As a result, only the portion of the sample surface irradiated with the desired optical image is evaporated or deteriorated by heat to be processed into a desired pattern, and it is possible to prevent a zero-order light from processing an unintended portion.

As described above, the laser processing apparatus 10 according to the present embodiment includes the zero-order light shielding plate 70 for cutting the zero-order light arranged on the optical path of the readout light from the Fourier lens 60 to the sample T. With this configuration, it is possible to cut out the zero-order light generated as a result of Fourier transform of the readout light phase-modulated by the SLM 20, and irradiate only a desired optical image to the sample T, and an unintended part is generated by the zero-order light. Processing can be prevented. (Second Embodiment) Hereinafter, a laser processing apparatus according to a second embodiment of the present invention will be described with reference to FIG.

In the present embodiment, the S
The laser processing device 10 is configured using the LM 20.
The writing electric signal transmitter (hologram pattern writing means) 43 has a configuration for writing a hologram pattern directly on the SLM 20. Thus, in this embodiment, since the laser processing apparatus 10 is configured using the transmission type SLM 20, the light projecting means 50, the SLM 2
The zero, the Fourier lens 60, the zero-order light shielding plate 70, and the sample T are arranged on the same optical axis.

As described above, also in the laser processing apparatus 10 according to the present embodiment having the transmissive SLM 20, the zero-order light shielding plate 70 disposed on the optical path of the output light from the Fourier lens 60 to the sample T is provided. SLM2
The zero-order light generated as a result of Fourier transform of the light phase-modulated at 0 can be cut, and only the desired optical image is irradiated on the sample T to prevent unintended portions from being processed by the zero-order light. can do. (Third Embodiment) Hereinafter, a laser processing apparatus according to a third embodiment of the present invention will be described with reference to FIG. The same elements as those described in the first embodiment are denoted by the same reference numerals, and redundant description will be omitted.

The laser processing apparatus 10 according to the present embodiment
Further comprises an imaging lens 80 for forming an image of the readout light Fourier-transformed by the Fourier lens 60 on a predetermined surface of the sample T, and a zero-order light beam on the optical path of the readout light from the Fourier lens 60 to the imaging lens 80. The difference from the first embodiment is that a zero-order light shielding plate 70 for cutting light is arranged.

That is, in the first embodiment, the readout light is Fourier-transformed by the Fourier lens 60 to directly form a desired optical image and the 0th-order light on a predetermined surface of the sample T, and the 0th-order light is formed. The light was shielded by a zero-order light shielding plate 70 disposed immediately before the sample T. On the other hand, in the present embodiment, the readout light subjected to the Fourier transform by the Fourier lens 60 is once formed into an image, the 0th-order light is removed by the 0th-order light shielding plate 70, and the desired image is formed on the predetermined surface of the sample T by the imaging lens 80. Irradiates only the optical image. Here, since the zero-order light appears at a fixed position, the zero-order light shielding plate 70 is connected to the Fourier lens 6.
At the focal position of the readout light that has been Fourier-transformed by 0, it is preferable that the position is preliminarily adjusted and fixed so as to block only the portion where the 0th-order light appears.

As described above, the laser processing apparatus 10 according to the present embodiment is provided with the imaging lens 80 for imaging the read-out light Fourier-transformed by the Fourier lens 60 on a predetermined surface of the sample T. Since the 0th-order light shielding plate 70 for cutting the 0th-order light is arranged on the optical path of the readout light from the lens to the imaging lens 80,
The zero-order light generated as a result of Fourier-transforming the read-out light phase-modulated by the SLM 20 can be cut, and the sample T is irradiated with only a desired optical image to process an unintended part by the zero-order light. Can be prevented.

In particular, in this embodiment, since the zero-order light shielding plate 70 is previously positioned and fixed on the optical path of the readout light from the Fourier lens 60 to the imaging lens 80,
The setting operation of the apparatus 10 can be simplified as compared with the case where the positioning is performed immediately before the sample T and fixed. (Fourth Embodiment) Hereinafter, a laser processing apparatus according to a fourth embodiment of the present invention will be described with reference to FIG.

In the present embodiment, the S
The laser processing device 10 is configured using the LM 20.
The writing electric signal transmitter (hologram pattern writing means) 43 has a configuration for writing a hologram pattern directly on the SLM 20. Thus, in this embodiment, since the laser processing apparatus 10 is configured using the transmission type SLM 20, the light projecting means 50, the SLM 2
The zero, the Fourier lens 60, the zero-order light shielding plate 70, and the sample T are arranged on the same optical axis.

Further, the laser processing apparatus 10 according to the present embodiment further includes an imaging lens 80 for imaging the output light Fourier-transformed by the Fourier lens 60 on a predetermined surface of the sample T. The second embodiment differs from the second embodiment in that a zero-order light shielding plate 70 for cutting the zero-order light is arranged on the optical path of the output light reaching the imaging lens 80.

That is, in the second embodiment, the output light is Fourier-transformed by the Fourier lens 60 to directly form a desired optical image and zero-order light on a predetermined surface of the sample T. The light was shielded by a zero-order light shielding plate 70 disposed immediately before T. On the other hand, in the present embodiment, the output light subjected to the Fourier transform by the Fourier lens 60 is once formed into an image, the 0th-order light is removed by the 0th-order light shielding plate 70, and then the desired image is formed on the predetermined surface of the sample T by the imaging lens 80. Irradiates only the optical image. Here, since the zero-order light appears at the fixed position, the zero-order light shielding plate 70 is pre-aligned so as to shield only the part where the zero-order light appears at the focal position of the output light Fourier-transformed by the Fourier lens 60. It is preferable to fix it.

As described above, the laser processing apparatus 10 according to the present embodiment also includes the zero-order light shielding plate 70 disposed on the optical path of the output light from the Fourier lens 60 to the imaging lens 80. The zero-order light generated as a result of performing the Fourier transform on the light that has been phase-modulated by the SLM 20 can be cut, and the sample T is irradiated with only a desired optical image and
Processing of an unintended part by the next light can be prevented.

In the present embodiment, the zero-order light shielding plate 70 is preliminarily positioned and fixed on the optical path of the output light from the Fourier lens 60 to the imaging lens 80. The setting operation of the apparatus can be simplified as compared with the case where the positioning is performed and fixed. (Fifth Embodiment) Next, a fifth embodiment of the laser processing apparatus according to the present invention will be described with reference to FIG.

In the laser processing apparatus according to the first embodiment described above, a case has been described in which a desired pattern is formed on the surface of a sample T placed at a desired position.
The installation position of the sample T is not always fixed.
If the pattern is presumed to be placed at the desired position and the pattern is irradiated on the sample T when the setting position of the sample T is shifted from the desired position, the pattern is enlarged, reduced, It may be deformed or the like, resulting in a decrease in processing accuracy.

The laser processing apparatus 10 according to the present embodiment
In view of such a problem, an object position recognizing means for acquiring position information of the sample T is further provided as shown in FIG. This object position recognizing means includes a laser distance measuring device 90 having therein a light emitting element 92 such as a semiconductor laser and a light receiving element 94 such as a photodiode. The laser distance measuring device 90 emits laser light from the light emitting element 92 toward the target T, receives the reflected light with the light receiving element 94, and measures the position (distance) of the target. This laser distance measuring device 90 is connected to the electric signal generator 43 for writing.

In this laser processing apparatus 10, the position information of the target T measured by the laser distance measuring apparatus 90 is as follows:
It is sent to the electric signal generator 43 for writing. Then, when an optical image to be actually irradiated and processed on the sample T is input to the writing electric signal generator 43, the writing electric signal generator 43 corresponds to the desired optical image based on the position of the sample T. Hologram pattern is required,
The hologram pattern is displayed on the liquid crystal television 42.

Next, when writing light is emitted from the light source 41 on the writing light side toward the liquid crystal television 42, image information of a hologram pattern is written into the writing light when passing through the liquid crystal television 42. The writing light having this image information is imaged on the photoconductive layer 24 of the SLM 20 by the imaging lens 44.

On the other hand, readout light of linearly polarized light is emitted from the laser light source 51. Then, the reading light is transmitted through the lens 52,
The light is adjusted to a parallel light by the collimating lens 53. At this time, the light is incident on the light modulation layer 32 of the SLM 20 as P-polarized light. The read light that has entered the light modulation layer 32 is phase-modulated by the hologram pattern, reflected by the mirror layer 25, and output again from the incident surface.

The phase-modulated readout light is Fourier-transformed by the Fourier lens 60 to form an image, so that the sample T is irradiated with a desired optical image that matches the position of the sample T. As a result, the portion of the sample surface irradiated with the laser beam is evaporated or deteriorated by heat and processed into a desired pattern.

As described above, since the laser processing apparatus 10 according to the present embodiment is provided with the object position recognizing means for acquiring the position information of the sample T, a pattern matching the position of the sample T can be generated. Thus, accurate processing can be performed without depending on a change in the position of the sample T.

The laser distance measuring device 90 as the object position recognizing means includes a laser processing device 10 according to the second embodiment shown in FIG. 4, a laser processing device 10 according to the third embodiment shown in FIG. 6 can be applied to the laser processing apparatus 10 according to the fourth embodiment shown in FIG. 6, which makes it possible to generate a pattern that matches the position of the sample T, and depends on the change in the position of the sample T. It is possible to perform accurate machining without any trouble. (Sixth Embodiment) Next, a sixth embodiment of the laser processing apparatus according to the present invention will be described with reference to FIG.

In the above-described embodiment, the planar sample T
Although the case where a desired pattern is formed on the processed surface has been described, the processed surface of the sample T is not always flat. If the processing surface of the sample T having a three-dimensional shape is irradiated with a pattern assuming a flat surface, the pattern is
There is a possibility that distortion may occur in accordance with the unevenness of the processing surface, thereby lowering the processing accuracy.

The laser processing apparatus 10 according to the present embodiment
In view of such a problem, an object shape recognizing means for acquiring three-dimensional information of the sample T is further provided as shown in FIG. This object shape recognizing means is provided with two imaging devices 100 and 102 each capable of capturing an image of the sample T.
These imaging devices 100 and 102 are arranged in a substantially symmetrical positional relationship with respect to the optical axis from the imaging lens 80 to the sample T, and are connected to the electric signal generator 43 for writing.

In this laser processing apparatus 10, the imaging device 1
The stereo images of the sample T captured by 00 and 102 are sent to the electrical signal generator 43 for writing. Then, a correspondence between pixels is obtained between images captured by the pair of imaging devices 100 and 102, and a pixel shift amount of a corresponding point is calculated.
That is, the parallax is calculated, and the distance to the target is calculated using triangulation. In this way, three-dimensional information such as the unevenness of the sample T is calculated, and the three-dimensional shape of the sample T is recognized. In the laser processing device 10 according to the present embodiment, the imaging devices 100 and 102 as object shape recognition means.
Can also obtain the position information of the target T,
The imaging devices 100 and 102 also function as object position recognition means.

When an optical image to be actually illuminated and processed on the sample T is input to the writing electric signal generator 43, the writing electric signal generator 43 determines the desired image based on the three-dimensional shape of the sample T. Is obtained, and the hologram pattern is displayed on the liquid crystal television 42.

Next, when the writing light is emitted from the light source 41 on the writing light side toward the liquid crystal television 42, the hologram pattern image information is written into the writing light when passing through the liquid crystal television 42. The writing light having this image information is imaged on the photoconductive layer 24 of the SLM 20 by the imaging lens 44.

On the other hand, linearly polarized read light is emitted from the laser light source 51. Then, the reading light is transmitted through the lens 52,
The light is adjusted to a parallel light by the collimating lens 53. At this time, the light is incident on the light modulation layer 32 of the SLM 20 as P-polarized light. The read light that has entered the light modulation layer 32 is phase-modulated by the hologram pattern, reflected by the mirror layer 25, and output again from the incident surface.

Then, the phase-modulated readout light is Fourier-transformed by the Fourier lens 60, and the zero-order light shielding plate 7
After the zero-order light is removed by 0, an image is formed by the imaging lens 80, and a three-dimensional surface of the sample T is irradiated with a desired optical image conforming to the shape of the sample T. As a result, the portion of the sample surface irradiated with the laser beam is evaporated or deteriorated by heat and processed into a desired pattern.

As described above, since the laser processing apparatus 10 according to the present embodiment is provided with the object shape recognizing means for acquiring the three-dimensional information of the sample T, it is possible to generate a pattern matching the shape of the sample T. This makes it possible to suppress distortion of the irradiated pattern on the surface of the sample T, thereby suppressing a reduction in processing accuracy.

The imaging devices 100 and 102 as the object shape recognizing means include the laser processing device 10 according to the first embodiment shown in FIG. 1, the laser processing device 10 according to the second embodiment shown in FIG. 6 can be applied to the laser processing apparatus 10 according to the fourth embodiment shown in FIG. 6, thereby making it possible to generate a pattern that matches the shape of the sample T. It is possible to suppress distortion and suppress a decrease in processing accuracy.

[0059]

According to the laser processing apparatus of the present invention, since the zero-order light resulting from the Fourier transform of the read light phase-modulated by the spatial light modulator can be cut by the shielding means, the target It is possible to perform processing by irradiating only a desired optical image, and it is possible to prevent an unintended part from being processed by zero-order light.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a configuration of a laser processing apparatus according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a configuration of a spatial light modulator.

FIG. 3 shows the arrangement of a zero-order light shielding plate, and FIG.
FIG. 3B is a front view showing a state before the zero-order light shielding plate is arranged, and FIG. 3B is a front view showing a state after the zero-order light shielding plate is arranged.

FIG. 4 is a plan view schematically showing a configuration of a laser processing apparatus according to a second embodiment.

FIG. 5 is a plan view schematically showing a configuration of a laser processing apparatus according to a third embodiment.

FIG. 6 is a plan view schematically showing a configuration of a laser processing apparatus according to a fourth embodiment.

FIG. 7 is a plan view schematically showing a configuration of a laser processing apparatus according to a fifth embodiment.

FIG. 8 is a plan view schematically showing a configuration of a laser processing apparatus according to a sixth embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 ... Laser processing apparatus, 20 ... Spatial light modulator, 40 ... Hologram pattern writing means, 50 ... Light emitting means, 60
... Fourier lens, 70 ... 0th-order light shielding plate, 80 ... Imaging lens, 90 ... Laser ranging device, 100,102 ... Imaging device, T ... Sample.

Continued on the front page (51) Int.Cl. ⁷ Identification FI FI Theme Court II (Reference) H01S 3/00 H01S 3/00 B (72) Inventor Tsutomu Hara 1126 No. 1-cho, Hamamatsu-shi, Hamamatsu-shi, Shizuoka Pref. Within the company (72) Inventor Teruo Hiruma 1126 Nomachi, Hamamatsu City, Shizuoka Prefecture 1 Hamamatsu Photonics Co., Ltd.

Claims (4)

[Claims] A spatial light modulator; a hologram pattern writing unit for writing a hologram pattern on the spatial light modulator; a light projecting unit for inputting read light to the spatial light modulator; A Fourier lens for Fourier-transforming the readout light phase-modulated by a modulator, and a shielding unit for cutting a zero-order light arranged on an optical path of the readout light from the Fourier lens to a target. A laser processing apparatus, comprising: 2. a spatial light modulator; hologram pattern writing means for writing a hologram pattern on the spatial light modulator; light projecting means for causing read light to enter the spatial light modulator; A Fourier lens for Fourier-transforming the readout light phase-modulated by a modulator; an imaging lens for forming an image of the readout light Fourier-transformed by the Fourier lens on a predetermined surface of a target; and the Fourier lens. And a shielding means for cutting the zero-order light disposed on the optical path of the readout light from the light source to the imaging lens. 3. An object shape recognizing unit for acquiring three-dimensional information of the target, wherein the hologram pattern writing unit is configured to execute the target based on the three-dimensional information of the target acquired by the object shape recognizing unit. 3. The laser processing apparatus according to claim 1, wherein the laser processing apparatus has a structure capable of generating a hologram pattern matching the shape of the laser processing apparatus. 4. The apparatus according to claim 1, further comprising: an object position recognizing unit for obtaining the target position information, wherein the hologram pattern writing unit is configured to detect the position of the target based on the position information of the target obtained by the object position recognizing unit. The laser processing apparatus according to any one of claims 1 to 3, wherein the laser processing apparatus has a structure capable of generating a hologram pattern conforming to (1).