JP2001267175A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component of the structure in which a resin sleeve is not damaged during conveying of the component. SOLUTION: The electronic component 1 comprises a component element 2 contained in a sheathing case 6 made of a metal and lead wires 4 each covered with a heat shrinkable resin sleeve in the case 6. In this case, ends of the wires 4 are each formed with a curved surface not having a sharp corner. Since the end of the wire 4 is formed with the curved surface not having the sharp corner, the end of the wire 4 does not damage the sleeve of another electronic component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of an electronic component having a lead wire, and more particularly to a structure of a lead wire.

[0002]

2. Description of the Related Art An electronic component having a lead wire is, for example, an electrolytic capacitor. The structure of this electrolytic capacitor is as follows.

As shown in FIG. 2, a capacitor element 2 is
It is formed by winding an anode foil and a cathode foil through a separator to form a cylindrical shape. An electrode tab 3 is connected to each electrode foil, and is led out from one winding end face of the capacitor element 2. The electrode tab 3 has a continuous flat plate portion and a round bar portion. The flat plate portion is connected to the electrode foil, and the round bar portion is led out of the capacitor element 2. The lead wire 4 is further welded to this round bar portion.

The capacitor element 2 is housed together with a sealing body 5 made of an elastic member in a bottomed cylindrical outer case 6 made of metal such as aluminum, and the outer case 6 is sealed by caulking the open end. .

[0005] A resin sleeve 7 is coated on the outer case 6 for displaying the polarity and rating of the electrolytic capacitor 1 and for insulating the outer case 6. Generally, a heat-shrinkable resin sleeve 7 is often used. The coating process is as follows. That is, the electrolytic capacitor 1
Is cut into a predetermined length, and the cut resin sleeve 7 is coated on the main body of the electrolytic capacitor 1 and then heated to shrink the resin sleeve 7. Thus, the electrolytic capacitor 1 is in close contact with the main body.

[0006]

In a process of manufacturing an electronic component having a lead such as an electrolytic capacitor, the lead is supplied as a linear continuous body 10. When used as the lead wire 4, the linear continuum 10 is cut into a predetermined length for use. As the cutting method,
As shown in FIGS. 3A and 3B, the cutting jig 11 is cut into a predetermined length by abutting from one side or both sides. At this time, the cut lead wire 4 is crushed by a cutting jig 11, and FIG. 3C shows a side view of the lead wire viewed from the side, and FIG. 3D shows a top view of the lead wire viewed from above. As shown in the figure, the tip portion is formed to have a corner portion 12. Then, even after completion as an electronic component using the lead wire 4, the end of the lead wire 4 has a corner 9.

An electronic component having such a lead wire is
In some cases, several to about ten or more pieces are stored in one bag and transported. At this time, the electronic components are in a state of being in random contact with each other. For this reason, the tip of the lead wire may come into contact with the resin sleeve of another electronic component, and the contact may damage the resin sleeve.

When an electronic component is soldered to a printed circuit board, a solder dipping method or the like is used, and the electronic component is sometimes placed in a high-temperature environment. By the way, as described above, the resin sleeve of the electronic component often uses a heat-shrinkable material. When an electronic component using a heat-shrinkable resin sleeve is placed in a high-temperature environment, the resin sleeve tends to further shrink by heat. At this time, if there is a pinhole or flaw in the resin sleeve, the shrinkage stress is concentrated on the pinhole or flaw. Then, the resin sleeve may be torn from a portion such as a pinhole, and eventually the resin sleeve may be broken.

Therefore, it is necessary to store and transport electronic components without damaging the resin sleeve.

In view of the above, the present invention provides a structure in which electronic components having lead wires, especially electronic components covered with a resin sleeve, do not damage each other.

[0011]

The present invention is characterized in that, in an electronic component having a lead wire, the tip of the lead wire has a curved surface.

By making the tip of the lead wire a curved surface,
Even if the tip of the lead wire contacts another electronic component, the other electronic component is not damaged.

The electronic component is preferably an electronic component in which the component elements are housed in a metal outer case and the outer case is covered with a heat-shrinkable resin sleeve.

In an electronic component covered with a heat-shrinkable resin sleeve, damage to the resin sleeve is eliminated, so that problems such as breakage of the resin sleeve when placed in a high-temperature environment such as during soldering can be avoided. .

[0015]

Embodiments of the present invention will now be described with reference to the drawings.

FIG. 1 is a sectional view showing the internal structure of an electrolytic capacitor as an example of an electronic component. Reference numeral 2 denotes a capacitor element formed by winding a strip-shaped anode foil and a cathode foil via electrolytic paper as a separator, and forming a cylindrical shape. Electrode tabs 3 for external drawing are connected to the anode foil and the cathode foil, respectively. The electrode tab 3 is formed by connecting a flat portion to a round bar portion, the flat portion is connected to an electrode foil, and the round bar portion is led out from one winding end surface of the capacitor element 2. The lead wire 4 is further welded to the round bar portion of the electrode tab 3.

As the lead wire 4, a CP wire is used.
The CP wire is a steel wire plated with copper and further plated with solder. The tip of the lead wire 4 is formed into a curved surface. Here, the curved surface refers to a state where there is no sharp corner.
Therefore, it may be formed into a hemispherical shape as shown in FIG. 4A, or may be a curved surface having an elliptical cross section as shown in FIG. Such a curved surface can be obtained by cutting the lead wire 4 to a predetermined length and then polishing the end thereof. Processing of the tip of the lead wire 4 into a curved surface may be performed before or after welding to the electrode tab 3.

The sealing element 5 made of elastic rubber is mounted on the capacitor element 2 as described above, and is housed in a bottomed cylindrical outer case 6 made of aluminum. Then, a lateral groove is formed on the side surface of the outer case 6 and a curling process is performed on the opening end to seal the electrolytic capacitor.

After that, the electrolytic capacitor 1 is covered with a resin sleeve 7 indicating the polarity and rating of the electrolytic capacitor. That is, the heat-shrinkable resin sleeve formed in the shape of a tube is cut into a predetermined length, and is covered from the outside of the outer case 6 of the electrolytic capacitor 1. After that, electrolytic capacitor 1
Is left in a heating furnace or the like to shrink the resin sleeve 7 and make it adhere to the main body of the electrolytic capacitor 1.

In the above-described electrolytic capacitor 1, since the tip of the lead wire 4 is curved, even if the lead wire 4 of the electrolytic capacitor 1 comes into contact with the resin sleeve of another electrolytic capacitor, The sleeve is less likely to be damaged.

Further, since the tip of the lead wire of the electronic component has a curved surface, the curved surface of the tip of the lead wire serves to guide the electronic component into the through hole even when the electronic component is inserted into the through hole. , It becomes easy to insert into the through hole.

Although the embodiment of the present invention has been described with reference to the electrolytic capacitor, the present invention is not limited to the electrolytic capacitor. The present invention can be applied to various electronic components other than the electrolytic capacitor.

[0023]

According to the present invention, in an electronic component having a lead wire, the tip of the lead wire is formed into a curved surface,
Even when the electronic components come into contact with each other, the tip of the lead wire does not damage other electronic components. Further, it becomes easy to insert the lead wire of the electronic component into the through hole of the printed board.

Further, in the case where the electronic component is a component in which a component element is housed in a metal outer case and the outer case is covered with a heat-shrinkable resin sleeve,
By eliminating damage to the resin sleeve, problems such as breakage of the outer sleeve when placed in a high-temperature environment such as during soldering can be avoided.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an electronic component (electrolytic capacitor) of the present invention.

FIG. 2 is a sectional view showing a conventional electronic component (electrolytic capacitor).

FIG. 3 is an explanatory view showing a step of cutting a lead wire.

FIGS. 4A and 4B are drawings showing a tip of a lead wire of an electronic component according to the present invention, wherein FIGS.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electrolytic capacitor (electronic component) 2 Capacitor element (component element) 3 Electrode tab 4 Lead wire 5 Sealing body 6 Outer case 7 Resin sleeve 10 Linear continuous body 11 Cutting jig 12 Corner

Claims (2)

[Claims] 1. An electronic component having a lead wire, wherein the tip of the lead wire has a curved surface. 2. The electronic component according to claim 1, wherein the component element is housed in a metal outer case and the outer case is covered with a heat-shrinkable resin sleeve.