JP2001260153A - Method for molding thermosetting resin - Google Patents

Method for molding thermosetting resin

Info

Publication number
JP2001260153A
JP2001260153A JP2000069959A JP2000069959A JP2001260153A JP 2001260153 A JP2001260153 A JP 2001260153A JP 2000069959 A JP2000069959 A JP 2000069959A JP 2000069959 A JP2000069959 A JP 2000069959A JP 2001260153 A JP2001260153 A JP 2001260153A
Authority
JP
Japan
Prior art keywords
molding
thermosetting resin
mold
molded product
thin plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000069959A
Other languages
Japanese (ja)
Inventor
Masahiro Mitsui
正宏 三井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2000069959A priority Critical patent/JP2001260153A/en
Publication of JP2001260153A publication Critical patent/JP2001260153A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To enhance filling properties and the thickness accuracy of a molded article in the compression molding of a thin plate-shaped molded article using a thermosetting resin molding material much in the compounding quantity of a filler. SOLUTION: In a method for molding the thin plate-shaped molded article with a surface area of 50-1,500 cm2 and a thickness of 0.1-5 mm using the thermosetting resin molding material, the molding material comprising a material composition consisting of 10-30 weight % of a thermosetting resin and 70-90 weight % of an inorganic filler and having a spiral flow of 10-70 cm is subjected to compression molding under molding pressure of 30-100 MPa and a mold clamping speed at the time of molding is preferably 0.1-1 mm/sec.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、熱硬化性樹脂成形
材料を圧縮成形により成形して、薄板状成形品を製造す
る方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a thin plate-like molded product by molding a thermosetting resin molding material by compression molding.

【0002】[0002]

【従来の技術】従来、熱硬化性樹脂成形材料の圧縮成形
では、適温に加熱した金型の中に成形材料を入れ、樹脂
の溶融により適当な流動性となった時に加圧して、成形
材料を金型の隅々までゆきわたらせ、さらに加熱加圧を
続けて金型の中で完全に硬化させ、所定の形状寸法の成
形品に成形するものである。一般的に圧縮成形では、成
形圧力は15〜30MPaで十分である。ここで、熱硬
化性樹脂は、フェノール樹脂、エポキシ樹脂、メラミン
樹脂、不飽和ポリエステル樹脂、ジアクリルフタレート
樹脂、ユリア樹脂、シリコン樹脂などである。
2. Description of the Related Art Conventionally, in the compression molding of a thermosetting resin molding material, a molding material is put into a mold heated to an appropriate temperature, and when the resin has a suitable fluidity by melting, the molding material is pressed. Is spread to the corners of the mold, and further heated and pressed to be completely cured in the mold to form a molded product having a predetermined shape and dimensions. Generally, in compression molding, a molding pressure of 15 to 30 MPa is sufficient. Here, the thermosetting resin is a phenol resin, an epoxy resin, a melamine resin, an unsaturated polyester resin, a diacryl phthalate resin, a urea resin, a silicone resin, or the like.

【0003】一般的な熱硬化性樹脂成形材料は、充填材
量が30〜60重量%で、樹脂量分が40〜70重量%
であり、溶融時の流動性が良い材料である。しかし、本
発明に使用する成形材料は、無機充填材が70重量%以
上と多く樹脂分が少ない材料であり、薄板状成形品(5
0〜1500cm2 、厚さ0.1〜5mm)を圧縮成形
するには流動性が不十分であり、充填性や厚さ精度等の
要求品質を満足できないのが現状である。
A general thermosetting resin molding material has a filler amount of 30 to 60% by weight and a resin amount of 40 to 70% by weight.
It is a material having good fluidity at the time of melting. However, the molding material used in the present invention is a material having a large amount of an inorganic filler of 70% by weight or more and a small resin content, and is a thin plate-like molded product (5).
(0 to 1500 cm 2 , 0.1 to 5 mm in thickness) is insufficient in fluidity for compression molding, and at present it is not possible to satisfy required qualities such as fillability and thickness accuracy.

【0004】[0004]

【発明が解決しようとする課題】本発明は、熱硬化性樹
脂の成形に関し、スパイラルフローが10〜70cmで
あり、かつ無機充填材を70〜90重量%含む成形材料
を使用し、上記寸法の薄板状成形品を圧縮成形するにお
いて、充填性を向上させ、成形品の厚み精度を向上させ
ることを目的とする。
The present invention relates to the molding of a thermosetting resin, which uses a molding material having a spiral flow of 10 to 70 cm and containing 70 to 90% by weight of an inorganic filler, and having the above dimensions. An object of the present invention is to improve the filling property and improve the thickness accuracy of a molded product in compression molding of a thin plate-shaped molded product.

【0005】[0005]

【課題を解決しようとする手段】本発明は、熱硬化性樹
脂成形材料を用い、成形品寸法が表面積50〜1500
cm2 、厚さ0.1〜5mmである薄板状成形品を成形
する方法において、材料組成が樹脂10〜30重量%及
び無機充填材70〜90重量%からなり、スパイラルフ
ローが10〜70cmである成形材料を、成形圧力30
〜100MPaにて圧縮成形することを特徴とする薄板
状成形品の製造方法に関するものであり、充填性を向上
させ、成形品の厚み精度を向上させた成形方法である。
さらに好ましくは、型締め速度を0.1〜1mm/秒と
いう低速にすることにより充填性をさらに向上させるも
のである。
SUMMARY OF THE INVENTION The present invention uses a thermosetting resin molding material and has a molded product having a surface area of 50 to 1500.
cm 2, in a method of forming a thin plate molded article has a thickness of 0.1 to 5 mm, the material composition is 10 to 30 wt% resin and an inorganic filler 70-90 wt%, the spiral flow in 10~70cm A molding material is subjected to a molding pressure of 30.
The present invention relates to a method for producing a thin plate-shaped molded product, which is characterized by being compression-molded at a pressure of 100 to 100 MPa.
More preferably, the filling property is further improved by setting the mold clamping speed to a low speed of 0.1 to 1 mm / sec.

【0006】以下、本発明を詳細に説明する。本発明の
熱硬化性樹脂成形材料は、樹脂10〜30重量%及び無
機充填材70〜90重量%であり、無機充填材の配合量
が通常のものよりかなり多いものであり、成形時の流動
性が小さい材料である。流動性を示す指標として、スパ
イラルフローが10〜70cmである。スパイラルフロ
ーは、高さ4mmで幅4mmのスパイラル形状の流路を
持つ金型を150℃に設定し、注入圧力46MPaで材
料の流動距離を測定したものである。ここで、無機充填
材は、ガラス繊維、シリカ、タルク、クレー、炭酸カル
シウム、黒鉛などである。本発明において、成形圧力を
30〜100MPaという高圧で圧縮成形することによ
り、流動性の小さい材料でも高い圧力により押し延ばさ
れるため充填性が向上し、厚さ精度も向上させることが
可能になる。30MPa未満では、圧力が不足し完全な
充填は困難である。100MPaを越えると充填性は良
くなるが、金型の強度不足となり金型の破損の危険性が
あり、金型を大きくするとコスト面、作業性の面で、実
用的でないものとなる。
Hereinafter, the present invention will be described in detail. The thermosetting resin molding material of the present invention comprises 10 to 30% by weight of a resin and 70 to 90% by weight of an inorganic filler. It is a material with low properties. As an index indicating the fluidity, the spiral flow is 10 to 70 cm. The spiral flow is obtained by setting a mold having a spiral flow path of 4 mm in height and 4 mm in width at 150 ° C. and measuring the flow distance of the material at an injection pressure of 46 MPa. Here, the inorganic filler is glass fiber, silica, talc, clay, calcium carbonate, graphite, or the like. In the present invention, by performing compression molding at a high molding pressure of 30 to 100 MPa, even a material having low fluidity can be expanded by high pressure, so that the filling property is improved and the thickness accuracy can be improved. If the pressure is less than 30 MPa, the pressure is insufficient and complete filling is difficult. If it exceeds 100 MPa, the filling properties will be improved, but the strength of the mold will be insufficient and there is a risk of damage to the mold. If the mold is enlarged, it becomes impractical in terms of cost and workability.

【0007】そして、上記高圧で圧縮成形することによ
り、成形品の密度が高くなり、強度、その他の特性も向
上する。また、型締め速度を上記のように低速とするこ
とにより、材料投入後、加熱された金型内で材料が温め
られ適度な溶融状態となったときに成形することが可能
になり、さらに充填性の向上を図ることができる。前記
型締め速度は、流動性が最もよくなる時に型締めして成
形するために、金型が完全に閉まる手前10mmから行
うことが好ましい。但し、問題点として、型締め速度を
低速とすることで成形サイクルが長くなり、生産性が低
下することである。
[0007] By compression molding at the high pressure, the density of the molded article is increased, and the strength and other properties are also improved. In addition, by setting the mold closing speed to a low speed as described above, it becomes possible to form the material when the material is warmed in a heated mold and in an appropriate molten state after the material is charged, and furthermore, the filling is performed. Performance can be improved. The mold clamping speed is preferably set to be 10 mm before the mold is completely closed in order to mold the mold when the fluidity becomes the best. However, as a problem, the molding cycle is lengthened by lowering the mold clamping speed, and the productivity is reduced.

【0008】高圧成形を可能にするには、通常の金型寸
法では金型の強度不足、さらにこれにより金型の変形が
考えられるので、金型厚さを通常の1.5〜2倍程度と
することで金型の強度向上、及び変形の防止を行う必要
がある。通常の金型(下型)厚さは150mm程度であ
り、強度向上が必要な場合は300mm程度である。
In order to enable high-pressure molding, it is considered that the strength of the mold is insufficient with ordinary mold dimensions, and the mold may be deformed due to this. Therefore, the thickness of the mold is about 1.5 to 2 times the normal thickness. It is necessary to improve the strength of the mold and prevent deformation. The thickness of a normal mold (lower mold) is about 150 mm, and when strength needs to be improved, it is about 300 mm.

【0009】[0009]

【実施例】以下、代表的な実施例を紹介する。成形材
料、成形品寸法、及び成形条件は下記の通りである。 成形材料 フェノール樹脂成形材料 スパイラルフロー 35cm 材料組成 フェノール樹脂 27重量% 充填材(シリカ、タルク等量)73重量% 成形品寸法 200×200×1.5mm 金型温度 150℃ 成形圧力 20MPa,35MPa,50MPa,75MPa 型締め速度 0.67mm/秒,1.5mm/秒 表1は充填性及び成形品の厚み精度を測定した結果であ
る。充填性は目視により判定した。 ○:良好 △:一部かすれ有り ×:充填不足 成形品の厚み精度は、マイクロメータでサンプルの9点
を測定しその最大値と最小値の差により判定した。 ○:良好 △:厚さ精度やや劣るが、実用可能
×:NG
[Embodiments] Representative embodiments will be described below. The molding material, molded product dimensions, and molding conditions are as follows. Molding material Phenolic resin molding material Spiral flow 35cm Material composition Phenolic resin 27% by weight Filler (silica, talc equivalent) 73% by weight Molded product size 200 × 200 × 1.5mm Mold temperature 150 ° C Molding pressure 20MPa, 35MPa, 50MPa , 75 MPa Mold clamping speed 0.67 mm / sec, 1.5 mm / sec Table 1 shows the results of measuring the filling property and the thickness accuracy of the molded product. The filling property was visually determined. :: Good Δ: Partially blurred ×: Insufficient filling The thickness accuracy of the molded product was determined by measuring the nine points of the sample with a micrometer and determining the difference between the maximum value and the minimum value. :: good △: thickness accuracy is slightly inferior, but practical
×: NG

【0010】[0010]

【表1】 表1から明らかなように、成形圧力35MPa、50M
Pa及び75MPaでは、型締め速度が0.67mm/
秒及び1.5mm/秒のいずれの場合も良好な結果が得
られた。型締め速度は、0.67mm/秒の場合の方が
1.5mm/秒の場合より優れた結果であった。
[Table 1] As is clear from Table 1, the molding pressure is 35 MPa, 50 M
At Pa and 75 MPa, the mold closing speed is 0.67 mm /
Good results were obtained in both the case of 1.5 mm / sec and the case of 1.5 mm / sec. The mold clamping speed was better at 0.67 mm / sec than at 1.5 mm / sec.

【0011】[0011]

【発明の効果】本発明によると、樹脂量が少なく、流動
性の小さい熱硬化性樹脂成形材料を用いて薄板状成形品
を圧縮成形する際、成形圧力を30〜100MPaと高
くすること、及び好ましくは型締め速度を0.2〜1m
m/秒という低速にすることにより、充填性、厚さ精度
の向上を図ることができる。
According to the present invention, when a thin plate-like molded product is compression-molded using a thermosetting resin molding material having a small amount of resin and a low fluidity, the molding pressure is increased to 30 to 100 MPa, and Preferably the mold clamping speed is 0.2 to 1 m
By setting the speed as low as m / sec, the filling property and the thickness accuracy can be improved.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 FI テーマコート゛(参考) // B29K 101:10 B29K 101:10 105:16 105:16 B29L 7:00 B29L 7:00 Fターム(参考) 4F071 AA31 AA33 AA41 AA42 AA49 AA67 AB03 AB21 AB28 AB30 AD01 AF54 BB01 BC07 4F202 AA37 AB11 AB16 AG01 CA09 CB01 CL01 4F204 AA37 AB11 AB16 AG01 FA01 FB01 FF21 FN11 4J002 BG071 CC001 CC161 CC181 CD001 CF211 CP031 DA026 DE236 DJ016 DJ036 DJ046 DL006 FD016 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) // B29K 101: 10 B29K 101: 10 105: 16 105: 16 B29L 7:00 B29L 7:00 F term ( Reference) 4F071 AA31 AA33 AA41 AA42 AA49 AA67 AB03 AB21 AB28 AB30 AD01 AF54 BB01 BC07 4F202 AA37 AB11 AB16 AG01 CA09 CB01 CL01 4F204 AA37 AB11 AB16 AG01 FA01 FB01 FF21 FN11 4J002 BG071 CC001 DJ0 016

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 熱硬化性樹脂成形材料を用い、成形品寸
法が表面積50〜1500cm2 、厚さ0.1〜5mm
である薄板状成形品を成形する方法において、材料組成
が樹脂10〜30重量%及び無機充填材70〜90重量
%からなり、スパイラルフローが10〜70cmである
成形材料を、成形圧力30〜100MPaにて圧縮成形
することを特徴とする薄板状成形品の製造方法。
1. A thermosetting resin molding material is used. The molded product has a surface area of 50 to 1500 cm 2 and a thickness of 0.1 to 5 mm.
In a method of molding a thin plate-like molded product, a molding material having a material composition of 10 to 30% by weight of a resin and 70 to 90% by weight of an inorganic filler and a spiral flow of 10 to 70 cm is formed at a molding pressure of 30 to 100 MPa. A method for producing a thin plate-shaped molded product, comprising compression-molding.
【請求項2】 成形時の型締め速度が0.1〜1mm/
秒である請求項1記載の薄板状成形品の製造方法。
2. The mold closing speed during molding is 0.1 to 1 mm /
2. The method for producing a thin plate-like molded product according to claim 1, wherein the time is seconds.
JP2000069959A 2000-03-14 2000-03-14 Method for molding thermosetting resin Pending JP2001260153A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000069959A JP2001260153A (en) 2000-03-14 2000-03-14 Method for molding thermosetting resin

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000069959A JP2001260153A (en) 2000-03-14 2000-03-14 Method for molding thermosetting resin

Publications (1)

Publication Number Publication Date
JP2001260153A true JP2001260153A (en) 2001-09-25

Family

ID=18588756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000069959A Pending JP2001260153A (en) 2000-03-14 2000-03-14 Method for molding thermosetting resin

Country Status (1)

Country Link
JP (1) JP2001260153A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6846442B2 (en) * 2001-10-15 2005-01-25 Sumitomo Rubber Industries, Ltd. Process for producing golf ball

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6846442B2 (en) * 2001-10-15 2005-01-25 Sumitomo Rubber Industries, Ltd. Process for producing golf ball

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