JP2001257529A - Oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize miniaturization without deteriorating characteristics of an oscillator. SOLUTION: By forming a resonator divided into plural inner layers at nearly the same position and in the same shape, a Q value is raised and a C/N characteristics is raised. Furthermore, characteristics is prevented from being deteriorated by oscillation, etc. An external connection terminal is provided on the rear surface of a board for contacting a side surface only at a ground terminal, thereby a shield cover can be fixed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator such as a VCO (Voltage Controlled Oscillator) used for communication equipment using a high frequency, for example, a portable telephone.

[0002]

2. Description of the Related Art FIG. 6 shows a configuration of a conventional oscillator. The first layer 40 includes a second layer 41, a third layer 42, and a fourth layer 43. The first layer 40 includes an oscillation circuit 28, a trimming 29, a through hole 30, and a through hole 32. Is configured. The connection relationship of each part is shown. A trimming part 29 for adjusting the resonator length is connected to the oscillation circuit 28, and the trimming part 29 is electrically connected to the inner layer line 31 through the through hole 30.
Is electrically connected to the ground portion 33 through the through hole 32 and is grounded. The through hole 30 is not connected to the ground portion 33 in the second layer 41 and the fourth layer 43, and is electrically connected to the inner layer line 31 only in the third layer 42. Further, the through hole 32 is electrically connected to the inner layer line 31 at the third layer 42, and is electrically connected to the ground portion 33 at one or both of the second layer 41 and the fourth layer 43. I have. Here, the total length of the trimming portion 29 and the inner layer line 31 was the resonator length. In order to further reduce the size, it is necessary to eliminate the trimming portion 29 and dispose the entire resonator in the inner layer. However, if the line is constituted only by the inner layer, the Q value of the resonator decreases and C / C
N had deteriorated.

FIG. 7 shows a connection diagram of a variable capacitance diode 34 and a frequency control voltage terminal 35 as shown in FIG.
The configuration of each layer is the same as that in FIG. The cathode terminal of the variable capacitance diode 34 is electrically connected to the inner layer line 38 through the through hole 37, and the line 38 is electrically connected to the frequency control voltage terminal 35 of the first layer 40 through the through hole 39. The capacitor 36 is electrically connected to the frequency control voltage terminal 35 at one terminal, and the other terminal is grounded. The inner layer line 38 is designed so that the impedance on the frequency control voltage terminal side from the variable capacitance diode 34 becomes higher.

Further, in the conventional configuration examples shown in FIGS. 6 and 7, through-holes are used for connection between the layers, so that the lines are formed in almost the same positions on the layers other than the third layer 42 in substantially the same shape. When configured, it could only be connected in parallel.

Further, as shown in FIG. 8, in the conventional oscillator, a shield cover fixing terminal 52 for fixing the shield cover 50 and an external connection terminal 53 are formed on the surface of the substrate 51. It is necessary to arrange the components disposed inside so as not to contact the shield cover 50, the external connection terminals 53, and the shield cover fixing terminals 52, and the area of the surface of the substrate 51 cannot be used effectively.

[0006]

In the conventional structure, the inner layer line is shortened as the substrate area is reduced, and it is difficult to secure a required length. Further, when the resonator is formed in the inner layer, it is difficult to secure the C / N of the oscillator because the Q value of the resonator becomes low. Further, electric energy generated by vibration of a ringer or the like is applied as a voltage to a line connecting the frequency control voltage terminal and the variable capacitance diode, so that unnecessary spurious is generated. In addition, since the layers are connected to each other using the through holes, it is not possible to electrically connect the lines of a plurality of layers at substantially the same position and substantially the same shape in series. Further, in the conventional configuration, a terminal for fixing the shield cover and an external connection terminal are required on the surface of the substrate, and the surface area of the substrate cannot be used effectively.

The present invention solves the above-mentioned conventional problems, and secures a long line length even in a small-area substrate, increases the Q value of a resonator formed in an inner layer, and applies the Q value to a variable capacitance diode. It is an object of the present invention to attenuate a voltage due to vibration and to fix a shield cover without providing a terminal for fixing the shield cover and an external connection terminal on a substrate.

[0008]

In order to achieve the above object, the present invention uses a multilayer wiring board, and forms a long resonator by forming a resonator with a spiral coil line and arranging the resonator in a plurality of layers. It is possible to secure a long length and increase the Q value. In addition, the line connecting the frequency control voltage terminal and the variable capacitance diode is composed of a spiral coil line, and a long line length is secured by arranging it in a plurality of layers to attenuate the voltage generated by vibration and the like. I was able to do it. Also, by using a multilayer wiring board having an inner via hole (IVH) structure capable of interlayer connection at an arbitrary wiring pattern position, lines of substantially the same shape arranged at substantially the same position on a plurality of layers could be connected in series. Furthermore, external connection terminals are configured on the back of the board,
By fixing the shield cover on the side of the board, the surface area of the board can be used effectively and the size can be reduced.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention relates to an oscillator formed using a multilayer wiring board,
The resonator of the oscillator is formed using a line, and the line is divided into a plurality of layers, and the lines formed in each layer are formed in substantially the same position at substantially the same shape, and the lines in each layer are connected in series. Oscillator characterized by being connected to
Since the line length is increased and the Q value is increased by making the shapes of the lines in each layer substantially the same, the C / N of the oscillator is increased.
Has an effect of increasing.

According to a second aspect of the present invention, there is provided the oscillator, wherein the multilayer wiring board has an inner via hole (IVH) structure capable of interlayer connection at an arbitrary wiring pattern position, and the multilayer wiring board having the IVH structure. Since the pattern of each layer can be electrically connected without using a through-hole by using, the line can be divided into a plurality of layers and formed in substantially the same position and substantially in the same shape.

According to a third aspect of the present invention, the line connecting the frequency control voltage terminal of the oscillator and the variable capacitance diode is divided into a plurality of layers of the multilayer circuit board, and the multilayer line is formed. Form the shape almost the same,
An oscillator characterized in that the lines of each layer are connected in series, and the length of the line is increased, and the area occupied by the line in each layer is reduced. It has the effect that the voltage attenuates.

According to a fourth aspect of the present invention, the external connection terminals are arranged on the back surface of the substrate, and only the ground terminals of the external connection terminals are formed at corners so as to be in contact with the side surfaces, and the remaining external connection terminals are formed. The oscillator is characterized in that the terminals are arranged closer to the inner side than the side surface and are arranged with a non-conductive interval between the side surface and the side surface.By arranging the external connection terminal on the back surface, the size of the oscillator can be reduced. An oscillator having the function of fixing the shield cover on the side surface because only the ground terminal among the external connection terminals is connected to the side surface of the substrate.

According to a fifth aspect of the present invention, in the oscillator, the shield cover is electrically connected only to two sides of the back surface of the substrate that are in contact with the side surface of the ground terminal. Is fixed by the ground terminal on the side surface, so that the size of the oscillator can be reduced.

According to a sixth aspect of the present invention, there is provided an external connection terminal having a ground portion provided in a frame shape on an outer peripheral portion of a back surface of the substrate and an external connection terminal arranged inside the frame-shaped ground portion. Only the inner ground terminal is electrically connected to the frame-shaped ground portion, and the remaining external connection terminals are arranged closer to the inner side than the side surface, and are arranged with a non-conductive interval between the side surface and the side surface. The shield cover can be fixed at an arbitrary portion of the frame-shaped ground portion on the back surface of the substrate, and has an effect that the oscillator can be reduced in size.

FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIG.

Embodiment 1 Hereinafter, an oscillator according to Embodiment 1 of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an oscillator according to a first embodiment of the present invention. A multilayer wiring board 1 includes a first layer 2, a second layer 3, a third layer 4, and a fourth layer 5. A line 8 is formed on the second layer 3, and a line 10 is formed on the third layer 4. The first layer 2 is a component surface, and an oscillation circuit 6 is configured. In the second layer 3, a ground portion 12, a line 8, a via 7, which is not electrically connected to the ground portion 12,
Via 9 is arranged.

The third layer 4 includes a ground portion 12, a line 10 that is not electrically connected to the ground portion 12, a via 9,
Via 11 is arranged. The fourth layer 5 is a ground portion on the entire surface, and the via 11 is electrically connected. The oscillation circuit 6 and the line 8 disposed on the first layer 2 are electrically connected via a via 7, and the line 8 and the line 10 are electrically connected via a via 9. The line 10 is electrically connected to a ground portion 12 of the fourth layer 5 via a via 11. That is, the line 8 and the line 10 function as a resonator.

Here, the lines 8 and 10 are formed in spiral coils in substantially the same shape at substantially the same positions and arranged in upper and lower layers, so that the direction of the electric field in the space between the lines 8 and 10 is Are the same and strengthen each other, so that the current density increases and the Q value increases. As a result, C
/ N characteristics are improved.

Further, by arranging the line 8 and the line 10 at substantially the same positions and in substantially the same shape, the occupied area on the substrate is reduced, noise generated by vibration of a ringer or the like is mixed into the resonator, and the frequency is reduced. It has the effect of preventing fluctuation.

Incidentally, any one of the first layer 2, the second layer 3, the third layer 4, and the fourth layer 5 may be provided with a trimming portion for adjusting the resonator length.

In FIG. 1, the multilayer wiring board is composed of four layers, and the resonator is arranged in two layers. However, in implementing the present invention, the oscillator is composed of five or more multilayer wiring boards. Alternatively, the resonator may be divided into three or more layers.

Further, the second layer 3 and the third layer 4 on which the lines 8 and 10 are arranged do not have to be in contact with each other, and a layer constituted by a ground portion may be interposed therebetween.

Further, as the substrate in the present embodiment,
By using a multilayer wiring board having an inner via hole (IVH) structure capable of interlayer connection at an arbitrary wiring pattern position, it is possible to configure the lines 8 and 10 in almost the same position and in almost the same shape and to connect them in series. It became.

(Embodiment 2) Hereinafter, an oscillator according to Embodiment 2 of the present invention will be described with reference to the drawings.

FIG. 2 is a perspective view of the oscillator according to the second embodiment of the present invention. Since the oscillator has the same layer structure as that of FIG. 1, the multilayer wiring board 1 to the fourth layer 5 and the ground portion 12 will be described. Omit. The first layer 2 has a variable capacitance diode 1
3, a capacitor 15, and a frequency control voltage terminal 14 are arranged. The cathode terminal of the variable capacitance diode 13 is electrically connected to the line 17 via the via 16, and the line 17 is connected to the line 18 via the via 19. Is electrically connected to The line 18 is electrically connected to the frequency control voltage terminal 14 at the first layer 2 via the via 20 and the capacitor 1
5, one terminal is electrically connected to the frequency control voltage terminal 14, and the other terminal is grounded.

Here, the line 17 and the line 18 are formed in a spiral coil shape at substantially the same position and substantially in the same shape. By adopting the configuration of the present embodiment, the line length is increased, and the area occupied by the line can be reduced. In addition, by forming the lines 17 and 18 at substantially the same positions and in substantially the same shape, electric energy generated by vibration of a ringer or the like of a mobile phone is applied as a voltage to a frequency control voltage, which is unnecessary for an oscillator output. Spurious generation can be prevented.

Embodiment 3 Hereinafter, an oscillator according to Embodiment 3 of the present invention will be described with reference to the drawings.

FIG. 3 is a back view of an oscillator constituted by using a multilayer wiring board according to the third embodiment of the present invention, in which external connection terminals 21 are arranged at corners, and a ground terminal 22 is provided on a side surface 23 of the board. The other terminals are arranged inwardly so as not to contact the side surface. Therefore, when the shield cover 24 is attached according to this configuration, the shield cover 24 is connected to the side surface only at a tangent to the ground terminal 22. That is, the back surface ground terminal 22 and the shield cover 2
4 is electrically connected and fixed.

FIG. 4 is a perspective view of the oscillator according to the third embodiment of the present invention. The shield cover 24 is in contact with and fixed to the side surface only at the fixing portion 25, and is electrically connected to the back surface ground terminal 22. I understand.

According to this configuration, the shield cover can be fixed without forming the external connection terminal and the shield cover fixing terminal on the surface of the multilayer wiring board, so that the oscillator area can be reduced.

The present embodiment can be implemented in a multilayer substrate using through holes other than the multilayer wiring substrate described in claim 1 or 2.

(Embodiment 4) Hereinafter, an oscillator according to Embodiment 4 of the present invention will be described with reference to the drawings.

FIG. 5 is a back view of an oscillator constituted by using a multilayer wiring board according to the fourth embodiment of the present invention. A frame-like ground portion 26 is formed inside a side surface 23 of the board, and a ground terminal 22 is provided. It is electrically connected to the frame ground 26. The external connection terminal 21 is the frame-shaped ground portion 2
6 so as not to be connected to the inside.

By adopting this configuration, the shield cover 24 can be connected and fixed to the frame-shaped ground portion 26 at an arbitrary position. Therefore, the shield cover can be fixed without forming the external connection terminal and the shield cover fixing terminal on the surface of the multilayer wiring board, and the effect of reducing the oscillator area is possible.

It should be noted that the present embodiment can be implemented in a multilayer substrate using through holes other than the multilayer wiring substrate described in claim 1 or 2.

[0037]

As described above, according to the present invention, the line length is increased by arranging the resonators in a plurality of layers, and a long line length can be ensured even if the substrate area is small. Further, by forming the lines of each layer at substantially the same positions and in substantially the same shape and by forming the lines in a spiral coil shape, the Q value was increased, and a high C / N characteristic of the oscillator was obtained.
In addition, by forming an oscillator using a multilayer wiring board having an inner via hole (IVH) structure capable of interlayer connection at an arbitrary wiring pattern position, lines of each layer are formed at substantially the same position in substantially the same shape, and connected in series. I was able to do it. Further, the line connecting the variable capacitance diode and the frequency control voltage terminal is divided into a plurality of layers in the same manner as the resonator, and is formed in substantially the same position and in the same shape, so that the frequency control voltage generated by vibration is generated. The applied voltage could be attenuated. Further, the external connection terminal is formed on the back surface of the substrate, a non-conductive portion is provided between the side surface so as not to contact the side surface of the substrate, and the shield cover is fixed on the side surface of the substrate by electrically connecting only the ground terminal to the side surface. As a result, the area of the substrate surface could be effectively used. As a result, the size of the oscillator can be reduced without deteriorating the characteristics.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an oscillator according to a first embodiment of the present invention.

FIG. 2 is an exploded perspective view of an oscillator according to a second embodiment of the present invention.

FIG. 3 is a back view of the oscillator according to the third embodiment of the present invention.

FIG. 4 is an exploded perspective view of an oscillator according to a third embodiment of the present invention.

FIG. 5 is a back view of the oscillator according to the fourth embodiment of the present invention.

FIG. 6 is an exploded perspective view of a conventional oscillator.

FIG. 7 is an exploded perspective view of a conventional oscillator.

FIG. 8 is an exploded perspective view of a conventional oscillator.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Multilayer wiring board 2 1st layer 3 2nd layer 4 3rd layer 5 4th layer 6 Oscillation circuit 7, 9, 11, 16, 19, 20 Via 8, 10, 17, 18 Line 12 Ground part 13 Variable Capacitance Diode 14 Frequency Control Voltage Terminal 15 Capacitor 21 External Connection Terminal 22 Ground Terminal 23 Side of Board 24 Shield Cover 25 Fixed Part 26 Frame Ground

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hiroki Iwamiya 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. (reference) 5J006 HB01 HB05 HB13 HB21 HB22 LA02 LA09 LA22 PA03 PA08 5J081 AA11 BB01 CC30 CC42 EE03 EE09 JJ04 JJ12 JJ14 LL01 MM07 MM08

Claims (6)

[Claims] An oscillator formed using a multilayer wiring board, wherein an oscillator of the oscillator is formed using a line,
An oscillator characterized in that the line is divided into a plurality of layers, the lines formed in each layer are formed at substantially the same positions and in substantially the same shape, and the lines of each layer are connected in series. 2. The oscillator according to claim 1, wherein the multilayer wiring board has an inner via hole structure that allows interlayer connection at an arbitrary wiring pattern position. 3. A line connecting a frequency control voltage terminal of an oscillator and a variable capacitance diode is divided into a plurality of layers of a multilayer circuit board, and a line shape formed on each layer is formed substantially the same. 2. The oscillator according to claim 1, wherein said lines are connected in series. 4. An external connection terminal is arranged on the back surface of the substrate, and among the external connection terminals, only a ground terminal is arranged at a corner so as to be in contact with a side surface, and the remaining external connection terminals are shifted inward from the side surface. The oscillator according to claim 1, wherein the oscillator is arranged with a non-conductive space between the oscillator and the side surface. 5. The oscillator according to claim 4, wherein the shield cover is electrically connected only on two sides in contact with the side surface of the ground terminal on the back surface of the substrate. 6. A frame-shaped ground portion provided on the outer peripheral portion of the back surface of the substrate and an external connection terminal disposed inside the frame-shaped ground portion, and only the inner ground terminal of the external connection terminal is provided on the frame. While electrically connected to the shape ground portion, the remaining external connection terminals are brought closer to the inside than the side surfaces,
5. The oscillator according to claim 4, wherein a non-conducting space is provided between the oscillator and the side surface.