JP2001257442A - Multi-substrate circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multi-substrate circuit device exhibiting an excellent safety from leakage while suppressing increase in costs. SOLUTION: The multi-substrate circuit device is provided with a photocoupler 313 having low-potential terminals 3131 and 3132 to which a low potential is applied, and high-potential terminals 3133 and 3134 to which a potential higher than that applied to the low-potential terminals is applied; and a low-potential side circuit board 32 mainly having low-potential conductor patterns 37 and 38 to which a low potential is applied, and a high-potential side circuit board 31 mainly having high-potential conductor patterns 39 and 40 to which a high potential is applied. The low-potential terminals 3131 and 3132 of the photocoupler 313 are fixed on the low-potential conductor patterns 37 and 38 of the low-potential side circuit board 32, and the high-potential terminals 3133 and 3134 of the photocoupler 313 are fixed on the high-potential conductor patterns 39 and 40 of the high-potential side circuit board 31.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit board type circuit device using a plurality of circuit boards.

[0002]

2. Description of the Related Art In recent years, the main battery of an electric vehicle has been gradually increased in voltage in order to reduce power loss due to wiring resistance and switching element resistance and to downsize wiring and circuit elements. It has been greatly exceeded.

A battery controller for controlling the main battery detects the terminal voltage of the battery and performs capacity detection and monitoring by a built-in microcomputer based on the detected voltage. As a result, this battery controller is used. Has an extremely high voltage detection unit and a low voltage calculation unit.

In this charging / discharging circuit for the main battery,
Although the output signal voltage of the microcomputer is low, it is necessary to control the input and output of high-voltage power to and from the main battery based on the output signal voltage.

That is, in the conventional battery control circuit device,
A high potential circuit system (for example, an input / output system) reaching several hundred volts,
A low-potential circuit system that operates with a power supply voltage of several volts is mixed.

However, the battery controller described above is
A large number of circuit components mounted on a circuit board are connected by conductor patterns on the circuit board. However, it is necessary to ensure that each conductor pattern on the circuit board has sufficient insulation against the high voltage. And the circuit board cost has increased significantly.

Further, since it is difficult to increase the breakdown voltage of IC components such as a microcomputer, the circuit components of the low-potential circuit system may be erroneously or creepage-discharged or the like. It was necessary to avoid shorts and rare earths in the wiring.

In order to solve this problem, conventionally, circuit components of a high-potential circuit system and circuit components of a low-potential circuit system are separately mounted on different circuit boards.

[0009]

However, even when the above-mentioned two circuit boards having different potentials are used, circuit components for transmitting signals between the high potential circuit system and the low potential circuit system (hereinafter referred to as signal relay circuit components). ) Must be provided with a low potential terminal to which a low voltage of a low potential circuit system is applied and a high potential terminal to which a high voltage of a high potential circuit system is applied. These two terminals are soldered to the conductor pattern of the circuit board near the signal relay circuit component.

As a result, the low potential terminal of the signal relay circuit component and the low potential conductor pattern connected thereto, and the high potential terminal and the high potential conductor pattern connected thereto are formed as follows.
It will be dense.

For this reason, when working near the signal relay circuit component, the low potential terminal or exposed low potential conductor pattern and the high potential terminal or exposed high potential conductor pattern are mistakenly shown. There was a possibility that it could be triggered.

Similarly, when dew condensation or thermal cracks occur on the circuit board near the signal relay circuit components, the low potential terminal or the exposed low potential conductor pattern and the high potential terminal or the exposed high potential conductor pattern are separated. There was a possibility of short-circuiting and short-circuiting between them.

By using a special connector to cover the low-potential terminal and the exposed low-potential conductor pattern, or to cover the high-potential terminal and the exposed high-potential conductor pattern, the above-mentioned problem is somewhat reduced. Is improved, but the connector mounting cost is increased.

In any case, a problem when using a plurality of circuit boards is that extra wiring for signal transmission between the two boards is required. For example, if a flexible substrate is used for this purpose, a connector for the flexible substrate is required for both substrates, which increases the component cost and the assembly cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a multi-substrate circuit device having excellent leakage safety while suppressing an increase in cost.

[0016]

According to the present invention, there is provided a multi-substrate circuit device according to the present invention, wherein a low potential terminal to which a low potential is applied and a high potential to which a higher potential is applied than the low potential terminal. A circuit component having terminals, a low-side circuit board mainly having a low-potential conductor pattern to which a low potential is applied, and a high-side circuit board mainly having a high-potential conductor pattern to which a high potential is applied. The low-potential terminal of the circuit component is fixed to the low-potential conductor pattern of the low-side circuit board; and the high-potential terminal of the circuit component is fixed to the high-potential conductor pattern of the high-side circuit board. − Is fixed to the pin. The term “fixed” means that electrical connection is made irremovably by soldering, for example, and does not include detachable connection using a connector or the like.

In this manner, the wiring and circuit components of the high-potential circuit system can be mainly collected on the high-level circuit board, and the wiring and circuit components of the low-level circuit system can be mainly collected on the low-level circuit board. It is not necessary to increase the withstand voltage of the substrate, and high-density wiring can be performed, and it is possible to suppress a leakage fault between the wiring and circuit parts of the high-potential circuit system and the wiring and circuit parts of the low-order circuit system. it can.

Further, according to the present invention, a circuit component having terminals connected to both circuit systems is provided on each wiring pattern of both circuit boards.
The high-potential wiring pattern and the low-potential wiring pattern do not concentrate around this circuit component. As a result, it is possible to reliably prevent an electric leakage accident due to creeping discharge or the like while avoiding complication of the device configuration.

The two circuit boards can be arranged facing each other in parallel at a predetermined distance from each other, or may be arranged on the same plane or at right angles to each other.

According to a second aspect of the present invention, in the multi-substrate circuit device according to the first aspect, the circuit component is a signal relay circuit component for transmitting a signal between the two substrates (for example, a photocoupler, a transformer, a relay). Therefore, it is possible to prevent a short circuit and a short circuit in the vicinity of a signal relay circuit component, which has been conventionally difficult, despite the use of a simple assembling method of soldering terminals.

According to a third aspect of the present invention, in the multi-substrate circuit device according to the first or second aspect, both circuit boards are arranged in parallel with each other with the circuit component interposed therebetween. The required space of the apparatus can be made compact, and the soldering operation can be easily performed using a molten solder bath or the like.

According to the multi-substrate circuit device of the fourth aspect, the first circuit substrate, the second circuit substrate disposed in parallel with the first circuit substrate at a predetermined distance, and both ends, And a conductive terminal rod which is individually inserted into a terminal insertion hole penetrating through each of the substrates and soldered to a conductor pattern of the circuit boards.

In this case, the wiring patterns of the two circuit boards can be easily connected by the linear conductive terminal rod. That is, one end of this conductive terminal rod is inserted into one circuit board in the same process as another circuit component by a component inserter, and is instantaneously mounted on the anti-component mounting surface of this circuit board in a molten solder bath or the like. Soldered. Thereafter, the other end of the conductive terminal rod is inserted into the hole of the other circuit board, and is soldered on the non-component mounting surface of this circuit board. In addition,
The central portions of the plurality of conductive terminal rods may be supported while being electrically insulated from each other by an insulating resin holder.

According to the multi-substrate circuit device of the fifth aspect, the first circuit substrate, the second circuit substrate disposed in parallel with the first circuit substrate at a predetermined distance, and both ends, And a spacer individually inserted into terminal insertion holes penetrating through the two boards and soldered to conductor patterns of the two circuit boards, respectively. It is characterized in that it has a step formed at both ends at the predetermined distance and abutting against the opposing surfaces of the two circuit boards.

According to this structure, the spacer for maintaining the space between the pair of circuit boards opposed to each other can be mounted and soldered similarly to the other circuit components, and the assembly is simplified. .

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below in detail with reference to the following examples.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a battery management apparatus for an electric vehicle using a circuit board device of the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view of the battery management device of the electric vehicle, FIG. 2 is a schematic block diagram of the device of FIG.
FIG. 2 is an enlarged sectional view of a main part showing a modification of FIG. 1.

This device detects each module voltage, total voltage and current of the main battery 1 for supplying power to the traveling motor, and
An apparatus for calculating a battery capacity, that is, an amount of stored power, wherein 2 is a case, 3 is a circuit section, and 4 is an auxiliary battery for auxiliary power supply.

(Entire Configuration) The case 2 includes a frame 21 having openings on both sides, a lid plate 22 for closing the lower opening of the frame 21 in FIG. 1, and an upper opening of the frame 21 in FIG. The lid plate 22 is fixed to the frame portion 21 with screws 24.
, And the bottom plate 23 is fastened to the frame 21 with screws (not shown).

The circuit section 3 has a high-order circuit board 31 and a low-order circuit board 32, and a plurality of necessary circuit components are mounted on the element mounting surfaces of both boards 31, 32, respectively. Three
Reference numerals 4 and 35 denote cylindrical spacers, and 36 denotes a long screw. The circuit board 31 is fixed at a predetermined distance from the bottom plate 23 by being assembled as shown in FIG.
Are fixed in parallel at a predetermined distance from the circuit board 31.

The high-side circuit board 31 includes a high-voltage system controller 311 for detecting the terminal voltages and currents of the 20 battery modules constituting the main battery 1, and a high-voltage system controller 31.
An input / output separated DC-DC converter 312 for supplying a power supply voltage to the power supply circuit 1 is mounted on the circuit board 32, and a microcomputer 321 for signal processing is mounted on the lower circuit board 32. The photocoupler 313 is disposed between the substrates 31 and 32 in a hollow manner as described later, and is provided with the microcomputer 321 and the high-voltage system controller 31.
1 and is electrically insulated to transmit a signal.

In this embodiment, the high-voltage system control unit 31
The power supply voltage 1 is obtained by converting the voltage of the auxiliary battery 4 by the DC-DC converter 312 and using it.
May be supplied to the high-voltage system controller from the controller. Although a DC-DC converter 312 is not shown, it has a low-voltage-side inverter circuit, a step-up transformer, a full-wave rectifier circuit, and a smoothing circuit, but the low-voltage-side inverter circuit is mounted on the lower-side circuit board 32. May be. Further, this step-up transformer can be regarded as a signal relay circuit component according to the present invention.

(Explanation of Photocoupler 313) The arrangement of the photocoupler 313 constituting the signal relay circuit component according to the present invention will be described in more detail with reference to FIG. FIG. 3 shows FIG.
However, the arrangement itself of the photocoupler 313 is the same.

The photocoupler 313 has a resin mold section 3130, low potential terminals 3131 and 3132 projecting downward from the resin mold section 3130, and a high potential projecting upward from the resin mold section 3130. Potential terminal 313
3, 3134. Low potential terminals 3131, 3
Reference numeral 132 denotes a conductor pattern (not shown) which is inserted into a through hole of the lower circuit board 32 and is provided on the lower surface of the lower circuit board 32.
(Wiring patterns) 37 and 38 are individually soldered. The high-potential terminals 3133 and 3134 are inserted into through holes of the high-side circuit board 31,
Conductor pattern (wiring pattern) 3 not shown on the back of
9 and 40 are soldered individually.

In this manner, the low potential terminals 3131 and 3132, which are the terminals of the light emitting diodes in the photocoupler 313 driven by the microcomputer 321 at a low voltage, and the conductor patterns 37 and 38 connected thereto are provided. A high-potential terminal 31 to which a high voltage is applied, which is a terminal of a light-receiving element in the photocoupler 313 driven by the light-emitting diode.
33, 3134 and conductor pattern 3 connected thereto
It is possible to secure a large electrical insulation distance between the first and second ninth and the ninth and the ninth, and it is possible to satisfactorily prevent electric leakage. Further, since signals can be exchanged between the low-potential circuit system and the high-potential circuit system through the photocoupler 313, a signal relay system such as a flexible wiring between the two circuit boards 31 and 32 having different voltages is omitted. And the structure can be simplified.

The photocoupler 313 transmits a signal from the microcomputer 321 to the high-voltage control unit 311 as well as a signal from the high-voltage control unit 311 to the microcomputer 321.
1 and 3, but are not shown in FIGS. 1 and 3. In this case, the light emitting diode of the photocoupler 313 is connected to a pair of high potential terminals, and the light receiving element of the photocoupler 313 is connected to a pair of low potential terminals.

(Effects of Embodiment) According to the above-described apparatus of this embodiment, the photocoupler (signal relay circuit component) 31
3 low-potential terminals 3131 and 3132 are soldered to low-potential wiring patterns (conductor patterns) 37 and 38 of the lower-side circuit board, and high-potential terminals 3133 and 3134 of a photocoupler (signal relay circuit component) 313 are soldered. Are soldered to the high-potential wiring patterns (conductor patterns) 39 and 40 of the higher-level circuit board, so that signal relaying between a plurality of circuit boards having different potentials of the conductor pattern is performed by a circuit configuration. It can be performed safely without increasing complexity.

(Modification 1) Reference numeral 6 shown in FIG. 3 denotes a spacer for connecting the circuit boards 31 and 32 facing each other in parallel while maintaining a constant gap therebetween. This space
The cover 6 is a straight metal bar having a large-diameter central portion 61 and small-diameter ends 62, and both ends are soldered through through holes in the circuit boards 31 and 32. The radial step surface between the large diameter portion 61 and both end portions 62 of the spacer 6 is the circuit board 3
1, 32 are in contact.

In this way, the spacer 6 and the circuit boards 31 and 32 can be fixed by the same soldering process as other circuit components. In this case, the peripheral portions of the circuit boards 31 and 32 fixed to the spacer 6 are fixed in close contact with the case 7 and the inner surface of the lid 8.

(Modification 2) Reference numeral 9 shown in FIG. 3 denotes a conductive terminal rod for electrically connecting conductor patterns (not shown) of the circuit boards 31 and 32 facing each other in parallel. The conductive terminal rod 9 is soldered through the through holes of the circuit boards 31 and 32.

A pair of conductive terminal rods 9 are provided, and a pair of conductor patterns of the lower-side circuit board 32 forming an output end of an inverter circuit of the DC-DC converter mounted on the lower-side circuit board 32. And the conductor patterns connected to both ends of the primary coil of the transformer fixed to the high-order circuit board 31.

Thus, the conductor patterns of the circuit boards 31 and 32 can be connected by the conductive terminal rods 9 without using a flexible board.

(Modification 3) In the modification shown in FIG.
The photocoupler 313 is fixed or adhered to the element mounting surface of the lower circuit board 32, and its low potential terminal 31310 is soldered to the conductor pattern 370 of the lower circuit board 32. The high potential terminal 31330 is soldered to the conductor pattern 390 of the high-order circuit board 31.

This makes it easy to fix the photocoupler 313.

The photocoupler 313 may be fixed to the element mounting surface of the high-order circuit board 31.

In each of the above embodiments, the photocoupler 3
The conductor pattern connected to the terminal 13 is the circuit board 31, 3
2 is formed on the anti-element mounting surface, but may be formed on the element mounting surface or may be embedded in the circuit boards 31 and 32.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an embodiment of a battery management device for an electric vehicle using a multi-substrate circuit device of the present invention.

FIG. 2 is a schematic block circuit diagram of the device of FIG.

FIG. 3 is an enlarged sectional view of a main part showing a modification of FIG. 1;

FIG. 4 is an enlarged sectional view of a main part showing a modification of FIG. 1;

[Explanation of symbols]

1 is a main battery, 3 is a circuit board, 4 is an auxiliary battery, 3
1 is a high-side circuit board, 32 is a low-side circuit board, 313 is a photocoupler (signal relay circuit component in the present invention), 31
31, 3132 are low potential terminals, 3133, 3134 are high potential terminals, 37, 38 are low potential wiring patterns, 39, 4
0 is a high potential wiring pattern.

Claims (5)

[Claims] 1. A circuit component having a low potential terminal to which a low potential is applied, a high potential terminal to which a higher potential is applied than the low potential terminal, and a low potential conductor pattern to which a low potential is applied. And a high-side circuit board mainly having a high-potential conductor pattern to which a high potential is applied, wherein the low-potential terminal of the circuit component is the low-side circuit board of the low-side circuit board. A multi-substrate circuit device, being fixed to a low-potential conductor pattern, wherein the high-potential terminal of the circuit component is fixed to the high-potential conductor pattern of the high-side circuit board. 2. The multi-board circuit device according to claim 1, wherein said circuit component is a signal relay circuit component. 3. The multi-board circuit device according to claim 1, wherein the two circuit boards are arranged in parallel with each other with the circuit component interposed therebetween. 4. A first circuit board, a second circuit board disposed in parallel with the first circuit board at a predetermined distance from the second circuit board, and both end portions are respectively provided through the both boards. And a conductive terminal rod individually inserted into the terminal insertion hole and soldered to the conductor pattern of the two circuit boards. 5. A first circuit board, a second circuit board disposed in parallel with the first circuit board at a predetermined distance from the first circuit board, and both end portions are respectively provided through the both boards. Spacers individually inserted into the terminal insertion holes and soldered to the conductor patterns of the two circuit boards, wherein the spacers are formed at both ends at the predetermined distance from each other, and A multi-substrate circuit device, comprising: a step portion that abuts opposing surfaces of both circuit boards.