JP2001257436A - Folded wiring board, base substrate therefor and liquid crystal device and electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board having a driving circuit and wires mounted on one substrate, which shortens its process, lowers its cost, and saves the trouble for component management. SOLUTION: The base substrate 10 for the folded wiring board is divided into two blocks of a driving circuit mounted on which the driving circuit 11A and many wires are mounted, and a sire mounted part 12 on which a wire 12A is mounted across a folding part 15 where no wire is formed. Before the base substrate 10 is folded at the folding part 15, the driving circuit 11A and the wire 12A are not electrically connected together. The base substrate 10 is folded at the folding part 15 and stuck to electrically connect the driving circuit 11A and wire 12A together, thus providing the folded wiring board 20.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a base substrate for a foldable wiring board, a foldable wiring board, a liquid crystal device, and an electronic apparatus. The present invention relates to a wiring substrate base substrate, a bending type wiring substrate manufactured by bending the base substrate, and a liquid crystal device and an electronic device including the bending type wiring substrate.

[0002]

2. Description of the Related Art A liquid crystal panel or the like mounted on a mobile phone or a portable information processing device is an integrated circuit (IC).
t), a large-scale integration (LSI), a resistor, a capacitor, and other chips. In general, a driving circuit and a wiring board for mounting wiring for connecting the driving circuit to the liquid crystal panel or the like are mounted on the liquid crystal panel or the like, so that the driving circuit and the liquid crystal panel or the like are electrically connected to each other. Is done.

A conventional wiring board is manufactured by mounting a driving circuit and wiring on two different boards and attaching the two boards together.

FIGS. 9A to 9C are process diagrams showing a conventional method for manufacturing a wiring board 100, and the manufacturing method and structure of the wiring board will be described.

FIG. 9 (a) shows an IC, an LSI,
FIG. 1 is a schematic plan view of a substrate 101 on which a driving circuit 101A including a large number of chips such as resistors and capacitors and a large number of wirings (not shown) are mounted as viewed from above.
Although only three chips are formed for simplicity in the drawing, it is assumed that a large number of chips finer than those shown are actually formed. The driving circuit 101A includes a substrate 101
Is electrically connected to the connection terminal 101B formed on the back surface of the substrate.

FIG. 9B is a schematic plan view of a substrate 102 on which a large number of wirings 102A for connecting a driving circuit 101A to a liquid crystal panel and the like are viewed from above.
The wiring 102A is provided on the back surface of the substrate 102 or on the substrate 10
2, the wiring 102A is electrically connected to a connection terminal 102B formed on the surface of the substrate 102. An external circuit connection terminal portion 102C for connecting to an external circuit and a liquid crystal panel connection terminal portion 102D for connecting to wiring such as a liquid crystal panel are provided on the substrate 102.
Are provided.

To obtain the wiring board 100, FIG.
9A, the substrate 101 shown in FIG. 9A is placed on the substrate 102 shown in FIG. 9B so that the connection terminals 101B and 102B overlap. Connection terminals 101B, 102
B, a conductive film such as an anisotropic conductive film (ACF) is sandwiched between the front side of the substrate 101 and the substrate 1.
02 is heated to a predetermined temperature while being press-bonded from the back surface side, and the binder layers of the film are thermoset, thereby bonding the connection terminals 101B and 102B and electrically connecting via the conductive particles in the film. , Wiring board 10
0 is manufactured.

In the wiring board 100, an external circuit connecting terminal portion 102C connected to an external circuit and the driving circuit 10
1A is electrically connected. The driving circuit 1
01A is electrically connected to a wiring 102A via a connection terminal 101B, a conductive film such as an ACF, and a connection terminal 102B, and the wiring 102A is electrically connected to a liquid crystal panel or the like via a connection terminal 102D for a liquid crystal panel or the like. Connected.

Next, a process of mounting the wiring board 100 on a liquid crystal panel or the like will be briefly described.

As an example, FIG. 10B shows a schematic plan view when the wiring substrate 100 is mounted on the liquid crystal panel 200 shown in FIG.

[0011] As shown in FIG.
0, a large number of predetermined patterns are formed on the inner surfaces of the substrates 201 and 202 in order to apply a voltage to the liquid crystal layer sandwiched between the upper substrate 202 and the lower substrate 201 disposed opposite to the upper substrate 202. Electrodes are formed. Substrate 2
A large number of wirings 200A connected to the respective electrodes 01 are collected and arranged on one side of the liquid crystal panel 200.

[0012] As shown in FIG.
The liquid crystal panel etc. connection terminal portion 102D is connected to the liquid crystal panel 20.
0 to the wiring 200A.
0 is mounted on the liquid crystal panel 200. For the sake of simplicity, the wiring 200A is connected to the connection terminal 102 such as a liquid crystal panel.
D, but the wiring 200A is actually connected to the connection terminal 102 such as a liquid crystal panel via a driving driver.
D and is connected to the wiring board 100. A large number of wirings connected to each electrode of the substrate 202 are also connected to the wiring substrate 100 via a driver for driving.

[0013]

The above-mentioned wiring board 100
In the manufacturing method, the driving circuit 101A and the wiring 102
Since A is mounted on two different substrates 101 and 102, there are problems in that the number of manufacturing steps is large, the production efficiency is low, and the cost is high due to the large number of components. Also, since the substrates 101 and 102 must be managed separately,
There is a problem that it takes time to manage parts. further,
Since the substrate 101 and the substrate 102 are attached to each other through a conductive film such as an ACF, the substrate 101 and the substrate 102 may be separated. Further, when the substrate 101 and the substrate 102 are attached to each other, there is a possibility that a displacement may occur in the attachment, so that there is a problem that alignment management at the time of joining is required.

On the other hand, suppose that the driving circuit 10 is provided on one substrate.
When 1A and the wiring 102A are mounted, the problems of the manufacturing process, component management, and peeling of the board can be solved, but there is a problem that the occupied area of the board itself becomes large and space cannot be saved.

Accordingly, the present invention solves the above-mentioned problems, and in the manufacturing process, a drive circuit which enables a reduction in the number of steps, a reduction in cost, a reduction in labor for parts management, and a reduction in space. It is an object of the present invention to provide a wiring board in which the wiring and the wiring are mounted on one board.

Further, by providing this wiring board,
It is an object of the present invention to provide a liquid crystal device and an electronic device with improved production efficiency and space saving.

[0017]

As a result of research conducted by the present inventor to solve the above-mentioned problems, the present inventor has invented a single foldable base substrate on which a driving circuit and wiring are mounted, and the base substrate has been developed. By bending and sticking the above, a bent-type wiring board that can solve the above-mentioned problem has been invented.

That is, a means taken by the present invention to solve the above problem is a foldable foldable wiring board base substrate on which at least a driving circuit and wiring are mounted, wherein the base substrate is At the boundary of the section, a driving circuit mounting section on which the driving circuit and the wiring are mounted, and a wiring mounting section on which the wiring is mounted are divided into blocks, and each of the blocks includes the bending section. A connection terminal for electrically connecting the driving circuit and the wiring of the wiring mounting portion is formed when the base substrate is bent.

In the driving circuit mounting section, the driving circuit is mounted on a front surface of the base substrate, and the driving circuit is connected to the connection terminals formed on a back surface of the base substrate. In the wiring mounting portion, the wiring is connected to the connection terminal formed on the back surface of the base substrate, the base substrate is bent at the bending portion, and the driving circuit mounting portion and the wiring mounting portion are connected to each other. By electrically connecting the two connection terminals thus formed, the drive circuit and the wiring of the wiring mounting portion can be electrically connected.

According to the above means, the driving circuit and the wiring are mounted on a single base substrate, and the base substrate is bent at the bent portion where the wiring is not formed, whereby the driving circuit and the wiring are connected to each other. Can be provided, wherein the base substrate is electrically connected.

In addition, the bending type wiring board base substrate is bent at the bending portion, and the driving circuit and the wiring of the wiring mounting portion are electrically connected. A substrate can be provided.

Since this folding type wiring board is manufactured from a single base board on which the driving circuit and the wiring are mounted, the manufacturing process can be shortened and cost can be reduced.
The labor of parts management can be reduced. Further, since the bent type wiring board is manufactured by bending a base board on which a driving circuit and wiring are mounted, a small occupied area and space saving can be achieved.

In the case where the wiring is formed at the bent portion, when the base substrate is bent at the bent portion, a physical impact may be applied to the wiring at the bent portion, and the electrical connection may be cut off. However, in the present invention, since no wiring is formed at the bent portion, there is no such fear.

Further, in the conventional wiring board to which two substrates are adhered, there is a possibility that the board is peeled off. However, in the bending type wiring board of the present invention, one end is fixed by the bent portion. Therefore, there is little possibility of peeling after bending and sticking.

Further, by providing a liquid crystal panel connection terminal portion in the wiring mounting portion, it is possible to provide a base substrate for a foldable wiring board and a foldable wiring board which can be connected to a liquid crystal panel. By connecting the liquid crystal panel connection terminal portion of the substrate to the wiring arranged on the side of the liquid crystal panel, it is possible to provide a liquid crystal device with improved production efficiency and space saving.

The wiring mounting portion includes a main body portion that is overlapped with the driving circuit mounting portion when the bending type wiring board base substrate is bent at the bending portion, and an extension portion provided to extend the wiring. And the liquid crystal panel connection terminal portion may be provided at two places of the main body portion and the extension portion.

In this case, the liquid crystal panel connection terminal provided on the main body is electrically connected to a wiring disposed on one side of the liquid crystal panel, and the liquid crystal panel connection terminal provided on the extension is provided on the extension. By electrically connecting the liquid crystal panel connection terminal portion and the wiring arranged on the other side of the liquid crystal panel, a production efficiency can be improved and a space-saving liquid crystal device can be provided.

[0028] The present invention is a base substrate for a foldable wiring board on which at least a driving circuit and a wiring are mounted and which can be bent at a bending portion, wherein the base substrate is provided with the driving circuit at a boundary of the bending portion. And a driving circuit mounting portion on which the wiring is mounted, and a wiring mounting portion on which the wiring is mounted is divided into blocks, and each of the blocks includes:
A connection terminal for electrically connecting the driving circuit and the wiring of the wiring mounting portion is formed.

According to this structure of the present invention, the driving circuit and the wiring are mounted on one base substrate, and the base circuit is bent at the bent portion where the wiring is not formed, thereby forming the driving circuit and the wiring. Wiring is electrically connected,
A bent-type wiring board base substrate can be provided.

Further, by providing the above-mentioned folding type wiring substrate or liquid crystal device, it is possible to provide an electronic device in which the production efficiency is improved and the space inside the electronic device is reduced.

[0031]

Next, an embodiment according to the present invention will be described in detail.

First Embodiment FIGS. 1A and 1B are schematic plan views of a bent-type wiring board base substrate 10 according to a first embodiment of the present invention when viewed from the front side and the back side, respectively. Is shown.

As shown in FIGS. 1A and 1B, FPC (Flex
base substrate 1 consisting of a substrate such as a ible printed circuit)
0 is divided into two blocks by a bent portion 15, and one of the blocks (the left side in the figure) is a driving circuit mounting portion 1.
1. The other block (right side in the figure) is a wiring mounting unit 12
It has become. No wiring is formed in the bent portion 15. A slit or the like may be formed in the bent portion 15 to make the base substrate 10 easier to bend.

As shown in FIG. 1A, in the driving circuit mounting section 11, a driving circuit 11A composed of a number of chips such as ICs, resistors, capacitors, etc. A large number of omitted wirings are mounted. Although only three chips are formed for simplification in the drawing, it is assumed that many fine chips are formed. In the wiring mounting section 12, a large number of wirings 12A for connecting the driving circuit 11A to a liquid crystal panel or the like are mounted on the surface of the base substrate 10 or inside the base substrate 10. In the base substrate 10, the driving circuit 11A and the wiring 12A are not electrically connected.

In the driving circuit mounting section 11, the driving circuit 11A is electrically connected to connection terminals 11B formed on the back surface of the base substrate 10 as shown in FIG.

In the wiring mounting section 12, the wiring 12
A is electrically connected to a connection terminal 12B formed on the back surface of the base substrate 10 shown in FIG.

When the base substrate 10 shown in FIGS. 1A and 1B is bent at the bent portion 15, the connection terminals 11B, 1B
The joining terminals 11B and 12B are joined so that the 2Bs are joined to each other.
B is formed at a position equidistant from the bent portion 15.

As shown in FIGS. 1 (a) and 1 (b), an external circuit connection terminal portion 12C for connection to an external circuit is provided on the upper and lower sides of the wiring mounting portion 12 of the base substrate 10. When,
A liquid crystal panel connection terminal portion 12D for connection to wiring such as a liquid crystal panel is provided.

Next, FIGS. 2A to 2C show process charts for manufacturing the foldable wiring board 20 from the foldable wiring board base substrate 10. explain.

FIG. 2A is a schematic plan view of the bent-type wiring board base substrate 10 as viewed from the front side. FIG.
The base substrate 10 shown in FIG. 1A is the same as that shown in FIG. As shown in FIG. 2B, the base substrate 10 is bent at the bent portion 15 so that the connection terminals 11B and 12B are joined.

Next, as shown in FIG. 2C, an ACF (anisotropic conductive material) is provided between the connection terminals 11B and 12B.
(ilm) and the like, and the folded base substrate 10 is heated to a predetermined temperature while being press-bonded from the front side and the back side, and the binder layer of the film is thermoset, thereby connecting the connection terminals 11B and 12B. Attach and electrically connect via conductive particles in the film,
The bending type wiring board 20 is manufactured.

In the bending type wiring board 20, the external circuit connection terminal portion 12C connected to the external circuit and the drive circuit 11A are electrically connected. The driving circuit 11A is electrically connected to the wiring 12A via the connection terminal 11B, a conductive film such as an ACF, and the connection terminal 12B. The wiring 12A is connected to the connection terminal 1 such as a liquid crystal panel.
It is electrically connected to a liquid crystal panel or the like via 2D.

Next, a description will be given of a process of mounting on a liquid crystal panel or the like. As an example, the bending type wiring board 20 is shown in FIG.
FIG. 3B is a schematic plan view of a state when the liquid crystal panel 30 is mounted on the liquid crystal panel 30 shown in FIG. 3A, and a process of mounting the liquid crystal panel 30 will be briefly described.

As shown in FIG. 3A, in the liquid crystal panel 30, in order to apply a voltage to a liquid crystal layer sandwiched between an upper substrate 32 and a lower substrate 31 arranged opposite to the upper substrate 32. A large number of electrodes are formed in a predetermined pattern on the inner surfaces of the substrates 31 and 32, and a large number of wirings 30A connected to the respective electrodes of the substrates 31 and 32 are collected on one side of the liquid crystal panel 30, and the liquid crystal drive Driver 33.
The driving driver 33 includes a terminal 34 for connection to a wiring board.
It is connected to the.

As shown in FIG. 3 (b), by connecting the connection terminal portion 12D for connecting the liquid crystal panel etc. of the bendable wiring board 20 to the connection terminal 34 for connecting the wiring board of the liquid crystal panel 30, the bendable wiring is formed. The substrate 20 is mounted on the liquid crystal panel 30, and a liquid crystal device is manufactured.

According to the present embodiment, the bending type wiring board 20 is manufactured by bending the single bending type wiring board base substrate 10 on which the driving circuit 11A and a large number of wirings 12A are mounted. In the manufacturing process,
It is possible to shorten the process, reduce the cost, and reduce the labor for parts management. Further, since the foldable wiring board 20 is manufactured by bending the foldable wiring board base substrate 10 on which the driving circuit 11A and a large number of wirings 12A are mounted, the occupied area is small and the space can be saved. It becomes something.

In the case where wiring is formed in the bent portion 15, the bent type wiring board base substrate 10 may be bent at the bent portion 15, or may be bent.
When crimping is performed from the back side and the front side, a physical impact may be applied to the wiring of the bent portion 15 and the electrical connection may be cut off. However, in the present embodiment, no wiring is formed in the bent portion 15. Therefore, there is no such fear.

Further, in the present embodiment, since the connection terminals 11B and 12B are designed to be joined by bending the base substrate 10 for a foldable wiring board at the bent portion 15, there is no possibility that the joining may be displaced. .

Further, in the conventional wiring board 100 on which the two substrates 101 and 102 are adhered, there is a possibility that the substrates 101 and 102 may be separated. However, the bending type wiring board 20 of the present embodiment has one end. Since the portion is fixed by the bent portion 15, there is little possibility of peeling after sticking.

Further, as shown in FIGS. 3A and 3B, the folding type wiring board 20 of the present embodiment can be easily mounted on a liquid crystal panel or the like. Accordingly, a liquid crystal device with improved production efficiency and space saving can be provided.

Further, by providing the bending type wiring board 20 or the liquid crystal device on which the bending type wiring board 20 is mounted, it is possible to provide an electronic device in which the production efficiency is improved and the space inside the electronic device is reduced.

Second Embodiment FIGS. 4A and 4B are schematic plan views of a bent-type wiring board base substrate 40 according to a second embodiment of the present invention when viewed from the front side and the back side, respectively. Is shown. 4A and 4B, the same components as those of the bent-type wiring board base substrate 10 are denoted by the same reference numerals.

As shown in FIGS. 4A and 4B, the base substrate 40 made of an FPC board or the like
Divided into two blocks and one block (left side in the figure)
Is a driving circuit mounting section 11 and the other block (right side in the figure) is a wiring mounting section 42. No wiring is formed in the bent portion 15.

As shown in FIG. 4A, in the driving circuit mounting section 11, as in the first embodiment, a driving circuit 11A is provided on the surface of the base substrate 40, and a number of illustrations are omitted. Wiring and is mounted. In addition, the wiring mounting section 42
2, a large number of wirings 42A for connecting the driving circuit 11A to a liquid crystal panel or the like are mounted on the surface of the base substrate 40 or inside the base substrate 40. In the base substrate 40, the driving circuit 11A and the wiring 42
A is not electrically connected.

Further, the wiring mounting section 42 is
The main body portion 42 that is overlapped with the driving circuit mounting portion 11 when the bending type wiring board base substrate 40 is bent by
a and an extension 4 provided to extend the wiring 42A.
2b.

In the driving circuit mounting section 11, the driving circuit 11A is electrically connected to the connection terminals 11B formed on the back surface of the base substrate 40, as shown in FIG.

In the wiring mounting section 42, the wiring 42
A is electrically connected to the connection terminal 12B formed on the back surface of the base substrate 40 shown in FIG.

As in the first embodiment, when the base substrate 40 shown in FIGS.
The joining terminals 11B, 12B are formed at positions equidistant from the bent portion 15 so that the connecting terminals 11B, 12B are joined to each other.

As shown in FIGS. 4A and 4B, an external circuit connection terminal portion 12C for connecting to an external circuit is provided on the main body portion 42a of the wiring mounting portion 42 of the base substrate 40. A connection terminal 42D for connecting a liquid crystal panel or the like for connection to a wiring such as a liquid crystal panel is provided.
b is provided with a liquid crystal panel connection terminal section 42E for connecting to wiring such as a liquid crystal panel.

Next, FIGS. 5A to 5C show process charts for manufacturing the foldable wiring board 50 from the foldable wiring board base substrate 40. The manufacturing method and structure of the foldable wiring board 50 will be described. explain.

FIG. 5A is a schematic plan view of the bent type wiring board base substrate 40 as viewed from the front side. FIG.
The base substrate 40 shown in FIG. 4A is the same as that shown in FIG. As shown in FIG. 5B, the base substrate 40 is bent at the bending portion 15 so that the connection terminals 11B and 12B are joined.

Next, as shown in FIG. 5C, an ACF (anisotropic conductive material) is provided between the connection terminals 11B and 12B.
ilm) and the like, and the connection terminals 11B and 12B are bonded and electrically connected as described in the first embodiment.
Is manufactured.

In the bent type wiring board 50, the external circuit connection terminal portion 12C connected to the external circuit and the drive circuit 11A are electrically connected. The driving circuit 11A is electrically connected to the wiring 42A via the connection terminal 11B, a conductive film such as an ACF, and the connection terminal 12B, and the wiring 42A is connected to the connection terminal portion 4 such as a liquid crystal panel.
It is electrically connected to a liquid crystal panel or the like via 2D or 42E.

Next, a description will be given of a process of mounting on a liquid crystal panel or the like. As an example, the bending type wiring board 50 is shown in FIG.
FIG. 6B is a schematic plan view when the state of mounting on the liquid crystal panel 60 shown in FIG. 6A is viewed from above, and the mounting process on the liquid crystal panel 60 will be briefly described.

As shown in FIG. 6A, in the liquid crystal panel 60, in order to apply a voltage to the liquid crystal layer sandwiched between the upper substrate 62 and the lower substrate 61 disposed opposite to the upper substrate 62. On the inner surfaces of the substrates 61 and 62, a large number of electrodes are formed in a predetermined pattern, and a large number of wirings 60A connected to the electrodes formed on one of the substrates are collected on one side of the liquid crystal panel 60. It is connected to a liquid crystal driving driver 63A. The driving driver 63A is connected to a terminal 64A for connection to a wiring board. A large number of wirings 60B connected to the electrodes formed on the other substrate are collected on the other side of the liquid crystal panel 60, and a liquid crystal driving driver 63B
It is connected to the. The driving driver 63B is connected to a connection terminal 64B for connection to a wiring board.

As shown in FIG. 6 (b), the connection terminals 42D for connecting the liquid crystal panel etc. of the bendable wiring board 50 and the connection terminals 64A for connecting the wiring board of the liquid crystal panel 60 are connected. Terminal part 42E for connection of liquid crystal panel etc.
By connecting the connection terminals 64B to the wiring substrate of the liquid crystal panel 60, the bendable wiring substrate 50 is mounted on the liquid crystal panel 60, and the liquid crystal device is manufactured.

According to the present embodiment, the folding-type wiring board 50 is manufactured by folding the single folding-type wiring board base substrate 40 on which the driving circuit 11A and a large number of wirings 42A are mounted. In the manufacturing process,
It is possible to shorten the process, reduce the cost, and reduce the labor for parts management. Further, since the foldable wiring board 50 is manufactured by bending the foldable wiring board base substrate 40 on which the driving circuit 11A and a large number of wirings 42A are mounted, the occupied area is small and space can be saved. It becomes something.

When the wiring is formed in the bent portion 15, the bent type wiring board base substrate 40 may be bent at the bent portion 15, or the bent type wiring substrate 50 may be bent.
When crimping from the back side and the front side, a physical impact may be applied to the wiring of the bent portion 15 and the electrical connection may be cut off, but in the present embodiment, no wiring is formed in the bent portion 15. Therefore, there is no such fear.

Furthermore, in the present embodiment, since the connection terminals 11B and 12B are designed to be joined by bending the bendable wiring board base substrate 40 at the bent portions 15, there is no danger of the joining being shifted. .

In the conventional wiring board 100 having the two substrates 101 and 102 bonded thereto, there is a possibility that the substrates 101 and 102 may be separated. However, the bending type wiring board 50 of the present embodiment has one end. Since the portion is fixed by the bent portion 15, there is little possibility of peeling after sticking.

As shown in FIGS. 6A and 6B, the bending type wiring board 50 of the present embodiment is easy to mount on a liquid crystal panel or the like. Accordingly, a liquid crystal device with improved production efficiency and space saving can be provided.

Further, by providing the bending type wiring board 50 or the liquid crystal device on which the bending type wiring board 50 is mounted, it is possible to provide an electronic device in which production efficiency is improved and space inside the electronic device is reduced.

Next, a specific example of an electronic apparatus provided with a liquid crystal device on which the bending type wiring board 20 or 50 according to the first and second embodiments is mounted will be described.

FIG. 7A is a perspective view showing an example of a portable telephone. In FIG. 7A, reference numeral 300 denotes a mobile phone main body, and reference numeral 301 denotes a liquid crystal display unit provided with a liquid crystal display device on which the above-mentioned folding type wiring board 20 or 50 is mounted.

FIG. 7B is a perspective view showing an example of a portable information processing device such as a word processor or a personal computer. Fig. 7 (b)
In the figure, 400 is an information processing device, 401 is an input unit such as a keyboard, 403 is an information processing main body, and 402 is a liquid crystal display unit provided with a liquid crystal display device on which the above-mentioned folding type wiring board 20 or 50 is mounted.

FIG. 7C is a perspective view showing an example of a wristwatch-type electronic device. In FIG. 7C, reference numeral 500 denotes a watch main body, and reference numeral 501 denotes the above-mentioned folding type wiring board 20 or 5.
0 shows a liquid crystal display unit provided with a liquid crystal display device on which the reference numeral 0 is mounted.

FIG. 8 is a schematic configuration diagram showing a main part of a projection type display device using either the above-mentioned bent type wiring substrate 20 or 50 as a light modulation device. In FIG. 8, 61
0 is a light source, 613 and 614 are dichroic mirrors, 6
15, 616 and 617 are reflection mirrors, 618 is an entrance lens, 619 is a relay lens, 620 is an exit lens, 62
2, 623 and 624 are liquid crystal light modulators, 625 is a cross dichroic prism, and 626 is a projection lens.
The light source 610 includes a lamp 611 such as a metal halide and a reflector 612 that reflects light from the lamp. Blue light,
The dichroic mirror 613 that reflects green light is
While transmitting the red light of the light flux from 0, it reflects the blue light and the green light. The transmitted red light is reflected by the reflection mirror 617, and the liquid crystal light modulator 622 for red light is transmitted.
Is incident on. On the other hand, green light among the color lights reflected by the dichroic mirror 613 is reflected by the dichroic mirror 614 that reflects green light, and is incident on the liquid crystal light modulation device 623 for green light. On the other hand, the blue light also passes through the second dichroic mirror 614. For blue light,
In order to prevent light loss due to a long optical path, the incident lens 618,
A light guiding unit 621 including a relay lens system including a relay lens 619 and an emission lens 620 is provided, and blue light is incident on the liquid crystal light modulation device for blue light 624 via this. The three color lights modulated by the respective light modulators enter the cross dichroic prism 625. This prism is formed by bonding four right-angle prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in a cross shape on the inner surface. The three color lights are combined by these dielectric multilayer films to form light representing a color image. The synthesized light is projected on a screen 627 by a projection lens 626 which is a projection optical system,
The image is displayed enlarged.

Each of the electronic devices shown in FIGS. 7A to 7C and FIG. 8 includes a liquid crystal device on which the above-mentioned folding type wiring board 20 or 50 is mounted, so that the production efficiency is improved. In addition, the space inside the electronic device is reduced.

[0079]

As described above, according to the present invention, 1
Provided is a bent-type wiring board base substrate in which a driving circuit and wiring are mounted on a single base substrate, and the driving circuit and the wiring are electrically connected by bending the base substrate. be able to.

Further, by bending the base substrate for a foldable wiring board and electrically connecting the drive circuit and the wiring, the manufacturing process can be shortened, the cost can be reduced, and the labor for parts management can be reduced. And a space-saving folding type wiring board can be provided.

Further, by mounting the bending type wiring board of the present invention, it is possible to provide a liquid crystal device with improved production efficiency and space saving.

Further, by providing the bending type wiring board of the present invention or the liquid crystal device on which the bending type wiring board of the present invention is mounted, it is possible to provide an electronic device with improved production efficiency and space saving inside the electronic device. be able to.

[Brief description of the drawings]

FIGS. 1 (a) and 1 (b) are schematic plan views showing the structure of a bent-type wiring board base substrate according to a first embodiment of the present invention when viewed from the front side and the back side, respectively.

FIGS. 2 (a) to 2 (c) are process diagrams showing a method for manufacturing a bent type wiring board according to the first embodiment of the present invention.

FIGS. 3 (a) and 3 (b) are schematic plan views showing steps of mounting a bendable wiring board according to the first embodiment of the present invention on a liquid crystal panel.

FIGS. 4 (a) and 4 (b) are schematic plan views showing the structure of a bent type wiring board base substrate according to a second embodiment of the present invention when viewed from the front side and the back side, respectively.

FIGS. 5A to 5C are process diagrams showing a method for manufacturing a bent type wiring board according to a second embodiment of the present invention.

6 (a) and 6 (b) are schematic plan views showing steps of mounting a bending type wiring board according to a second embodiment of the present invention on a liquid crystal panel.

7A is a diagram illustrating an example of a mobile phone including a liquid crystal display device implementing the above-described embodiment, and FIG. 7B is a portable type including a liquid crystal display device implementing the above-described embodiment. FIG. 7C is a diagram illustrating an example of an information processing device, and FIG. 7C is a diagram illustrating an example of a wristwatch-type electronic device including a liquid crystal display device in which the above embodiment is mounted.

FIG. 8 is a schematic configuration diagram showing a main part of a projection display device using a liquid crystal device implementing the above-described embodiment as a light modulation device.

FIGS. 9A to 9C are process diagrams illustrating a conventional method for manufacturing a wiring board.

FIGS. 10A and 10B are schematic plan views showing steps of mounting a conventional wiring board on a liquid crystal panel.

[Explanation of symbols]

10, 40 Bend type wiring board base substrate 20, 50 Bend type wiring board 11 Driving circuit mounting part 11A Driving circuit 11B Connection terminal 12, 42 Wiring mounting part 12A, 42A Wiring 12B Connection terminal 12C For external circuit connection Terminal portions 12D, 42D, 42E Terminal portions for connection of liquid crystal panels and the like 42a Main body portion 42b Extension portions 15 Bend portions 30, 60 Liquid crystal panels 30A, 60A, 60B Wiring of liquid crystal panels 34, 64A, 64B Terminals 33 for connection to wiring board 33 , 63A, 63B LCD driver

Continued on the front page F-term (reference) 2H092 GA48 GA50 GA55 MA32 NA25 NA27 RA05 5E338 AA01 AA02 AA12 BB51 BB56 BB75 CC01 CD11 EE22 EE27 EE32 5E344 AA12 BB04 BB11 CC17 EE12 5G435 AA17 AA18 BB12 KK09 EE32 EE

Claims (12)

[Claims] 1. A base substrate for a foldable wiring board on which at least a driving circuit and a wiring are mounted, wherein the base substrate mounts the driving circuit and the wiring at a bent portion. The driving circuit mounting portion and the wiring mounting portion on which the wiring is mounted are divided into blocks, and each of the blocks includes the driving circuit and the wiring mounting portion when the base substrate is bent through the bending portion. A connection terminal for electrically connecting a portion of the base to the wiring. 2. The driving circuit mounting portion, wherein the driving circuit is mounted on a front surface of the base substrate, and the driving circuit is connected to the connection terminal formed on a back surface of the base substrate. In the wiring mounting portion, the wiring is connected to the connection terminal formed on the back surface of the base substrate, and the base substrate is bent at the bending portion, and the driving circuit mounting portion and the wiring mounting portion 2. The electric circuit according to claim 1, wherein the drive circuit and the wiring of the wiring mounting portion are electrically connectable by electrically connecting the formed two connection terminals. Base substrate for bendable wiring board. 3. The bending-type wiring board base substrate according to claim 1 or 2, wherein the bending circuit is bent at the bending portion, and the driving circuit and the wiring of the wiring mounting portion are electrically connected. A bent-type wiring board characterized by the above-mentioned. 4. The liquid crystal panel connection terminal part is provided on the wiring mounting part.
A base substrate for a bent type wiring board according to the above. 5. The bending-type wiring board base substrate according to claim 4, wherein the base portion is bent at the bending portion, and the driving circuit and the wiring of the wiring mounting portion are electrically connected. Bendable wiring board. 6. A liquid crystal device, comprising the bending type wiring board according to claim 5, wherein the liquid crystal panel connection terminal portion is connected to wiring arranged on a side portion of the liquid crystal panel. 7. The liquid crystal panel connecting terminal portion includes a main body portion and an extension portion, and the liquid crystal panel connection terminal portion is provided at two positions of the main body portion and the extension portion. A base substrate for a bent type wiring board according to the above. 8. The bending-type wiring board base substrate according to claim 7, wherein the bending circuit is bent at the bending portion, and the driving circuit and the wiring of the wiring mounting portion are electrically connected. Bendable wiring board. 9. The liquid crystal panel connecting terminal provided on the main body and the wiring arranged on one side of the liquid crystal panel, wherein the bending type wiring board according to claim 8 is provided. A liquid crystal device, wherein the liquid crystal panel connection terminal portion provided on the extension portion is electrically connected to a wiring disposed on the other side of the liquid crystal panel. 10. A base substrate for a foldable wiring board, on which at least a driving circuit and a wiring are mounted and which can be bent at a bending portion, wherein the base substrate has a boundary between the driving circuit and the driving circuit at the bending portion. The circuit is divided into a driving circuit mounting section on which wiring is mounted and a wiring mounting section block on which the wiring is mounted, and each of the blocks electrically connects the driving circuit and the wiring on the wiring mounting section. A connection terminal connected to the base substrate for a bent type wiring board. 11. An electronic apparatus, comprising: the bending-type wiring board according to claim 3. 12. An electronic apparatus comprising the liquid crystal device according to claim 6. Description: