JP2008108909A - Connection structure of flexible wiring board, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connection structure of a flexible wiring board which can improve the reliability by suppressing stress to be applied to a connecting member for electrically connecting a terminal portion of the flexible wiring board and a terminal portion of a body to be connected, and also to provide electronic equipment. <P>SOLUTION: The connection structure of the FPC board 6 includes the FPC board 6 having a conductor interconnection 61 formed on a flexible base film 60 and a terminal portion 63 formed on the conductor interconnection 61, and a frame portion 20 having an interconnection electrode 21. In the connection structure of the FPC board 6, the terminal portion 63 of the FPC board 6 and a solder connection face 22 of the frame portion 20 are electrically connected by a first solder 10. The FPC board 6 is formed with a pair of projections 6a for arranging a second solder 11 not electrically connected to the first solder 10. The pair of projections 6a and the solder connection face 22 are fixed by the second solder 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a connection structure of a flexible wiring board and an electronic device, and more specifically, a terminal portion of a flexible wiring board in which a conductor wiring is formed on a flexible base film and a terminal portion of a connected body. The present invention relates to a connection structure of a flexible wiring board, which is electrically connected by a connection member, and an electronic device.

  In recent years, electronic devices such as portable terminals such as mobile phones and PDAs, personal computers, televisions, video cameras, digital cameras, and game terminals have been made thinner and smaller in order to differentiate them from other products. There is an urgent need to respond to (so-called light, thin and small).

  However, in a liquid crystal display device used for a portable terminal device, for example, a plurality of members such as an array substrate, a counter substrate, a liquid crystal layer, an optical film, a backlight device, a drive circuit, and a power supply circuit are formed in the device. (For example, refer to Patent Document 1). That is, each member is formed densely in order to achieve so-called lightness, thinness, and miniaturization. For this reason, the space for arranging the wiring for connecting these members to each other is extremely small.

  Therefore, in order to connect these members to each other, a flexible printed circuit (FPC) substrate that can be folded or folded is generally used (see, for example, Patent Document 2). That is, the members are connected by bending or folding the FPC board.

  FIG. 56 shows an example of a conventional FPC board connection structure. For example, FIG. 56 shows a connection structure between an array substrate (connected body) of a liquid crystal panel and an FPC substrate. 56A is a plan view showing the connection structure of the FPC board, and FIG. 56B is a cross-sectional view taken along the cutting line 56b-56b ′ shown in FIG. 56A. .

As shown in FIG. 56, the FPC board 100 includes a flexible base film 101 formed of a polyimide film or the like, and a conductor wiring 102 formed using copper foil or the like on both surfaces of the base film 101, An insulating film 103 that protects the conductor wiring 102 is provided. Further, the FPC board 100 is formed with a terminal portion 104 where the insulating film 103 is removed and the conductor wiring 102 is exposed. The terminal portion 104 of the FPC board 100 and the wiring electrode (terminal portion) 105a formed on the array substrate 105 are electrically connected by a connecting member such as a solder 106, for example.
Japanese Patent Laid-Open No. 11-326904 (FIGS. 1-10) Japanese Patent Laid-Open No. 2001-210919 (FIGS. 2 to 4)

  However, in the conventional FPC board connection structure described above, for example, as shown in FIG. 57, when the FPC board is bent and used, the following problems occur.

  The problem is that stress is applied to a connecting member such as solder in which the terminal portion of the FPC board and the terminal portion of the connected body are electrically connected due to the bending stress of the FPC board. For this reason, when an FPC board connection structure is incorporated into an electronic device, or after incorporation, cracks (cracks) may occur in solder as a connection member. If cracks occur in the solder, which is a connecting member, the continuity failure occurs between the terminal portion of the FPC board and the terminal portion of the connected body, and the reliability of the electronic device is reduced.

  The present invention has been made in view of the above problems, and its purpose is to suppress stress applied to a connection member in which a terminal portion of a flexible wiring board and a terminal portion of a connected body are electrically connected. Another object of the present invention is to provide a flexible wiring board connection structure with improved reliability and an electronic device.

  In order to achieve the above object, a flexible wiring board connection structure according to the present invention comprises a flexible wiring board having a conductor wiring and a terminal portion formed on the conductor wiring on a flexible base film, and a terminal portion. In the connection structure of the flexible wiring board, the terminal part of the flexible wiring board and the terminal part of the connected body are electrically connected by a connecting member, the flexible wiring board includes: A reinforcing member arrangement portion for arranging a reinforcing member that is not electrically connected to the connection member is formed, and the reinforcing member arrangement portion and the connected body are fixed by the reinforcing member. Features.

  In order to achieve the above object, an electronic apparatus according to the present invention includes the above connection structure.

  As described above, the flexible wiring board connection structure and the electronic device of the present invention suppress the stress applied to the connection member in which the terminal part of the flexible wiring board and the terminal part of the connected body are electrically connected. This has the effect of improving reliability.

  In order to achieve the above object, a flexible wiring board connection structure according to the present invention comprises a flexible wiring board having a conductor wiring and a terminal portion formed on the conductor wiring on a flexible base film, and a terminal portion. In the connection structure of the flexible wiring board, the terminal part of the flexible wiring board and the terminal part of the connected body are electrically connected by a connecting member, the flexible wiring board includes: A reinforcing member arrangement part for arranging a reinforcing member that is not electrically connected to the connected member is formed, and the reinforcing member arranging part and the connected body are fixed by the reinforcing member. It is characterized by.

  In the connection structure of the flexible wiring board of the present invention, the terminal part of the flexible wiring board and the terminal part of the connected body are electrically connected by a connecting member. The flexible wiring board is formed with a reinforcing member arrangement portion for arranging a reinforcing member that is not electrically connected to the connection member. The reinforcing member arrangement portion and the connected body are fixed by a reinforcing member.

  According to the connection structure of the flexible wiring board of the present invention, the reinforcing member placement portion formed on the flexible wiring board is fixed by the connected body and the reinforcing member. Even so, the bending stress of the flexible wiring board is absorbed by the reinforcing member. For this reason, the stress added to the connection member by which the terminal part of a flexible wiring board and the terminal part of a to-be-connected body are electrically connected can be suppressed. Therefore, poor conduction between the terminal portion of the flexible wiring board and the terminal portion of the connected body can be suppressed. As a result, a flexible wiring board connection structure with improved reliability can be realized.

  In order to achieve the above object, the flexible wiring board connection structure according to the present invention is such that a part of the flexible wiring board is folded so that the conductor wiring of the flexible wiring board is outside, and the flexible wiring board is folded. The terminal part of the board and the terminal part of the body to be connected are electrically connected by the connecting member, and the reinforcing member arrangement part is formed at a place folded in the flexible wiring board. preferable.

  According to this aspect, since the reinforcing member disposition portion is formed at the folded portion in the flexible wiring board, the reinforcing member disposing portion and the connected body of the folded flexible wiring substrate are fixed by the reinforcing member. The For this reason, even when the flexible wiring board is bent and used, for example, the bending stress of the flexible wiring board is absorbed by the reinforcing member. Therefore, it is possible to suppress stress applied to the connection member in which the terminal portion of the folded flexible wiring board and the terminal portion of the connected body are electrically connected. Therefore, poor conduction between the terminal portion of the folded flexible wiring board and the terminal portion of the connected body can be suppressed. As a result, a flexible wiring board connection structure with improved reliability can be realized.

  In order to achieve the above object, the flexible wiring board connection structure according to the present invention is such that a part of the flexible wiring board is folded so that the conductor wiring of the flexible wiring board is outside, and the flexible wiring board is folded. The terminal part of the board and the terminal part of the connected body are electrically connected by the connecting member, and the flexible wiring board includes a protruding board formed to extend outward from the flexible wiring board. It is preferable that the protruding substrate is folded, and the reinforcing member disposition portion is formed at a position folded on the protruding substrate.

  According to this aspect, since the reinforcing member disposition portion is formed at the folded position on the protruding substrate, the reinforcing member disposing portion and the connected body of the folded protruding substrate are fixed by the reinforcing member. For this reason, even when the flexible wiring board is bent and used, for example, the bending stress of the flexible wiring board is absorbed by the reinforcing member. Therefore, it is possible to suppress stress applied to the connection member in which the terminal portion of the folded flexible wiring board and the terminal portion of the connected body are electrically connected. Therefore, poor conduction between the terminal portion of the folded flexible wiring board and the terminal portion of the connected body can be suppressed. As a result, a flexible wiring board connection structure with improved reliability can be realized.

  In order to achieve the above object, the flexible wiring board connection structure according to the present invention is preferably configured such that the flexible wiring board has conductor wiring formed only on one side of the base film.

  According to this aspect, since the conductive wiring is formed on only one surface of the base film, the flexible wiring substrate has less rigidity than the flexible wiring substrate on which the conductive wiring is formed on both surfaces of the base film. . For this reason, the flexible wiring board can be easily folded.

  In order to achieve the above object, the flexible wiring board connection structure according to the present invention is preferably configured such that the reinforcing member disposition portion is at least a pair of protrusions formed outward of the flexible wiring substrate.

  According to this aspect, at least the pair of protruding portions formed on the outside of the flexible wiring board and the connected body are fixed by the reinforcing member. Since at least the pair of projecting portions and the connected body are fixed by the reinforcing member, stable fixing strength can be ensured.

  In order to achieve the above object, in the flexible wiring board connection structure according to the present invention, the reinforcing member placement portion is an outer peripheral surface of at least a pair of notches formed inward of the flexible wiring substrate. Is preferred.

  According to this aspect, the outer peripheral surface of at least a pair of notches formed inside the flexible wiring board and the connected body are fixed by the reinforcing member. Since at least the outer peripheral surface of the pair of notches and the connected body are fixed by the reinforcing member, a stable fixing strength can be ensured. Moreover, since the notch part is formed in the flexible wiring board, the flexible wiring board which can respond to space saving is realizable rather than the protrusion part being formed in the flexible wiring board.

  In order to achieve the above object, the flexible wiring board connection structure according to the present invention is such that the reinforcing member arrangement portion is an outer peripheral surface of a hole formed at substantially the center of both sides of the flexible wiring board. Is preferred.

  According to this aspect, the outer peripheral surface of the hole part formed in the approximate center of the both sides of the flexible wiring board and the connected body are fixed by the reinforcing member. Since the outer peripheral surface of the hole and the connected body are fixed by the reinforcing member, a stable fixing strength can be ensured. Moreover, since the hole is formed in the flexible wiring board, it is possible to realize a flexible wiring board that can cope with space saving as compared with the case where the protruding part is formed on the flexible wiring board.

  In order to achieve the above object, it is preferable that the connection structure of the flexible wiring board according to the present invention is configured such that the reinforcing member arrangement portion is a joint surface formed on the flexible wiring board.

  According to this aspect, the joint surface formed on the flexible wiring board and the connected body are fixed by the reinforcing member. Further, since the joint surface is formed on the flexible wiring board, it is possible to realize a flexible wiring board that can cope with space saving as compared with the case where the protruding part is formed on the flexible wiring board. Furthermore, since the protrusion part, the notch part, and the hole part are not formed in the flexible wiring board, the flexible wiring board which can suppress manufacturing cost is realizable.

  In order to achieve the above object, it is preferable that the connection structure of the flexible wiring board according to the present invention is configured such that the joint surface is formed of at least a pair formed inward of the flexible wiring board.

  According to this aspect, at least the pair of joint surfaces formed on the inner side of the flexible wiring board and the connected body are fixed by the reinforcing member. Since at least the pair of joint surfaces and the connected body are fixed by the reinforcing member, stable fixing strength can be ensured.

  In order to achieve the above object, it is preferable that the connection structure of the flexible wiring board in the present invention has an aspect in which the joint surface is formed over the entire width direction of the flexible wiring board.

  According to this aspect, the joint surface formed over the entire width direction of the flexible wiring board and the connected body are fixed by the reinforcing member. Since the joint surface formed over the entire width direction and the connected body are fixed by the reinforcing member, a stable fixing strength can be ensured.

  In order to achieve the above object, in the flexible wiring board connection structure according to the present invention, the protruding board includes an extended board formed to extend in the length direction of the flexible wiring board, and the protruding board includes: When folded, the extended board is preferably arranged so as to cover the connecting member to which the terminal part of the flexible wiring board and the terminal part of the connected body are connected.

  According to this aspect, the protruding substrate includes the extended substrate, and when the protruding substrate is folded, the extended substrate is disposed so as to cover the connection member. For this reason, the connection member to which the terminal portion of the flexible wiring board and the terminal portion of the connected body are electrically connected can be prevented from being short-circuited by contact with another metal member, for example, by the extended substrate. Therefore, a flexible wiring board connection structure with improved reliability can be realized.

  In order to achieve the above object, an electronic apparatus according to the present invention includes the above connection structure.

  According to this aspect, the electronic apparatus includes the flexible wiring board connection structure with improved reliability. For this reason, an electronic device with improved reliability can be realized.

  Hereinafter, more specific embodiments of the present invention will be described in detail with reference to the drawings. However, in the drawings referred to below, for the convenience of explanation, among the constituent members of one embodiment of the present invention, only the main members necessary for explaining the present invention are shown in a simplified manner. Therefore, the flexible wiring board connection structure and the electronic device according to the present invention can include arbitrary constituent members that are not shown in the drawings referred to in this specification. Moreover, the dimension of the member in each figure does not faithfully represent the dimension of the actual component member, the dimension ratio of each member, or the like.

(Embodiment 1)
One embodiment of the present invention is described below with reference to FIGS. FIG. 1 is a perspective view of a liquid crystal panel. 2 and 4 are plan views of the FPC board. 3 and 5 are a plan view and a cross-sectional view showing the connection structure of the FPC board. FIG. 6 is a view showing a state in which the FPC board is bent.

  Hereinafter, before describing the connection structure of the FPC board in detail, the configuration of the liquid crystal display device (electronic device) including the connection structure of the FPC board will be briefly described. Electronic devices having an FPC board connection structure include not only liquid crystal display devices but also portable terminal devices such as mobile phones and PDAs, personal computers, televisions, video cameras, digital cameras, and game terminals. It is. In other words, an electronic device provided with an FPC board connection structure only needs to have this connection structure, and the type and application thereof are not particularly limited.

  The liquid crystal display device includes a liquid crystal panel and a backlight device provided on the back surface of the liquid crystal panel.

  As shown in FIG. 1, the liquid crystal panel 1 includes an array substrate 2, a counter substrate 3, a driver circuit 4, an optical film 5, an FPC substrate 6, a resin frame 7, and the like.

  The array substrate 2 is a substrate in which TFTs (Thin Film Transistors) that are switching elements and pixel electrodes are formed in a matrix on a transparent glass substrate. The counter substrate 3 is a substrate in which, for example, filter layers of three colors of red, green, and blue are formed on a transparent glass substrate. The array substrate 2 has a frame portion 20 that protrudes more than the counter substrate 3. The driver circuit 4 is a circuit for driving TFTs formed on the array substrate 2, and is mounted on the upper surface of the frame portion 20 by a COG (Chip on glass) method. A liquid crystal layer (not shown) is sandwiched between the array substrate 2 and the counter substrate 3. The optical film 5 is, for example, a polarizing plate or a diffusion film. The optical film 5 is provided on the upper surface of the counter substrate 3. An optical film (not shown) is also provided on the lower surface of the array substrate 2.

  The FPC board 6 is a flexible board in which conductor wiring is formed on a base film made of a resin film such as polyimide. On the FPC board 6, electronic components 40 such as a power supply circuit and a control circuit are mounted. Further, the FPC board 6 is connected to wiring electrodes formed on the frame part 20 of the array board 2. For this reason, a control signal, a power supply voltage, etc. can be supplied from the electronic component 40 mounted on the FPC board 6 to the driver circuit 4 mounted on the frame portion 20 of the array substrate 2 with the FPC board 6 interposed therebetween. The detailed configuration of the FPC board 6 will be described later.

  The resin frame 7 is a frame for fixing the array substrate 2 and the counter substrate 3. When the resin frame 7 is attached to the array substrate 2 and the counter substrate 3 side, the liquid crystal panel 1 is formed. The components of the liquid crystal panel 1 are not limited to these members. For example, in a monochrome liquid crystal panel, filter layers of three colors of red, green, and blue do not have to be formed on the counter substrate. Instead of TFTs that are switching elements of the array substrate 2, MIM (Metal Insulator Metal) may be formed.

  A backlight device (not shown) includes a light emitting diode (LED) that is a light source, a light guide plate that totally reflects light incident from the light emitting diode, and emits the light to the liquid crystal panel 1 side, outside the light guide plate. A reflection sheet that reflects the emitted light and returns it to the light guide plate again, a diffusion sheet that uniformly diffuses the light emitted from the light guide plate, two lens sheets that collect the light emitted from the light guide plate, and a reflection sheet And the like, and a resin frame for fixing each of these members. Note that the constituent elements of the backlight device are not limited to these members. For example, instead of a light emitting diode, a cold cathode tube may be provided as a light source, or a reflective sheet and a protective sheet may be used as a single sheet. Further, one lens sheet may be used. Further, when the liquid crystal panel 1 is of a reflective type, the liquid crystal display device does not have to be provided with a backlight device.

  Next, the connection structure of the FPC board 6 of this embodiment will be described in detail. Hereinafter, a connection structure between the frame portion 20 of the array substrate 2 of the liquid crystal panel 1 and the FPC substrate 6 will be described as an example.

  First, as shown in FIG. 2, the FPC board 6 includes a base film 60, conductor wiring 61, and an insulating film 62. The base film 60 is a flexible film formed from a polyimide film or a polyester film. The conductor wiring 61 is a wiring formed on both surfaces of the base film 60 using a copper foil or the like. The insulating film 62 is a film that protects the conductor wiring 61. That is, the FPC board 6 is an FPC board having a double-sided structure in which the conductor wiring 61 is formed on both sides of the base film 60, but is not limited thereto. For example, the FPC board 6 may have a single-side structure in which the conductor wiring 61 is formed only on one side of the base film 60, or may have a multilayer structure in which the conductor wiring 61 is formed in multiple layers. . The FPC board 6 has through holes (not shown) for electrically connecting the conductor wirings 61 formed on both surfaces of the base film 60. FIG. 2 shows an example in which two conductor wirings 61 are formed on the FPC board 6, but the present invention is not limited to this. An arbitrary number of conductor wirings 61 may be formed on the FPC board 6.

  The FPC board 6 is formed with a terminal portion 63 from which the insulating film 62 is removed and the conductor wiring 61 is exposed. That is, the terminal part 63 is formed in the conductor wiring 61. Further, the FPC board 6 is formed with a pair of semicircular protrusions (reinforcing member arrangement parts) 6 a formed outward in the width direction from both sides of the FPC board 6. The pair of projecting portions 6a is formed between the terminal portion 63 and a bent portion W (see FIG. 6) where a part of the FPC board 6 is bent. In addition, the shape of the protrusion part 6a is not limited to said semicircle shape. For example, the shape of the protrusion 6a may be a triangle, a rectangle, a polygon, or the like. Moreover, the notch may be formed in the protrusion part 6a and the protrusion part may be further formed in the protrusion part 6a.

  As shown in FIG. 3, the terminal portion 63 of the FPC board 6 includes a wiring electrode (terminal portion) 21 formed on the frame portion (connected body) 20 of the array substrate 2 and a first solder (connection member). ) 10 is electrically connected. As a connection method, for example, the first solder 10 is applied to the terminal portion 63, and the terminal portion 63 to which the first solder 10 is applied and the wiring electrode 21 are overlapped. The first solder 10 is fused and connected to the overlapped terminal portion 63 and the wiring electrode 21 by applying heat and pressure.

  Further, the protruding portion 6 a of the FPC board 6 is fixed by a solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2 and a second solder (reinforcing member) 11. The second solder 11 is disposed so as not to be electrically connected to the first solder 10 to which the terminal portion 63 and the wiring electrode 21 are connected. Since the pair of protrusions 6a and the solder connection surface 22 are fixed by the second solder 11, a stable fixing strength can be ensured.

  In the above description, the example in which the protrusions 6a are formed as a pair outward in the width direction from both sides of the FPC board 6 has been described. For example, as shown in FIG. Two pairs may be formed outward in the width direction from the both side portions. As a result, as shown in FIG. 5, the two pairs of protrusions 6a and the solder connection surfaces 22 are fixed by the second solder 11, so that the pair of protrusions 6a and the solder connection surfaces 22 are the second solder. Compared with the example fixed by 11, stable fixing strength can be secured. Note that the protrusions 6 a are not limited to an example in which a pair or two of the protrusions 6 a are formed outward in the width direction from both sides of the FPC board 6.

  As described above, according to the connection structure of the FPC board 6 in the present embodiment, the pair of protrusions 6 a formed between the bent part W of the FPC board 6 and the terminal part 63 of the FPC board 6 are provided. Since the solder connection surface 22 of the frame portion 20 and the second solder 11 are fixed, for example, the bending stress due to the bent portion W of the FPC board 6 is absorbed by the second solder 11 as shown in FIG. The For this reason, the stress added to the 1st solder 10 in which the terminal part 63 of the FPC board | substrate 6 and the wiring electrode 21 of the frame part 20 are electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 63 of the FPC board 6 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, the connection structure of the FPC board 6 with improved reliability can be realized.

(Embodiment 2)
Still another embodiment of the present invention will be described below with reference to FIGS. 7 and 9 are plan views of the FPC board. 8 and 10 are a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to the structure demonstrated in Embodiment 1, the same referential mark as Embodiment 1 is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 7, the FPC board 6 of the present embodiment is replaced with a pair of semicircular cutouts formed inward in the width direction from both sides of the FPC board 6, instead of the protrusions 6 a of the first embodiment. 6b is formed. An outer peripheral surface (reinforcing member placement portion) 60b that is a solder bonding surface is formed on the outer periphery of the notch portion 6b. The outer peripheral surface 60b which is a solder bonding surface is formed from, for example, a land or a pad. The pair of notches 6 b is formed between the terminal portion 63 and the bent portion W. Unlike the FPC board 6 of the first embodiment, the FPC board 6 of the present embodiment does not have the protrusions 6a, so that an FPC board that can cope with space saving can be realized. In addition, the shape of the notch part 6b is not limited to said semicircle shape. For example, the shape of the notch 6b may be triangular, rectangular, polygonal, or the like.

  As shown in FIG. 8, the outer peripheral surface 60 b of the cutout portion 6 b of the FPC board 6 has a solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2 and a second solder (reinforcement). Member) 11. Since the outer peripheral surface 60b of the pair of notches 6b and the solder connection surface 22 are fixed by the second solder 11, stable fixing strength can be ensured.

  Incidentally, in the above description, an example in which the notch portions 6b are formed in a pair inward in the width direction from both side portions of the FPC board 6 has been described. For example, as shown in FIG. Two pairs may be formed inward in the width direction from both side portions. As a result, as shown in FIG. 10, the outer peripheral surface 60b of the two pairs of notches 6b and the solder connection surface 22 are fixed by the second solder 11, so that the outer peripheral surface 60b of the pair of notches 6b and the solder connection are connected. Compared to the example in which the surface 22 is fixed by the second solder 11, a stable fixing strength can be ensured. The notches 6b are not limited to an example in which a pair or two of the notches 6b are formed inward in the width direction from both sides of the FPC board 6.

  In addition, for example, the notches 6b are formed in a pair or two inward in the width direction from both sides of the FPC board 6, and the protrusions 6a described in the first embodiment are outward in the width direction from both sides of the FPC board 6. One or two pairs may be formed. Thereby, since the outer peripheral surface 60b of the protrusion part 6a and the notch part 6b, and the solder connection surface 22 are fixed by the 2nd solder 11, stable fixing strength can be ensured.

  As described above, according to the connection structure of the FPC board 6 in the present embodiment, the pair of notch parts 6b formed between the bent part W of the FPC board 6 and the terminal part 63 of the FPC board 6 are provided. Since the outer peripheral surface 60 b is fixed by the solder connection surface 22 of the frame portion 20 and the second solder 11, the bending stress due to the bent portion W of the FPC board 6 is absorbed by the second solder 11. For this reason, the stress added to the 1st solder 10 in which the terminal part 63 of the FPC board | substrate 6 and the wiring electrode 21 of the frame part 20 are electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 63 of the FPC board 6 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, the connection structure of the FPC board 6 with improved reliability can be realized.

(Embodiment 3)
Still another embodiment of the present invention will be described below with reference to FIGS. 11, 13, 15 and 17 are plan views of the FPC board. 12, FIG. 14, FIG. 16 and FIG. 18 are a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 11, the FPC board 6 of this embodiment has an elliptical hole 6 c formed at substantially the center of both sides of the FPC board 6, instead of the notch 6 b of the second embodiment. The hole 6 c is formed at one place of the FPC board 6. On the outer periphery of the hole 6c, an outer peripheral surface (reinforcing member arrangement portion) 60c, which is a solder bonding surface, is formed. The outer peripheral surface 60c, which is a solder bonding surface, is formed from, for example, lands or pads. The hole 6 c is formed between the terminal portion 63 and the bent portion W. Unlike the FPC board 6 of the first embodiment, the FPC board 6 of the present embodiment does not have the protrusions 6a, so that an FPC board that can cope with space saving can be realized. Note that the shape of the hole 6c is not limited to the elliptical shape described above. For example, the hole 6c may have a circular shape, a triangular shape, a rectangular shape, a polygonal shape, or the like.

  As shown in FIG. 12, the outer peripheral surface 60c of the hole 6c of the FPC board 6 has a solder connection surface (connected body) 22 formed on the frame part 20 of the array substrate 2 and a second solder (reinforcement). Member) 11. The second solder 11 passes through the hole 6c. That is, since the hole 6c is formed at substantially the center of both sides of the FPC board 6, the outer peripheral surface 60c of the hole 6c and the solder connection surface 22 by the second solder 11 ensure stable fixing strength. it can.

  In the above description, the example in which the hole 6c is formed at one place in the approximate center in the width direction of the FPC board 6 has been described. For example, as shown in FIG. It may be formed at two locations in the approximate center of both side portions. As a result, as shown in FIG. 14, the outer peripheral surface 60c of the two holes 6c and the solder connection surface 22 are fixed by the second solder 11, so that the outer peripheral surface 60c of the one hole 6c and the solder Compared to the example in which the connection surface 22 is fixed by the second solder 11, a stable fixing strength can be ensured. In addition, the hole 6c is not limited to the example formed in one place or two places of the approximate center of both sides of the FPC board 6.

  Further, for example, as shown in FIG. 15, the hole 6 c is formed at one place in the approximate center of both sides of the FPC board 6, and the protruding part 6 a described in the first embodiment extends from both sides of the FPC board 6. A pair may be formed outward in the width direction. As a result, as shown in FIG. 16, not only the outer peripheral surface 60c of the hole 6c but also the protrusion 6a is connected by the solder connection surface 22 and the second solder 11, so that the comparison with the example shown in FIG. Thus, a stable fixing strength can be secured.

  Further, for example, as shown in FIG. 17, the hole 6 c is formed at one place in the approximate center of both sides of the FPC board 6, and the notch 6 b described in the second embodiment is formed from both sides of the FPC board 6. A pair may be formed inward in the width direction. As a result, as shown in FIG. 18, not only the outer peripheral surface 60c of the hole 6c but also the outer peripheral surface 60b of the notch 6b is connected to the solder connection surface 22 by the second solder 11, so that FIG. Compared to the example shown, stable fixing strength can be ensured.

  As described above, according to the connection structure of the FPC board 6 in the present embodiment, the outer peripheral surface of the hole 6 c formed between the bent part W of the FPC board 6 and the terminal part 63 of the FPC board 6. Since 60 c is fixed by the solder connection surface 22 of the frame portion 20 and the second solder 11, the bending stress due to the bent portion W of the FPC board 6 is absorbed by the second solder 11. For this reason, the stress added to the 1st solder 10 in which the terminal part 63 of the FPC board | substrate 6 and the wiring electrode 21 of the frame part 20 are electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 63 of the FPC board 6 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, the connection structure of the FPC board 6 with improved reliability can be realized.

(Embodiment 4)
Another embodiment of the present invention will be described below with reference to FIGS. 19, 21, 23, 25, 27, 29, and 31 are plan views of the FPC board. 20, FIG. 22, FIG. 24, FIG. 26, FIG. 28, FIG. 30 and FIG. 32 are a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 19, the FPC board 6 of the present embodiment is replaced with a pair from the both sides of the FPC board 6 inward in the width direction, instead of the protrusions 6 a, the notches 6 b and the holes 6 c of the first to third embodiments. A semicircular joint surface (reinforcing member placement portion) 6d is formed. The bonding surface 6 d is formed on the upper surface of the FPC board 6. The joining surface 6d is formed from, for example, a land or a pad. The pair of joining surfaces 6d is formed between the terminal portion 63 and the bent portion W. Unlike the FPC board 6 of the first embodiment, the FPC board 6 of the present embodiment does not have the protrusions 6a, so that an FPC board that can cope with space saving can be realized. Moreover, since the protrusion part 6a, the notch part 6b, and the hole part 6c are not formed in the FPC board 6 of this embodiment like the FPC board 6 of Embodiment 1-3, the FPC board 6 which can suppress manufacturing cost. Can be realized. The shape of the joint surface 6d is not limited to the semicircular shape described above. For example, the shape of the joint surface 6d may be a triangle shape, a rectangular shape, a polygonal shape, or the like.

  As shown in FIG. 20, the joining surface 6 d of the FPC board 6 is formed by a solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2 and a second solder (reinforcing member) 11. It is fixed. Since the pair of joining surfaces 6d and the solder connection surface 22 are fixed by the second solder 11, a stable fixing strength can be ensured.

  In the above description, an example in which a pair of bonding surfaces 6d are formed inward in the width direction from both sides of the FPC board 6 has been described. For example, as illustrated in FIG. Two pairs may be formed inward in the width direction from both side portions. As a result, as shown in FIG. 22, the two pairs of joint surfaces 6d and the solder connection surfaces 22 are fixed by the second solder 11, so that the pair of joint surfaces 6d and the solder connection surfaces 22 are the second solder. Compared with the example fixed by 11, stable fixing strength can be secured. The bonding surfaces 6d are not limited to an example in which a pair or two pairs are formed inward in the width direction from both side portions of the FPC board 6.

  Further, in the above description, an example in which the bonding surfaces 6d are formed in a pair or two inward in the width direction from both sides of the FPC board 6 has been described. For example, as illustrated in FIG. It may be formed over the entire width direction of the FPC board 6. Accordingly, as shown in FIG. 24, the entire width direction of the FPC board 6 can be fixed by the second solder 11, so that the bonding surface 6d by the second solder 11 and the solder connection surface 22 have a stable fixing strength. It can be secured.

  Further, for example, as shown in FIG. 25, the bonding surface 6 d is formed over the entire width direction of the FPC board 6, and the protruding portions 6 a described in the first embodiment are outside the width direction from both sides of the FPC board 6. A pair may be formed. As a result, as shown in FIG. 26, the entire width direction of the FPC board 6 can be fixed by the second solder 11, and the outer periphery of the FPC board 6 in contact with the second solder 11 becomes longer by the protrusion 6a. Compared with the example shown in FIG. 23, stable fixing strength can be ensured.

  Further, for example, as shown in FIG. 27, the bonding surface 6 d is formed over the entire width direction of the FPC board 6, and the notch portions 6 b described in the second embodiment are formed in the width direction from both sides of the FPC board 6. A pair may be formed. As a result, as shown in FIG. 28, the entire width direction of the FPC board 6 can be fixed by the second solder 11, and the outer periphery of the FPC board 6 in contact with the second solder 11 becomes longer by the notch 6b. Compared with the example shown in FIG. 23, stable fixing strength can be ensured.

  Further, for example, as shown in FIG. 29, the bonding surface 6 d is formed over the entire width direction of the FPC board 6, and the notches 6 b described in the second embodiment are formed in the width direction from both sides of the FPC board 6. A pair of holes 6c formed in the opposite direction and the hole 6c described in the third embodiment may be formed at approximately one center of both sides of the FPC board 6. As a result, as shown in FIG. 30, the entire width direction of the FPC board 6 can be fixed by the second solder 11, and the outer periphery of the FPC board 6 in contact with the second solder 11 is notched 6b and hole 6c. Therefore, a stable fixing strength can be ensured as compared with the example shown in FIG.

  Further, for example, as shown in FIG. 31, the bonding surface 6 d is formed over the entire width direction of the FPC board 6, and the protruding portions 6 a described in the first embodiment are outside the width direction from both sides of the FPC board 6. The hole 6c described in the third embodiment may be formed substantially at the center of both sides of the FPC board 6. As a result, as shown in FIG. 32, the entire width direction of the FPC board 6 can be fixed by the second solder 11, and the outer periphery of the FPC board 6 that is in contact with the second solder 11 has a protrusion 6a and a hole 6c. Therefore, a stable fixing strength can be ensured as compared with the example shown in FIG.

  As described above, according to the connection structure of the FPC board 6 in the present embodiment, the joint surface 6d formed between the bent part W of the FPC board 6 and the terminal part 63 of the FPC board 6 has the frame. Since the solder connection surface 22 of the portion 20 and the second solder 11 are fixed, the bending stress due to the bent portion W of the FPC board 6 is absorbed by the second solder 11. For this reason, the stress added to the 1st solder 10 in which the terminal part 63 of the FPC board | substrate 6 and the wiring electrode 21 of the frame part 20 are electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 63 of the FPC board 6 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, the connection structure of the FPC board 6 with improved reliability can be realized.

(Embodiment 5)
Embodiments 1 to 4 have described examples in which a protruding portion, a cutout portion, a hole portion, and a bonding surface are formed on an FPC board. On the other hand, Embodiment 5-8 demonstrates the example by which the protrusion part, the notch part, the hole part, and the joint surface are formed in the folding part of the folded FPC board | substrate.

  First, an embodiment in which a protruding portion is formed in a folded portion of a folded FPC board will be described below with reference to FIGS. 33 and 34. FIG. 33 is a plan view of the FPC board. FIG. 34 is a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 33, the FPC board 8 of the present embodiment uses a flexible base film 80 formed of a polyimide film, a polyester film, or the like, and a copper foil or the like on one side of the base film 80. A formed conductor wiring 81 is provided. That is, the FPC board 8 is a single-sided FPC board in which the conductor wiring 81 is formed only on one side, but is not limited thereto. For example, the FPC board 8 may have a double-sided structure in which the conductor wiring 81 is formed on both sides of the base film 80, or a multilayer structure in which the conductor wiring 81 is formed in multiple layers. However, in the present embodiment, since a part (folding portion) of the FPC board 8 described later is folded, it is preferable that the FPC board has a single-sided structure that is less rigid than a double-sided FPC board. Thereby, the FPC board can be easily folded. Although FIG. 33 shows an example in which two conductor wirings 81 are formed, the present invention is not limited to this. An arbitrary number of conductor wirings 81 may be formed on the FPC board 8.

  The FPC board 8 includes a folding part 82 that is folded along the folding line A so that the conductor wiring 81 is on the outside. That is, the folding part 82 is folded on the upper surface of the FPC board 8. Further, the vicinity of the folded conductor wiring 81 is formed as the terminal portion 83.

  A pair of semicircular protrusions (reinforcing member placement portions) 8 a are formed on the folding portion 82 of the FPC board 8 outward in the width direction from both sides of the end portion of the folding portion 82. In addition, the shape of the protrusion part 8a is not limited to said semicircle shape. For example, the shape of the protruding portion 8a may be triangular, rectangular, polygonal, or the like. Moreover, the notch may be formed in the protrusion part 8a and the protrusion part may be further formed in the protrusion part 8a. In addition, the pair of projecting portions 8 a of the folded portion 82 in the folded state is formed between the terminal portion 83 and the bent portion W.

  Further, the FPC board 8 has a pair of cutouts 84 formed in parallel to the fold line A from both sides of the FPC board 8 inward in the width direction. Since the pair of cutout portions 84 are formed in parallel with the fold line A, the fold portion 82 can be easily folded on the upper surface of the FPC board 8 along the fold line A. Furthermore, a pair of notches 85 are formed on the FPC board 8 so as to face the pair of protrusions 8a when the folding portion 82 is folded along the folding line A.

  As shown in FIG. 34, the FPC board 8 has a folding portion 82 folded on the upper surface of the FPC board 8 so that the conductor wiring 81 is on the outside. The terminal part 83 of the folded part 82 is electrically connected to the wiring electrode (terminal part) 21 formed on the frame part 20 of the array substrate 2 by the first solder (connection member) 10.

  Further, the protruding portion 8 a formed in the folded portion 82 is fixed by the solder connection surface (connected body) 22 and the second solder (reinforcing member) 11 formed in the frame portion 20 of the array substrate 2. Has been. The second solder 11 is disposed so as not to be electrically connected to the first solder 10 to which the terminal portion 83 and the wiring electrode 21 are connected. Since the pair of protrusions 8a and the solder connection surface 22 are fixed by the second solder 11, a stable fixing strength can be ensured. Further, since the pair of notches 85 are formed so as to face the pair of protrusions 8a, the second solder 11 is disposed in the pair of notches 85. For this reason, the fixing strength between the pair of protruding portions 8a and the solder connection surface 22 by the second solder 11 is stable.

  By the way, in the above description, an example in which a pair of the protruding portions 8a are formed outward in the width direction from both sides of the folded folded portion 82 has been described. For example, the protruding portions 8a are formed in the folded folded portion 82. Two pairs may be formed outward in the width direction from both side portions. Thus, since the two pairs of protrusions 8a and the solder connection surface 22 are fixed by the second solder 11, the pair of protrusions 8a and the solder connection surface 22 are fixed by the second solder 11. Compared to the above, stable fixing strength can be secured. In addition, the protrusion part 8a is not limited to the example currently formed in a pair or two pairs in the width direction outward from the both sides of the folded-up folded part 82.

  As described above, according to the connection structure of the FPC board 8 of the present embodiment, the pair of projecting portions 8a are formed at the folded portions in the folding portion 82, so that the folded folding portion 82 The pair of protrusions 8 a and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 8 is absorbed by the second solder 11. Therefore, it is possible to suppress stress applied to the first solder 10 in which the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20 are electrically connected. Accordingly, it is possible to suppress poor conduction between the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20. As a result, the connection structure of the FPC board 8 with improved reliability can be realized.

(Embodiment 6)
Still another embodiment of the present invention will be described below with reference to FIGS. FIG. 35 is a plan view of the FPC board. FIG. 36 is a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  The folded portion 82 of the FPC board 8 of the present embodiment is replaced with a pair of semicircles inward in the width direction from both sides of the end portion of the folded portion 82, as shown in FIG. 35, instead of the protruding portion 8a of the fifth embodiment. A notch 8b having a shape is formed. An outer peripheral surface (reinforcing member placement portion) 80b, which is a solder bonding surface, is formed on the outer periphery of the notch portion 8b. The outer peripheral surface 80b, which is a solder bonding surface, is formed from, for example, lands or pads. The outer peripheral surface 80b of the notch 8b is formed on the upper surface of the folding portion 82 when the folding portion 82 is folded on the upper surface of the FPC board 8 along the folding line A. Since the folding part 82 of the present embodiment is not formed with the protruding part 8a unlike the folding part 82 of the fifth embodiment, the FPC board 8 that can be saved in space can be realized. In addition, the shape of the notch 8b is not limited to the semicircular shape described above. For example, the shape of the notch 8b may be triangular, rectangular, polygonal, or the like. Further, the pair of cutout portions 8 b of the folded portion 82 in the folded state is formed between the terminal portion 83 and the bent portion W.

  In addition, the pair of cutout portions 85 formed in the FPC board 8 is formed in substantially the same size as the pair of cutout portions 8b formed in the folding portion 82, but is not limited thereto.

  As shown in FIG. 36, the FPC board 8 has a folded portion 82 folded on the upper surface of the FPC board 8 so that the conductor wiring 81 is on the outside. The outer peripheral surface 80b of the notch 8b formed in the folded portion 82 is a solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2 and the second solder (reinforcing member) 11. It is fixed by. Since the outer peripheral surface 80b of the pair of notches 8b and the solder connection surface 22 are fixed by the second solder 11, stable fixing strength can be ensured.

  By the way, in the above description, the example in which the notch portions 8b are formed in a pair inward in the width direction from both sides of the folded folded portion 82 has been described. For example, the notched portions 8b are folded in the folded folded portion 82. Two pairs may be formed inward in the width direction from both side portions. Thereby, since the outer peripheral surface 80b of the two pairs of notches 8b and the solder connection surface 22 are fixed by the second solder 11, the outer peripheral surface 80b of the pair of notches 8b and the solder connection surface 22 are the second. Compared to the example in which the solder 11 is fixed, stable fixing strength can be secured. Note that the notches 8b are not limited to an example in which a pair or two of the notches 8b are formed inward in the width direction from both sides of the folded portion 82.

  As described above, according to the connection structure of the FPC board 8 of the present embodiment, the pair of cutout portions 8b are formed at the folded portions in the folding portion 82, so that the folded folding portion 82 The outer peripheral surface 80 b of the pair of notches 8 b and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 8 is absorbed by the second solder 11. Therefore, it is possible to suppress stress applied to the first solder 10 in which the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20 are electrically connected. Accordingly, it is possible to suppress poor conduction between the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20. As a result, the connection structure of the FPC board 8 with improved reliability can be realized.

(Embodiment 7)
Still another embodiment of the present invention will be described below based on FIG. 37 and FIG. FIG. 37 is a plan view of the FPC board. FIG. 38 is a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  In the FPC board 8 of the present embodiment, in addition to the notch portion 8b of the seventh embodiment, as shown in FIG. 37, an elliptical hole portion 8c is formed at the approximate center of both side portions of the folded portion 82. The hole 8 c is formed at one place of the folding part 82 of the FPC board 8. On the outer periphery of the hole 8c, an outer peripheral surface (reinforcing member placement portion) 80c, which is a solder bonding surface, is formed. The outer peripheral surface 80c, which is a solder bonding surface, is formed from, for example, lands or pads. The outer peripheral surface 80c of the hole 8c is formed on the upper surface of the folding portion 82 when the folding portion 82 is folded on the upper surface of the FPC board 8 along the folding line A. Unlike the folding part 82 of Embodiment 5, the folding part 82 of this embodiment does not have the protruding part 8a, so that the FPC board 8 that can cope with space saving can be realized. Note that the shape of the hole 8c is not limited to the elliptical shape described above. For example, the shape of the hole 8c may be a circular shape, a triangular shape, a rectangular shape, a polygonal shape, or the like. Further, the hole 8 c of the folded portion 82 in the folded state is formed between the terminal portion 83 and the bent portion W.

  In addition, when the folding portion 82 is folded along the folding line A, the FPC board 8 has an elliptical shape in the approximate center of both sides of the FPC board 8 so as to face the hole 8c formed in the folding portion 82. A hole 80c is formed. The hole part 81c formed in the FPC board 8 is formed in substantially the same size as the hole part 8c formed in the folding part 82, but is not limited to this.

  As shown in FIG. 38, such an FPC board 8 has a folded portion 82 folded on the upper surface of the FPC board 8 so that the conductor wiring 81 is on the outside. The outer peripheral surface 80c of the hole 8c and the outer peripheral surface 80b of the notch 8b formed in the folded portion 82 are folded with the solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2. 2 solder (reinforcing member) 11. That is, since not only the outer peripheral surface 80b of the notch portion 8b but also the outer peripheral surface 80c of the hole portion 8c is fixed by the solder connection surface 22 and the second solder 11, stable fixing is possible as compared with the sixth embodiment. Strength can be secured.

  By the way, in the above description, the example in which the hole 8c is formed at one central position on both sides of the folded part 82 has been described. For example, the hole 8c is formed by folding the folded part 82. You may form in two places of the approximate center of both sides. As a result, the outer peripheral surface 80c of the two holes 8c and the solder connection surface 22 are fixed by the second solder 11, so that the outer peripheral surface 80c of the one hole 8c and the solder connection surface 22 are the second. Compared with the example fixed by the solder 11, stable fixing strength can be secured. In addition, the hole part 8c is not limited to the example currently formed in one place or two places of the approximate center of the both sides of the folded-up folding part 82. FIG.

  As described above, according to the connection structure of the FPC board 8 of the present embodiment, the cutout portion 8b and the hole portion 8c are formed at the folded portion in the folding portion 82, so that the folded portion is folded. The outer peripheral surface 80 b of the notch 8 b and the outer peripheral surface 80 c of the hole 8 c and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 8 is absorbed by the second solder 11. Therefore, it is possible to suppress stress applied to the first solder 10 in which the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20 are electrically connected. Accordingly, it is possible to suppress poor conduction between the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20. As a result, the connection structure of the FPC board 8 with improved reliability can be realized.

(Embodiment 8)
Still another embodiment of the present invention will be described below with reference to FIGS. 39, 40 and 42 are plan views of the FPC board. 41 and 43 are a plan view and a cross-sectional view showing a connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  The folding part 82 of the FPC board 8 of this embodiment is replaced with the protrusion part 8a, the notch part 8b, and the hole part 8c of Embodiments 5-7, and both sides of the edge part of the folding part 82 are shown in FIG. A pair of rectangular joint surfaces (reinforcing member placement portions) 8d are formed inward in the width direction. The joint surface 8d is formed of, for example, a land or a pad. The joint surface 8d is formed on the upper surface of the folding portion 82 when the folding portion 82 is folded on the upper surface of the FPC board 8 along the folding line A. Since the folding part 82 of the present embodiment is not formed with the protruding part 8a unlike the folding part 82 of the fifth embodiment, the FPC board 8 that can be saved in space can be realized. Moreover, since the protrusion part 8a, the notch part 8b, and the hole part 8c are not formed in the folding part 82 of this embodiment like the folding part 82 of Embodiment 5-7, the FPC board 8 which can suppress manufacturing cost. Can be realized. The shape of the bonding surface 8d is not limited to the above rectangular shape. For example, the shape of the joint surface 8d may be a semicircular shape, a triangular shape, a polygonal shape, or the like. In addition, the pair of joint surfaces 8 d of the folded portion 82 in the folded state are formed between the terminal portion 83 and the bent portion W.

  As shown in FIG. 40, the FPC board 8 is configured so that when the folding part 82 is folded along the folding line A, the FPC board 8 faces the pair of joint surfaces 8 d formed on the folding part 82. It is preferable that a pair of notches 85 are formed inward in the width direction from both side portions. The effect will be described later.

  As shown in FIG. 41, such an FPC board 8 has a folded portion 82 folded on the upper surface of the FPC board 8 so that the conductor wiring 81 is on the outside. The joint surface 8 d formed on the folded portion 82 is fixed by a solder connection surface (connected body) 22 and a second solder (reinforcing member) 11 formed on the frame portion 20 of the array substrate 2. Yes. Since the pair of joining surfaces 8d and the solder connection surface 22 are fixed by the second solder 11, a stable fixing strength can be ensured.

  As shown in FIG. 40, when the pair of cutout portions 85 are formed in the FPC board 8 so as to face the pair of bonding surfaces 8d, the second solder 11 is disposed in the pair of cutout portions 85. Become so. For this reason, the fixing strength between the joint surface 8d and the solder connection surface 22 by the second solder 11 is stable.

  Incidentally, in the above description, an example in which a pair of joining surfaces 8d is formed inward in the width direction from both side portions of the folded folded portion 82 has been described. For example, the joining surfaces 8d are folded in the folded folded portion 82. Two pairs may be formed inward in the width direction from both side portions. As a result, the two pairs of bonding surfaces 8d and the solder connection surfaces 22 are fixed by the second solder 11, so that the pair of bonding surfaces 8d and the solder connection surfaces 22 are fixed by the second solder 11. Compared to the above, stable fixing strength can be secured. The joint surfaces 8d are not limited to an example in which a pair or two pairs are formed inward in the width direction from both side portions of the folded folded portion 82.

  In the above description, the example in which the joint surfaces 8d are formed in a pair or two inward in the width direction from both side portions of the folded folded portion 82 has been described. For example, the joint surfaces 8d are folded. It may be formed over the entire width direction of the portion 82. Thereby, since the whole width direction of the folded-up folding part 82 can be fixed by the second solder 11, the fixing strength between the joint surface 8d and the solder connection surface 22 by the second solder 11 is stabilized.

  Further, for example, as shown in FIG. 42, in addition to the notch portion 8b and the hole portion 8c of the seventh embodiment being formed in the folding portion 82, the joint surface 8d is the entire width direction of the folding portion 82. It may be formed over. As a result, as shown in FIG. 43, the entire folded portion 82 in the width direction can be fixed by the second solder 11, and the outer periphery of the FPC board 8 that is in contact with the second solder 11 is formed with the notch 8b and the hole. Since it becomes long by the part 8c, compared with the example shown in Embodiment 7, stable fixing strength can be ensured.

  As described above, according to the connection structure of the FPC board 8 of the present embodiment, the joining surface 8d is formed at the folded portion in the folding portion 82, so the joining surface of the folded folding portion 82 is formed. 8 d and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 8 is absorbed by the second solder 11. Therefore, it is possible to suppress stress applied to the first solder 10 in which the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20 are electrically connected. Accordingly, it is possible to suppress poor conduction between the terminal portion 83 of the folded folded portion 82 and the wiring electrode 21 of the frame portion 20. As a result, the connection structure of the FPC board 8 with improved reliability can be realized.

(Embodiment 9)
Embodiments 5-8 demonstrated the example by which the protrusion part, the notch part, the hole part, and the joint surface were formed in the folding part of the folded FPC board | substrate. On the other hand, Embodiments 9 to 12 describe examples in which a protruding portion, a cutout portion, a hole portion, and a bonding surface are formed on a protruding substrate of a folded FPC board.

  First, an embodiment in which a protruding portion is formed on a projection substrate of a folded FPC substrate will be described below with reference to FIGS. 44 and 45. FIG. 44 is a plan view of the FPC board. FIG. 45 is a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 44, the FPC board 9 of the present embodiment uses a flexible base film 90 formed of a polyimide film, a polyester film, or the like, and a copper foil or the like on one side of the base film 90. A formed conductor wiring 91 is provided. That is, the FPC board 9 is a single-sided FPC board in which the conductor wiring 91 is formed only on one side, but is not limited thereto. For example, a double-sided structure in which the conductor wiring 91 is formed on both sides of the base film 90 may be used, or a multilayer structure in which the conductor wiring 91 is formed in multiple layers may be used. However, in this embodiment, since a part of the FPC board 9 (folded portion, protruding board), which will be described later, is folded, it is preferable that the FPC board has a single-sided structure that is less rigid than a double-sided FPC board. . Thereby, the FPC board can be easily folded. FIG. 44 shows an example in which two conductor wirings 91 are formed, but the present invention is not limited to this. An arbitrary number of conductor wirings 91 may be formed on the FPC board 9.

  The FPC board 9 includes a folding portion 92 that is folded along the folding line A so that the conductor wiring 91 is on the outside. That is, the folding part 92 is folded on the upper surface of the FPC board 9. Further, the vicinity of the folded conductor wiring 91 is formed as the terminal portion 93.

  Further, the FPC board 9 has a pair of notches 94 formed in parallel to the fold line A from both sides of the FPC board 9 inward in the width direction. Since the pair of cutout portions 94 are formed in parallel to the fold line A, the fold portion 92 can be easily folded on the upper surface of the FPC board 9 along the fold line A.

  The FPC board 9 includes a protruding board 95 formed to extend outward in the width direction of the FPC board 9. The protruding substrate 95 is folded on the upper surface of the FPC substrate 9 along the fold line B. Further, the FPC board 9 is formed with a U-shaped cutout 90 a parallel to the fold line B.

  The protruding substrate 95 of the FPC board 9 has a pair of semicircular protruding portions (reinforcing member arrangement portions) 9 a formed outward from both sides of the protruding substrate 95. That is, the base (trunk) side protrusion 9a of the protruding substrate 95 is formed by a U-shaped cutout 90a. In addition, the shape of the protrusion part 9a is not limited to said semicircle shape. For example, the shape of the protruding portion 9a may be triangular, rectangular, polygonal, or the like. Moreover, the notch may be formed in the protrusion part 9a and the protrusion part may be further formed in the protrusion part 9a. Further, the pair of protruding portions 9 a of the protruding substrate 95 in the folded state is formed between the terminal portion 93 and the bent portion W.

  As shown in FIG. 45, such a FPC board 9 has a folded portion 92 folded on the upper surface of the FPC board 9 so that the conductor wiring 91 is on the outside. The terminal portion 93 of the folded portion 92 that is folded is electrically connected to the wiring electrode (terminal portion) 21 formed on the frame portion (connected body) 20 of the array substrate 2 by the first solder (connection member) 10. Has been.

  Further, the FPC board 9 has a protruding board 95 folded on the upper surface of the FPC board 9. The protruding portion 9 a formed on the folded protruding substrate 95 is fixed by the solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2 and the second solder (reinforcing member) 11. Yes. The second solder 11 is disposed so as not to be electrically connected to the first solder 10 to which the terminal portion 93 and the wiring electrode 21 are connected. Since the pair of protrusions 9a and the solder connection surface 22 are fixed by the second solder 11, stable fixing strength can be ensured.

  By the way, in the above description, the example in which the protrusions 9a are formed as a pair outward from both sides of the folded projection substrate 95 has been described. For example, the projections 9a are formed on both sides of the folded projection substrate 95. Two pairs may be formed outward. As a result, the two pairs of protrusions 9 a and the solder connection surface 22 are fixed by the second solder 11, so that the pair of protrusions 9 a and the solder connection surface 22 are fixed by the second solder 11. Compared to the above, stable fixing strength can be secured. Note that the protruding portions 9a are not limited to an example in which a pair or two of the protruding portions 9a are formed outward from both sides of the folded protruding substrate 95.

  As described above, according to the connection structure of the FPC board 9 of the present embodiment, the pair of projecting portions 9a are formed at the folded portions of the projecting substrate 95. The pair of protrusions 9 a and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 9 is absorbed by the second solder 11. Therefore, stress applied to the first solder 10 in which the terminal portion 93 of the folded portion 92 that is folded and the wiring electrode 21 of the frame portion 20 is electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 93 of the folded portion 92 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, a connection structure of the FPC board 9 with improved reliability can be realized.

(Embodiment 10)
Still another embodiment of the present invention will be described below with reference to FIGS. 46 and 47. FIG. FIG. 46 is a plan view of the FPC board. 47A and 47B are a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 46, the protruding substrate 95 of the FPC board 9 of the present embodiment has a semicircular cutout 9b formed inward from the protruding substrate 9, instead of the protruding portion 9a of the ninth embodiment. . The outer periphery of the notch 9b is formed with an outer peripheral surface (reinforcing member placement portion) 90b that is a solder bonding surface. The outer peripheral surface 90b which is a solder bonding surface is formed from, for example, a land or a pad. The outer peripheral surface 90b of the notch 9b is formed on the upper surface of the protruding substrate 95 when the protruding substrate 95 is folded along the folding line B on the upper surface of the FPC substrate 9. Unlike the protruding substrate 95 of the ninth embodiment, the protruding substrate 95 of the present embodiment does not have the protruding portion 9a, so that the FPC substrate 9 that can cope with space saving can be realized. In addition, the shape of the notch part 9b is not limited to said semicircle shape. For example, the shape of the notch 9b may be triangular, rectangular, polygonal, or the like. Further, the notched portion 9 b of the protruding substrate 95 in the folded state is formed between the terminal portion 93 and the bent portion W.

  Further, the FPC board 9 is formed with a circular cutout portion 91 b in parallel with the fold line B. On the outer periphery of the circular cutout portion 91b, an outer peripheral surface (reinforcing member placement portion) 92b that is a solder bonding surface is formed. Further, the FPC board 9 is notched inward in the width direction from the side of the FPC board 9 so as to face the notch 9b formed in the protruding board 95 when the protruding board 95 is folded along the fold line B. A portion 93b is formed.

  As shown in FIG. 47, the FPC board 9 is folded on the upper surface of the FPC board 9 and the protruding board 95 is folded on the upper surface of the FPC board 9 so that the conductor wiring 91 is on the outside. ing. In the folded protruding substrate 95, the circular cutout portion 91b formed in the FPC substrate 9 is formed as a semicircular cutout portion 91b. That is, the folded protruding substrate 95 is formed with a pair of notches 9b and 91b inward from both sides of the protruding substrate 95.

  The outer peripheral surfaces 90b and 92b of the notches 9b and 91b formed in the folded protruding substrate 95 are connected to the solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2 and the second solder ( It is fixed by a reinforcing member 11. Since the outer peripheral surfaces 90b and 92b of the pair of notches 9b and 91b and the solder connection surface 22 are fixed by the second solder 11, stable fixing strength can be ensured.

  By the way, in the above description, an example in which the notches 9b and 91b are formed in pairs from both sides of the folded projection substrate 95 has been described. For example, the notches 9b and 91b are folded projection substrates. Two pairs may be formed inward from both sides of 95. As a result, the two pairs of notches 9b and 91b and the solder connection surface 22 are fixed by the second solder 11, so that the pair of notches 9b and 91b and the solder connection surface 22 are fixed by the second solder 11. Compared to the examples, stable fixing strength can be secured. The notches 9b and 91b are not limited to an example in which a pair or two of the notches 9b and 91b are formed inward from both sides of the folded protruding substrate 95.

  As described above, according to the connection structure of the FPC board 9 of the present embodiment, the pair of cutout portions 9b and 91b are formed in the folded portion of the protruding substrate 95, so that the protruding substrate folded. The outer peripheral surfaces 90 b and 92 b of the 95 pair of notches 9 b and 91 b and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 9 is absorbed by the second solder 11. Therefore, stress applied to the first solder 10 in which the terminal portion 93 of the folded portion 92 that is folded and the wiring electrode 21 of the frame portion 20 is electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 93 of the folded portion 92 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, a connection structure of the FPC board 9 with improved reliability can be realized.

(Embodiment 11)
Still another embodiment of the present invention will be described below with reference to FIGS. 48 and 49 are plan views of the FPC board. 50 and 51 are a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 48, the protruding substrate 95 of the FPC board 9 of this embodiment has an elliptical hole 9c formed in the protruding substrate 95 in addition to the notch 9b of the tenth embodiment. On the outer periphery of the hole 9c, an outer peripheral surface (reinforcing member placement portion) 90c that is a solder bonding surface is formed. The outer peripheral surface 90c, which is a solder bonding surface, is formed from, for example, lands or pads. The outer peripheral surface 90c of the hole 9c is formed on the upper surface of the protruding substrate 95 when the protruding substrate 95 is folded along the folding line B on the upper surface of the FPC substrate 9. Since the protruding substrate 95 of the present embodiment is not formed with the protruding portion 9a unlike the protruding substrate 95 of the ninth embodiment, the FPC substrate 9 that can cope with space saving can be realized. Note that the shape of the hole 9c is not limited to the elliptical shape. For example, the hole 9c may have a circular shape, a triangular shape, a rectangular shape, a polygonal shape, or the like. Further, the hole 9 c of the protruding substrate 95 in the folded state is formed between the terminal portion 93 and the bent portion W.

  As shown in FIG. 49, the protruding substrate 95 preferably includes an extended substrate 96 formed to extend in the length direction of the FPC substrate 9. The effect will be described later.

  Further, the FPC board 9 has a hole portion 91c at substantially the center of both sides of the FPC board 9 so as to face the hole portion 9c formed in the projection board 95 when the protruding substrate 95 is folded along the fold line B. Is formed. The hole portion 91c formed in the FPC board 9 is formed in substantially the same size as the hole portion 9c formed in the protruding substrate 9c, but is not limited thereto.

  As shown in FIG. 50, the FPC board 9 is folded on the upper surface of the FPC board 9 and the protruding board 95 is folded on the upper surface of the FPC board 9 so that the conductor wiring 91 is on the outside. ing. That is, the folded protruding substrate 95 has a pair of notches 9b and 91b formed inwardly from both sides of the protruding substrate 95, and is provided at one central location on both sides of the protruding substrate 95. A hole 9c is formed in the hole.

  The outer peripheral surfaces 90b and 92b of the notches 9b and 91b and the outer peripheral surface 90c of the hole 9c formed in the folded protruding substrate 95 are solder connection surfaces (connected bodies) formed on the frame portion 20 of the array substrate 2. ) 22 and the second solder (reinforcing member) 11. That is, since not only the outer peripheral surfaces 90b and 92b of the notches 9b and 91b but also the outer peripheral surface 90c of the hole 9c is fixed by the solder connection surface 22 and the second solder 11, compared with the tenth embodiment. Stable fixing strength can be secured.

  In the case where the extended substrate 96 is included in the protruding substrate 95, as shown in FIG. 51, when the protruding substrate 95 is folded on the upper surface of the FPC substrate 9, the extended substrate 96 becomes the terminal portion of the FPC substrate 9. 93 and the wiring electrode 21 are arranged so as to cover the first solder 10 to be electrically connected. For this reason, the first solder 10 can be prevented from being short-circuited by contact with another metal member, for example, by the extended board 95.

  In the above description, the example in which the hole 9c is formed at one central portion of both sides of the folded projection substrate 95 has been described. For example, the hole 9c is formed on the folded projection substrate 95. You may form in two places of the approximate center of both sides. As a result, the outer peripheral surface 90c of the two holes 9c and the solder connection surface 22 are fixed by the second solder 11, so that the outer peripheral surface 90c of the one hole 9c and the solder connection surface 22 are the second. Compared with the example fixed by the solder 11, stable fixing strength can be secured. Note that the hole 9c is not limited to an example in which the hole 9c is formed at one or two substantially central positions on both side portions of the folded projection substrate 95.

  As described above, according to the connection structure of the FPC board 9 of the present embodiment, the pair of cutout portions 9b and 91b and the hole portion 9c are formed at locations where the protruding substrate 95 is folded. The outer peripheral surfaces 90 b and 92 b of the pair of cutout portions 9 b and 91 b and the outer peripheral surface 90 c of the hole portion 9 c and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 9 is absorbed by the second solder 11. Therefore, stress applied to the first solder 10 in which the terminal portion 93 of the folded portion 92 that is folded and the wiring electrode 21 of the frame portion 20 is electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 93 of the folded portion 92 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, a connection structure of the FPC board 9 with improved reliability can be realized.

(Embodiment 12)
Still another embodiment of the present invention will be described below with reference to FIGS. 52 and 54 are plan views of the FPC board. 53 and 55 are a plan view and a cross-sectional view showing the connection structure of the FPC board. In addition, about the structure which has the function similar to each above-mentioned embodiment, the same referential mark as the embodiment is attached, and the detailed description is abbreviate | omitted.

  As shown in FIG. 52, the protruding substrate 95 of the FPC board 9 of the present embodiment is formed in a rectangular shape inside the protruding substrate 95 as shown in FIG. 9d is formed as a joint surface (reinforcing member placement portion). The bonding surface 9d is formed from, for example, a land or a pad. The bonding surface 9d is formed on the upper surface of the protruding substrate 95 when the protruding substrate 95 is folded on the upper surface of the FPC substrate 9 along the fold line B. Since the protruding substrate 95 of the present embodiment is not formed with the protruding portion 9a unlike the protruding substrate 95 of the fifth embodiment, the FPC substrate 9 that can cope with space saving can be realized. Further, the protruding substrate 95 of the present embodiment is not formed with the protruding portion 9a, the notch portion 9b, and the hole portion 9c, unlike the protruding substrate 95 of the fifth to seventh embodiments. Therefore, the FPC substrate 9 that can suppress the manufacturing cost. Can be realized. Note that the shape of the bonding surface 9d is not limited to the rectangular shape. For example, the shape of the bonding surface 9d may be a semicircular shape, a triangular shape, a polygonal shape, or the like. Further, the joint surface 9 d of the protruding substrate 95 in the folded state is formed between the terminal portion 93 and the bent portion W.

  As shown in FIG. 53, such an FPC board 9 has a folded portion 92 folded on the upper surface of the FPC board 9 and a protruding board 95 folded on the upper surface of the FPC board 9 so that the conductor wiring 91 is on the outside. ing. That is, the folded protruding substrate 95 is formed with a pair of bonding surfaces 9 d inward from both sides of the protruding substrate 95.

  The joint surface 9 d formed on the folded protruding substrate 95 is fixed by the solder connection surface (connected body) 22 formed on the frame portion 20 of the array substrate 2 and the second solder (reinforcing member) 11. Yes. Since the pair of joining surfaces 9d and the solder connection surface 22 are fixed by the second solder 11, stable fixing strength can be ensured.

  In the above description, an example in which the bonding surfaces 9d are formed in pairs from both sides of the folded protruding substrate 95 has been described. For example, the bonding surfaces 9d have both sides of the folded protruding substrate 95. Two pairs may be formed inward from the inside. As a result, the two pairs of bonding surfaces 9d and the solder connection surfaces 22 are fixed by the second solder 11, so that the pair of bonding surfaces 9d and the solder connection surfaces 22 are fixed by the second solder 11. Compared to the above, stable fixing strength can be secured. Note that the bonding surfaces 9d are not limited to an example in which a pair or two pairs are formed inward in the width direction from both sides of the folded protruding substrate 95.

  In the above description, an example in which the bonding surfaces 9d are formed in pairs or two inward from both sides of the folded protruding substrate 95 has been described. For example, the bonding surfaces 9d are folded in the protruding substrate 95. It may be formed over the entire width direction. Thereby, since the whole width direction of the folded projection board | substrate 95 can be fixed with the 2nd solder 11, the fixing strength of the joining surface 9d and the solder connection surface 22 by the 2nd solder 11 is stabilized.

  Further, for example, as shown in FIG. 54, in addition to the notches 9b and 90b and the hole 9c of the eleventh embodiment formed in the protruding substrate 95, the bonding surface 9d has a width of the protruding substrate 95. It may be formed over the entire direction. As a result, as shown in FIG. 55, the entire width direction of the folded protruding substrate 95 can be fixed by the second solder 11, and the outer periphery of the FPC substrate 9 in contact with the second solder 11 is notched 9b, 91b. In addition, since it becomes longer due to the hole portion 9c, a stable fixing strength can be secured as compared with the example shown in the eleventh embodiment.

  As described above, according to the connection structure of the FPC board 9 of the present embodiment, the bonding surface 9d is formed at the position where the protruding substrate 95 is folded, so the bonding surface of the folded protruding substrate 95 is formed. 9 d and the solder connection surface 22 of the frame portion 20 are fixed by the second solder 11. Therefore, the bending stress due to the bent portion W of the FPC board 9 is absorbed by the second solder 11. Therefore, stress applied to the first solder 10 in which the terminal portion 93 of the folded portion 92 that is folded and the wiring electrode 21 of the frame portion 20 is electrically connected can be suppressed. Therefore, poor conduction between the terminal portion 93 of the folded portion 92 and the wiring electrode 21 of the frame portion 20 can be suppressed. As a result, a connection structure of the FPC board 9 with improved reliability can be realized.

  In the first to twelfth embodiments described above, the example in which the connecting member for electrically connecting the terminal portion of the FPC board and the terminal portion of the connected body is solder is described. However, the present invention is not limited to this. Absent. For example, using an anisotropic conductive film (ACF) or anisotropic conductive adhesive (ACA) to electrically connect the terminal portion of the FPC board and the terminal portion of the connected body. Can do. That is, any connecting member may be used as long as the terminal portion of the FPC board and the terminal portion of the connected body can be electrically connected.

  In the first to twelfth embodiments described above, the example in which the reinforcing member to which the reinforcing member arranging portion of the FPC board and the connected body are fixed is solder is described. However, the present invention is not limited to this. For example, the reinforcing member placement portion of the FPC board and the connected body can be fixed using an adhesive, an adhesive, a double-sided adhesive tape, or the like. That is, any reinforcing member may be used as long as the reinforcing member arranging portion of the FPC board and the connected body can be fixed.

  Moreover, in said Embodiments 5-12, the example in which a folding part was folded on the upper surface of a FPC board was demonstrated. Here, when the terminal part of the folded part and the terminal part of the connected body are connected using a connecting member, the folded part is temporarily fixed to the FPC board with a double-sided adhesive tape or adhesive material in advance. May be. In the above-described ninth to twelfth embodiments, the example in which the protruding substrate is folded on the upper surface of the FPC substrate has been described. Here, when the folded protruding substrate and the connected body are fixed using the reinforcing member, the folded protruding substrate may be temporarily fixed to the FPC substrate with a double-sided adhesive tape or an adhesive material in advance.

  Furthermore, in the above-described embodiment 11, the example in which the extended substrate is included in the protruding substrate has been described. However, in the ninth, tenth, and twelfth embodiments, the extended substrate is included in the protruding substrate. May be.

  That is, the present invention is not limited to the above-described embodiment, and various modifications can be made within the scope shown in the claims. That is, embodiments obtained by combining technical means appropriately changed within the scope of the claims are also included in the technical scope of the present invention.

  As described above, the present invention suppresses stress applied to the connection member in which the terminal portion of the flexible wiring board and the terminal portion of the connected body are electrically connected, and the connection structure of the flexible wiring board improves reliability. It is useful as an electronic device.

It is a perspective view which shows the liquid crystal panel of the liquid crystal display device in embodiment of this invention, Fig.1 (a) is an exploded perspective view of a liquid crystal panel, FIG.1 (b) is a perspective view of a liquid crystal panel. FIGS. 2A and 2B are a plan view and a cross-sectional view of the FPC board in the first embodiment, FIG. 2A is a plan view of the FPC board, and FIG. 2B is a cutting line 2b-2b ′ shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along. FIGS. 3A and 3B are a plan view and a cross-sectional view showing the FPC board connection structure in the first embodiment. FIG. 3A is a plan view of the FPC board connection structure, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along cutting line 3b-3b 'shown in FIG. It is a top view which shows the modification of the FPC board in 1st Embodiment. FIGS. 5A and 5B are a plan view and a cross-sectional view showing a connection structure of a modification of the FPC board in the first embodiment, FIG. 5A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 5b-5b 'shown in a). It is drawing which shows the state which bent the FPC board | substrate of FIG. It is a top view of the FPC board in a 2nd embodiment. FIGS. 8A and 8B are a plan view and a cross-sectional view of the FPC board in the second embodiment, FIG. 8A is a plan view of the FPC board, and FIG. 8B is a cutting line 8b-8b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view which shows the modification of the FPC board in 2nd Embodiment. FIGS. 10A and 10B are a plan view and a cross-sectional view showing a connection structure of a modification example of the FPC board in the second embodiment, FIG. 10A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 10b-10b 'shown in a). It is a top view of the FPC board in a 3rd embodiment. FIGS. 12A and 12B are a plan view and a cross-sectional view of the FPC board in the third embodiment, FIG. 12A is a plan view of the FPC board, and FIG. 12B is a cutting line 12b-12b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view which shows the modification of the FPC board in 3rd Embodiment. FIGS. 14A and 14B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the third embodiment, FIG. 14A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 14b-14b 'shown in a). It is a top view which shows the modification of the FPC board in 3rd Embodiment. FIGS. 16A and 16B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the third embodiment, FIG. 16A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 16b-16b 'shown in a). It is a top view which shows the modification of the FPC board in 3rd Embodiment. FIGS. 18A and 18B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the third embodiment, FIG. 18A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 18b-18b 'shown in a). It is a top view of the FPC board in a 4th embodiment. FIG. 20A is a plan view of the FPC board and a cross-sectional view of the FPC board in the fourth embodiment, FIG. 20A is a plan view of the FPC board, and FIG. 20B is a cutting line 20b-20b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view which shows the modification of the FPC board in 4th Embodiment. FIGS. 22A and 22B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the fourth embodiment, FIG. 22A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 22b-22b 'shown in a). It is a top view which shows the modification of the FPC board in 4th Embodiment. FIGS. 24A and 24B are a plan view and a cross-sectional view showing a connection structure of a modification of the FPC board in the fourth embodiment, FIG. 24A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along cutting line 24b-24b 'shown in a). It is a top view which shows the modification of the FPC board in 4th Embodiment. FIGS. 26A and 26B are a plan view and a cross-sectional view showing a connection structure of a modification of the FPC board in the fourth embodiment, FIG. 26A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 26b-26b 'shown in a). It is a top view which shows the modification of the FPC board in 4th Embodiment. FIGS. 28A and 28B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the fourth embodiment, FIG. 28A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 28b-28b 'shown in a). It is a top view which shows the modification of the FPC board in 4th Embodiment. FIGS. 30A and 30B are a plan view and a cross-sectional view showing a connection structure of a modification of the FPC board in the fourth embodiment, FIG. 30A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 30b-30b 'shown in a). It is a top view which shows the modification of the FPC board in 4th Embodiment. FIGS. 32A and 32B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the fourth embodiment, FIG. 32A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 32b-32b 'shown in a). It is a top view of the FPC board in a 5th embodiment. FIG. 34A is a plan view and a sectional view of the FPC board in the fifth embodiment, FIG. 34A is a plan view of the FPC board, and FIG. 34B is a cutting line 34b-34b shown in FIG. 34A. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view of the FPC board in a 6th embodiment. 36A and 36B are a plan view and a cross-sectional view of the FPC board in the sixth embodiment, where FIG. 36A is a plan view of the FPC board, and FIG. 36B is a cutting line 36b-36b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view of the FPC board in a 7th embodiment. FIG. 38A is a plan view and a cross-sectional view of the FPC board in the seventh embodiment, FIG. 38A is a plan view of the FPC board, and FIG. 38B is a cut line 38b-38b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view of the FPC board in an 8th embodiment. It is a top view which shows the modification of the FPC board in 8th Embodiment. 40 is a plan view and a cross-sectional view of the FPC board shown in FIG. 39 in the eighth embodiment, FIG. 41 (a) is a plan view of the FPC board, and FIG. 41 (b) is a cutting line 41b shown in FIG. 41 (a). It is sectional drawing of the FPC board | substrate cut | disconnected along -41b '. It is a top view which shows the modification of the FPC board in 8th Embodiment. FIGS. 43A and 43B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the eighth embodiment, FIG. 43A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 43b-43b 'shown in a). It is a top view of the FPC board in a 9th embodiment. FIG. 45A is a plan view and a cross-sectional view of the FPC board in the ninth embodiment, FIG. 45A is a plan view of the FPC board, and FIG. 45B is a cutting line 45b-45b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view of the FPC board in a 10th embodiment. 47A and 47B are a plan view and a cross-sectional view of the FPC board according to the tenth embodiment, in which FIG. 47A is a plan view of the FPC board, and FIG. 47B is a cutting line 47b-47b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view of the FPC board in an 11th embodiment. It is a top view which shows the modification of the FPC board in 11th Embodiment. 48 is a plan view and a sectional view of the FPC board of FIG. 48 in the eleventh embodiment, FIG. 50 (a) is a plan view of the FPC board, and FIG. 50 (b) is a cutting line 50b− shown in FIG. 50 (a). It is sectional drawing of the FPC board cut | disconnected along 50b '. FIGS. 51A and 51B are a plan view and a cross-sectional view showing a connection structure of a modification of the FPC board of FIG. 49 in the eleventh embodiment, FIG. 51A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 51b-51b 'shown in (a). It is a top view of the FPC board in a 12th embodiment. FIGS. 53A and 53B are a plan view and a sectional view of the FPC board in the twelfth embodiment, FIG. 53A is a plan view of the FPC board, and FIG. 53B is a cutting line 53b-53b shown in FIG. It is sectional drawing of the FPC board | substrate cut | disconnected along '. It is a top view which shows the modification of the FPC board in 12th Embodiment. FIGS. 55A and 55B are a plan view and a cross-sectional view showing a connection structure of a modified example of the FPC board in the twelfth embodiment, FIG. 55A is a plan view of the connection structure of the FPC board, and FIG. It is sectional drawing of the connection structure of the FPC board cut | disconnected along the cutting line 55b-55b 'shown in a). 56A and 56B are a plan view and a cross-sectional view showing a conventional FPC board connection structure, FIG. 56A is a plan view of the FPC board connection structure, and FIG. 56B is a cutting line 56b shown in FIG. 56A. It is sectional drawing of the connection structure of the FPC board cut | disconnected along -56b '. It is drawing which shows the state which bent the conventional FPC board | substrate.

Explanation of symbols

2 Array substrate (connected body)
6, 8, 9 FPC board 6a, 8a, 9a Protruding part (reinforcing member arrangement part)
6b, 8b, 9b, 91b Notch portion 60b, 80b, 90b, 92b Outer peripheral surface of the notch portion (reinforcing member placement portion)
6c, 8c, 9c Hole portion 60c, 80c, 90c Outer peripheral surface of hole portion (reinforcing member placement portion)
6d, 8d, 9d Joint surface (reinforcing member placement part)
10 First solder (connection member)
11 Second solder (reinforcing member)
20 Frame (connected body)
21 Wiring electrode (terminal part of connected body)
22 Solder connection surface (object to be connected)
60, 80, 90 Base film 61, 81, 91 Conductor wiring 63, 83, 93 Terminal part (terminal part of FPC board)
82, 92 Folding part 95 Projection board 96 Extension board

Claims (12)

A flexible wiring board having a conductor wiring and a terminal portion formed on the conductor wiring on a flexible base film, and a connected body having a terminal portion, the terminal portion of the flexible wiring board and the object to be connected In the connection structure of the flexible wiring board in which the terminal portion of the connection body is electrically connected by the connection member,
The flexible wiring board is formed with a reinforcing member arrangement portion for arranging a reinforcing member that is not electrically connected to the connection member,
The connection structure for a flexible wiring board, wherein the reinforcing member arrangement portion and the connected body are fixed by the reinforcing member. A part of the flexible wiring board is folded so that the conductor wiring of the flexible wiring board is on the outside, and the terminal portion of the flexible wiring board and the terminal portion of the connected body are folded by the connecting member. Electrically connected,
The connection structure of the flexible wiring board according to claim 1, wherein the reinforcing member arrangement portion is formed at a portion folded in the flexible wiring board. A part of the flexible wiring board is folded so that the conductor wiring of the flexible wiring board is on the outside, and the terminal portion of the flexible wiring board and the terminal portion of the connected body are folded by the connecting member. Electrically connected,
The flexible wiring board includes a protruding board formed to extend outward from the flexible wiring board,
The protruding substrate is folded;
The connection structure for a flexible wiring board according to claim 1, wherein the reinforcing member arrangement portion is formed at a portion folded on the protruding substrate.   The flexible wiring board connection structure according to claim 2 or 3, wherein the flexible wiring board has a conductor wiring formed only on one side of the base film.   The connection structure of the flexible wiring board according to any one of claims 1 to 4, wherein the reinforcing member arrangement portion is at least a pair of protrusions formed outward of the flexible wiring board.   5. The flexible wiring board connection structure according to claim 1, wherein the reinforcing member arrangement portion is an outer peripheral surface of at least a pair of notches formed inward of the flexible wiring board.   The connection structure of the flexible wiring board according to any one of claims 1 to 4, wherein the reinforcing member arrangement portion is an outer peripheral surface of a hole formed at a substantially center of both sides of the flexible wiring board.   The connection structure of the flexible wiring board according to any one of claims 1 to 4, wherein the reinforcing member arrangement portion is a joint surface formed on the flexible wiring board.   The connection structure for a flexible wiring board according to claim 8, wherein the joint surface is composed of at least a pair formed inside the flexible wiring board.   The connection structure for a flexible wiring board according to claim 8, wherein the joint surface is formed over the entire width direction of the flexible wiring board. The protruding substrate includes an extended substrate formed to extend in the length direction of the flexible wiring substrate,
The said extended board | substrate is arrange | positioned so that the said connection member to which the terminal part of the said flexible wiring board and the terminal part of the said to-be-connected body are connected may be covered when the said protrusion board | substrate is folded. Flexible wiring board connection structure.   An electronic apparatus comprising the connection structure according to any one of claims 1 to 11.

Images