JP2001257139A5 - - Google Patents
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- JP2001257139A5 JP2001257139A5 JP2001000633A JP2001000633A JP2001257139A5 JP 2001257139 A5 JP2001257139 A5 JP 2001257139A5 JP 2001000633 A JP2001000633 A JP 2001000633A JP 2001000633 A JP2001000633 A JP 2001000633A JP 2001257139 A5 JP2001257139 A5 JP 2001257139A5
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- JP
- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001000633A JP2001257139A (en) | 2000-01-07 | 2001-01-05 | Semiconductor substrate and its manufacturing method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000001478 | 2000-01-07 | ||
| JP2000-1478 | 2000-01-07 | ||
| JP2001000633A JP2001257139A (en) | 2000-01-07 | 2001-01-05 | Semiconductor substrate and its manufacturing method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006266518A Division JP2007036279A (en) | 2000-01-07 | 2006-09-29 | Method for manufacturing semiconductor substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001257139A JP2001257139A (en) | 2001-09-21 |
| JP2001257139A5 true JP2001257139A5 (en) | 2006-01-12 |
Family
ID=26583230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001000633A Pending JP2001257139A (en) | 2000-01-07 | 2001-01-05 | Semiconductor substrate and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001257139A (en) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4581349B2 (en) * | 2003-08-29 | 2010-11-17 | 株式会社Ｓｕｍｃｏ | Manufacturing method of bonded SOI wafer |
| JP4902953B2 (en) | 2004-09-30 | 2012-03-21 | ラピスセミコンダクタ株式会社 | Manufacturing method of semiconductor device |
| US7781309B2 (en) | 2005-12-22 | 2010-08-24 | Sumco Corporation | Method for manufacturing direct bonded SOI wafer and direct bonded SOI wafer manufactured by the method |
| JP2007243038A (en) * | 2006-03-10 | 2007-09-20 | Sumco Corp | Laminated wafer, and manufacturing method therefor |
| JP5618521B2 (en) * | 2008-11-28 | 2014-11-05 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| JP2011029355A (en) * | 2009-07-24 | 2011-02-10 | Sumco Corp | Method of manufacturing semiconductor wafer with laser mark |
| JP5846727B2 (en) * | 2009-09-04 | 2016-01-20 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor substrate |
| JP6232186B2 (en) * | 2013-01-16 | 2017-11-15 | 住友化学株式会社 | Nitride semiconductor wafer marking method and nitride semiconductor wafer with identification code |
| JP6155745B2 (en) * | 2013-03-26 | 2017-07-05 | 住友電気工業株式会社 | Semiconductor device manufacturing method and semiconductor substrate manufacturing method |
| JP2016139642A (en) * | 2015-01-26 | 2016-08-04 | 株式会社東芝 | Semiconductor device |
| JP6760245B2 (en) * | 2017-11-06 | 2020-09-23 | 信越半導体株式会社 | Method for manufacturing an SOI wafer having a thin film SOI layer |
| JP7467843B2 (en) * | 2019-08-29 | 2024-04-16 | 富士電機株式会社 | Silicon carbide epitaxial substrate and method for manufacturing silicon carbide epitaxial substrate |
| WO2021199585A1 (en) * | 2020-04-02 | 2021-10-07 | 東京エレクトロン株式会社 | Substrate processing method and substrate processing apparatus |
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2001
- 2001-01-05 JP JP2001000633A patent/JP2001257139A/en active Pending