JP2001256681A - Sticking method, spacer and sticking apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To level disks each obtained by sticking two disk substrates different from each other in warpage shape and to obtain a disk having high planarity. SOLUTION: Plural disks 10, each comprising two disk substrates overlapped by way of an adhesive comprising a cationic UV-curing composition, are stacked while interposing each of the disks 10 between rigid disks 8 as spacers. A thrust strip 8a is formed on the peripheral part side of each face of the rigid disks 8 opposite to the disk 10 along the peripheral direction. The disk 10 is curved by the thrust strip 8a in a direction opposite to its warpage in the case of stacking, so that it is leveled and disks suitable particularly for use as writable information optical disks are obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of laminating two disc substrates typified by digital / versatile discs, and a spacer disposed between the discs and stacking the discs. And a bonding apparatus.

[0002]

2. Description of the Related Art As is well known, when a digital video / versatile disk, so-called DVD, is manufactured, a method of bonding two disk substrates together with a cationic ultraviolet curable composition as an adhesive is employed. Have been. As a bonding method using the cationic UV-curable composition, a cationic UV-curable composition is discharged from a discharge means toward the surface of one of the disk substrates to be bonded, and is dropped. There is a method of irradiating the ultraviolet curable composition with ultraviolet rays, and then laminating the other disk substrates to be bonded, and bonding both disk substrates together. Dispensers of a valve type, a plunger type, a rotary displacement type, and the like are generally used as the discharging means.

Here, there are two types of the above-mentioned DVDs, which are produced by bonding two disk substrates having a thickness of about 0.6 mm to each other, a read-only type (ROM) and a writable type, which belong to the latter. DVD-R, DVD-
There are RAM or DVD-RW. In the read-only type, the information recording layer is composed of two layers, a light reflection layer and a protective layer. On the other hand, the writable type has a multilayer structure in which 4 to 5 thin films are stacked. ing. Since the information recording layer in the multilayer structure does not transmit ultraviolet light at all, as a method of bonding such two disk substrates, the present inventors applied a liquid cationic ultraviolet curable composition previously irradiated with ultraviolet light to a disk substrate. We proposed a "falling-light type laminating method" in which the coating was performed in an annular shape, and then superimposed and spread.

[0004]

By the way, if the two disk substrates to be bonded have a warp, and if the warp is opposite, after the bonding, the mutual distortions cancel each other, which is a serious problem. Never, but on the contrary,
If the degree of warpage is different, a phenomenon may occur in which, after bonding, the disk is pulled by the disk substrate on the side with the higher warpage and is distorted. These issues are mainly due to
In a writable information optical disk, the effect is serious and noticeable, and it becomes difficult to keep the disk flat after bonding, which is a major cause of a decrease in yield in the bonding process.

That is, usually, a sputtering apparatus is used for producing a thin film constituting a disk substrate. In this case, the disk substrate made of plastic undergoes thermal deformation due to local surface heating during sputtering. In the case of a multi-layer structure, such a tendency becomes even greater, and in a disk substrate having a thickness of 0.6 mm actually obtained,
It becomes largely axisymmetrically biased to the bonding surface side or the opposite side. In particular, the DVD-
In the case where an information recording layer is provided only on one surface of R, DVD-RAM or DVD-RW, it is necessary to bond such a warped disk substrate to a dummy substrate having a relatively small warpage (a substrate having no information recording layer). Come out.

The present invention has been made in view of the above circumstances, and even if two disk substrates having different warpage shapes are bonded to each other, the unbalance of the warpage of the two disk substrates is corrected and controlled to obtain a flat surface. It is an object of the present invention to provide a disk bonding method, a spacer, and a bonding apparatus capable of obtaining a high-quality disk.

[0007]

According to a first aspect of the present invention, there is provided a bonding method comprising the steps of applying an adhesive between at least one disk substrate made of two thermoplastic resins having an information recording layer. This is a disk bonding method in which the two are laminated with an interposition therebetween, wherein the disk in which the disk substrates are overlapped with each other via an adhesive is bent in a direction opposite to the warp direction to correct the warp. And

As described above, by bending a disk in which two disk substrates are overlapped with an adhesive therebetween to the side opposite to the warpage, the warpage of the disk can be easily and reliably corrected. . As a result, particularly in a writable information optical disk in which the warpage of the disk poses a problem, the warp can be significantly reduced, and defects can be reduced.

[0009] Here, International Publication WO99 / 66506 discloses a method of bonding two disk substrates. Here, it is recommended that the adhesive be spread on a rigid disk having a flat surface so that the adhesive between the substrates can be spread reliably and sufficiently. However, in the conventional bonding method using a rigid disk, when one or both of the warpages of the disk substrates to be bonded are small enough to be overlooked, including the fact that they are subsequently offset by bonding. Is effective in obtaining a bonded disc without warpage, but otherwise, a bonded disc with warp that cannot be overlooked may be inevitably manufactured. In view of such circumstances, the present inventors have conducted studies to solve this problem, and as a result, have reached the present invention.

That is, the present invention relates to a case where only one of two disk substrates to be bonded is warped and one is not warped, or both of the two disk substrates are warped, and both of them are warped. This is a particularly effective method for preventing the warpage of the disks to which the disks are bonded when the degree of warpage is so different as to be non-cancellable.
In addition, the present invention can be used in a case where there are a large number of disk substrates having a certain degree of warp that cannot be overlooked, without wasting such inappropriate disk substrates, and as a result, even if they are used, This is an effective method for easily and continuously obtaining a bonded disc without warpage.

In the present invention, the two disk substrates facing each other are forcibly bent in the direction opposite to the warp direction before the adhesive is completely cured. What is mainly composed of a plastic resin has a suitable rigidity as compared with a disk substrate made of glass or a substrate containing a fiber-reinforced thermoplastic resin, and can be corrected by bending without breaking. It is preferred.

The bonding method according to the second aspect is the first aspect.
In the bonding method described above, by laminating the disks via spacers formed with ridges extending circumferentially on the facing surface, the ridges warp the disk to the side opposite to the warp, It is characterized by correcting warpage.

That is, by laminating the disks via spacers having ridges formed circumferentially on the surface facing the disks, the ridges of the spacers make it possible to easily reverse the warp of the disks by the ridges of the spacers. It can be deflected to the side and flattened.

According to a third aspect of the present invention, there is provided the bonding method according to the second aspect.
In the bonding method described above, a plurality of protrusions are formed on the spacer at intervals in the radial direction.

That is, since the disks are stacked via the spacer having a plurality of ridges formed at intervals in the radial direction, the warpage of the disk is evenly removed in the radial direction by the plurality of ridges. Can be flattened.

According to a fourth aspect of the present invention, there is provided the bonding method according to the second aspect.
Alternatively, in the bonding method according to the third aspect, the protrusion is formed on the front and back of the spacer, and the disc is pressed from the front and back by the protrusion to bend to the side opposite to the warpage.

In this manner, the disk can be pressed from the front and back by the ridges formed on the front and back of the spacer, the warpage thereof can be removed, and the disk can be flattened more favorably.

According to a fifth aspect of the present invention, there is provided a spacer for use in a disk bonding apparatus for bonding an adhesive between two disk substrates, each having at least one of the information recording layers and made of a thermoplastic resin. So,
It is arranged between the discs stacked via the adhesive,
A ridge for bending the disk in a direction opposite to the warpage is formed on a surface facing the disk so as to extend in a circumferential direction.

That is, by arranging two disk substrates between disks which are overlapped with each other via an adhesive,
The ridges allow the disk to bend to the side opposite to the warpage, thereby easily and surely correcting the warpage of the disk.

According to a sixth aspect of the present invention, in the spacer of the fifth aspect, a plurality of the ridges are formed at intervals in a radial direction.

As described above, the warp of the disk can be evenly removed in the radial direction by the plurality of ridges formed at intervals in the radial direction, and the disk can be flattened more favorably.

According to a seventh aspect of the present invention, in the spacer according to the fifth or sixth aspect, the ridges are formed on the front and back, and the disc is pressed from the front and back by the front and back ridges, and is opposite to the warp. It is characterized by bending.

That is, the disk is pressed from the front and back by the ridges formed on the front and back, the warpage thereof can be reliably removed, and the flattening can be performed more favorably.

The spacer according to claim 8 is the spacer according to claims 5-7.
3. The spacer according to claim 1, wherein a corner of the ridge is chamfered.

In other words, since the corners of the ridge are chamfered, it is possible to reliably eliminate a problem that the disc surface is damaged by the corners when they are arranged between the disks and stacked. it can.

The bonding apparatus according to the ninth aspect is a dropping means for dropping the cationic ultraviolet curable plastic onto the disk substrate, and an ultraviolet irradiating means for irradiating ultraviolet rays to the cationic ultraviolet curable composition in the process of falling. Stacking means for stacking another disk substrate so that the surface of the disk substrate on which the cationic ultraviolet-curable composition has been dropped faces the other disk substrate to form one disk, and mounting the disk between a plurality of spacers. Stacking means for arranging and stacking a plurality of sheets, wherein the spacer in the stacking means includes:
A spacer according to any one of claims 5 to 8 is characterized.

As described above, the cationic UV-curable composition previously irradiated with UV light is dropped and applied onto a disk substrate, and then bonded to another disk substrate to form a single disk. By stacking the spacers with the spacers interposed therebetween before the curable composition is cured, the spacers correct the warpage and increase the flatness of each disk.

[0028]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a DVD manufacturing apparatus employing a bonding method, a spacer, and a bonding apparatus according to the present invention will be described below with reference to the drawings, using DVD manufacturing as an example. The DVD manufacturing apparatus shown in FIG. 1 is schematically constituted by a disk substrate take-out area R1, a disk creation area R2, a disk inspection area R3, and a disk stacking area R4.

The disk substrate take-out region R1 includes a stock area A1 in which the first disk substrate 1a and the second disk substrate 1b are stacked and held by the disk holder 7, and a first area held in the disk holder 7. And the second disk substrate 1a. And a take-out area A2 for taking out 1b one by one.

The disc preparation region R2 includes a coating stage B having an ultraviolet curable composition falling irradiation device (hereinafter referred to as a drop irradiation device) 4 for dropping a cationic ultraviolet curing resin onto the first disk substrate 1a. The surface of the one disk substrate 1a on which the cation-type ultraviolet curable resin has been dropped is opposed to the second disk substrate 1b, and the first and second disk substrates 1a and 1b are superimposed on the superimposing device 5 and the superimposing device. 5, a transport device 19 for transporting the disk 10 formed in the step 5, a disk laminating / separating device D "for spreading the disk 10 and performing an end surface hardening process (hardening acceleration process), and a disk laminating / separating device D" In the disk inspection area R3.

Further, the disk inspection region R3 is constituted by a disk inspection device 31 for inspecting the quality of the formed disk 10 for good or bad.
Is configured by a disc sorting / stacking device 32 that ejects a defective disk 10 and stacks the disks 10 determined to be non-defective on the disk holder 7.

The disk substrate take-out area R1, the disk creation area R2, the disk inspection area R3,
The disk stacking regions R4 are sequentially arranged so as to form a substantially U-shape when viewed in a plan view, and a disk substrate take-out region R1 and a disk stacking region R4 are respectively arranged at the start point and the end point of the U-shape. And, between the disk substrate take-out region R1 and the disk lamination region R4,
A transport path 33 for transporting an empty disk holder 7 is formed.

Next, an outline of a DVD manufacturing process according to the present embodiment will be described. In the disk substrate take-out area R1, first, the first and second disk substrates 1a and 1b stacked on the disk holder 7 in the take-out area A2 are taken out and transferred to the disk making area R2.

FIG. 2 is a diagram showing a procedure for taking out and transferring the first or second disk substrates 1a and 1b stacked in the take-out area A2 by the disk substrate transfer device 2. Although the disk substrate shown in the figure is the first disk substrate 1a, the same procedure as described below is employed when transferring the second disk substrate 1b. Therefore, the first disk substrate 1a in the figure may be the second disk substrate 1b.

The disk substrate transfer device 2 is provided with a deflection applying means 22 as shown in FIG. The deflection applying means 22 reciprocates the vacuum suction unit 221 for vacuum suction on the first disk substrate 1a and the vacuum suction unit 221 in a direction perpendicular to the plate surfaces of the first disk substrates 1a and 1b. Reciprocating unit 222 and vacuum suction unit 22
1 is provided with a displacement suppressing unit 223 that mechanically restrains a part of the first disk substrate 1a when the device 1 operates. In addition, the deflection applying unit 22 operates the first disk substrate 1a by operating the vacuum suction unit 221.
It also has a function as holding means for holding.

To transfer the first disk substrate 1a,
The disk substrate transfer device 2 is disposed to face the outermost layer 1a 'of the first disk substrate 1a, and as shown in (a), the vacuum suction part 221 and the displacement restriction part 223 are attached to the first disk substrate 1a. The substrate is brought into contact with the substrate 1a '.

Next, the vacuum suction unit 221 is vacuum-sucked to the plate surface of the first disk substrate 1a ', and the reciprocating unit 222 is contracted as shown in FIG. In this case, the vacuum suction unit 221 provided at the tip of the reciprocating unit 222
Is lifted upward while being suctioned to the first disk substrate 1a, whereby the portion of the first disk substrate 1a to which the vacuum suction portion 221 has been sucked becomes
Displace upward.

At this time, the portion of the first disk substrate 1a 'which is in contact with the displacement suppressing portion 223 is
23, the displacement is suppressed, and as a result, the first disk substrate 1a 'made of a flexible material is curved as shown in FIG. The first disk substrate 1
a 'will be distorted.

By the way, the first disk substrate 1 on the outermost layer
a 'and another first disk substrate 1a in contact with the lower side thereof.
(Hereinafter, referred to as a first disk substrate 1a ″), both of which have a high surface smoothness, and may be in a pseudo-adhered state due to electrostatic force or vacuum suction force. When the outermost first disk substrate 1a 'is deformed as described above, the outermost first disk substrate 1a "is also attached to the first disk substrate 1a" pseudo-adhered to the first disk substrate 1a'. ′. As a result, the lower first disk substrate 1a ″ is also distorted, and at the same time, a restoring force acts to eliminate the distortion.

The distortion generated in the lower first disk substrate 1a "is generated by the adhesive force acting between the lowermost first disk substrate 1a" and the outermost first disk substrate 1a '. When the force is equal to or greater than the restoring force, the distortion of the lower first disk substrate 1a ″ is not eliminated.

However, the first disk substrate 1a ″
Of the first disk substrate 1a ″, the lower the first disk substrate 1a ″ is, the larger the distortion of the first disk substrate 1a ′ becomes. It is separated from the substrate 1a 'and restored to the original flat plate shape.
This makes it possible to separate the outermost first disk substrate 1a ′ from the lower first disk substrate 1a ″, and it is possible to reliably prevent two sheets of the first disk substrate 1a from being removed.

As described above, the lower first disk substrate 1
After separating the first disk substrate 1a 'from a ", the disk substrate transfer device 2 is moved upward while the first disk substrate 1a' is being sucked by the vacuum suction unit 221. In this case, the first The disk substrate 1a 'is separated while maintaining the flexed state, thereby preventing the first disk substrate 1a' from re-adhering to 1a ". After that, the reciprocating part 222 is returned to the original position, whereby the first disk substrate 1a '
Is restored to the original plate shape. Then, the first disk substrate 1a 'separated in this manner is moved to the next processing step.

As described above, the first disk substrate 1
In the case where a ′ is curvedly deformed, the smaller the curvature of the curvature is, the larger the generated distortion is. Thereby, the restoring force generated on the first disk substrate 1a 'also increases,
The separation force of the first disk substrate 1a 'can be adjusted. In order to increase the curvature of the curvature, the distance between the vacuum suction unit 221 and the displacement suppressing unit 223 may be reduced, or the moving distance of the reciprocating unit 222 may be increased.

As described above, when a predetermined amount of disk substrate is taken out from the disk holder 7 in the take-out area A2, the disk holder 7 becomes empty. 7 is transported through the transport path 33 to the disk lamination region R4 side.

The first disk substrate 1a of the first and second disk substrates 1a and 1b thus taken out is supplied to the supply position B1 of the coating stage B. The first disk substrate 1a supplied to the supply position B1 moves to the application position B2 when the turntable 3 rotates in the direction of the arrow in the figure.

First disk substrate 1 located at application position B2
The cation type ultraviolet curable composition 45 irradiated with ultraviolet rays by the drop irradiation device 4 is dropped and applied in a ring shape on a.

The configuration of the drop irradiation device 4 will be described with reference to FIG. In FIG. 3, reference numeral 41 denotes a dispenser (nozzle) for dropping the cationic ultraviolet curable composition;
Is an ultraviolet irradiation means, 43 is a housing having a reflection plate on the inner surface,
Reference numeral 44 denotes a quartz tube which is provided up and down in the housing 43 and through which the cationic ultraviolet curable composition discharged from the dispenser 41 passes.

As the dispenser 41, a model 1500DV (nozzle inner diameter 0.83 mm) manufactured by EFD of the United States was used. The rotary table 3 is provided with three disk substrate mounting tables (not shown), and the disk substrates 1a are mounted on these disk substrate mounting tables. This disk substrate mounting table is rotatable by a motor (not shown).

The distance between the ultraviolet irradiation means 42 and the falling cationic ultraviolet curable composition was 50 mm, and the inner surface of the ultraviolet irradiation means 42 and the falling cationic ultraviolet curable composition was a reflective plate. The configured housing 43
To improve the uniformity of ultraviolet irradiation. A shutter 43a is provided on the upper part of the housing 43 to open and close the opening 44a of the quartz tube 44 by moving in the direction of the arrow in the figure.
Is provided.

The ultraviolet ray irradiating means 42 emits light while the cationic ultraviolet ray curable composition 45 is falling, thereby irradiating the cationic ultraviolet ray curable composition 45 with ultraviolet rays. Since the disk substrate mounting table is rotated during this time, the cationic ultraviolet curable composition 45 is applied to the first disk substrate 1a in a ring shape. In addition,
The ring-shaped convex portion of the first disk substrate 1a is omitted.

Predetermined amount of cationic UV curable composition 4
When the drop of 5 is completed, the shutter 43a is operated to the left in the drawing to close the opening 44a of the quartz tube 44 through which the cationic ultraviolet curable composition 45 passes. Then, when the first disk substrate 1a to which the cationic ultraviolet curable composition 45 is to be dropped next moves, the shutter 43a is operated in the state shown in the figure to drop the cationic ultraviolet curable composition 45. Resume. UV irradiation means 4 even when the cationic UV curable composition 45 is not dropped
2 emits light continuously, so that the shutter 4
By opening and closing 3a, ultraviolet irradiation to the dispenser 41 is prevented, and the blockage is prevented. That is, the shutter 43a is moved from the dispenser 41 to the disk substrate 1
When the cationic UV curable composition 45 is not ejected to a, the UV irradiation means 42 irradiates the cationic UV curable composition with ultraviolet rays and the dispenser 4.
1 so as to block ultraviolet rays leaking from the irradiation location.

The first disk substrate 1a on which the cationic ultraviolet curable composition 45 has been dropped and applied in a ring shape is superposed on the second disk substrate 1b in the superposition device 5.

FIG. 4 shows the configuration of the superposing apparatus 5. The superposing apparatus 5 includes a pair of disk substrate holding tables 51 and 52, a hinge 53 connecting the tables 51 and 52, and a suction path 54 connected to a vacuum pump (not shown).
It consists of.

As shown in FIG. 4A, a disk substrate holding table 51 is provided with a first disk substrate 1a coated with a cationic ultraviolet curable composition 45 in a ring shape, and a disk substrate holding table 52. A second disk substrate 1b is placed on the second disk substrate. By driving a vacuum pump (not shown), the first and second disk substrates 1 a and 1 b
It is adsorbed by 1, 52. Then, the disk substrate holding table 51 is rotated at a high speed about the hinge 53 from the state shown in FIG. As shown in FIG. 4B, the disk substrate holding table 51 is brought close to the disk holding table 52 until immediately before the cationic UV curable composition applied in a ring shape comes into contact with the second disk substrate 1b. Switching from the continuous turning operation up to that time to the minute step operation, for example, every 0.1 to 0.2 degrees of the small angle of 0.1 to 0.2.
Overlap gradually with a waiting time of 3 seconds and finally 1
Rotate to 80 ° (parallel state) to stop and stop driving the vacuum pump. . By performing the contact between the cationic ultraviolet curable composition and the disk substrate in a stepwise manner as described above, the incorporation of bubbles into the adhesive layer can be significantly reduced.

First and second disk substrates 1a, 1b
10 formed by overlapping
Is transported from the superposing device 5 to the disk stacking / separating device D ″ side by the transport device 19. The transport device 19
As schematically shown in FIG. 5, when stacking the disks 10 and the disks 10, gripping portions 191, 192, 193, which can grip and release the rigid disk 8 as a spacer disposed between the disks 10. 194.

As shown in FIG. 6, the gripping portion 193 of the gripping portions 191 to 194 includes an air flow passage 64, a disk-shaped vacuum suction portion 62 provided at the tip thereof, and a lower center of the vacuum suction portion 62. Cylindrical air picker 63 protruding from the part
It consists of. The air picker 63 is made of rubber and has a hollow inside. The supply passage 64a of the air flow passage 64 communicates with air supply means (not shown),
b communicates with a vacuum pump (not shown). Air picker 6
By supplying air to the hollow portion 3 through the supply path 64a, the diameter can be changed.

When the vacuum suction unit 62 comes into contact with the superposed disks 10 as shown in FIG. Next, the hole 1 of the disk 10
When air is supplied into the air picker 63 having a diameter smaller than 0a, the diameter increases and the hole 10a of the disk 10 is uniformly pressed from the inside as shown in FIG. 6C. Thereby, the first disk substrate 1a and the second disk substrate 1
Even if the axis of b is deviated, the axis can be matched. Therefore, these grip portions 191 to 1
By transporting the disk 10 by 94, the axes of the disk substrates 1a and 1b of the disk 10 are aligned.

The gripping portions 191 to 194 are arranged at regular intervals on a straight line, and the interval between the gripping portions 191 to 194 is the interval between the first position 11 "and the fourth position 13" in the disk stacking / separating apparatus D ". Furthermore, the gripper 1
Reference numerals 91 to 194 denote disk stacking and
First position 11 "and fourth position 1 in separation device D"
3 "can be interlocked along a straight line L1.

The transport device 19 moves the disk 10 from the superposing device 5 to the disk stacking / separating device D ″.
First, of the gripping portions 191 to 194, the gripping portion 191 arranged closest to the superposing apparatus 5 is transferred.
1 formed in the superposing device 5 by the
0, and the gripper 191 is moved to 192, 193, 194
Along with the straight line L1 to supply the disk 10 to the pressing device 35 (see FIG. 1).

As shown in FIG. 7, the pressing device 35 has a pair of opposing pressing portions 36, 36 capable of gripping the upper and lower surfaces of the disk 10. When the disk 10 is supplied to the pressing device 35, the pressing device 35
As a result, the disk 10 is pressed from its upper and lower surfaces. Here, the pressing device 35 is provided between the pressing portions 36, 36.
As shown in FIG. 7, the first and second disk substrates 1a and 1b constituting the disk 10 are also opposed to each other while maintaining the predetermined distance. Will be done. By allowing a predetermined time to elapse in this state, the cationic ultraviolet curable resin 4 between the first and second disk substrates 1a and 1b
5 can be extended. Note that the above-described interval Δh
Is set to a value such that the above-mentioned spreading is performed favorably.

The disc 10 on which the spreading process has been performed by the pressing device 35 is now gripped by the gripper 192. The gripper 192 conveys the disk 10 to the axis-centered conveyance buffer 195 (see FIG. 1). Then, the disk 10 supplied to the axis-centered transport buffer 195 is
It is gripped by the gripper 193 and is supplied onto the disk holder 7 arranged at the first position 11 "of the disk stacking / separating device D".

At this time, the disk holder 7 arranged in the disk stacking / separating apparatus D ″ already has the rigid disk 8
Here, the disk 10 is arranged on the rigid disk 8 so as to overlap.

When the disk 10 is supplied to the disk holder 7 arranged at the first position 11 ″ by the gripper 193, the gripper 194 is moved to the disk stacking / separating device D as shown in FIG. Is located on the fourth position 13 ". The gripper 194 is different from the first position 11" by the gripper 193.
At the same time, the rigid disk 8 is gripped while the disk 10 is released. Then, as shown in FIG.
When the gripper 194 is moved to the first position 11 ″ together with the grippers 191, 192, 193 and the rigid disk 8 is released, the disk 10 placed at the first position 11 ″ is released.
The rigid disks 8 can be stacked on top.

At this time, the gripper 193 is placed on the transport buffer 195 for centering the axis, and the gripper 192 is placed on the pressing device 35.
Since the gripper 191 moves with respect to the overlaying device 5, the grippers 191, 192, and 193 allow the disc 10 positioned in the overlaying device 5, the pressing device 35, and the centering / conveying buffer 195 to move. The discs 10 are sequentially moved from the stacking apparatus 5 to the disc stacking / separating apparatus by releasing the discs 10 by moving the grippers 191, 192, 193 to the positions shown in FIG. It can be transferred to the D ″ side.

Further, in the state of FIG.
The rigid disk 8 is gripped by the gripper 194 and the gripper 1
When the rigid disk 8 is released in the state shown in FIG. 5A and the rigid disk 8 is released, the rigid disks 8 can be stacked at the first position 11 ". That is, according to the transport device 19, the disks 10 are sequentially superimposed. It is possible to transfer the disk 5 from the device 5 to the disk stacking / separating device D ″ side, and to stack the rigid disks 8 and the disks 10 alternately at the first position 11 ″.

8 shows the details of the configuration of the disk holder 7 used in the disk stacking / separating apparatus D ″. The configuration of the disk holder 7 is that used in the disk substrate take-out region R1. It has a common configuration with.

In FIG. 8, reference numeral 70 denotes a base, reference numeral 71 denotes a spindle erected on the base 70, and reference numeral 72 denotes an elevating table which moves up and down along the spindle 71. The disk 10 first transported by the transport device 19 is transferred to the disk holder 7 disposed at the first position 11 "in the disk stacking / separating device D". At this time, in the disk holder 7, the rigid disk 8 is already arranged on the elevating table 72, and the transported disk 10 is placed on the rigid disk 8. Subsequently, after lowering the elevating table 72 until the tip of the spindle 71 projects from the disk 10, the next rigid disk 8 is placed on the disk 10 by the transport device 19. In this case, as described above, the rigid disk 8 is supplied in a state of being stacked on the disk holder 7 arranged at the fourth position 13 ″.

The rigid disk 8 is an Al disk having a thickness of 2 mm, and has a ring-shaped groove 8b for avoiding interference with the ring-shaped protrusion 10b of the disk 10. The outer diameter of the rigid disk 8 is set smaller than the outer diameter of the disk 10. This is to prevent interference between the burrs and the rigid disk 8 due to the occurrence of burrs due to injection molding on the outer peripheral edge of the disk substrate constituting the disk 10.

The rigid disk 8 is provided with a ridge 8a extending in the circumferential direction on a surface of the outer peripheral portion where the disk 10 is disposed. The ridge 8a has a height h of about 40 to 50 μm, and a width w of about 2 to 4 mm. The rigid disk 8 is chamfered at all of the ridges 8a, the ring-shaped grooves 8b, and all corners of the hole 8c formed at the center and through which the spindle 71 is inserted to come into contact with the disk 10. These corners prevent the disk 10 from being damaged.

The disks 10 stacked between the rigid disks 8 are stacked with the center side slightly bent downward by raising the outer peripheral side upward by the ridges 8a. Thereby, for example, by laminating the disks 10 that are warped upward, the disks 10 bend to the side opposite to the warp, so that the warp is corrected.

The disc laminating / separating apparatus D ″ has a first position 11 ″, a fifth position 15 ″, a sixth position 16 ″, and a second position 11 ″ arranged on the same circumference as shown in FIG. Position 1
7 ", third position 18", fourth position 13 "
The disk holder 7 is sequentially moved and circulated around the center R as a rotation center. When a predetermined amount of the disk 10 and the rigid disk 8 are stacked on the disk holder 7 at the first position 11 "by the above-described transport device 19, the disk stacking / separating device D" moves the disk holder 7 to the second position. It is moved to the fifth position 15 "and a predetermined time has elapsed. This ensures that the cationic ultraviolet curable resin on the disk 10 is spread.

Subsequently, the disk laminating / separating device D ″ is
The disk holder 7 on which the disk 10 is mounted is moved to the sixth position 16 "to perform an end surface hardening process (hardening acceleration process). The end surface hardening process is a process for the following purpose. The cationic UV curable composition exposed to the outside from the bonding surface is delayed in curing, which causes a trouble in disk handling, so that the end surface is irradiated with ultraviolet light or the disk is heated. Thereby, the curing of the cationic ultraviolet curable composition is promoted.

At the sixth position 16 ″, an end face hardening device E is provided.
1 and a heater 38 provided in the constant temperature chamber E1. The end face hardening processing is performed by holding the laminated disks 10 after the spreading process in the constant temperature chamber E1 for a predetermined time.

Next, the disk stacking / separating device D ″ moves the disk holder 7 on which the disk 10 is mounted to the second position 1.
The disk 10 and the rigid disk 8 are separated by the transfer device 20 at the second position 17 ". The transfer device 20 includes grippers 201, 202, and 203, as shown in FIG. Gripper 20
1, 202, 203 are formed so as to be able to grip and release the disk 10 and the rigid disk 8, and are arranged at regular intervals on a straight line. Further, these gripping portions 20
The spacing of 1,202,203 coincides with the spacing between the second position 17 "and the third position 18". In addition, when viewed in a plan view, the grippers 201, 202, and 203 can be linked along a straight line L2 connecting the second position 17 "and the third position 18".

The grip 201 on the side closer to the disk stacking / separating apparatus D ″ among the grips 201, 202, and 203
First, as shown in FIG. 9A, the second position 17 ″
The rigid disk 8 on the disk holder 7 is gripped. Then, the gripper 201 is moved to the third position 18 ″ as shown in FIG. 9 (b), and the rigid disk 8 is released here. The rigid disks 8 can be stacked and arranged.

At this time, the grip portion 202 is in the second position 1
7 "above the disc 10
As shown in FIG. 9A, the gripper 202 is moved onto a disk inspection device 31 to be described later, and the disk 10 is released. When the disk 10 is released, the disk inspection device 31 is moved from the second position 17 ″ to the disk inspection device 31. 10 can be transferred.

At this time, the gripper 201 is
As shown in (a), the rigid disk 8 can be gripped again because it is on the second position 17 ". By repeating such an operation, the disk 10 can be held on the second position 17". And the rigid disk 8 can be separated, and the rigid disk 8 can be stacked on the disk holder 7 at the third position 18 ".

In FIG. 9B, the grip 203
9 is located on the disk inspection device 31, and in FIG. 9A, the gripping portion 203 is located on the disk selection / separation device 32 described later. Therefore, when the grip portion 203 is located at the position shown in FIG. 9B, the disk 10 on the disk inspection device 31 is gripped. When the grip portion 203 is located at the position shown in FIG. By releasing the disk 10, the disk 10 can be transferred from the disk inspection device 31 to the disk selection / separation device 32. On the other hand, the rigid disk 8 stacked on the disk holder 7 at the third position 18 "is conveyed to the fourth position 13", where the disk 10 and the rigid disk 8 at the first position 11 " Used for stacking work.

The disk 10 transferred from the disk stacking / separating device D ″ to the disk inspection device 31 is inspected for good / defective. The inspected disk 10 is, as described above, held by the gripper. The disk is transferred to the disk sorting / stacking device 32 by 203. Here, the disk inspection device 3
The discs judged as defective in 1 are sorted out, and only discs judged as non-defective are stacked on the disc holder 7 moved from the disc substrate take-out area R1 side through the transport path 33. The disks 10 stacked in this manner are mounted on the disk holder 7,
Further, it is transported to the next step.

According to the DVD manufacturing apparatus described above, in the disk stacking / separating apparatus D ″, the first position 11 ″, the fifth position 15 ″, and the sixth position 16 ″ arranged on the same circumference. , The second position 17 ″, the third position 18 ″, and the fourth position 13 ″, the disk holder 7 is sequentially moved and circulated. Recycling and reuse can be realized.

The grippers 183, 18 of the transfer device 19
4 interlocks on the straight line L1 so that the first position 1
Since the rigid disks 8 and the disks 10 can be alternately stacked at 1 ", the transportation efficiency of the disks 10 is good and the productivity is high.

In addition, in the transfer device 20,
Since the rigid disk 8 and the disk 10 are separated at the second position 17 ″ by the interlocking movement of the rigid disks 8 and 10 on the straight line L2, the rigid disk 8 and the disk 10 can be efficiently separated. Can,
High productivity.

Further, since the disk substrate take-out area R1 and the disk stacking area R4 are connected by the transport path 33 and the empty disk holder 7 can be circulated and used, a more efficient disk holder 7 can be used. Operation is possible. Furthermore, since the disk substrate take-out area R1, the disk creation area R2, the disk inspection area R3, and the disk stacking area R4 are arranged in a substantially U-shape, the transport path 33 can be shortened, and the space efficiency is also improved. Are better.

As described above, according to the method for bonding disks in the DVD manufacturing apparatus and the apparatus for bonding the rigid disks 8 and the disks 10 used in stacking, the two disk substrates 1a and 1b are made of an adhesive. The warpage of the disk 10 can be easily and reliably corrected by bending the disks 10 superposed via the cationic ultraviolet curable composition to the side opposite to the warpage. As a result, particularly in a writable information optical disk in which the warpage of the disk 10 becomes a problem, the warp can be significantly reduced, and the defects can be reduced.

Furthermore, the warpage of the disk 10 can be removed very easily only by laminating the disks via the rigid disk 10 having the protruding ridges 8a formed on the outer peripheral side over the surface facing the disk 10 in the circumferential direction. Can be flattened. Further, since the corners of the ridges 8a are chamfered, when the ridges 8a are arranged between the disks 10 and laminated,
It is possible to reliably eliminate the problem that the corners scratch the surface of the disk 10.

FIG. 10 shows a rigid disk 8 formed in another shape, and a plurality of annular ridges 8a are formed on the upper surface and the lower surface of the rigid disk 8. As shown in FIG. ing. On the upper surface side, three ridges 8a are formed so as to gradually decrease in height at intervals from the outer peripheral portion except for the inner peripheral portion, and on the lower surface side, the inner peripheral portion except for the outer peripheral portion is formed. The three ridges 8a are formed so as to gradually decrease in height at intervals from the side.

According to the rigid disk 8 on which the ridges 8a are formed, the disks 10 arranged between the rigid disks 8 are separated by the ridges 8a formed on the upper and lower surfaces of the upper and lower rigid disks 8. As described above, the disk 10 is bent between the rigid disks 8 so that the disk 10 is bent toward the side opposite to the warp, thereby correcting the warpage of the disk 10. You.

In other words, according to the method of laminating disks in the DVD manufacturing apparatus and the apparatus for laminating rigid disks 8 and disks 10 used for stacking, a plurality of ridges 8a are formed at intervals in the radial direction. Therefore, the warpage of the disk 10 can be evenly removed in the radial direction by the plurality of ridges 8a, and the disk 10 can be flattened more favorably. In addition, the disk 10 is pressed from the front and back by the ridges 8a formed on the front and back of the rigid disk 8, so that the warp can be removed and the flattening can be performed more favorably.

In the step of separating the disk 10 from the rigid disk, if the rigid disk is flat, pseudo-attachment of the disks occurs, and the rigid disk is dragged by the disk 10 when separating the disks. Although a phenomenon may occur, in the present embodiment, the use of the rigid disk 8 does not cause pseudo adhesion between the disks, and can prevent the above-described trouble at the time of separation. In the above embodiment, other configurations may be adopted without departing from the spirit of the present invention.

[0090]

As described above, according to the bonding method, the spacer and the bonding apparatus of the present invention, the following effects can be obtained. According to the laminating method according to the first aspect, the disk in which two disk substrates are overlapped with each other via an adhesive is bent toward the side opposite to the warpage, so that the disk can be easily and surely warped. Can be corrected. As a result, particularly in a writable information optical disk in which the warpage of the disk poses a problem, the warp can be significantly reduced, and defects can be reduced.

According to the laminating method of the second aspect, the disks are laminated via the spacer having the ridge formed so as to extend in the circumferential direction on the surface facing the disk. Very easily, the disk can be flexed away from its bow and removed and flattened.

According to the laminating method of the third aspect, the disks are stacked via the spacer having a plurality of ridges formed at intervals in the radial direction.
The plurality of ridges can be removed evenly in the radial direction, and can be more preferably flattened.

According to the laminating method of the fourth aspect, the disk can be pressed from the front and back by the ridges formed on the front and back of the spacer to remove the warp, and the flattening can be performed more favorably. .

According to the spacer of the fifth aspect, by arranging the two disk substrates between the disks which are overlapped with each other with an adhesive therebetween, the ridge warps the disk to the side opposite to the warpage. Therefore, the warpage of the disk can be easily and reliably corrected.

According to the spacer according to the sixth aspect, the plurality of protrusions formed at intervals in the radial direction can evenly remove the warp of the disk in the radial direction, and furthermore, the flatness can be further improved. Can be.

According to the spacer of the seventh aspect, the disk is pressed from the front and back by the ridges formed on the front and back,
The warpage can be reliably removed, and the flattening can be performed more favorably.

According to the spacer according to the eighth aspect, since the corners of the ridge are chamfered, when arranged between the disks and laminated, the corners may damage the disk surface. Troubles can be reliably eliminated.

According to the laminating apparatus of the ninth aspect, the cation type ultraviolet curable composition which has been irradiated with ultraviolet rays is dropped and applied onto a disk substrate, and then bonded to another disk substrate to form one disk. By stacking the pieces with the spacers interposed therebetween before the cationic ultraviolet curable composition is cured, the spacers correct the warp and increase the flatness of each disk.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing an optical disk manufacturing apparatus using a bonding method according to an embodiment of the present invention.

FIG. 2 is a diagram showing a procedure for gripping a disk substrate in the disk substrate transport device applied to the optical disk manufacturing apparatus of FIG. 1;

FIG. 3 is a diagram showing a configuration of an ultraviolet curable composition falling irradiation apparatus applied to the optical disk manufacturing apparatus of FIG.

FIG. 4 is a diagram for explaining superposition of disk substrates.

FIG. 5 is an elevational view schematically showing a disk transport device used in the optical disk manufacturing apparatus of FIG. 1;

FIG. 6 is a diagram showing a configuration of a gripping unit in the disk transport device of FIG. 5;

FIG. 7 is a vertical sectional view schematically showing a pressing device used in the optical disk manufacturing apparatus of FIG.

FIG. 8 is a view illustrating a state in which a disk and a rigid disk are stacked on a disk holder used in the optical disk manufacturing apparatus of FIG. 1 for explaining a bonding method, a spacer, and a bonding apparatus according to an embodiment of the present invention. is there.

FIG. 9 is an elevational view schematically showing the disk transfer device.

FIG. 10 is a diagram illustrating a state in which disks for explaining a rigid disk according to another embodiment of the present invention and a rigid disk are stacked.

[Explanation of symbols]

 1a, 1b disk substrate 8 rigid disk (spacer) 8a ridge 10 disk

Continued on the front page F term (reference) 4F211 AA44 AD08 AH38 TA03 TC02 TC09 TH18 TQ04 TW26 4J040 JB08 LA11 MA10 MB03 NA21 PA25 PA32 PA44 PB20 PB22 5D121 AA03 AA07 EE22 EE24 FF02 FF11 FF13 FF18 GG02

Claims (9)

[Claims] At least one of which has an information recording layer.
A disk bonding method in which an adhesive is interposed between two disk substrates made of a thermoplastic resin and the two are bonded to each other, and a disk in which disk substrates are overlapped with each other via an adhesive is formed in a direction opposite to a warping direction. By bending
A bonding method characterized by correcting warpage. 2. The disk is stacked via a spacer having a ridge formed circumferentially on an opposing surface, so that the ridge deflects the disk to a side opposite to the warp, thereby reducing the warp. The bonding method according to claim 1, wherein the bonding is performed. 3. The spacer according to claim 2, wherein a plurality of protrusions are formed at intervals in a radial direction.
The bonding method described. 4. The spacer according to claim 2, wherein the ridges are formed on the front and back sides of the spacer, and the disc is pressed from the front and back sides by the ridges to bend to the side opposite to the warpage. 3. The bonding method according to 3. 5. At least one having an information recording layer
A spacer used in a disk bonding apparatus for bonding an adhesive between two disk substrates made of a thermoplastic resin and interposing the adhesive therebetween, and is disposed between the disks stacked via the adhesive,
A spacer, wherein a ridge for bending the disk in a direction opposite to the warpage is formed on a surface facing the disk so as to extend in a circumferential direction. 6. The spacer according to claim 5, wherein a plurality of said ridges are formed at intervals in a radial direction. 7. The disk according to claim 5, wherein the ridges are formed on the front and back, and the disk is pressed from the front and back by the front and back buckles to bend to the side opposite to the warpage. Spacer. 8. The spacer according to claim 5, wherein a corner of the ridge is chamfered. 9. A dropping means for dropping a cationic UV-curable plastic onto a disk substrate, an ultraviolet irradiation means for irradiating the cationic UV-curable composition falling with ultraviolet rays, and the cation of the disk substrate Stacking means for stacking another disk substrate to make one disk by opposing the surface on which the mold ultraviolet curable composition has fallen, and stacking a plurality of disks by disposing the disks between a plurality of spacers Means, wherein said spacer in said stacking means is
A bonding apparatus comprising the spacer according to any one of the above.