JP2001241907A - Displacement detector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a displacement detector capable of easily detecting the displacement of an article to be measured through a partition wall. SOLUTION: A pair of sensing coils 22a, 22b are arranged to the outside of the partition wall 15a of a non-magnetic solder tank 13a storing molten solder 14 being a conductor so as to be turned toward the partition wall 15a in the displacement range of the liquid surface of the molten solder 14 and a detection part 41 is connected to the sensing coils 22a, 22b. When the liquid surface of the molten solder 14 in the solder tank 13a is displaced, the sensing coils 22a, 22b are changed in inductance. The displacement of the liquid surface of the molten solder 14 is detected on the basis of the change in the inductances of the sensing coils 22a, 22b by the detection part 41. The displacement of the liquid surface of the molten solder 14 can be easily detected through the partition wall 15a of the solder tank 13a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a displacement detecting device for detecting a displacement of an object to be measured.

[0002]

2. Description of the Related Art Conventionally, as this kind of displacement detection device,
For example, the configuration shown in FIG. 11 or FIG. 12 is known.

Then, a displacement detecting device 1a shown in FIG.
Is for managing the level of the liquid surface of the molten solder 4 as an object to be measured stored in the solder tank 3 in the solder tank 3 of the soldering apparatus 2, that is, detecting the displacement of the liquid level. The switch 6 is turned on and off in conjunction with the vertical movement of the float 5 floating on the liquid surface of the solder 4, and the displacement of the liquid surface of the molten solder 4 is detected.

In the displacement detecting device 1b shown in FIG. 12, an eddy current sensor 8 is disposed so as to face the liquid surface of the molten solder 4 in the solder bath 3, and the eddy current formed by the sensor 8 is formed. , The displacement of the liquid surface of the molten solder 4 is detected.

However, in the displacement detectors 1a and 1b shown in FIGS. 11 and 12, it is usually convenient to perform the soldering operation above the liquid level of the molten solder 4, so that the displacement of the liquid level of the molten solder 4 is detected. Float 5 or sensor unit 8 to be detected
Is present on the liquid surface of the molten solder 4, so that the float 5 or the sensor unit 8 may interfere with a substrate to be soldered (not shown) of the soldering apparatus 2. To avoid such interference, the size of the solder bath 3 must be increased.

[0006] In particular, in the displacement detection device 1b shown in FIG.
Using the eddy current, the displacement of the liquid surface of the molten solder 4 is detected by the sensor unit 8.
Therefore, it is not easy to separate the sensor section 8 from the liquid surface of the molten solder 4 by a partition member or the like. Further, since the range in which the displacement of the liquid level of the molten solder 4 can be continuously detected is limited, the range in which the displacement of the liquid level of the molten solder 4 can be detected is reduced. Further, since the molten solder 4 is usually at a high temperature of about 200 ° C., it is not easy to bring the sensor section 8 close to the liquid surface of the molten solder 4 in order to prevent a decrease in the durability of the sensor section 8.

Further, the displacement value of the liquid level of the molten solder 4 detected by the displacement detecting device 1b and the voltage value output from the sensor unit 8 when the liquid level of the molten solder 4 changes are not necessarily proportional. Not a relationship. For this reason, the sensor unit 8
It is necessary to create a conversion table or the like for determining the displacement value of the liquid level of the molten solder 4 based on the voltage output from the device. Therefore, manufacturing is not easy, and further, for example, a conductor such as a stainless steel plate is used. From the outside of the solder bath 3 through a partition 9 as a side wall of the solder bath 3
It is not easy for the sensor unit 8 to detect the displacement value of the liquid level.

[0008]

As described above, in the displacement detectors 1a and 1b shown in FIGS. 11 and 12, since it is convenient to perform the soldering operation above the liquid level of the molten solder 4, a solder bath is used. 3 must be increased. In particular, in the displacement detection device 1b, it is not easy to separate the sensor unit 8 from the liquid surface of the molten solder 4 by a partition member or the like, and the detectable range for the displacement of the liquid surface of the molten solder 4 becomes small, It is not easy to bring the sensor unit 8 close to the liquid surface of the molten solder 4. The displacement of the liquid level of the molten solder 4 and the voltage output from the sensor unit 8 when the liquid level of the molten solder 4 is displaced are not necessarily in a proportional relationship.

Furthermore, there is a problem that it is not easy to detect the displacement of the liquid level of the molten solder 4 as the object to be measured via the partition 9 of the solder bath 3.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to provide a displacement detection device capable of easily detecting a displacement of an object to be measured via a partition.

[0011]

According to a first aspect of the present invention, there is provided a displacement detecting device comprising: a nonmagnetic partition wall which is separated from an object to be measured which is displaced on one side; A sensor unit having a sensing coil disposed on the other side of the partition in at least a part of a displacement range of the device to be measured displaced on one side of the lever partition, and a change in inductance of the sensing coil of the sensor unit; And a detector for detecting the displacement of the object to be measured via the partition.

In this configuration, when the object to be measured is displaced on one side of the nonmagnetic partition, the sensing coil of the sensor unit disposed on the other side of the partition is disposed because the object to be measured is a conductor. The magnetic field that forms changes and the inductance of this sensing coil changes. In this state, the detection unit detects the displacement of the device under test based on the change in the inductance. As a result, without disposing the sensor section on one side of the partition wall on which the object to be measured is displaced, and further without displacing the sensor section with the object to be measured, the displacement of the object to be measured is measured via the partition wall. And a detection unit. Therefore, it is easy to detect the displacement of the measured object via the partition.

According to a second aspect of the present invention, there is provided a displacement detecting device.
In the displacement detection device described above, the sensing coils of the sensor unit are arranged side by side in pairs in a direction intersecting the direction in which the measured object is displaced.

In this configuration, the sensing coils forming a pair along the direction intersecting the direction of displacement of the object to be measured are juxtaposed, so that the magnetic field formed by these paired sensing coils also Intersects the displacement direction of As a result, the change in the inductance of the sensor unit that occurs when the object to be measured is displaced becomes clearer, so that the detection unit detects the displacement of the object to be measured more accurately.

According to a third aspect of the present invention, there is provided a displacement detecting device.
In the displacement detection device described above, the sensing coils of the sensor unit are arranged side by side in pairs in a direction orthogonal to the direction in which the measured object is displaced.

In this configuration, the sensing coils forming a pair along the direction perpendicular to the direction of displacement of the object to be measured are juxtaposed, so that the magnetic field formed by the pair of sensing coils also At right angles to the displacement direction. As a result, the change in the inductance of the sensor unit that occurs when the object to be measured is displaced becomes clearer, so that the sensor unit and the detection unit detect the displacement of the object to be measured more accurately.

According to a fourth aspect of the present invention, there is provided a displacement detecting device.
Or the displacement detection device according to 3, wherein the sensor unit includes a pair of temperature compensation coils disposed at equal intervals from each of the pair of sensing coils, and one end of one of the pair of temperature compensation coils has one end. One end of the pair of one sensing coils is electrically connected, the other end is electrically connected to one end of the pair of the other sensing coils, and one end of the pair of the other temperature compensation coils has one end thereof. The other end of one of the sensing coils is electrically connected, the other end is electrically connected to the other end of the pair of other sensing coils, the detection unit,
A connection point between the pair of one sensing coil and the pair of other temperature compensation coils, and a connection point between the pair of other sensing coils and the pair of one temperature compensation coils, respectively. Is what it is.

In this configuration, a pair of temperature compensating coils are disposed at regular intervals from each of the pair of sensing coils, and one end of one temperature compensating coil is connected to one end of one sensing coil and the other end. Connecting one end of the other sensing coil, connecting one end of the other temperature compensation coil to the other end of one sensing coil, and the other end to the other end of the other sensing coil,
Furthermore, by connecting the detection unit to the connection point between one sensing coil and the other temperature compensation coil and the connection point between the other sensing coil and the one temperature compensation coil, the temperature of the DUT itself to be detected is reduced. Even if different, the same change in inductance occurs in the sensor unit when the object to be measured is displaced. As a result, the pair of temperature compensation coils compensate for the temperature error when the sensor unit and the detection unit detect the displacement of the measured object having different temperatures. For this reason, even if the temperature of the measured object changes, the displacement can be accurately detected.

According to a fifth aspect of the present invention, there is provided a displacement detecting device.
In the displacement detecting device according to any one of the above (1) to (4), the differential voltage value between the pair of sensing coils is substantially proportional to the displacement value of the measured object.

In this configuration, since the differential voltage value between the pair of sensing coils is substantially proportional to the displacement value of the object, the distance between the pair of sensing coils generated when the object is displaced. It becomes easy to detect the displacement of the DUT by the detection unit based on the change in the inductance. As a result, the configuration of the detection unit is simplified and the production is facilitated, so that the production cost can be reduced.

According to a sixth aspect of the present invention, there is provided a displacement detecting device.
The displacement detecting device according to any one of the above (1) to (5), further comprising a magnetic plate having magnetism juxtaposed with the partition on one side of the partition opposed to the sensor unit via the partition.

In this configuration, a magnetic plate is provided in parallel with the partition on one side of the partition facing the sensor section via the partition, so that when the object to be measured is displaced,
Under the influence of the magnetism of the magnetic plate, a more amplified change in inductance occurs in the sensor unit. Therefore, since the sensitivity of the sensor unit is improved, the energy cost for detecting the displacement of the object to be measured is reduced, and the accuracy of the sensor unit is improved.

According to a seventh aspect of the present invention, there is provided a displacement detecting device.
7. The displacement detecting device according to any one of the above items 6, wherein the sensing coil includes a heat-resistant bobbin and a heat-resistant wire wound around the bobbin.

In this configuration, since the sensing coil is formed by winding a heat-resistant wire around a heat-resistant bobbin, the partition wall is heated to a high temperature when detecting the displacement of the high-temperature measuring object. Even in this case, the inductance of the sensor unit changes accurately. Therefore, the displacement of the measured object can be detected regardless of the temperature of the measured object itself.

The displacement detecting device according to the eighth aspect is the first aspect.
8. The displacement detection device according to any one of to 7, wherein the object to be measured is a molten solder, the partition is a side wall of a solder bath in which the molten solder is stored, and the sensor unit is an exterior of the side wall of the solder bath. The detection unit is for detecting displacement of the liquid level of the molten solder.

In this configuration, when the liquid level of the melted solder in the solder bath is displaced, the inductance of the sensor disposed outside the side wall of the solder bath changes. Thereafter, based on the change in the inductance, the detection unit detects the displacement of the liquid level of the molten solder. For this reason, the detection of the displacement of the liquid level of the molten solder through the side wall of the solder bath is facilitated by the sensor unit and the detection unit.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction of a first embodiment of the displacement detecting device according to the present invention will be described below with reference to FIGS.

As shown in FIGS. 1 to 5, reference numeral 11a denotes a displacement detecting device. The displacement detecting device 11a is, for example, a conductor stored in the solder bath 13a of the solder bath 13a of the soldering device 12. The displacement of the liquid level of the molten solder 14 as an object to be measured is detected, and the level of the liquid level of the molten solder 14 is managed.

The displacement detecting device 11a detects the displacement of the liquid level of the molten solder 14 in the solder tank 13a through a partition wall 15a which is a side wall of a solder tank 13a formed of a non-magnetic material such as stainless steel. The sensor unit 21 is provided as a differential detection circuit for sensing. This sensor unit 21 is connected to the solder bath 13a.
Is arranged outside this solder bath 13a toward the partition wall 15a. The sensor unit 21 includes a pair of sensing coils 22.
a, 22b, the pair of sensing coils 22a, 22b
As shown in FIG. 3, a center leg iron core 24a, 24b located at the center of a substantially flat E-shaped core 23a, 23b, which is a conductor, is made of a heat-resistant synthetic resin such as Teflon (registered trademark). It is formed by inserting a heat-resistant wire 25 having heat resistance a plurality of times wound around a substantially cylindrical bobbin (not shown) formed by molding.

The pair of sensing coils 22a and 22b move in the direction in which the liquid level of the molten solder 14 in the solder bath 13a is displaced, that is, in the horizontal direction perpendicular to the direction in which the molten solder 14 increases and decreases. It is juxtaposed. The pair of sensing coils 22a and 22b are substantially the same as each other, and are disposed substantially in the middle of the range of increase and decrease of the molten solder 14, as shown in FIGS.

Further, the pair of sensing coils 22a, 22b
A pair of these sensing coils equally spaced from each other
A pair of temperature compensating coils 22a and 22b are provided below the 22a and 22b. These pair of temperature compensation coils 26a, 26b
Compensates for temperature errors by preventing temperature effects such as temperature changes when detecting the displacement of the liquid surface of the molten solder 14 having a different melting temperature with the pair of sensing coils 22a and 22b. The temperature compensation coil 26a has one end electrically connected to one end of the sensing coil 22a and the other end electrically connected to one end of the sensing coil 22b. Further, one end of the temperature compensation coil 26b is electrically connected to the other end of the sensing coil 22a, and the other end is electrically connected to the other end of the sensing coil 22b.

The temperature compensation coil 26a is connected to the sensing coil 2
2a, and the temperature compensation coil 26b is disposed below the sensing coil 22b. Further, these temperature compensation coils 26a and 26b are substantially the same as the sensing coils 22a and 22b, and are provided with central leg iron cores 28a and 28b located at the center of the substantially flat E-shaped cores 27a and 27b as conductors, for example, Teflon. These are formed by inserting a heat-resistant wire 29 that is wound a plurality of times on a substantially cylindrical bobbin (not shown) formed of a heat-resistant synthetic resin or the like. The pair of temperature compensating coils 22a and 22b are horizontally arranged side by side, and are disposed outside the partition wall 15a facing the position where the molten solder 14 is always stored in the solder bath 13a.

Here, the sensing coils 22a, 22b and the temperature compensating coils 26a, 26b are respectively connected to the center leg iron cores 24a, 24b,
The central leg iron cores 24a, 24b, 28a, 28b are disposed horizontally with the ends of 28a, 28b facing the partition wall 15a of the solder bath 13a.

Then, an AC voltage is applied to the sensor section 21 as a basic signal having a stable frequency and waveform.
A stabilized basic signal generating unit 31 for applying the AC voltage to each of the sensing coils 22a and 22b and each of the temperature compensating coils 26a and 26b of the sensor unit 21 is provided.

As shown in FIG. 4, the stabilizing basic signal generator 31 includes a connection point between the sensing coil 22a and the temperature compensating coil 26a, a sensing coil 22b and the temperature compensating coil 2a.
It is electrically connected to each connection point with 6b. Further, the stabilizing basic signal generator 31 includes the sensing coils 26a and 26a.
An alternating voltage is applied to these sensing coils 26a and 26b so that mutually opposite magnetic fields are formed for each of the coils 6b.

Further, the sensor unit 21 includes
A detection unit 41 for detecting the displacement of the liquid level of the molten solder 14 in the solder bath 13a through the partition wall 15a based on the change in inductance between the pair of sensing coils 22a and 22b, that is, the differential voltage value, is attached. I have. The detection unit 41 includes a filter circuit 42 that inputs a differential voltage between the pair of sensing coils 22a and 22b and removes noise of the differential voltage or removes an extra signal. The filter circuit 42 shown in FIG.
As shown in FIG. 6, the connection point between the sensing coil 22a and the temperature compensation coil 26b and the connection point between the sensing coil 22b and the temperature compensation coil 26a are electrically connected.

A rectifier circuit 43 for rectifying an input AC voltage is electrically connected to the filter circuit 42. The rectifier circuit 43 receives an AC current as a differential voltage between the pair of sensing coils 22a and 22b from which noise has been removed by the filter circuit 42, rectifies the AC voltage, and outputs the rectified AC voltage.

Further, the rectifying circuit 43 has a displacement signal indicating the displacement of the liquid level of the molten solder 14 in the solder bath 13a based on the differential voltage between the pair of sensing coils 22a and 22b, that is, the change in inductance. An output adjustment circuit 44 for outputting a signal is electrically connected. This output adjustment circuit 44 is a rectifier circuit.
An alternating current as a differential voltage between the pair of sensing coils 22a and 22b rectified in 43 is input, and a displacement of the liquid level of the molten solder 14 in the solder bath 13a is calculated from the voltage value of the alternating current. The displacement signal of the liquid level of the molten solder 14 is output.

Here, as shown in FIG.
The displacement value of the liquid level of the molten solder 14 in the
Is substantially proportional to the differential voltage value between the pair of sensing coils 22a and 22b when the liquid surface of the sensor is displaced.

Next, the operation of the first embodiment will be described.

In a state where the stabilized basic signal generator 31 applies a stabilized AC voltage as a basic signal to the pair of sensing coils 22a and 22b and the pair of temperature compensating coils 26a and 26b, When the liquid level of the molten solder 14 is displaced, the inductance between the pair of sensing coils 22a and 22b changes.

At this time, the molten solders 14 having different melting temperatures are used.
However, the temperature compensation is performed by the pair of temperature compensation coils 26a and 26b connected to the pair of sensing coils 22a and 22b.

The differential voltage generated due to the change in inductance between the pair of sensing coils 22a and 22b is rectified by the rectifier circuit 43 after noise is removed by the filter circuit 42.

Thereafter, based on the differential voltage, the output adjusting circuit 44 detects the displacement of the liquid level of the molten solder 14 in the solder bath 13a, and outputs a displacement signal indicating the displacement of the liquid level of the molten solder 14. I do.

Then, by receiving this displacement signal, the displacement of the liquid level of the molten solder 14 in the solder bath 13a can be easily detected.

As described above, according to the first embodiment, when the liquid level of the melted solder 14 in the solder bath 13a is displaced, the sensing coil disposed outside the partition 15a of the solder bath 13a.
The inductance between 22a and 22b changes, and the output adjustment circuit 44 of the detection unit 41 outputs a displacement signal corresponding to the displacement of the liquid level of the molten solder 14 based on the differential voltage accompanying the change in inductance. As a result, the molten solder 1
4. Displacement of the liquid surface can be easily detected.

For this reason, without being disposed in the solder bath 13a, and without being brought into contact with the molten solder 14,
Since the displacement of the liquid level of the molten solder 14 stored in the solder tank 13a, that is, the stored amount, can be detected from outside the partition wall 15a of the solder tank 13a, it is convenient to perform the soldering operation on the liquid level of the molten solder 14. However, since the sensing coils 22a and 22b for detecting the displacement of the liquid surface of the molten solder 14 and the substrate to be soldered (not shown) of the soldering device 12 do not interfere with each other, the size of the solder bath 13a can be reduced.

Further, by arranging a pair of sensing coils 22a and 22b along the horizontal direction,
Since the magnetic field generated by the a and 22b is orthogonal to the direction of displacement of the liquid level of the molten solder 14, the change in the inductance between the sensing coils 22a and 22b generated when the liquid level of the molten solder 14 is displaced becomes clearer. Therefore, it is possible to more accurately detect the displacement of the liquid level of the molten solder 14 in the solder tank 13a based on the change in the inductance, and further, it is possible to detect the displacement of the liquid level of the molten solder 14 by eddy current. In addition, a large detectable range for displacement of the liquid level of the molten solder 14, that is, a large detectable stroke can be secured.

Further, the sensing coils 22 arranged side by side horizontally
A pair of temperature compensating coils 26a and 26b are horizontally arranged below a and 22b, and one end of the temperature compensating coil 26a is connected to the sensing coil 22a.
To the other end of the sensing coil 22b, one end of the temperature compensation coil 26b is connected to the other end of the sensing coil 22a, and the other end is connected to the other end of the sensing coil 22b. By electrically connecting the detection unit 41 to the connection point between the sensing coil 22a and the temperature compensation coil 26b and the connection point between the sensing coil 22b and the temperature compensation coil 26a, these sensing coils 22a and 22b and the temperature compensation coil 26
The bridge circuit is constituted by a and 26b.

For this reason, the melting solders 14 having different melting temperatures are used.
Even when the liquid level of the molten solder 14 is detected, when the liquid level of the molten solder 14 is displaced in the solder bath 13a, the sensing coils 22a, 22b
A substantially equal change in inductance can occur between them.

As a result, when the displacement of the liquid level of the molten solder 14 is detected by the sensing coils 22a and 22b, the temperature compensation coil 26
Temperature errors can be compensated by a and 26b. For this reason, molten solder
Regardless of the temperature of the molten solder 14, that is, even when detecting the displacement of the liquid level of the molten solder 14 having a different temperature, the displacement of the liquid level of the molten solder 14 can be similarly detected without performing temperature correction or the like. , The usability can be improved.

The differential voltage value based on the change in inductance between the sensing coils 22a and 22b is substantially proportional to the displacement value of the liquid level of the molten solder 14 in the solder bath 13a. Therefore, it is possible to easily detect the displacement of the liquid level of the molten solder 14 by the detection unit 41 using the sensing coils 22a and 22b generated when the liquid level of the molten solder 14 is displaced.

Therefore, there is no need to create a conversion table or the like for determining the displacement value of the liquid level of the molten solder 14 based on the differential voltage value between the sensing coils 22a and 22b. As a result,
Since the configuration of the detection unit 41 can be simplified, manufacturability can be improved,
Furthermore, manufacturing costs can be reduced.

Further, since the sensing coils 22a, 22b and the temperature compensating coils 26a, 26b are formed by winding heat-resistant wires 25, 29 having heat resistance around a heat-resistant bobbin, the displacement of the liquid surface of the molten solder 14 at a high temperature can be achieved. Is detected, the inductance between the sensing coils 22a and 22b changes accurately even if the solder bath 13a is heated to a high temperature.

As a result, the detectable range for the temperature of the molten solder 14 in the sensing coils 22a and 22b can be expanded,
It can be used even in a high temperature environment. Further, the sensing coils 22a and 22b and the temperature compensation coils 26a and 26b are
Since it can be brought close to the heated solder bath 13a, the change in inductance between the sensing coils 22a and 22b becomes more accurate, and the displacement of the liquid level of the molten solder 14 by the detection unit 41 can be detected more accurately.

The cores 23a, 23b, 23a, 23b of the sensing coils 22a, 22b and the temperature compensating coils 26a, 26b of the sensor section 21,
Since cores 27a and 27b are E-shaped, each of these cores 23a, 23b, 27
The magnetic field diverges from the ends of the center leg iron cores 24a, 24b, 28a, 28b of a and 27b, or the magnetic field converges to the ends of these center leg iron cores 24a, 24b, 28a, 28b. Therefore, these sensing coils 22
The magnetic field formed by a and 22b and the temperature compensation coils 26a and 26b is substantially square with the liquid level of the molten solder 14 in the solder bath 13a. As a result, the magnetic field between the sensing coils 22a and 22b due to the displacement of the liquid surface of the molten solder 14, that is, the inductance changes more accurately and with high sensitivity, so that the sensitivity of the sensor unit 21 can be improved.

Further, the differential voltage based on the change in the inductance between the sensing coils 22a and 22b is filtered by the filter circuit 42 to remove noise and rectified by the rectification management 43. Since the displacement of the liquid level of the molten solder 14 is detected and a displacement signal of the liquid level is output, the displacement of the liquid level of the molten solder 14 is greater than when the filter circuit 42 and the rectifying circuit 43 are not provided. Can be detected accurately.

Next, the configuration of the second embodiment of the present invention will be described with reference to FIG.

The displacement detector 11b shown in FIG. 6 is basically the same as the displacement detector 11a shown in FIGS. 1 to 5, except that a float 51 is floated on the molten solder 14 in the solder bath 13b. It is.

The float 51 is a magnetic material and is formed in a substantially rectangular parallelepiped. In addition, this float
51 is disposed at a position facing each of the pair of sensing coils 22a and 22b via the partition wall 15b of the solder tank 13b whose upper part is sealed, and with the displacement of the liquid level of the molten solder 14, The molten solder 14 is similarly displaced in the direction of displacement of the liquid surface, that is, in the vertical direction.

Next, the operation of the second embodiment will be described.

The operation of the displacement detection device 11b shown in FIG. 6 is basically the same as that of the displacement detection device 11a shown in FIGS.

When the liquid level of the molten solder 14 is displaced, the float 51 is displaced with the displacement of the liquid level.

In this state, the inductance between the sensing coils 22a and 22b changes. Then, based on the change in the inductance, the detecting unit 41 detects the molten solder 1 in the solder bath 13b.
4. Detect the displacement of the liquid surface.

As described above, in the second embodiment, the displacement of the liquid level of the molten solder 14 in the solder bath 13b is detected by the sensing coils 22a and 22b and the detection unit 41.
Further, the same effects as those of the displacement detecting device 11a shown in FIG. 5 can be obtained.

The float 51, which is a magnetic material, is placed in a solder bath.
When the liquid surface of the molten solder 14 in the solder bath 13b is displaced by floating on the solder bath 13b, the float 51 is similarly displaced with the displacement of the liquid surface. Therefore, the molten solder 14
When the liquid surface is displaced, the magnetic field generated by the float 51 similarly changes, so that the change in inductance generated between the sensing coils 22a and 22b can be further amplified.

As a result, the influence of the oxides and the like contained in the molten solder 14 is less likely to occur, so that the change in inductance between the sensing coils 22a and 22b can be made clearer,
The sensitivity of 22a and 22b can be improved, and the energy cost for detecting the displacement of the liquid level of the molten solder 14 can be reduced.
The accuracy of the sensing coils 22a, 22b can be improved.

In this case, the solder tank 13b whose upper part is sealed
However, since this solder bath 13b is a non-magnetic material,
The displacement of the liquid level of the molten solder 14 can be detected by a change in inductance between the sensing coils 22a and 22b.

Next, the configuration of the third embodiment of the present invention will be described with reference to FIG.

The displacement detecting device 11c shown in FIG. 7 is basically the same as the displacement detecting device 11a shown in FIGS. 1 to 5, except that a magnetic plate 61 having magnetism is provided in the solder bath 13a. It is.

The magnetic plate 61 is a back iron formed in a substantially flat plate shape. The side facing the sensing coils 22a and 22b via the partition wall 15a of the solder tank 13a, that is, the solder tank 13a
In the solder bath 13a, the solder bath 13a is fixed and arranged substantially parallel to the partition wall 15a. The magnetic plate 61 is formed in a size that can face the sensing coils 22a and 22b and the temperature compensation coils 26a and 26b.

Next, the operation of the third embodiment will be described.

The operation of the displacement detector 11c shown in FIG. 7 is basically the same as that of the displacement detector 11a shown in FIGS.

As described above, in the third embodiment, the displacement of the liquid level of the molten solder 14 in the solder bath 13a is detected by the sensing coils 22a and 22b and the detection unit 41.
Further, the same effects as those of the displacement detecting device 11a shown in FIG. 5 can be obtained.

Further, since the magnetic plates 61 are arranged side by side on the side facing the sensing coils 22a and 22b via the partition wall 15a of the solder tank 13a, when the liquid level of the molten solder 14 in the solder tank 13a is displaced, Due to the influence of the magnetism of the magnetic plate 61, a more amplified change in inductance occurs between the sensing coils 22a and 22b.

Therefore, the sensitivity of the sensing coils 22a and 22b when the liquid level of the molten solder 14 is displaced can be improved, and
The energy cost for detecting the displacement of the liquid level of 14 can be reduced.

Next, the configuration of the fourth embodiment of the present invention will be described with reference to FIG.

The displacement detecting device 11d shown in FIG. 8 is basically the same as the displacement detecting device 11a shown in FIGS. 1 to 5, but has a substantially E-shaped flat core E-shaped core 71 and a pair of sensing coils.
22a and 22b are formed.

The E-shaped core 71 is a conductor. Side leg cores 73a and 73b are located on both sides of the center leg core 72 located at the center. In addition, these side leg cores 73a and 73b are fitted with heat-resistant wires (not shown) having a substantially cylindrical heat resistance.
25 turns are attached. The parts to which these heat-resistant wires 25 are attached are the sensing coils, respectively.
22a and 22b.

Next, the operation of the fourth embodiment will be described.

The operation of the displacement detector 11d shown in FIG. 8 is basically the same as that of the displacement detector 11a shown in FIGS.

As described above, in the fourth embodiment, the displacement of the liquid level of the molten solder 14 in the solder bath 13a is detected by the sensing coils 22a and 22b and the detection unit 41.
Further, the same effects as those of the displacement detecting device 11a shown in FIG. 5 can be obtained.

Further, since the sensing coils 22a and 22b are formed by winding the heat-resistant wires 25 around the side leg cores 73a and 73b of the E-shaped core 71, the structure of the sensing coils 22a and 22b can be simplified, and the manufacturability can be improved. And the sensing coils 22a, 22b
Are integrated, it is possible to reduce the time and effort required to dispose the sensing coils 22a and 22b.

Next, the configuration of the fifth embodiment of the present invention will be described with reference to FIG.

The displacement detecting device 11e shown in FIG. 9 is basically the same as the displacement detecting device 11d shown in FIG. 8, except that a pair of sensing coils 22a and 22b are formed by a concave core 81 having a substantially U-shaped flat plate.
Is formed.

The concave core 81 is an electric conductor, and the side leg iron cores 82 and 83 on both sides are respectively provided with a substantially cylindrical heat-resistant bobbin (not shown) around which a heat-resistant wire 25 is wound. Have been. And these heat resistant wires
The parts to which 25 is attached become the sensing coils 22a and 22b, respectively.

Next, the operation of the fifth embodiment will be described.

The operation of the displacement detector 11e shown in FIG. 9 is basically the same as that of the displacement detector 11d shown in FIG.

As described above, in the fifth embodiment, the displacement of the liquid level of the molten solder 14 in the solder bath 13a is detected by the sensing coils 22a and 22b and the detection unit 41.
The same effect as the displacement detecting device 11d shown in FIG.

Also, since the sensing coils 22a and 22b are formed by winding the heat-resistant wires 25 around the respective side leg iron cores 82 and 83 of the concave core 81, the sensing coils 22a and 22b are different from those of the E-shaped core 71.
Since the configuration of 22a, 22b is simplified, the sensing coils 22a, 22b
Manufacturing costs can be reduced.

Next, the configuration of the sixth embodiment of the present invention will be described with reference to FIG.

The displacement detecting device 11f shown in FIG. 10 is basically the same as the displacement detecting device 11a shown in FIGS. 1 to 5, except that the liquid level of the molten solder 14 stored in the solder tank 13a is different. The sensing coil 22 detects the displacement of the object 91 as an object to be measured.
The detection is performed through the partition 15f at a and 22b.

The object 91 is a conductor, and moves, that is, is displaced along the partition wall 15f above the horizontally disposed partition wall 15f. Below the partition wall 15f, a pair of sensing coils 22 and 22b are arranged side by side in a direction orthogonal to the direction of displacement of the object 91. These sensing coils 22 and 22b are , 22b are arranged with the ends of the center leg iron cores 24a, 24b facing upward.

Next, the operation of the sixth embodiment will be described.

The operation of the displacement detecting device 11f shown in FIG. 10 is basically the same as that of the displacement detecting device 11a shown in FIGS.

As described above, in the sixth embodiment, the displacement of the object 91 is detected by the sensing coils 22a and 22b and the detecting section 41.
Thus, the same effect as the displacement detecting device 11a shown in FIGS. 1 to 5 can be obtained.

In the above embodiments, the molten solder is used.
Although the configuration in which the displacement of the liquid surface or the object 91 of 14 is detected by the sensing coils 22a, 22b and the detection unit 41 has been described, the present invention is not limited to such a configuration, and instead of the molten solder 14 and the object 91, If the DUT is a magnetic material, the displacement of the DUT can be detected by a change in inductance between the sensing coils 22a and 22b.

Further, the configuration has been described in which the displacement of the liquid level of the molten solder 14 or the object 91 is detected by the differential voltage between the sensing coils 22a and 22b. Thus, the liquid level of the molten solder 14 or the displacement of the object 91 can be detected.

[0099]

According to the displacement detecting device of the first aspect,
Since the sensor unit is disposed on the other side of the non-magnetic partition wall, the detecting unit detects the displacement of the measured object based on the change in the inductance of the sensor unit which is changed by the displacement of the conductive object on one side of the partition wall. , The displacement of the object to be measured via the partition can be easily detected.

According to the displacement detecting device of the second aspect, in addition to the effect of the displacement detecting device of the first aspect, the sensing coils are juxtaposed in pairs along the direction intersecting the displacement direction of the object to be measured. Then, since the magnetic fields of these paired sensing coils intersect with the displacement direction of the device under test, the change in the inductance of the sensor unit that occurs when the device under test is displaced becomes clearer, and Can be detected more accurately.

According to the displacement detecting device of the third aspect, in addition to the effect of the displacement detecting device of the first aspect, if the sensing coils are juxtaposed in a pair along the direction perpendicular to the direction of displacement of the object to be measured. Since the magnetic field of the pair of sensing coils is orthogonal to the displacement direction of the device under test, the change in the inductance of the sensor unit that occurs when the device under test is displaced becomes more clear, and the detection unit detects the magnetic field of the device under test. The displacement amount can be detected more accurately.

According to the displacement detecting device of the fourth aspect, in addition to the effect of the displacement detecting device of the second or third aspect, even when the temperature of the object to be detected is different, the object to be measured is When the sensor section and the detecting section detect displacement of the object to be measured having different temperatures, a temperature error can be compensated by a pair of temperature compensating coils. In addition, it is possible to expand the temperature range of the measured object in which the displacement can be detected.

According to the displacement detecting device of the fifth aspect, in addition to the effect of the displacement detecting device of the second aspect, the displacement value of the object to be measured and the differential voltage value between the pair of sensing coils are provided. Is approximately proportional, the position of the device under test can be easily detected by the detecting unit based on the change in inductance of the sensor unit that occurs when the device under test is displaced, and as a result, the configuration of the detecting unit is simplified. And improve manufacturability,
Manufacturing costs can be reduced.

According to the displacement detecting device of the sixth aspect, in addition to the effect of the displacement detecting device of the first to fifth aspects, when the object to be measured is displaced, it is further amplified by the influence of the magnetism of the magnetic plate. Since the changed inductance is generated from the sensor unit, the sensitivity of the sensor unit can be improved, the energy cost for detecting the displacement of the object to be measured can be reduced, and the accuracy of the sensor unit can be improved.

According to the displacement detecting device of the seventh aspect, in addition to the effect of the displacement detecting device of any one of the first to sixth aspects, when detecting the displacement of the object to be measured having a high temperature, the partition wall is heated to a high temperature. Even if it is heated, it is a sensing coil in which a heat-resistant heat-resistant wire is wound around a heat-resistant bobbin, so the inductance of the sensor section changes accurately, regardless of the temperature of the DUT itself. The displacement of the object can be detected.

According to the displacement detecting device of the eighth aspect, in addition to the effect of the displacement detecting device of the first aspect, when the liquid level of the molten solder in the solder bath is displaced, the side wall of the solder bath is displaced. Since the inductance of the sensor part arranged outside changes and the detecting part detects the displacement of the liquid level of the molten solder based on the change of the inductance, the melting of the sensor part and the detecting part through the side wall of the solder bath is performed. The displacement of the liquid level of the solder can be easily detected.

[Brief description of the drawings]

FIG. 1 is a side view showing a part of a first embodiment of a displacement detection device of the present invention.

FIG. 2 is a cross-sectional view showing a part of the displacement detection device.

FIG. 3 is a cross-sectional view showing a part of the displacement detection device.

FIG. 4 is an explanatory view showing the displacement detection device.

FIG. 5 is a graph showing a relationship between a displacement value of an object to be measured and a differential voltage value between sensing coils in the displacement detection device.

FIG. 6 is a sectional view showing a part of the second embodiment of the present invention.

FIG. 7 is a sectional view showing a part of a third embodiment of the present invention.

FIG. 8 is a sectional view showing a part of a fourth embodiment of the present invention.

FIG. 9 is a sectional view showing a part of a fifth embodiment of the present invention.

FIG. 10 is a sectional view showing a part of a sixth embodiment of the present invention.

FIG. 11 is a partially cutaway side view showing a part of a conventional displacement detection device.

FIG. 12 is a partially cutaway perspective view showing a part of a conventional displacement detection device.

[Explanation of symbols]

 11a, 11b, 11c, 11d, 11e, 11f Displacement detector 13a, 13b Solder bath 14 Melted solder as an object to be measured 15a, 15b, 15f Partition wall 21 Sensor unit 22a, 22b Sensing coil 26a, 26b Temperature compensation coil 41 Sensing unit 61 Magnetic plate 91 Object as measured object

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Koji Saito 1-19-143 Higashi-Oizumi, Nerima-ku, Tokyo Inside the Tamura Corporation (72) Inventor Kazuhiko Takahashi 1-19-143, Higashi-Oizumi, Nerima-ku, Tokyo F-term in the Tamura Corporation (reference) 2F013 AB01 BC03 BG02 BG13 CA01 CB10 2F014 AA04 AA16 AB01 AB02 AB03 AC06 EB07 2F063 AA02 BA30 BB05 CC04 DA01 DA05 DD03 GA03 KA01 LA23 LA27

Claims (8)

[Claims] 1. A non-magnetic partition wall which is separated from a conductive object to be measured which is positioned on one side and which is displaced; and A sensor unit having a sensing coil disposed on the other side of the partition in at least a part of the displacement range; and a displacement of the device under test via the partition based on a change in inductance of the sensing coil of the sensor unit. A displacement detection device comprising: 2. The displacement detecting device according to claim 1, wherein the sensing coils of the sensor section are arranged side by side in a pair in a direction intersecting a direction in which the measured object is displaced. 3. The displacement detecting device according to claim 1, wherein the sensing coils of the sensor section are arranged side by side in a pair in a direction perpendicular to a direction in which the measured object is displaced. 4. The sensor section includes a pair of temperature compensation coils disposed at equal intervals from each of the pair of sensing coils, and one end of each of the pair of temperature compensation coils has one end thereof. One end of the pair of the other sensing coils is electrically connected to one end of the pair of the other sensing coils, and the other end of the pair of the other temperature compensation coils is one end of the one pair of the sensing coils. And the other end is electrically connected to the other end of the pair of the other sensing coils. The detection unit includes the pair of one sensing coils and the pair of the other temperature compensation coils. 4. A displacement detection device according to claim 2, wherein the connection point is electrically connected to a connection point between the pair of other sensing coils and the one pair of the temperature compensation coils. . 5. The displacement detection device according to claim 2, wherein a differential voltage value between the pair of sensing coils is substantially proportional to a displacement value of the object to be measured. 6. A magnetic plate having magnetism arranged in parallel with the partition wall on one side of the partition wall facing the sensor section via the partition wall.
The displacement detection device according to any one of the above. 7. The displacement detecting device according to claim 1, wherein the sensing coil includes a heat-resistant bobbin and a heat-resistant wire wound around the bobbin. apparatus. 8. An object to be measured is molten solder, a partition is a side wall of a solder tank in which the molten solder is stored, a sensor section is disposed outside the side wall of the solder tank, and a detection section is provided. 8. The displacement detection device according to claim 1, wherein the displacement detection device detects a displacement of a liquid level of the molten solder.