JP2001237633A - Mounting structure for planar antenna - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high quality planar antenna having signal transmission characteristics of low noise level, the antenna characteristics of a less dispersion and a high reliability connecting part by taking measures against draw backs that a feeder pin receives a noise, antenna characteristics are dispersed by dispersing the wetting form of connecting materials and connecting part reliability in an environmental load is lowered by reducing the quantity of connecting materials. SOLUTION: First of all, the feed pin is located lower than a patch in the transmitting/receiving direction of signal, concerning a solder or the like to be used for materials for connecting the feed pin and the patch, the quantity of feeding and connecting materials is fixed as preform members, the wetting form of bonding materials is controlled by applying plating with high wetness of bonding materials to the bonding part of the feed pin with the bonding materials and a bonding surface area is enlarged by providing ruggedness on the connecting plane of the patch and the feeding pin.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for transmitting and receiving an electric signal, and more particularly to an improvement in signal transmission characteristics in a radio frequency (radio frequency) transmission / reception antenna field, a simplification of a manufacturing process, and a reliability. The present invention relates to a mounting structure suitable for improvement.

[0002]

2. Description of the Related Art As a prior art related to the present invention, for example, a transmitting / receiving antenna shown in FIG. 4 of JP-A-09-2844031 is disclosed and is well known in general.

Here, a microstrip antenna will be described with reference to FIG. When an AC electric field is applied between a pair of conductors, an electromagnetic wave, that is, a traveling wave composed of electric and magnetic lines of force and a reflected wave are generated starting from the feeding point. In the case of a microstrip antenna, as shown in FIG.
A conductor plane as shown in (c) is used. Specifically, it has a structure like a printed circuit board in which a copper-plated and gold-plated laminated conductor and a dielectric plate such as Teflon are laminated, and the upper power supply plane conductor is a thin film strip and is formed into a fine shape by a process such as etching. And function as an antenna, the lower ground plane conductor is
A ground potential is used as a reference potential for stably distributing transmission / reception electromagnetic waves, and external noise is shielded, and a transmission / reception signal is shielded and conveyed to an antenna for power supply.

A plurality of patch-shaped power supply plane conductors are arranged in an array,
Microstrip antennas that obtain the required sensitivity are easier to make in terms of production technology than other antennas,
Because it is mechanically stable, it can be widely used if the cost can be reduced. Another feature of the microstrip antenna is that the antenna is regarded as a resonant circuit and its Q is increased to specify complex current paths in the conductor plate other than the required frequency in order to identify the complicated current path in the X-axis direction mainly in the X-axis. Can be made not to flow.

[0005] Finally, a problem concerning the loss of the antenna will be described. The copper loss caused by the current flowing in the conductor plate is inversely proportional to the dielectric thickness of the substrate, similarly to the Q of the resonance circuit of the antenna. On the other hand, the easiness of radiating radio waves radiated from the conductor plate is proportional to the dielectric thickness of the substrate.

[0006]

In the conventional antenna mounting structure, there is a problem that the S / N ratio of a received signal is deteriorated. In addition, the shape of the solder used as an electrically conductive material after curing varies due to wettability, and the efficiency as a receiving antenna varies, and impedance cannot be matched, so it is necessary to adjust the characteristics by adjusting the characteristics during the manufacturing process. There is a problem that this is very subtle and difficult. Furthermore, when the antenna is mounted in a place such as an automobile where environmental changes such as temperature are large, stress is generated in a connecting material which is a joining portion of different kinds of members. It is necessary to manage and absorb stress strain. On the other hand, if the amount of connection material used is reduced to reduce signal transmission loss, and the balance is lost, reliability problems may occur.

SUMMARY OF THE INVENTION It is an object of the present invention to make it difficult for a power supply pin to transmit and receive noise, to make the shape of the solder wet and to prevent the antenna characteristics from fluctuating, to optimize the amount of solder used, and to improve the usage environment. To improve the durability and reliability of the connection portion with respect to Another object of the present invention is to provide a product in which the transmission / reception characteristics of the signal and the antenna characteristics with small variations and the reliability of the connection portion are high and the quality is stable.

[0008]

According to the present invention, there is provided a planar antenna comprising a ground plane conductor and a feed plane conductor provided on both sides of a plane dielectric, wherein the feed plane conductor and the feed line at the feed point are Provided is a planar antenna which is orthogonal to each other and electrically connected by an electrically conductive material, and maintains a positional relationship between them by a mechanical support member.

According to the present invention, the surface of the joint between the power supply line conductor and the power supply line on both the upper and lower surfaces is formed on a conductor surface with little unevenness, and a dielectric is interposed between the ground plane conductor and the power supply line. Provided is an antenna having a coaxial structure.

The present invention further provides an antenna configured so that a joint between the power supply plane conductor and the power supply line and the power supply line transmit and receive a transmission / reception signal by electromagnetic coupling with each other.

The present invention further provides an antenna in which the power supply surface conductor and the power supply line are fused with each other by melting a preformed solder piece and by quantitative fusion.

The present invention further provides an antenna in which the power supply surface conductor and the power supply line are connected to each other by an electric connection means such as brazing or spot welding.

According to the present invention, there is further provided an antenna in which the power supply surface conductor and the power supply line are melt-bonded with solder, and the surface of the soldered connection between the power supply surface conductor and the power supply line is processed so as to reduce unevenness. provide.

According to the present invention, the periphery of a portion of the ground plane conductor through which the power supply line passes is preliminarily partially surface-treated by plating or the like with a material having good solder wettability, and is coaxial with the ground plane conductor and the power supply line. Provided is an antenna in which a coaxial ground conductor formed in a shape is joined by soldering.

According to the present invention, there is provided a planar antenna assembly comprising a planar antenna, a pedestal having a screw hole for fixing the planar antenna, and a screw for fixing the pedestal to a case. The hole provides an antenna having a structure in which the head of the screw has a seating surface at a depth such that the head of the screw does not protrude from the antenna substrate on the radio wave transmitting / receiving surface side of the planar antenna.

The present invention further provides a power supply plane conductor and a power supply line at a power supply point which are orthogonal to each other, are electrically connected to each other by an electrically conductive material, and are electrically connected to each other, and the other end of the power supply line is electrically connected to the RF module substrate. In between, the present invention provides a planar antenna that is configured to relieve temporal or thermal stress applied to a feed line locally or entirely by deformation or the like, and that is provided with a mechanism for maintaining a positional relationship between the two.

The present invention further provides a coaxial structure in which a dielectric is interposed between the ground plane conductor and the feeder line, and a dielectric material is interposed between the ground plane conductor and the ground side coaxial conductor. The present invention provides a planar antenna that avoids local concentration of an electromagnetic field.

Further, according to the present invention, the unevenness of the surface of the junction between the feeder conductor and the feeder line on both upper and lower surfaces is suppressed to at least 1/10 or less of the square side or the diameter of the feeder conductor, so that the local concentration of the electromagnetic field is reduced. Provide an antenna to avoid.

First, the power supply pins are arranged so as to be substantially flat without projecting from the patch surface in the signal transmission / reception direction, and the solder used as a material for connecting the power supply pins and the patches is a preform material and the amount of solder is previously determined. Along with making the power supply pin constant, eliminating the variation in the shape of the solder formed by forming a base material by plating etc. with a material with good solder wettability at the joint between the power supply pin and the solder, the joint surface between the patch and the power supply pin The bonding surface area is increased by providing irregularities in advance.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
A description will be given with reference to a mounting sectional view of the flat antenna of FIG. A microstrip antenna 4 comprising a ground plane conductor 1, a planar dielectric 2, and a patch-shaped feed plane conductor 3 has a through hole 5 on the feed plane conductor side, and the through hole 5 is connected to the patch 3 by a coated conductor 6. are doing. The coated conductor 6 is connected to the power supply pin 7 arranged coaxially with the through hole 5 by melting the solder 8.

At this time, the power supply pin 7 is
And is positioned lower without protruding from the patch surface 10. If the power supply pin 7 is higher than the patch surface 10, the power supply pin 7 acts as an antenna, and the portion of the pin protruding from the patch 3 transmits and receives a noise signal 12 different from the intended transmission / reception signal 11. By arranging it below the surface 10, high-quality signal transmission characteristics with a high S / N ratio can be advantageously obtained. The reason why the antenna is disposed lower than the antenna strip surface is that even if a minute projection or the like is left due to an error in the melting process, the adverse effect of generating noise is avoided if the antenna is lower.

The local peak phenomenon of the electromagnetic field may exist between the vicinity of the power supply pin 7 of the power supply plane conductor 3 and the ground plane conductor 1. That is, a local peak of the electromagnetic field occurs most frequently between the end surface of the covered conductor 6 on the ground plane conductor 1 side and the edge of the through hole of the ground plane conductor 1 unless a dielectric substance is interposed. Therefore, the gap must be filled with a dielectric material without voids, and the gap between the two conductors must be made as large as possible, or the terminal must be curved to reduce the peak phenomenon of the electromagnetic field.

Next, the power supply pin 7 is electrically connected to the power supply plane conductor 3, but the other end is connected to the high-frequency circuit board pattern side.
Due to the joining and fixing at 314, it is inevitable that stress is applied in the axial direction and the direction perpendicular to the axis. At this time, in order to prevent stress due to cold heat or temporal deformation from being applied to the joints formed by soldering or welding, the power supply pins should have local constriction or flexibility, or the power supply pins 7 as a whole should be flexible against stress. It is necessary to prevent the stress from being applied to the joining portion and causing a problem such as disconnection by configuring the device to behave so as to ensure conductivity.

Next, FIG. 2 shows an embodiment in which the solder 8 in FIG. 1 is preformed into a ball shape, and FIG. 3 shows an embodiment in which the solder 8 is preformed in a disk shape. 2 and 3, after aligning the through hole 5 and the power supply pin 7 in the manufacturing process, the solder preform 13 is placed, and the coated conductor 6 and the power supply pin 7 are melt-bonded by a soldering iron or reflow. When the amount of solder varies, the resistance value of the solder connection portion varies and the transmission loss increases, but in this case, the amount of solder can be controlled by the shape of the solder preform 13 and the solder preform 13
Is easy to mount, which simplifies the manufacturing process, which is advantageous.

Next, FIG. 4 shows an embodiment in which the power supply pin 7 and the covering conductor 6 are electromagnetically coupled without using the solder 8 in FIG. In this case, since the signal coupling portion is not mechanically coupled, it is advantageous because it becomes stress-free, does not require a bonding material, and is easy to assemble.

Next, FIG. 5 shows an embodiment in which the coated conductor 6 and the power supply pin 7 are joined by welding or brazing without using the solder 8 in FIG. In this case, the same effect as in the first embodiment can be obtained.

Next, the solder joint surface of the covering conductor 6 of the through hole 5 and the power supply pin 7 in FIG.
FIGS. 6 and 7 show an embodiment in which 14 is provided to improve the wettability of the solder. The smaller the impedance of the solder connection portion serving as the feeding point to the antenna, the smaller the signal transmission loss, so the smaller the amount of solder, the better. However, when mounted in a place such as an automobile where the environmental change is large, stress is generated in the solder 8 which is a joining portion of different kinds of members, so that it is necessary to secure a fixed amount of solder to absorb the distortion. Therefore, by providing irregularities 14 on the solder joint surface between the through hole 5 and the power supply pin 7, the surface area of the joint between the coated conductor 6 and the solder 8 on the through hole 5 and the joint area between the power supply pin 7 and the solder 8 are formed. Since a large surface area can be obtained, the amount of solder used can be reduced to reduce transmission loss, and at the same time, joint reliability can be ensured. further,
When the solder 8 is a ball-shaped preform as shown in FIG. 2, it is advantageous because the mounting property of the ball is improved.

Next, FIG. 8 shows an embodiment in which the plating 15 having good wettability of the solder 8 is applied in advance to the joint between the power supply pin 7 and the solder 8 in FIG. When the wetting shape of the solder 8 changes, the characteristic impedance changes and the signal transmission characteristics deteriorate.However, when the plating 15 with good wettability of the solder 8 is applied to the joint of the power supply pin 7 with the solder 8, the solder 8 Since the wetting spreads over the area where the plating 15 is applied, it is possible to make the wet shape of the solder 8 a desired shape by controlling the plating area without variation, and it is advantageous because the signal transmission characteristics can be improved. It is.

Next, the antenna of FIG.
FIG. 9 shows an embodiment implemented in FIG. The ground plane conductor 1 of the microstrip antenna 4 is bonded to the antenna base 16 by a conductive adhesive 17. The antenna base 16 has a screw hole 19
And attached to the module case 18 by screws 20. The antenna base 16 is provided with a screw seat surface 21 so that the screw head is located at a position lower than the patch surface 10 of the antenna. At this time, when the power supply pin 7 is lower than the signal transmission / reception direction 9, the antenna characteristics are reduced. This is advantageous because it is possible to obtain the same effect as not affecting the signal transmission and to obtain high-quality signal transmission characteristics.

Although the embodiment shown in FIGS. 1 to 9 has been described with respect to the antenna, particularly the case of a microstrip antenna, the present invention is applied. But
Similar effects can be obtained even in the case of an array of minute rectangular conductors.

Hereinafter, an embodiment of a communication terminal device to which a millimeter wave transmitting / receiving antenna according to the present invention is applied will be described with reference to the drawings.

FIG. 12 is an assembly configuration diagram of a communication terminal device according to an embodiment of the present invention. In the figure, the communication terminal device includes an upper case 201, a lower case 202, an IC card 203, an IC card reader / writer 204, a main board 205, and an RF module 206.
And an LCD module 220 as a display device. An RF module 206 and an LCD module are mounted on the main board 205, and a buzzer 215 and a test terminal 216 for checking are also mounted.

On the front side of the main board 205, a buzzer 215, a test terminal 216 and a power supply section 217 are provided. Since these devices have a larger height than other devices when mounted on a substrate, they are concentrated and arranged behind the highest LCD module 220. Although not shown, a communication processing unit and a communication connector are arranged on the back side of the main board 205 because the height is small and flat. In FIG. 11, the RF module 206 includes a module substrate 209, on which an antenna 210, a thin plate module shield 207, and a module connector 208 are disposed, and a main substrate shield 212 is disposed on a lower side, and integrated by soldering. Refers to a completed assembly. The RF module 206 is a part that processes a transmission / reception signal by being directly connected to the antenna.The signal is processed as a digital signal by the communication control LSI and the CPU, and then the LCD display device 220, the test terminal 216, and the buzzer 215 are processed. In addition to driving, the control circuit of the IC card reader / writer is also driven, and the history of used toll road tolls is recorded on the IC card, for example, in an automatic toll collection system (ETC).

In the case of the ETC system, the RF module 206
After the main board is mounted on the mounting surface such as the dashboard of the vehicle that is kept horizontal, the mounting angle is further adjusted so that the antenna surface has a predetermined gradient θ with respect to the horizontal plane and fixed. . Thereby, for example, the transmission / reception efficiency between the transmission / reception antenna mounted on the tollgate and the antenna is optimally set. The inclination of the module brackets 214a and 214b in FIG. 11 is set for positioning the RF module, and the angle θ of the vehicle-mounted antenna surface is finally adjusted by the mounting angle adjusting bracket 241 of the mounting bracket 222.

When the menu button 228b is operated while the IC card 203 is inserted into the IC card reader / writer 202, a menu showing the functions of the communication terminal is displayed on the LCD display panel. Each time the menu button 228b is pressed, the contents of the menu are shifted and displayed in order. When the enter button 228a is pressed while the desired menu is displayed, the menu is selected. The menu includes usage statement information and volume adjustment. For example, when the enter button is pressed when the former is displayed, the details of the usage statement information are displayed. Further, when the menu button is pressed in this state, the information is displayed retroactively to the information at the time of the previous payment. In addition, charges, use sections, and dates and times can be displayed in the form of a list. To change the display content, press the enter button to return to the initial menu selection state.

On the back of the communication terminal device, there are also provided a connection portion for a power supply, an external antenna connector for connection to an external antenna, and the like.

As another embodiment to which the present invention is applied, a millimeter-wave radar for detecting an inter-vehicle distance will be described.

FIG. 12A is a sectional view of a millimeter wave radar showing a first embodiment of the present invention, and FIG. 12B is a partially enlarged view showing a section of a coaxial line portion insulated by glass. . Millimeter wave radar
It consists of an RF module, a signal processing circuit, and a housing. Each configuration will be described in turn.

First, an RF module will be described as a configuration of the millimeter wave radar. RF module part is antenna 301
And a high-frequency circuit 302 and a base substrate 303 on which the high-frequency circuit 302 is mounted.

The configuration of the antenna will be described. Adhesive copper foil (a) 305 on both sides of 304 of low dielectric constant Teflon substrate (a)
(a) Bonded by 306, and further, a GND pattern (a) 307 is formed on one side and a patch antenna pattern 308 is formed on the other side by multi-layer metallization of Cu, Ni, Au or the like. Teflon substrate (a) 304
Has a through hole so that it can be connected to a glass coaxial cable
(a) 309 is provided.

Next, the high frequency circuit 302 will be described.
Teflon substrate with low dielectric constant, similar to the configuration of antenna 301
(b) A copper foil (b) 311 is bonded to both sides of the 310 with an adhesive (b) 312, and further, a multilayered metallization of Cu, Ni, Au, etc., and a ground pattern (b) 313 on one side and a high-frequency circuit pattern on the other side An MMIC 315 made of GaAs, such as an oscillator, an amplifier, and a mixer of 76 GHz, is bonded and mounted to the high-frequency circuit 303 with an Ag epoxy adhesive 319, and connected to the high-frequency circuit 303 by a gold wire 334. High frequency circuit 3
02 has a through hole so that it can be connected to a glass coaxial cable.
(b1) 316, and through holes (b2) 318 to take out the power, ground, input and output lines (a) 317 to the outside
Is provided.

Next, the base substrate 303 will be described.
The base substrate 303 is joined to the ground pattern (a) 307 of the antenna 301 and the ground pattern (b) 313 of the high-frequency circuit 302 with a silver epoxy adhesive 319. Further, the patch antenna pattern 30 is formed by a glass coaxial line penetrating the base substrate 303.
8 and the high-frequency circuit pattern 314 are connected via the solder 320. The power / ground / input / output line (a) 317 is also connected to the harness 321 via the glass coaxial line, and further connected to the signal processing circuit 322. At this time, the high frequency circuit 302 is hermetically sealed by the cover 323. Also, base substrate 3
03 is fixed to a case 324 as a housing with screws 326.

Next, the signal processing circuit 322 will be described as a configuration of the millimeter wave radar. The signal processing circuit 322 is formed by stacking a plurality of substrates in order to reduce the area. Each of the substrates is electrically connected by the harness 321 and is joined by the bush 325, and is fixed to the case 324. Further, a ground / power / input / output line (b) 333 to the signal processing circuit 322 is connected from the connector terminal 327 through the case 324.

Next, a case will be described as a configuration of the millimeter wave radar. The housing is composed of a radome 328 and a case 324, and the radome 328 is attached to the case 324 by screws 326. Radome 328 is made of a dielectric material that transmits millimeter waves.

The glass coaxial line according to the present invention will be described in detail. The glass coaxial line includes a lead 329 for transmitting an electric signal, a base substrate 303, and a glass dielectric 330 sealing the lead 329 and the base substrate 303. At high frequencies such as microwaves and millimeter waves, the characteristic impedance Z expressed by the following equation 1 is used to determine the loss of the coaxial line.

Z = 1 / 2π (√μ / ε) logb / a (1) Here, μ and ε are the magnetic permeability of the glass dielectric 330 between the lead 329 and the base substrate 303. The dielectric constant, a is the diameter of the lead 329, and b is the diameter of the through hole in the base substrate 303. Therefore, the impedance at L1, L2 and L3
In Z _L1 , Z _L2 , and Z _L3 , Z _L1 is equal to Z _L3, but Z _L2 is different. For this reason, if L2 varies, the impedance of the coaxial line varies, and transmission loss increases.

In order to manufacture a glass coaxial line in consideration of the above, first, the lead 329 is made of Kovar on the entire surface of Au.
Plating 331 is performed, and plating is mechanically removed only at a portion to be joined to the glass dielectric 330 to form an exposed portion 332 in which the underlying Kovar is exposed.

In this case, the exposed portion 332 can also be formed by partial Au plating.

Next, the leads 329 are arranged so as to penetrate the base substrate 303. A certain amount of beads of the glass dielectric 330 is sealed in the gap between the lead 329 and the base substrate 303.

Then, when a high-temperature heat treatment is performed, the glass dielectric 33 is heated.
Numeral 0 spreads wet while being oxidatively bonded to the exposed portion 332 of the lead 329 and the base substrate 303. At this time, Au plating of the lead 331
Is not oxidized and cannot be oxidized and bonded to the glass dielectric, and the shape of the glass dielectric is exactly as shown in the figure.

At this time, the melting point of the glass dielectric must be 1000 ° C. or less, and the heat treatment temperature must be set to the melting point of Au (1063 ° C.) or less so that the Au plating 331 does not melt. Regarding plating, Pt or the like is also conceivable. At this time, the melting point of the glass dielectric 330 is about 1700 ° C., which is 1769 ° C., which is more advantageous than Au.

As described above, the shape of the glass dielectric 330 with little variation can be obtained by the shape of the exposed portion 332 of the lead 329 and the amount of the glass dielectric bead. And transmission loss can be reduced.

Here, the outline of the dimensions is described for reference.

1) Teflon substrate (a) 304 / Teflon substrate
(b) 310> 50mm × 15mm × 127μm 2) Copper foil (a) 305 ・ Copper foil (b) 311> 18μm thick 3) Patch antenna pattern 308 ・ High frequency circuit pattern 3
Cu / Ni / Au 3 layer metallization forming 14> 18μm thick / 4 ～ 10
μm thickness / 0.3-0.5μm thickness 4) Ag epoxy adhesive 319> 20-30μm thickness 5) Through hole (a) 309, through hole (b1) 316> φ300
μm 6) Lead 329> φ200 μm 7) Glass dielectric> outer diameter φ0.9 mm, length 0.5-1.4 mm Next, an outline of an operation method as a millimeter wave radar in this mounting structure will be described.

The power is supplied from the connector terminal 327 to the signal processing circuit 3.
22 and at the same time, the signal processing circuit 322
A predetermined power is supplied to the high frequency circuit 302 through the power supply. This causes the MMIC315 oscillator to generate a 76GHz millimeter wave,
Further, the millimeter wave is amplified by an amplifier, passes through a high frequency circuit 302, and is transmitted to an antenna 301 via a solder 320 and a lead 329. The millimeter wave is transmitted from the antenna 301, and the antenna 301 receives the reflected wave after hitting the target at a predetermined timing. The reflected wave is mixed with the transmitted wave by the MMIC 315, and the power, ground, input, and output lines are used as IF signals.
(a) Obtain a signal at 317. The signal includes relative speed information, distance information, angle information, and the like between a vehicle or the like on which the millimeter wave radar is mounted and a target, and is calculated by the signal processing circuit 322. These results are output through the connector terminal 327.

[0056]

According to the present invention, the noise signal affects the antenna feed pin, the shape of the solder material varies, the antenna characteristics vary, and the reliability of the connection portion with respect to the environmental load is reduced due to the small amount of solder. Measure low,
A high-quality product having an antenna signal with a low noise level, antenna characteristics with a small variation, and a highly reliable solder connection can be supplied.

[Brief description of the drawings]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is a diagram showing a second embodiment of the present invention.

FIG. 3 is a diagram showing a third embodiment of the present invention.

FIG. 4 is a diagram showing a fourth embodiment of the present invention.

FIG. 5 is a diagram showing a fifth embodiment of the present invention.

FIG. 6 is a diagram showing a sixth embodiment of the present invention.

FIG. 7 is a diagram showing a seventh embodiment of the present invention.

FIG. 8 is a diagram showing an eighth embodiment of the present invention.

FIG. 9 is a diagram showing a ninth embodiment of the present invention.

FIG. 10 is an explanatory diagram showing the operation principle of the planar antenna.

FIG. 11 is a perspective view showing an embodiment of an automatic road toll collection system.

FIG. 12 is a sectional view of the embodiment of the mounting structure of the millimeter wave radar.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Ground conductor, 2 ... Dielectric board, 3 ... Patch, 4 ... Microstrip antenna, 5 ... Through-hole, 6 ... Coated conductor, 7 ... Feeding pin, 8 ... Solder, 9 ... Signal transmission / reception direction, 10 ... Patch Surface, 11: target signal, 12: noise signal, 13: solder preform, 14: unevenness, 15
... Plating, 16 ... Antenna base, 17 ... Conductive adhesive, 18 ... Module case, 19 ... Screw hole, 20 ... Screw, 21 ... Screw bearing surface, 101 ... Ground conductor, 102 ... Dielectric substrate, 103 ... Patch, 104: microstrip antenna, 105: through hole, 106: feeding pin,
107: connection material, 108: signal transmission / reception direction, 109
... Target signal, 110 noise signal, 301 antenna, 302 high frequency circuit, 303 base substrate, 30
4: Teflon substrate, 305: Copper foil (a), 306: Adhesive
(a), 307: GND pattern (a), 308: patch antenna pattern, 309: through hole (a), 310: Teflon substrate (b), 311: copper foil (b), 312: adhesive (b),
313: GND pattern (b), 314: High frequency circuit pattern, 315: MMIC, 316: Through hole (b1), 317
… Power, GND, input / output lines (a), 318… Through hole
(b2), 319: silver epoxy adhesive, 320: solder, 32
Reference Signs List 1 harness 322 signal processing circuit 323 cover 324 case 325 bush 326 screw 327 connector terminal 328 radome 329
… Lead, 330… glass dielectric, 331… Au plating,
332: exposed part, 333: GND, power supply, input, output line
(b) 334: gold wire.

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[Procedure amendment]

[Submission date] April 27, 2000 (200.4.2
7)

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0032

[Correction method] Change

[Correction contents]

FIG. 11 is an assembly configuration diagram of a communication terminal device according to an embodiment of the present invention. In the figure, the communication terminal device includes an upper case 201, a lower case 202, an IC card 203, an IC card reader / writer 204, a main board 205, and an RF module 206.
And an LCD module 220 as a display device. An RF module 206 and an LCD module are mounted on the main board 205, and a buzzer 215 and a test terminal 216 for checking are also mounted.

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] Figure 2

[Correction method] Change

[Correction contents]

FIG. 2

Continued on the front page (72) Inventor Tadashi Isono 2477 Takaba, Hitachinaka City, Ibaraki Prefecture Inside Hitachi Car Engineering Co., Ltd. (72) Inventor Shiro Ouchi 2520 Oji Takaba, Hitachinaka City, Ibaraki Pref.Hitachi, Ltd.Automotive Equipment Group (72) Inventor Mamoru Oba 2520 Oji Takaba, Hitachinaka City, Ibaraki Pref.Hitachi Automotive Equipment Co., Ltd. Group F-term (reference) 5J045 AA01 AB06 DA10 EA08 HA06 MA04 NA01 NA07 5J046 AA05 AA09 AB13 PA07

Claims (11)

[Claims] 1. A planar antenna comprising a ground plane conductor and a feed plane conductor provided on both sides of a plane dielectric,
A planar antenna, wherein the feeding surface conductor and the feeding line at the feeding point are orthogonal to each other and are electrically connected by an electrically conductive material, and a mechanical support member maintains a positional relationship between the two. 2. A power supply line conductor according to claim 1, wherein the surface of the junction with the power supply line on both the upper and lower surfaces of the power supply surface conductor is formed as a conductor surface with little unevenness, and a dielectric is interposed between the ground plane conductor and the power supply line. An antenna having a coaxial structure. 3. The antenna according to claim 2, wherein a junction between the power supply plane conductor and the power supply line and the power supply line transmit and receive a transmission / reception signal by electromagnetic coupling with each other. 4. The antenna according to claim 2, wherein the power-supply surface conductor and the power-supply line are connected to each other by melting a preformed solder piece and by quantitatively melting the pieces. 5. The antenna according to claim 2, wherein the power supply surface conductor and the power supply line are joined to each other by an electric joining means such as brazing or spot welding. 6. The power supply surface conductor and the power supply line according to claim 2, wherein the power supply line conductor and the power supply line are melt-bonded by soldering, and the surface of the solder joint between the power supply surface conductor and the power supply line is processed so as to reduce unevenness. An antenna, characterized in that: 7. The ground plane conductor and the power supply line according to claim 2, wherein the periphery of the ground plane conductor through which the power supply line passes is partially surface-treated in advance by plating or the like with a material having good solder wettability. And a coaxial ground conductor formed coaxially by soldering. 8. A planar antenna assembly comprising a planar antenna, a pedestal having a screw hole for fixing the planar antenna, and a screw for fixing the pedestal to a case, wherein a screw hole of the pedestal is provided. Is an antenna having a structure in which a head of a screw has a seating surface at such a depth that the head of the screw does not protrude from the antenna substrate on the radio wave transmitting / receiving surface side of the planar antenna. 9. A power supply plane conductor and a power supply line at a power supply point are orthogonal to each other and are electrically connected to each other by a portion which is joined and electrically connected with an electrically conductive material, and is electrically connected to the other end of the power supply line and the RF module substrate. In the middle of the joint, it is configured to relieve the temporal and thermal stress applied to the power supply line locally or entirely by deformation, etc., and to provide a mechanism to maintain the positional relationship between the two. Planar antenna. 10. A coaxial structure according to claim 2, wherein a dielectric is interposed between said ground plane conductor and said feeder line, and a dielectric material is provided between said ground plane conductor and said ground side coaxial conductor. A planar antenna characterized by avoiding local concentration of an electromagnetic field by intervening. 11. The method according to claim 2, wherein the unevenness of the surface of the joint between the power supply line conductor and the power supply line on both upper and lower surfaces is suppressed to at least 1/10 or less of the square side or the diameter of the power supply surface conductor. An antenna that avoids concentration.