JP2001237356A - Cooling device of electronic part and semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate temperature difference between an IC on the upstream side of cooling wind and an IC on the downstream side and improve the stability of circuit. SOLUTION: Triangular heat radiating fins 7 are installed on plural ICs 3a, 3b and 3c placed on the same substrate 1. The heat radiating fins 7 are installed so that apexes are positioned on the upstream side of cooling air and bases are positioned on the downstream side.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation fin used for cooling a semiconductor device such as a tester when a large amount of heat is generated and a plurality of components on the same substrate need to be cooled to the same temperature. Things.

[0002]

2. Description of the Related Art In recent years, the size of an apparatus has been reduced, and the amount of heat generated per unit volume of the apparatus has increased. In addition, devices that require extremely high precision, such as semiconductor devices,
Further, in the case where a plurality of identical circuits are incorporated in one substrate like 12a, 12b and 12c as in a substrate 11 shown in FIG. 6, an arbitrary component (especially LSI) 13a
Is the temperature of the component 13b or 1 having the same function (role) of another circuit.
3c greatly affects the accuracy of the device.

However, the motherboard 14 and the cooling fan 1
The same function (role) in the positional relationship with 5 and the circuit design of the board
Are often arranged in the flow direction 16 of the cooling air. In the conventional method of attaching a radiation fin individually to a component or attaching a long radiation fin to the same functional component, a plurality of component temperatures are set. It is difficult to be the same,
This caused a drop in the accuracy of the device.

FIG. 7 is a perspective view showing an example in which a radiation fin is attached to each component alone. In the drawing, reference numeral 17 denotes a conventional radiation fin. In this method, since the temperature rises as the cooling air goes downstream, the same functional parts 13a, 1
A large temperature difference occurs between 3b and 13c.

FIG. 8 is a perspective view showing another cooling system in which the same functional parts are connected to each other by a rectangular radiating fin 18 or a flat plate 19 having good heat conductivity.
In this method, since the same functional components are connected by the radiation fins 18 or the flat plates 19, the temperature uniformity is improved, but the effect of the temperature rise in the downstream direction of the cooling air is inevitable.

[0006]

Since the conventional semiconductor device is configured as described above, there is a difference in IC temperature between the upstream side and the downstream side of the cooling air, which hinders the stability of the circuit. There was a problem of doing.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has an upstream IC and a downstream IC.
And to improve the stability of the circuit.

[0008]

According to a first aspect of the present invention, there is provided a cooling device for electronic components, wherein a plurality of electronic components are mounted on the same substrate and cooled by a cooling fan. The triangular radiating fins are joined upward, and the triangular radiating fins are arranged such that the apex is located upstream of the cooling air and the bottom is located downstream.

According to a second aspect of the present invention, there is provided a cooling device for electronic components, wherein a plurality of electronic components are mounted on the same substrate and cooled by a cooling fan. The heat radiating fins are formed so that the surface area increases from the upstream side to the downstream side.

According to a third aspect of the present invention, there is provided a cooling device for an electronic component having a triangular shape having a triangular shape formed in a height direction such that a vertex is located on an upstream side of a cooling wind and a bottom side is located on a downstream side. Is provided.

According to a fourth aspect of the present invention, there is provided a semiconductor device comprising:
An electronic component cooling device according to any one of claims 1 to 3 is provided.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 is a perspective view showing a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a front view of a main part thereof, FIG. 3 is a side view of FIG. 2, and 1 is a substrate, 2a, 2b, 2c is the same circuit incorporated in the substrate 1; 3a, 3b and 3c are arbitrary components IC; 4 is a motherboard; 5 is a cooling fan; 6 is a flow direction of cooling air; , 3c are radiating fins having a triangular shape joined together.

Here, the radiation fins 7 are made of a material having good heat conductivity, and are sufficiently thermally connected to the ICs 3a, 3b, 3c. And, the radiation fins 7
The cooling air is formed so that its surface area increases as it goes downstream, compensating for the decrease in cooling efficiency downstream of the cooling air, and connecting the same functional parts, further improving temperature uniformity. The effect of stabilizing the device accuracy can be obtained. In addition, as shown in FIG.
3 is configured so that the thickness t of the radiating fins 7 is reduced so as not to cause heat retention.

As described above, the shape of the radiating fins 7 used for cooling a device that requires a large amount of heat and requires high accuracy is made triangular, and one radiating fin 7 is mounted on a plurality of the same functional parts on the same substrate 1. By mounting and cooling, the temperature difference between the same functional components is reduced, and the accuracy of the device is improved.

Embodiment 2 In addition, when a space | interval of a board | substrate is taken, as shown in FIG. 4, the radiation fin 8 of triangular shape can also be attached in the height direction further. Thus, by providing the triangular fins 8 also in the height direction of the fins, the surface area of the radiating fins can be further increased, and the decrease in the cooling efficiency downstream in the cooling air direction can be further compensated for. Temperature difference is reduced, and the accuracy of the apparatus can be improved.

Embodiment 3 The shape of the heat radiation fin does not have to be strictly triangular, and a trapezoidal heat radiation fin 9 as shown in FIG. 5 may be provided. Furthermore, even if it is a pentagon or more polygon, if the surface area of the radiation fin is made to increase downstream in the flow direction of the cooling air, the cooling efficiency and the accuracy of the device can be similarly improved.

As described above, in the semiconductor device, the accuracy can be improved by cooling the substrate 1 using the above-described heat radiation fins.

[0018]

According to the cooling device for electronic parts according to the first aspect of the present invention, a plurality of electronic parts are placed on the same substrate and cooled by a cooling fan. Along with joining the triangular radiating fins, the triangular radiating fins are arranged so that the apex is located on the upstream side of the cooling air and the bottom side is located on the downstream side, so that the temperature difference between the same functional components is reduced. As a result, the device accuracy can be improved.

According to the electronic component cooling device of the second aspect of the present invention, a plurality of electronic components are mounted on the same substrate,
A cooling fan is used for cooling, and a radiating fin having a shape whose surface area increases from upstream to downstream of the cooling air is joined over a plurality of components, so that cooling efficiency and device accuracy are improved. Improvement can be achieved.

According to the electronic component cooling device of the third aspect of the present invention, the cooling air has a triangular shape formed in the height direction such that the apex is located on the upstream side and the bottom is located on the downstream side. Since the radiation fins are provided, it is possible to further compensate for a decrease in the cooling efficiency in the downstream portion in the cooling air direction.

According to the semiconductor device of the present invention, the accuracy of the device can be improved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a front view of a main part showing the semiconductor device according to the first embodiment of the present invention;

FIG. 3 is a side view of a main part showing the semiconductor device according to the first embodiment of the present invention;

FIG. 4 is a perspective view showing a bonding state of a radiation fin according to Embodiment 2 of the present invention.

FIG. 5 is a perspective view showing a radiation fin alone according to Embodiment 3 of the present invention.

FIG. 6 is a perspective view showing a conventional semiconductor device.

FIG. 7 is a perspective view showing a conventional semiconductor device.

FIG. 8 is a perspective view showing a conventional semiconductor device.

[Explanation of symbols]

 1 Substrate, 5 cooling fan, 7, 8, 9 radiation fins.

Claims (4)

[Claims] 1. A plurality of electronic components are mounted on the same substrate,
In a cooling device for electronic components cooled by a cooling fan, a triangular radiating fin is joined over the plurality of components, and the triangular radiating fin has an apex on an upstream side of the cooling air and a downstream side on a downstream side. A cooling device for an electronic component, wherein the cooling device is arranged so that a bottom side is located. 2. Placing a plurality of electronic components on the same substrate,
In a cooling device for an electronic component cooled by a cooling fan, a radiating fin having a shape whose surface area increases from upstream to downstream of the cooling air is joined to the plurality of components. Cooling device for electronic components. 3. A heat radiation fin having a triangular shape formed in a height direction such that a vertex is located on an upstream side of a cooling wind and a bottom side is located on a downstream side of the cooling air. Item 3. A cooling device for an electronic component according to Item 2. 4. A semiconductor device comprising the cooling device for an electronic component according to claim 1.