JP2001235401A - Method and apparatus for forming lamina sample - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a lamina sample capable of obtaining a three-dimensional image free from strain when the three-dimensional image is synthesized using the cross-sectional image of the lamina sample continuously cut off from one sample block. SOLUTION: A carrier tape 2 is bonded to the surface of the sample block 10 and an aligning reference mark 12 is applied to the carrier tape 2 in the peripheral part of the sample block 10 using a punch 7. Subsequently, the surface layer part of the sample block 10 is sliced using a cutter 1 and the cut-off lamina sample 11 is held to the carrier tape 2 to be recovered. By repeating this operation, the lamina sample 11 continuously cut off from the sample block 10 is successively held to the carrier tape 2 to be recovered. When the three- dimensional image is synthesized from the image of the cut surface of the lamina sample 11, the alignment of each image is performed using the reference mark 12 applied to the carrier tape 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for continuously cutting a flaky sample from a biological sample or the like for observation or inspection of a tissue such as a biological sample, animals, plants, foods, etc. Device.

[0002]

2. Description of the Related Art When observing the three-dimensional morphology of a specific tissue in a biological sample, the following processing is performed. That is,
First, a biological sample is embedded in paraffin or the like to prepare a sample block. Next, the surface layer portion of the sample block is continuously sliced using a microtome, and the cut slice samples are sequentially attached to the surface of the carrier tape and collected. Photograph the cut surface of each collected slice sample in order,
The image of the cut surface obtained in this manner is subjected to image processing to synthesize a three-dimensional image of the tissue.

In the case of synthesizing a three-dimensional image by such a method, conventionally, alignment of images on each cut surface has been performed by eye measurement. For this reason, the accuracy of the alignment is limited, and this is a factor that causes distortion in the created three-dimensional image.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the conventional method for producing a thin slice sample. An object of the present invention is to provide a method for producing a slice sample capable of obtaining a three-dimensional image without distortion when synthesizing a three-dimensional image using a cross-sectional image of a slice sample continuously cut out from one sample block, and An object of the present invention is to provide an apparatus for that purpose.

[0005]

According to the method of the present invention, a carrier tape is adhered to the surface of a sample block, the surface layer of the sample block is sliced, and the sliced sample is removed from the surface of the carrier tape. In a method for preparing a slice sample in which thin sections continuously cut from one sample block are sequentially arranged on the surface of a carrier tape and collected by repeating these steps, the carrier is placed on the surface of the sample block. After attaching the tape and before slicing the surface layer of the sample block, the reference for positioning on the carrier tape at a fixed position in a plane parallel to the surface of the sample block around the sample block. Marking is provided.

According to the method for preparing a slice sample of the present invention, when the surface layer of the sample block is sliced, a reference mark is attached to the carrier tape at a predetermined position in a plane parallel to the surface of the sample block. Therefore, in a subsequent step, when synthesizing a three-dimensional image from an image obtained by photographing a cut surface of each slice sample, if the respective images are aligned using the fiducial mark attached to the carrier tape, the relative position of each image can be obtained. The position can be adjusted accurately. As a result, a three-dimensional image without distortion can be synthesized.

[0007] In place of the reference mark for positioning on the carrier tape at the peripheral portion of the sample block, a reference mark for positioning may be provided on the sample block itself from the back side of the carrier tape.

Preferably, the fiducial marks are provided at two places. In this way, when synthesizing a three-dimensional image in a subsequent step, the positioning of each image can be performed accurately and easily.

The reference mark can be formed by, for example, making a hole mechanically using a punch, or making a hole by irradiating a laser beam.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A method for producing a slice sample according to the present invention will be described with reference to the drawings.

FIG. 1 shows a schematic configuration of a slice sample preparation apparatus for carrying out a slice sample preparation method according to the present invention.

The sample block 10 is obtained by embedding a biological sample in paraffin. The sample block 10 is held on the sample holder 5 with the surface (in this example, the upper surface) horizontal. The sample holder 5 is driven up and down. The cutter 1 is arranged adjacent to the sample holder 5. The cutter 1 runs in a horizontal direction.

A carrier tape 2 is supplied above the sample block 10. The surface (the lower surface in this example) of the carrier tape 2 is covered with an adhesive. The carrier tape 2 is unwound from the unwinding roll 3, passes over the sample block 10, and is wound on the winding roll 4. A pair of punches 7 is arranged above the sample holder 5 with the carrier tape 2 interposed therebetween.

The process of preparing a sample using the thin sample preparing apparatus is as follows.

A. After holding the sample block 10 on the sample holder 5 and adjusting the vertical position of the sample holder 5, the cutter 1 is run to cut off the surface layer of the sample block 10 and is parallel to the running surface of the cutter 1. Make a perfect surface.

B. The sample holder 5 is sent upward by a predetermined distance.

C. Transfer carrier tape 2 to sample block 1
Affix to the surface of No. 0.

D. The punch 7 is driven in to make a reference mark (not shown) on the carrier tape 2.

E. Run the cutter 1 (in this example,
Then, the surface layer of the sample block 10 is cut. The surface layer is cut off at a thickness corresponding to the amount of the sample holder 5 sent out. The cut slice sample is held on the surface of the carrier tape 2 and separated from the sample block 10.

F. After returning the cutter 1 to its original position (in this example, returning from right to left in the figure), the feed roll 3 and the take-up roll 4 are driven to drive the thin sample together with the carrier tape 2 to the take-up roll 4 side. send.

By repeating the above steps "b" and subsequent steps, a thin sample is continuously cut from the sample block 10, and the cut thin samples are sequentially held on the surface of the carrier tape 2 and collected.

FIG. 2 shows the state of the thin sample held and collected on the surface of the carrier tape 2. In the example shown in FIG. 2A, fiducial marks 12 are provided by punches 7 at two locations around the slice sample 11. FIG.
In the example shown in (b), the reference mark 12 is provided inside the thin sample 11 by the punch 7. After sequentially photographing the cut surface of each slice sample, when synthesizing a three-dimensional image using the photographed images, if each image is aligned using the reference mark 12 attached to the carrier tape 2, each The relative positions of the images can be accurately adjusted.

FIG. 3 shows another example of a slice sample preparation apparatus for carrying out the method of the present invention. In this example, a pair of laser beam irradiation heads 8 are used instead of the punch 7 in the example shown in FIG. The laser beam irradiation head 8 makes two reference marks 12 on the carrier tape 2 from the back side of the carrier tape 2. Other configurations and methods of use are common to the example shown in FIG.

[0024]

According to the method for producing a slice sample of the present invention, when synthesizing a three-dimensional image from the image of the cut surface of each slice sample, the alignment of each image is performed using the reference mark attached to the carrier tape. Can be done accurately. As a result, a three-dimensional image without distortion can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of an apparatus for implementing a method for producing a slice sample of the present invention.

2A and 2B are diagrams illustrating a thin sample and a reference mark held on a carrier tape, FIG. 2A illustrates an example in which a reference mark is provided on a carrier tape, and FIG. 2B illustrates an example in which a reference mark is provided inside a thin sample. Represent.

FIG. 3 is a diagram showing another example of an apparatus for performing the method for producing a slice sample of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... cutter, 2 ... carrier tape, 3 ... payout roll, 4 ... take-up roll, 5 ... sample holder, 7 ... punch, 8 ... laser beam irradiation head, 9: Power supply unit, 10: Sample block, 11: Thin sample, 12: Reference mark.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Hiroshi Minato 2068-3, Ooka, Numazu-shi, Shizuoka Toshiba Machine Co., Ltd. Numazu Office (72) Inventor Toshiro Higuchi 3-4-26, Eda-Higashi, Tsuzuki-ku, Yokohama, Kanagawa 72) Inventor Kenichi Kudo 5-15-16 Sugamo, Toshima-ku, Tokyo F-term (reference) 3C060 AA20 BA10 BF01 BF02

Claims (10)

[Claims] 1. After a carrier tape is stuck to the surface of a sample block, the surface layer of the sample block is sliced, and the cut slice sample is held and collected on the surface of the carrier tape, and these steps are repeated. In the method for preparing a slice sample in which thin samples continuously cut from one sample block are sequentially arranged on the surface of the carrier tape and collected, after attaching the carrier tape to the surface of the sample block,
Before slicing the surface layer of the sample block, a reference mark for alignment is provided on the carrier tape at a fixed position in a plane parallel to the surface of the sample block at the periphery of the sample block. Sample preparation method. 2. After a carrier tape is attached to the surface of the sample block, the surface layer of the sample block is sliced, and the cut slice sample is held and collected on the surface of the carrier tape, and these steps are repeated. In the method for preparing a slice sample in which thin samples continuously cut from one sample block are sequentially arranged on the surface of the carrier tape and collected, after attaching the carrier tape to the surface of the sample block,
Before slicing the surface layer of the sample block, a reference mark for alignment is attached to the sample block from the back side of the carrier tape at a fixed position in a plane parallel to the surface of the sample block. Thin sample preparation method. 3. The method according to claim 1, wherein the fiducial marks are provided at two positions. 4. The method according to claim 1, wherein the reference mark is formed using a punch. 5. The method according to claim 1, wherein the reference mark is formed by irradiating a laser beam. 6. After attaching a carrier tape to the surface of a sample block held on the front surface of a sample holder, the surface layer of the sample block is sliced, and the cut-out thin sample is held and collected on the surface of the carrier tape. By repeating these steps, a slice sample preparation apparatus for sequentially collecting slice samples cut from one sample block on the surface of the carrier tape in order to collect the slice samples, comprising: A thin sample manufacturing apparatus, characterized in that the section has a punching device for making a reference mark for alignment on the carrier tape from the back side of the carrier tape. 7. After attaching a carrier tape to the surface of the sample block held on the front surface of the sample holder, the surface layer of the sample block is sliced, and the cut slice sample is held and collected on the surface of the carrier tape. By repeating these steps, a slice sample preparation apparatus for sequentially collecting slice samples cut from one sample block on the surface of the carrier tape in order to collect the slice samples, comprising: A thin sample manufacturing apparatus, comprising: a punching device for making a reference mark for alignment on a sample block from a side. 8. The drilling device according to claim 6, wherein the reference mark is formed at two positions.
2. The thin-section sample preparation apparatus according to 1. 9. The method according to claim 6, wherein the punching device is a punch. 10. The method according to claim 6, wherein the drilling device is a laser beam irradiation head.