JP2001234069A - Aromatic polysulfone resin film, method for producing the same and solution composition for producing the film - Google Patents

Aromatic polysulfone resin film, method for producing the same and solution composition for producing the film

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Publication number
JP2001234069A
JP2001234069A JP2000042471A JP2000042471A JP2001234069A JP 2001234069 A JP2001234069 A JP 2001234069A JP 2000042471 A JP2000042471 A JP 2000042471A JP 2000042471 A JP2000042471 A JP 2000042471A JP 2001234069 A JP2001234069 A JP 2001234069A
Authority
JP
Japan
Prior art keywords
aromatic polysulfone
polysulfone resin
film
producing
solution composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000042471A
Other languages
Japanese (ja)
Inventor
Yoshiki Matsuoka
祥樹 松岡
Manabu Hirakawa
学 平川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Chemical Co Ltd
Original Assignee
Sumitomo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co Ltd filed Critical Sumitomo Chemical Co Ltd
Priority to JP2000042471A priority Critical patent/JP2001234069A/en
Publication of JP2001234069A publication Critical patent/JP2001234069A/en
Pending legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To obtain an aromatic polysulfone resin solution composition film not causing orange-peel and reduction in surface smoothness in an aromatic polysulfone resin film by a casting method, having excellent storage stability. SOLUTION: [1] This aromatic polysulfone resin solution composition comprises 10 wt.% to 50 wt.% of an aromatic polysulfone resin having 0.60-1.0 dl/g reduced viscosity. [2] The aromatic polysulfone resin solution composition comprises an aromatic polysulfone resin containing >=80 mol% of a repeating unit of the formula per molecular chain. [3] This method for producing a film comprises (1) forming a solvent-containing cast film by casting the aromatic polysulfone resin solution composition on a substrate and (2) evaporating the solvent from the cast film. [4] The method for producing the cast film comprises a process for heating the film at a temperature equal to or higher than Tg of the aromatic polysulfone resin.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は芳香族ポリサルホン
樹脂フィルム、その製造方法よびその製造のための溶液
組成物に関する。
TECHNICAL FIELD The present invention relates to an aromatic polysulfone resin film, a method for producing the same, and a solution composition for producing the same.

【0002】[0002]

【従来の技術】芳香族ポリサルホン樹脂フィルムは、機
械的強度、電気的性質、透明性、耐熱性、耐薬品性、難
燃性などの諸性質に優れ、例えば液晶表示装置の高分子
電極基板や位相差フィルムなどに利用されている。流延
法により芳香族ポリサルホン樹脂フィルムを製造する方
法としては、下記公開特許公報に開示された方法が知ら
れている。特開平6−7936号公報には、含水率が
0.2重量%以下のポリサルホン系樹脂溶液を流延・乾
燥することによって、ポリサルホン系樹脂フィルムを製
造する方法が記載されている。また、特開平7−248
58公報には、ポリサルホン樹脂のアセトフェノン溶液
あるいはN−メチルピロリドン溶液から溶液流延法によ
りポリサルホン樹脂のフィルムを製造する方法が記載さ
れている。さらに特開平7−300559公報には、
1,3−ジオキソランを使用することにより表面性、透
明性、均質性に優れた芳香族ポリエーテルスルホンの流
延フィルムを製造する方法が記載されている。流延法に
よって芳香族ポリサルホン樹脂のフィルムを作製する場
合、流延用の芳香族ポリサルホン樹脂溶液(以下ドープ
ということがある)の粘度が低いと、乾燥の初期段階で
ウエット状態のフィルム上に対流が原因となるオレンジ
ピールが発生し、表面平滑性が低下してしまうという問
題があった。これを解決するためにはドープを高濃度と
し、粘度を上げる必要があるが、そうするとドープの保
存安定性が低下するという問題が生じていた。
2. Description of the Related Art Aromatic polysulfone resin films have excellent properties such as mechanical strength, electrical properties, transparency, heat resistance, chemical resistance, and flame retardancy. It is used for retardation films. As a method for producing an aromatic polysulfone resin film by a casting method, a method disclosed in the following patent publication is known. JP-A-6-7936 describes a method for producing a polysulfone-based resin film by casting and drying a polysulfone-based resin solution having a water content of 0.2% by weight or less. In addition, Japanese Patent Application Laid-Open No. 7-248
Japanese Patent Application Publication No. 58-58 describes a method for producing a polysulfone resin film from an acetophenone solution or an N-methylpyrrolidone solution of a polysulfone resin by a solution casting method. Further, JP-A-7-300559 discloses
A method for producing a cast film of aromatic polyethersulfone having excellent surface properties, transparency and homogeneity by using 1,3-dioxolane is described. When an aromatic polysulfone resin film is produced by a casting method, if the viscosity of an aromatic polysulfone resin solution for casting (hereinafter sometimes referred to as a dope) is low, convection occurs on a wet film at an initial stage of drying. There is a problem that orange peel is generated due to the above, and the surface smoothness is reduced. In order to solve this, it is necessary to increase the viscosity of the dope and increase the viscosity, but this has caused a problem that the storage stability of the dope is reduced.

【0003】[0003]

【発明が解決しようとする課題】本発明の目的は、芳香
族ポリサルホン樹脂溶液組成物であって、該組成物を用
いて流延法によって製造した芳香族ポリサルホン樹脂フ
ィルムに、オレンジピールが発生せず表面平滑性が低下
せず、かつ保存安定性がよい芳香族ポリサルホン樹脂溶
液組成物、該組成物を用いてなる芳香族ポリサルホン樹
脂フィルムおよびその製造方法を提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide an aromatic polysulfone resin solution composition, in which an orange peel is generated on an aromatic polysulfone resin film produced by a casting method using the composition. It is an object of the present invention to provide an aromatic polysulfone resin solution composition which does not lower the surface smoothness and has good storage stability, an aromatic polysulfone resin film using the composition, and a method for producing the same.

【0004】[0004]

【課題を解決するための手段】本発明者らは鋭意検討し
た結果、流延法により芳香族ポリサルホン樹脂フィルム
を製造する際、特定の還元粘度の芳香族ポリサルホン樹
脂を特定量含むドープを用いることで上記課題を解決で
きることを見出し、本発明を完成した。すなわち、本発
明は、[1]還元粘度が0.60〜1.0dl/gである
芳香族ポリサルホン樹脂を10重量%〜50重量%含む
芳香族ポリサルホン樹脂溶液組成物に係るものである。
さらに本発明は、[2]芳香族ポリサルホン樹脂が一分子
鎖あたり下記繰り返し構造単位を80モル%以上含有す
るものである上記〔1〕の芳香族ポリサルホン樹脂溶液
組成物に係るものである。
Means for Solving the Problems As a result of intensive studies, the present inventors have found that when producing an aromatic polysulfone resin film by a casting method, a dope containing a specific amount of an aromatic polysulfone resin having a specific reduced viscosity is used. Thus, the present inventors have found that the above problems can be solved and completed the present invention. That is, the present invention relates to [1] an aromatic polysulfone resin solution composition containing 10 to 50% by weight of an aromatic polysulfone resin having a reduced viscosity of 0.60 to 1.0 dl / g.
Further, the present invention relates to [2] the aromatic polysulfone resin solution composition according to [1] above, wherein the aromatic polysulfone resin contains the following repeating structural unit per molecule chain in an amount of 80 mol% or more.

【化2】 また本発明は、〔3〕(1)上記〔1〕または〔2〕の
芳香族ポリサルホン樹脂溶液組成物を支持体の上に流延
して溶媒を含む流延フィルムを形成し、(2)該流延フ
ィルムから溶媒を蒸発せしめる芳香族ポリサルホン樹脂
フィルムの製造方法に係るものである。次に本発明は、
〔4〕芳香族ポリサルホン樹脂のガラス転移温度(T
g)以上の温度で加熱する工程を含む上記〔3〕の芳香
族ポリサルホン樹脂フィルムの製造方法に係るものであ
る。次いで本発明は、〔5〕上記〔3〕または〔4〕芳
香族ポリサルホン樹脂フィルムの製造方法で製造してな
る芳香族ポリサルホン樹脂フィルムに係るものである。
Embedded image Further, the present invention provides [3] (1) casting the aromatic polysulfone resin solution composition of the above [1] or [2] on a support to form a casting film containing a solvent, (2) The present invention relates to a method for producing an aromatic polysulfone resin film by evaporating a solvent from the cast film. Next, the present invention
[4] Glass transition temperature of aromatic polysulfone resin (T
g) A method for producing an aromatic polysulfone resin film according to the above [3], including a step of heating at the above temperature. Next, the present invention relates to [5] the aromatic polysulfone resin film produced by the above method [3] or [4].

【0005】[0005]

【発明の実施の形態】以下、本発明について詳細に説明
する。本発明において、芳香族ポリサルホン樹脂とは、
アリーレン単位、エーテル結合およびサルホン結合の三
者が必須の繰り返し構造単位であって、アリーレン単位
がエーテルおよびサルホン結合とともに無秩序にまたは
秩序正しく位置するポリアリーレン化合物である。本発
明で用いる芳香族ポリサルホン樹脂としては、例えば、
下記一般式(I)で示される繰り返し構造単位からなる
構造を含む樹脂、(II)で示される構造を含む樹脂、
または(III)で示される構造を含む樹脂等があげられ
る。
BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. In the present invention, the aromatic polysulfone resin is
An arylene unit is a polyarylene compound in which three members of an ether bond and a sulfone bond are essential repeating structural units, and the arylene unit is located randomly or orderly together with the ether and the sulfone bond. As the aromatic polysulfone resin used in the present invention, for example,
A resin containing a structure consisting of a repeating structural unit represented by the following general formula (I), a resin containing a structure represented by (II),
Or a resin having the structure represented by (III).

【0006】[0006]

【化3】 ……(I) [式(I)中、R1は炭素数1〜6のアルキル基、炭素
数3〜10のアルケニル基、フェニル基またはハロゲン
原子を表し、pは0〜4の整数である。同一または異な
る核上の各R1は相互に異なっていてもよい。各pは相
互に異なっていてもよい。]
Embedded image ... (I) [In the formula (I), R 1 represents an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 3 to 10 carbon atoms, a phenyl group or a halogen atom, and p is an integer of 0 to 4. . Each R 1 on the same or different nuclei may be different from each other. Each p may be different from each other. ]

【0007】[0007]

【化4】 ……(II) [式(II)中、R1は炭素数1〜6のアルキル基、炭素
数3〜10のアルケニル基、フェニル基またはハロゲン
原子を表し、pは0〜4の整数である。m、nは平均繰
り返し構造単位数を示し、m、nは0.1から100ま
での正数である。同一または異なる核上の各R1は相互
に異なっていてもよい。各pは相互に異なっていてもよ
い。]
Embedded image ... (II) [In the formula (II), R 1 represents an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 3 to 10 carbon atoms, a phenyl group or a halogen atom, and p is an integer of 0 to 4. . m and n indicate the average number of repeating structural units, and m and n are positive numbers from 0.1 to 100. Each R 1 on the same or different nuclei may be different from each other. Each p may be different from each other. ]

【0008】[0008]

【化5】 ……(III) [式(III)中、R1は炭素数1〜6のアルキル基、炭素
数3〜10のアルケニル基、フェニル基またはハロゲン
原子を表し、pは0〜4の整数である。m、nは平均繰
り返し構造単位数を示し、m、nは0.1から100ま
での正数である。同一または異なる核上の各R1は相互
に異なっていてもよい。各pは相互に異なっていてもよ
い。各qは相互に異なっていてよい。]
Embedded image ... (III) [In formula (III), R 1 represents an alkyl group having 1 to 6 carbon atoms, an alkenyl group having 3 to 10 carbon atoms, a phenyl group or a halogen atom, and p is an integer of 0 to 4. . m and n indicate the average number of repeating structural units, and m and n are positive numbers from 0.1 to 100. Each R 1 on the same or different nuclei may be different from each other. Each p may be different from each other. Each q may be different from each other. ]

【0009】上記式(I)および式(II)で示される構
造はブロック共重合体を示しているが、本発明において
は、それぞれの繰返し構造単位を含むランダム共重合体
や交互共重合体をも示すものとする。
The structures represented by the above formulas (I) and (II) represent block copolymers. In the present invention, a random copolymer or an alternating copolymer containing each repeating structural unit is used. Shall also be indicated.

【0010】本発明で用いられる芳香族ポリサルホン樹
脂としては、(II)または(III)で表される構造中に
おける(m/m+n)は0.8以上であることが好まし
い。また、(III)の構造中のqは1であることが好ま
しい。
As the aromatic polysulfone resin used in the present invention, (m / m + n) in the structure represented by (II) or (III) is preferably 0.8 or more. Further, q in the structure of (III) is preferably 1.

【0011】これらの中で、(I)で示される繰り返し
構造単位からなる構造を含む樹脂、(II)で示される構
造を含む樹脂が好ましく、さらに好ましくは(I)で示
される繰り返し構造単位からなる構造を含む樹脂であ
る。(I)の繰り返し構造単位からなる構造を含む樹脂
のなかで、全てのpが0であるもの、即ち、下式で示さ
れる繰り返し構造単位からなる構造を含む樹脂がより好
ましく、一分子鎖あたり下式で示される繰り返し構造単
位を80モル%以上含有する樹脂が特に好ましい。
Among these, a resin having a structure comprising a repeating structural unit represented by (I) and a resin having a structure represented by (II) are preferable, and more preferably a resin having a structure comprising a repeating unit represented by (I) It is a resin including a structure. Among resins containing a structure consisting of repeating structural units of (I), those having all p's of 0, that is, resins containing a structure consisting of repeating structural units represented by the following formula, are more preferable. A resin containing a repeating structural unit represented by the following formula at 80 mol% or more is particularly preferred.

【0012】[0012]

【化6】 さらに、本発明に使用される芳香族ポリサルホン樹脂に
は、上述の構造に加えて、例えば、(IV)から(Vl)の
例で示される繰り返し構造単位を含んでいてもよい。
Embedded image Further, the aromatic polysulfone resin used in the present invention may contain, for example, the repeating structural units shown in the examples (IV) to (Vl) in addition to the above-mentioned structure.

【化7】 ……(IV)Embedded image …… (IV)

【化8】 ……(V)Embedded image …… (V)

【化9】 ……(Vl) (式(Vl)中、Xは炭素数1〜20の有機基、2価の硫
黄原子または酸素原子を表す。) ここに、炭素数1〜20の有機基としては、例えばイソ
プロピリデン基、エチリデン基などがあげられる。
Embedded image (Vl) (In the formula (Vl), X represents an organic group having 1 to 20 carbon atoms, a divalent sulfur atom or an oxygen atom.) Here, as the organic group having 1 to 20 carbon atoms, for example, Examples include an isopropylidene group and an ethylidene group.

【0013】本発明において用いられる芳香族ポリサル
ホン樹脂の分子量は、その尺度である還元粘度を用いて
表され、その値が0.60〜1.0dl/gの範囲であ
り、好ましくは0.60〜0.90dl/g、より好ま
しくは0.70dl/g〜0.80dl/gの範囲であ
る。0.60dl/g未満の該樹脂を用いると、流延に
適した安定なドープを得るのが難く、また1.0dl/
gを越えると該樹脂が得られ難いばかりか、該樹脂の溶
解性が低下する。尚、本発明において、還元粘度は10
0cm3のN,N−ジメチルホルムアミド中に芳香族ポ
リサルホンを1g溶解させた後、この溶液の粘度を25
℃で測定した値である。
The molecular weight of the aromatic polysulfone resin used in the present invention is represented by using a reduced viscosity as a measure thereof, and the value is in a range of 0.60 to 1.0 dl / g, preferably 0.60 to 1.0 dl / g. 0.90 dl / g, more preferably 0.70 dl / g to 0.80 dl / g. If the resin is less than 0.60 dl / g, it is difficult to obtain a stable dope suitable for casting.
If it exceeds g, not only is it difficult to obtain the resin, but also the solubility of the resin decreases. In the present invention, the reduced viscosity is 10
After dissolving 1 g of aromatic polysulfone in 0 cm 3 of N, N-dimethylformamide, the viscosity of this solution was increased to 25%.
It is a value measured at ° C.

【0014】また、本発明のドープに用いる溶媒として
は、N−メチル−2−ピロリドン、N,N−ジメチルホ
ルムアミド、N,N−ジメチルアセトアミドなどのアミ
ド類;ジメチルスルホキシドなどのスルホキシド類;ク
レゾールなどのフェノール類;塩化メチレンなどのハロ
ゲン化炭素類;γ−ブチロラクトンなどのエステル類;
等の芳香族ポリサルホン樹脂の良溶媒があげられる。こ
れらの溶媒は単独で使用しても、複数種類を混合して使
用してもよい。さらに必要に応じて、トルエン、キシレ
ンなどの芳香族炭化水素類;メチルエチルケトン、メチ
ルイソブチルケトン、アセトン、シクロヘキサノンなど
のケトン類;メタノール、エタノールなどのアルコール
類;水;等の芳香族ポリスルホン樹脂の貧溶媒を良溶媒
に添加することもできる。混合比率はドープの濃度、保
存安定性、支持体への流延後の乾燥条件などよって異な
るが、良溶媒/貧溶媒比が1/3以上であることが好ま
しい。本発明のドープ中の芳香族ポリスルホン樹脂の濃
度は、10重量%〜50重量%であり、20重量%〜4
0重量%であることが好ましい。10重量%未満の濃度
では、実効濃度が低く、特に厚膜において、乾燥の初期
段階でフィルムに対流が原因となるオレンジピールが発
生し、表面平滑性が低下してしまう。また、50重量%
以上の濃度では、ドープが保存時に芳香族ポリスルホン
樹脂の結晶化などによりゲル化してしまい安定性に劣
り、さらにこの領域ではドープが高粘度であることに由
来して、濾過性に劣る。
The solvent used in the dope of the present invention includes amides such as N-methyl-2-pyrrolidone, N, N-dimethylformamide and N, N-dimethylacetamide; sulfoxides such as dimethyl sulfoxide; cresol; Phenols; halogenated carbons such as methylene chloride; esters such as γ-butyrolactone;
And other good solvents for aromatic polysulfone resins. These solvents may be used alone or in combination of two or more. If necessary, aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, methyl isobutyl ketone, acetone and cyclohexanone; alcohols such as methanol and ethanol; water; poor solvents for aromatic polysulfone resins such as water Can be added to a good solvent. The mixing ratio varies depending on the concentration of the dope, storage stability, drying conditions after casting on the support, and the like, but the ratio of good solvent / poor solvent is preferably 1/3 or more. The concentration of the aromatic polysulfone resin in the dope of the present invention is 10% by weight to 50% by weight, and 20% by weight to 4% by weight.
It is preferably 0% by weight. When the concentration is less than 10% by weight, the effective concentration is low, and particularly in the case of a thick film, an orange peel occurs due to convection in the film at an early stage of drying, and the surface smoothness is reduced. In addition, 50% by weight
At the above concentration, the dope gels due to crystallization of the aromatic polysulfone resin during storage and the like, resulting in poor stability, and furthermore, in this region, the dope has high viscosity, resulting in poor filterability.

【0015】また、本発明のドープには必要に応じて、
レベリング剤や可塑剤などの添加剤を配合することもで
きる。レベリング剤としては、アクリル系、シリコーン
系、フッ素系のものが使用できる。可塑剤としては、芳
香族ポリサルホン樹脂との相溶性が良く、相分離やブリ
ードアウトを生じないもので、かつ着色の生じないもの
が好ましい。例えば、フタル酸系、リン酸系、アジピン
酸系、クエン酸系、グリコール酸系などの可塑剤が挙げ
られ、フタル酸ブチルベンジル、リン酸トリクレジル、
メチルフタリルエチルグリコレートなどが好ましく用い
られる。
In the dope of the present invention, if necessary,
Additives such as leveling agents and plasticizers can also be blended. As the leveling agent, acryl-based, silicone-based, and fluorine-based agents can be used. As the plasticizer, a plasticizer that has good compatibility with the aromatic polysulfone resin, does not cause phase separation or bleed-out, and does not cause coloring is preferable. For example, phthalic acid, phosphoric acid, adipic acid, citric acid, glycolic acid and the like plasticizers, butylbenzyl phthalate, tricresyl phosphate,
Methylphthalylethyl glycolate and the like are preferably used.

【0016】本発明の製造方法においては、上記の芳香
族ポリサルホン樹脂、溶媒等の配合物を混合・溶解し、
芳香族ポリサルホン樹脂溶液組成物(ドープ)を調製し
た後、(1)該ドープをコンマコーター、リップコータ
ー、ドクターブレードコーター、バーコーター、ロール
コーター等でエンドレスバンドまたはドラム上の支持体
の上に流延して、溶媒を含む流延フィルムを形成する。
(2)そして該流延フィルムより溶媒を蒸発せしめて、
膜状物を形成する。溶媒の蒸発は、蒸発の効率を向上さ
せるため、加熱により行うことが好ましい。加熱の温度
は、一定でもよく、必要に応じ変化させてもよい。
In the production method of the present invention, the compound such as the above-mentioned aromatic polysulfone resin and solvent are mixed and dissolved,
After preparing the aromatic polysulfone resin solution composition (dope), (1) the dope is flowed onto an endless band or a support on a drum by a comma coater, lip coater, doctor blade coater, bar coater, roll coater or the like. And forming a casting film containing a solvent.
(2) and evaporating the solvent from the casting film,
Form a film. The solvent is preferably evaporated by heating in order to improve the efficiency of the evaporation. The heating temperature may be constant or may be varied as needed.

【0017】また、本発明の製造方法において、フィル
ムを光学的に等方性とするため、芳香族ポリサルホン樹
脂のガラス転移温度(Tg)以上の温度で加熱する工程を
含むことがより好ましい。ガラス転移温度(Tg)以上の
温度で加熱する工程は、上記の溶媒を蒸発せしめる工程
の中で行われてもよいし、溶媒を蒸発せしめる工程と別
であってもよい。
Further, in the production method of the present invention, in order to make the film optically isotropic, it is more preferable to include a step of heating at a temperature higher than the glass transition temperature (Tg) of the aromatic polysulfone resin. The step of heating at a temperature equal to or higher than the glass transition temperature (Tg) may be performed in the step of evaporating the solvent, or may be different from the step of evaporating the solvent.

【0018】形成された膜状物を支持体から剥ぎ取っ
て、連続的に長尺の芳香族ポリサルホン樹脂フィルムを
得る。また、シート状の支持体を用いてバッチ法で短尺
の芳香族ポリサルホンフィルムを得ることもできる。
The formed film is peeled off from the support to obtain a continuous long aromatic polysulfone resin film. A short aromatic polysulfone film can also be obtained by a batch method using a sheet-like support.

【0019】このようにして製造された芳香族ポリサル
ホン樹脂フィルムの用途として種々のものがあげられ
る。例えば、電気絶縁分野では、H種クラスの電気機
器、モータや発電機のスロットライナ、相間絶縁などの
絶縁材料、接着剤や粘着剤を塗工しテープ状に加工した
変圧器や電線向けのラッピング材、コンデンサーなどの
誘電体用フィルム、チューブ状絶縁材料などに利用でき
る。エレクトロニクス関連分野では、フレキシブルプリ
ント回路基板やその補強板、耐熱スペーサー、PCBラ
ミネートなどに利用できる。音響関連分野では、スピー
カーの振動板や振動補強板に利用できる。情報関連分野
では、寸法安定性が要求される記録用テープ、ディス
ク、液晶ディスプレイのガラス基板代替フィルム、延伸
加工を施すことで位相差フィルム、光ファイバーの接続
部に利用できる。食品・医療分野では、医療用殺菌機
器、電子レンジ・オーブンレンジ用の加熱パックなどに
利用できる。
There are various uses of the aromatic polysulfone resin film thus produced. For example, in the field of electrical insulation, H-class electrical equipment, slot liners for motors and generators, insulating materials such as phase-to-phase insulation, and wrapping for transformers and wires coated with adhesives and adhesives and processed into tapes It can be used for materials, dielectric films such as capacitors, and tubular insulating materials. In the electronics-related field, it can be used for flexible printed circuit boards and their reinforcing plates, heat-resistant spacers, PCB laminates, and the like. In the acoustic-related field, it can be used for diaphragms and vibration reinforcing plates of speakers. In the information-related field, it can be used for recording tapes, disks, and glass substrate replacement films for liquid crystal displays that require dimensional stability, as well as for connection parts of retardation films and optical fibers by being stretched. In the food and medical fields, it can be used for medical sterilization equipment and heating packs for microwave ovens and microwave ovens.

【0020】[0020]

【実施例】次に本発明につき実施例をあげ具体的に説明
するが、本発明はこれらに限定されるものではない。
EXAMPLES Next, the present invention will be described specifically with reference to examples, but the present invention is not limited to these examples.

【0021】実施例1 商品名スミカエクセルPES7600P(住友化学工業
(株)製、ポリエーテルスルホン、還元粘度0.76d
l/g)をN,N−ジメチルホルムアミドに溶解し、固
形分濃度が25重量%の芳香族ポリスルホン樹脂溶液
(以下ドープと略記)を作製した。このドープをバーコ
ーター(クリアランス500μm)を用いてガラス板上
に流延し、100℃の加熱オーブンに入れ10分間放置
した。その後、フィルムの表面状態を観察したところ、
オレンジピールの発生のない良好な表面が得られた。
尚、ドープの作製・流延操作を通じて、ドープ粘度に顕
著な変化は観察されず、良好な安定性を有していた。
Example 1 Sumika Excel PES7600P (manufactured by Sumitomo Chemical Co., Ltd., polyether sulfone, reduced viscosity 0.76d)
1 / g) in N, N-dimethylformamide to prepare an aromatic polysulfone resin solution having a solid content of 25% by weight (hereinafter abbreviated as dope). This dope was cast on a glass plate using a bar coater (clearance: 500 μm), placed in a heating oven at 100 ° C., and left for 10 minutes. After that, when observing the surface condition of the film,
A good surface free of orange peel was obtained.
No significant change in the viscosity of the dope was observed during the production and casting operations of the dope, and the dope had good stability.

【0022】実施例2 商品名スミカエクセルPES7600P(住友化学工業
(株)製、ポリエーテルスルホン、還元粘度0.76d
l/g)をN,N−ジメチルホルムアミドに溶解し、固
形分濃度が30重量%のドープを作製した。このドープ
をバーコーター(クリアランス500μm)を用いてガ
ラス板上に流延し、100℃の加熱オーブンに入れ10
分間放置した。その後、フィルムの表面状態を観察した
ところ、オレンジピールの発生のない良好な表面が得ら
れた。尚、ドープの作製・流延操作を通じて、ドープ粘
度に顕著な変化は観察されず、良好な安定性を有してい
た。
Example 2 Sumika Excel PES7600P (manufactured by Sumitomo Chemical Co., Ltd., polyether sulfone, reduced viscosity 0.76d)
1 / g) was dissolved in N, N-dimethylformamide to prepare a dope having a solid content of 30% by weight. This dope was cast on a glass plate using a bar coater (clearance: 500 μm) and placed in a heating oven at 100 ° C.
Let stand for minutes. Thereafter, when the surface state of the film was observed, a good surface free of orange peel was obtained. No significant change in the viscosity of the dope was observed during the production and casting operations of the dope, and the dope had good stability.

【0023】比較例1 商品名スミカエクセルPES5200P(住友化学工業
(株)製、ポリエーテルスルホン、還元粘度0.52d
l/g)をN,N−ジメチルホルムアミドに溶解し、固
形分濃度が25重量%のドープを作製した。このドープ
をバーコーター(クリアランス500μm)を用いてガ
ラス板上に流延し、100℃の加熱オーブンに入れ10
分間放置した。その後、フィルムの表面状態を観察した
ところ、全面にオレンジピールが発生した。尚、520
0Pは7600Pに比べて還元粘度が低いにもかかわら
ず、該ドープの粘度は実施例1記載のドープよりも高
く、ゲル化の兆候が観察された。
Comparative Example 1 Sumika Excel PES5200P (manufactured by Sumitomo Chemical Co., Ltd., polyether sulfone, reduced viscosity 0.52d)
1 / g) was dissolved in N, N-dimethylformamide to prepare a dope having a solid concentration of 25% by weight. This dope was cast on a glass plate using a bar coater (clearance: 500 μm) and placed in a heating oven at 100 ° C.
Let stand for minutes. Thereafter, when the surface state of the film was observed, orange peel was generated on the entire surface. 520
Although 0P had a lower reduced viscosity than 7600P, the viscosity of the dope was higher than that of the dope described in Example 1, and signs of gelation were observed.

【0024】比較例2 商品名スミカエクセルPES5200P(住友化学工業
(株)製、ポリエーテルスルホン、還元粘度0.52d
l/g)をN,N−ジメチルホルムアミドに溶解し、固
形分濃度が30重量%の芳香族ポリスルホン樹脂溶液を
作製した。この溶液をバーコーター(クリアランス50
0μm)を用いてガラス板上に流延し、100℃の加熱
オーブンに入れ10分間放置した。その後、フィルムの
表面状態を観察したところ、全面にオレンジピールが発
生した。尚、5200Pは7600Pに比べて還元粘度
が低いにもかかわらず、該ドープの粘度は実施例2記載
のドープよりも高く、ゲル化の兆候が観察された。
Comparative Example 2 Sumika Excel PES5200P (manufactured by Sumitomo Chemical Co., Ltd., polyether sulfone, reduced viscosity 0.52d)
1 / g) was dissolved in N, N-dimethylformamide to prepare an aromatic polysulfone resin solution having a solid content of 30% by weight. This solution was applied to a bar coater (clearance 50
(0 μm), and cast in a heating oven at 100 ° C. for 10 minutes. Thereafter, when the surface state of the film was observed, orange peel was generated on the entire surface. Although the reduced viscosity of 5200P was lower than that of 7600P, the viscosity of the dope was higher than that of the dope described in Example 2, and a sign of gelation was observed.

【0025】[0025]

【表1】 [Table 1]

【0026】[0026]

【発明の効果】本発明の芳香族ポリサルホン樹脂溶液組
成物は、保存安定性がよく、かつ該組成物を用いて流延
法によって製造した芳香族ポリサルホン樹脂フィルム
は、オレンジピールが発生し、表面平滑性が低下してし
まうという問題がない。
EFFECT OF THE INVENTION The aromatic polysulfone resin solution composition of the present invention has good storage stability, and the aromatic polysulfone resin film produced by the casting method using the composition produces orange peel, There is no problem that the smoothness is reduced.

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 4F071 AA64 AA88 AE19 AH12 BA02 BB02 BC01 4J002 CN031 FD020 GB00 GG00 GP00 GQ00 GS00 HA05  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA64 AA88 AE19 AH12 BA02 BB02 BC01 4J002 CN031 FD020 GB00 GG00 GP00 GQ00 GS00 HA05

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】還元粘度が0.60〜1.0dl/gであ
る芳香族ポリサルホン樹脂を10重量%〜50重量%含
むことを特徴とする芳香族ポリサルホン樹脂溶液組成
物。
1. An aromatic polysulfone resin solution composition comprising 10 to 50% by weight of an aromatic polysulfone resin having a reduced viscosity of 0.60 to 1.0 dl / g.
【請求項2】芳香族ポリサルホン樹脂が一分子鎖あたり
下記繰り返し構造単位を80モル%以上含有するもので
あることを特徴とする請求項1記載の芳香族ポリサルホ
ン樹脂溶液組成物。 【化1】
2. The aromatic polysulfone resin solution composition according to claim 1, wherein the aromatic polysulfone resin contains at least 80 mol% of the following repeating structural units per molecular chain. Embedded image
【請求項3】(1)請求項1または2記載の芳香族ポリ
サルホン樹脂溶液組成物を支持体の上に流延して溶媒を
含む流延フィルムを形成し、(2)該流延フィルムから
溶媒を蒸発せしめることを特徴とする芳香族ポリサルホ
ン樹脂フィルムの製造方法。
(3) The aromatic polysulfone resin solution composition according to (1) or (2) is cast on a support to form a cast film containing a solvent. A method for producing an aromatic polysulfone resin film, comprising evaporating a solvent.
【請求項4】芳香族ポリサルホン樹脂のガラス転移温度
(Tg)以上の温度で加熱する工程を含むことを特徴と
する請求項3記載の芳香族ポリサルホン樹脂フィルムの
製造方法。
4. The method for producing an aromatic polysulfone resin film according to claim 3, further comprising the step of heating at a temperature higher than the glass transition temperature (Tg) of the aromatic polysulfone resin.
【請求項5】請求項3または4記載の芳香族ポリサルホ
ン樹脂フィルムの製造方法で製造してなることを特徴と
する芳香族ポリサルホン樹脂フィルム。
5. An aromatic polysulfone resin film produced by the method for producing an aromatic polysulfone resin film according to claim 3 or 4.
JP2000042471A 2000-02-21 2000-02-21 Aromatic polysulfone resin film, method for producing the same and solution composition for producing the film Pending JP2001234069A (en)

Priority Applications (1)

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Applications Claiming Priority (1)

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Publications (1)

Publication Number Publication Date
JP2001234069A true JP2001234069A (en) 2001-08-28

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Country Link
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