JP2001230504A - Flexible wiring board and its connection structure to circuit board - Google Patents
Flexible wiring board and its connection structure to circuit boardInfo
- Publication number
- JP2001230504A JP2001230504A JP2000046800A JP2000046800A JP2001230504A JP 2001230504 A JP2001230504 A JP 2001230504A JP 2000046800 A JP2000046800 A JP 2000046800A JP 2000046800 A JP2000046800 A JP 2000046800A JP 2001230504 A JP2001230504 A JP 2001230504A
- Authority
- JP
- Japan
- Prior art keywords
- board
- signal
- disconnection
- wiring
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、回路基板を接続す
るために用いられるフレキシブル配線基板、及び、この
フレキシブル配線基板の回路基板への接続構造に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible wiring board used for connecting a circuit board, and a structure for connecting the flexible wiring board to the circuit board.
【0002】[0002]
【従来の技術】フレキシブル配線基板(FPC)は、ポ
リイミド等の柔軟性且つ絶縁性を有する本体基板上に信
号用配線を形成してなるもので、回路基板の接続に用い
られる。このフレキシブル配線基板は、振動等による断
線の可能性があり、高品質な電子装置には、自己診断機
能による異常を検出することが必要となっている。2. Description of the Related Art A flexible wiring board (FPC) is formed by forming signal wiring on a flexible and insulating main body substrate such as polyimide or the like, and is used for connecting circuit boards. This flexible wiring board may be disconnected due to vibration or the like, and it is necessary for a high-quality electronic device to detect an abnormality by a self-diagnosis function.
【0003】従来、フレキシブル配線基板の断線を検出
する自己診断機能を持った電子装置がある。これは、各
信号用配線が断線した場合に、特定の信号出力(電圧や
周波数)が変化することを検知することにより実現して
いる。Conventionally, there is an electronic device having a self-diagnosis function for detecting disconnection of a flexible wiring board. This is realized by detecting that a specific signal output (voltage or frequency) changes when each signal wiring is disconnected.
【0004】[0004]
【発明が解決しようとする課題】しかしながら、上記従
来の断線検出方法では、特定の信号出力の変化を検出す
るための回路規模が大きくなったり、十分な検出精度が
出なかったり、断線を検出できない信号があったりする
など、断線検出を効率よく行うことは困難であった。However, in the above-described conventional disconnection detecting method, a circuit scale for detecting a change in a specific signal output becomes large, sufficient detection accuracy is not obtained, or a disconnection cannot be detected. It has been difficult to detect disconnection efficiently, for example, when there is a signal.
【0005】本発明は上記問題に鑑み、フレキシブル配
線基板の回路基板への接続構造において、簡易な構成に
てフレキシブル配線基板の断線検出を可能とすること、
及び、そのような接続構造に適したフレキシブル配線基
板を提供することを目的とする。SUMMARY OF THE INVENTION In view of the above problems, the present invention provides a structure for connecting a flexible wiring board to a circuit board, which makes it possible to detect disconnection of the flexible wiring board with a simple structure.
It is another object of the present invention to provide a flexible wiring board suitable for such a connection structure.
【0006】[0006]
【課題を解決するための手段】本発明は、フレキシブル
配線基板における信号用配線部の断線は、端部から発生
することから、本体基板の亀裂を電気信号に反映する配
線を、本体基板にダミー的に形成し、このダミー配線の
断線を検出することで、フレキシブル配線基板の断線検
出を行うことに着目してなされたものである。According to the present invention, since a disconnection of a signal wiring portion in a flexible wiring substrate occurs from an end portion, a wiring reflecting a crack in the main substrate to an electric signal is provided on the main substrate as a dummy. It is made by paying attention to performing disconnection detection of the flexible wiring board by forming the dummy wiring and detecting the disconnection of the dummy wiring.
【0007】即ち、請求項1記載の発明では、柔軟性を
有する絶縁性の本体基板(11)に信号用配線部(1
2)を形成してなるフレキシブル配線基板(10)を、
回路基板(20)に接続してなる接続構造において、本
体基板に信号用配線部とは独立した検出用配線部(1
3)を形成し、回路基板に、この検出用配線部が断線し
たときの信号を発生する断線信号発生回路手段(22)
を形成したことを特徴としている。That is, according to the first aspect of the present invention, the signal wiring portion (1) is provided on the flexible insulating main body substrate (11).
The flexible wiring board (10) formed by 2) is
In the connection structure connected to the circuit board (20), the detection wiring portion (1
3) forming a disconnection signal generating circuit means (22) for generating a signal when the detection wiring section is disconnected on the circuit board;
Is formed.
【0008】それによれば、フレキシブル配線基板の本
体基板にダミー配線としての検出用配線部を形成し、回
路基板に検出用配線部が断線したときの信号を発生する
断線信号発生回路手段を形成するだけの簡易な構成によ
り、検出用配線部の断線を利用して擬似的にフレキシブ
ル配線基板の断線検出を行うことができる。According to this, a detection wiring portion as a dummy wiring is formed on the main substrate of the flexible wiring substrate, and a disconnection signal generating circuit means for generating a signal when the detection wiring portion is disconnected is formed on the circuit board. With this simple configuration, the disconnection of the flexible wiring board can be simulated by utilizing the disconnection of the detection wiring portion.
【0009】特に、請求項2の発明のように、検出用配
線部(13)を、本体基板(11)の周辺部にて信号用
配線部(12)を囲うように形成することが好ましい。
振動等によりフレキシブル配線基板の断線が発生した場
合、本発明によれば、まず、周辺部に位置する検出用配
線部から断線が発生するため、より確実に断線の検出を
行うことができる。In particular, it is preferable that the detection wiring portion (13) is formed so as to surround the signal wiring portion (12) around the main body substrate (11).
According to the present invention, when the disconnection of the flexible wiring board occurs due to vibration or the like, the disconnection occurs first from the detection wiring portion located in the peripheral portion, so that the disconnection can be detected more reliably.
【0010】また、請求項3記載の発明はフレキシブル
配線基板に係るもので、本体基板(11)に信号用配線
部(12)とは独立した検出用配線部(13)を形成し
てなることを特徴としており、請求項1の接続構造に適
したフレキシブル配線基板を提供することができる。さ
らに、請求項4記載の発明によれば、請求項2の接続構
造に適したフレキシブル配線基板を提供することができ
る。According to a third aspect of the present invention, there is provided a flexible wiring board, wherein a detection wiring section (13) independent of a signal wiring section (12) is formed on a main board (11). And a flexible wiring board suitable for the connection structure of claim 1 can be provided. Further, according to the fourth aspect of the invention, it is possible to provide a flexible wiring board suitable for the connection structure of the second aspect.
【0011】なお、上記各手段の括弧内の符号は、後述
する実施形態に記載の具体的手段との対応関係を示す一
例である。Note that the reference numerals in parentheses of the above means are examples showing the correspondence with specific means described in the embodiments described later.
【0012】[0012]
【発明の実施の形態】以下、本発明を図に示す実施形態
について説明する。図1は、本発明の実施形態に係るフ
レキシブル配線基板の回路基板への接続構造を模式的に
示す説明図である。本接続構造は、プリント基板(回路
基板)20をフレキシブル配線基板10を介して、図示
しない他のプリント基板に回路接続したものである。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention. FIG. 1 is an explanatory diagram schematically showing a connection structure of a flexible wiring board to a circuit board according to an embodiment of the present invention. In the present connection structure, a printed circuit board (circuit board) 20 is circuit-connected to another printed board (not shown) via a flexible wiring board 10.
【0013】フレキシブル配線基板10は、柔軟性を有
する絶縁性のポリイミド樹脂等よりなる本体基板(ベー
スフィルム)11と、この本体基板11に形成されプリ
ント基板20と上記他のプリント基板との間の信号の伝
達を行うためのCu等よりなる信号用配線部12とを有
する。The flexible wiring board 10 includes a main board (base film) 11 made of a flexible insulating polyimide resin or the like, and a printed circuit board 20 formed on the main board 11 and the other printed board. And a signal wiring portion 12 made of Cu or the like for transmitting a signal.
【0014】本体基板11の周辺部には、信号用配線部
とは電気的に独立した断線検出用の検出用配線部13
が、信号用配線部12を囲うようにCu等により形成さ
れている。つまり、信号用配線部12は、検出用配線部
13の内側に位置するように配置されている。A detection wiring portion 13 for disconnection detection, which is electrically independent of the signal wiring portion, is provided around the main body substrate 11.
Are formed of Cu or the like so as to surround the signal wiring portion 12. That is, the signal wiring section 12 is arranged so as to be located inside the detection wiring section 13.
【0015】フレキシブル配線基板10の一端側におい
て、信号用配線部12及び検出用配線部13は、それぞ
れターミナル21を介してプリント基板20に接続され
ている。また、図示しないが、フレキシブル配線基板1
0の他端側において、信号用配線部12はターミナル等
を介して、上記した他のプリント基板に電気的に接続さ
れている。こうして、両プリント基板は、信号用配線部
12を介して回路接続されている。On one end side of the flexible wiring board 10, the signal wiring section 12 and the detection wiring section 13 are connected to a printed board 20 via terminals 21, respectively. Although not shown, the flexible wiring board 1
On the other end side of the signal line 0, the signal wiring section 12 is electrically connected to the above-mentioned other printed circuit board via a terminal or the like. Thus, the two printed boards are circuit-connected via the signal wiring section 12.
【0016】また、プリント基板20には、検出用配線
部13が断線したときの信号(断線検出用信号S1)を
発生する断線信号発生回路手段としての断線検出回路2
2が設けられている。この断線検出回路22は、フレキ
シブル配線基板10の検出用配線部13とつながってお
り、プルアップ抵抗器23、信号を増幅するためのバッ
ファ回路24を備えた回路となっている。The printed circuit board 20 has a disconnection detection circuit 2 as a disconnection signal generating circuit for generating a signal (disconnection detection signal S1) when the detection wiring section 13 is disconnected.
2 are provided. The disconnection detection circuit 22 is connected to the detection wiring section 13 of the flexible wiring board 10 and is a circuit including a pull-up resistor 23 and a buffer circuit 24 for amplifying a signal.
【0017】ここで、プルアップ抵抗器23は、その一
端が検出用配線部13とバッファ回路24の入力側との
間にて電気的に接続され、その他端は図示しない電源に
接続されている。また、バッファ回路24の入力側は、
検出用配線部13を介して接地されており、出力側から
は、上記断線検出用信号S1が出力されるようになって
いる。Here, one end of the pull-up resistor 23 is electrically connected between the detection wiring section 13 and the input side of the buffer circuit 24, and the other end is connected to a power supply (not shown). . The input side of the buffer circuit 24 is
It is grounded via the detection wiring section 13, and the output side outputs the disconnection detection signal S1.
【0018】上記構成に基づき、本実施形態の作動を説
明する。図2は、フレキシブル配線基板10が断線した
場合の図である。また、図3は本実施形態の作用を示す
説明図であり、(a)は断線が発生する前の断線検出回
路22の状態を示す図、(b)は断線が発生した後の断
線検出回路22の状態を示す図、(c)は断線の発生に
よる断線検出回路22の信号変化の様子を示す図であ
る。The operation of this embodiment based on the above configuration will be described. FIG. 2 is a diagram when the flexible wiring board 10 is disconnected. FIGS. 3A and 3B are explanatory diagrams showing the operation of the present embodiment. FIG. 3A shows the state of the disconnection detecting circuit 22 before the disconnection occurs, and FIG. 3B shows the state of the disconnection detecting circuit after the disconnection occurs. FIG. 2C is a diagram showing a state of FIG. 22, and FIG. 2C is a diagram showing a state of a signal change of the disconnection detection circuit 22 due to the occurrence of disconnection.
【0019】上述したように、振動等によりフレキシブ
ル配線基板10の断線は本体基板の端部の方から発生し
やすいため、フレキシブル配線基板10は外側から亀裂
が入り、進行し、図2に示す様に、断線部K1が発生す
る。従って、フレキシブル配線基板10の亀裂により、
最初に断線するのは本体基板11の端部に位置する検出
用配線部13である。As described above, since the disconnection of the flexible wiring board 10 is likely to occur from the end of the main board due to vibration or the like, the flexible wiring board 10 is cracked from the outside and proceeds, as shown in FIG. Then, a disconnection portion K1 occurs. Therefore, due to the cracks in the flexible wiring board 10,
The first disconnection is the detection wiring portion 13 located at the end of the main body substrate 11.
【0020】断線部K1が発生する前の断線検出回路2
2の状態(正常時)は、図3(a)に示す様に、バッフ
ァ回路24は、検出用配線部13を介して接地されてい
るため、断線検出用信号S1は「ローレベル(Lレベ
ル)」になっている(図3(c)参照)。Disconnection detecting circuit 2 before disconnection K1 occurs
In the state 2 (normal state), as shown in FIG. 3A, the buffer circuit 24 is grounded via the detection wiring section 13, so that the disconnection detection signal S1 is "low level (L level). ) "(See FIG. 3C).
【0021】そして、断線が発生した場合(断線時)、
図3(b)に示す様に、バッファ回路24は接地されな
くなり、バッファ回路24には、プルアップ抵抗器23
を介して上記図示しない電源からの信号が入力される。
従って、断線検出信号S1は正常時のLレベルよりも高
い値を持った「ハイレベル(Hレベル)」になり、この
Hレベル信号の発生により断線が検出できることとな
る。When a disconnection occurs (at the time of disconnection),
As shown in FIG. 3B, the buffer circuit 24 is no longer grounded, and the buffer circuit 24 includes a pull-up resistor 23.
Via the power supply (not shown).
Accordingly, the disconnection detection signal S1 becomes a "high level (H level)" having a value higher than the normal L level, and the disconnection can be detected by the generation of the H level signal.
【0022】以上のように、本実施形態によれば、フレ
キシブル配線基板10の本体基板11にダミー配線とし
ての検出用配線部13を形成し、プリント基板(回路基
板)20に検出用配線部13が断線したときの信号を発
生する断線検出回路(断線信号発生回路手段)22を形
成するだけの簡易な構成により、検出用配線部13の断
線を利用してフレキシブル配線基板10の断線検出を行
うことができる。As described above, according to the present embodiment, the detection wiring section 13 as a dummy wiring is formed on the main board 11 of the flexible wiring board 10, and the detection wiring section 13 is formed on the printed board (circuit board) 20. With the simple structure of simply forming a disconnection detection circuit (disconnection signal generation circuit means) 22 that generates a signal when a disconnection occurs, the disconnection of the flexible wiring board 10 is detected using the disconnection of the detection wiring unit 13. be able to.
【0023】フレキシブル配線基板10における検出用
配線部13の形成位置は、断線が発生しやすい位置に形
成すれば良く、特に、本体基板11のどこに形成しなけ
ればならないと言うものではない。しかし、通常は、断
線は本体基板11の周辺部(端部)の方から発生しやす
いため、本実施形態のように、検出用配線部13を、本
体基板11の周辺部にて信号用配線部12を囲うように
形成することが好ましい。それにより、確実な断線検出
が可能となる。The formation position of the detection wiring portion 13 on the flexible wiring board 10 may be formed at a position where disconnection is likely to occur, and in particular, it does not have to be formed anywhere on the main body substrate 11. However, usually, the disconnection is likely to occur from the peripheral portion (edge) of the main body substrate 11. Therefore, as in the present embodiment, the detection wiring portion 13 is connected to the signal It is preferable to form so as to surround the portion 12. Thereby, reliable disconnection detection becomes possible.
【0024】また、本実施形態では、本体基板11に信
号用配線部12とは独立した検出用配線部13を形成し
てなることを特徴としたフレキシブル配線基板10が提
供され、この配線基板10は、図1に示した接続構造に
用いて好適なものである。なお、断線検出回路22は、
検出用配線部13の正常時と断線時との信号を電気的に
検出できるものであればよく、その構成は上記例に限定
されるものではない。Further, in the present embodiment, there is provided a flexible wiring board 10 characterized in that a detection wiring section 13 independent of a signal wiring section 12 is formed on a main board 11. Is suitable for use in the connection structure shown in FIG. Note that the disconnection detection circuit 22 includes:
The configuration is not limited to the above example as long as it can electrically detect signals when the detection wiring section 13 is normal and when it is disconnected.
【図1】本発明の実施形態に係るフレキシブル配線基板
の回路基板への接続構造を示す説明図である。FIG. 1 is an explanatory diagram showing a connection structure of a flexible wiring board to a circuit board according to an embodiment of the present invention.
【図2】フレキシブル配線基板が断線した場合の様子を
示す図である。FIG. 2 is a diagram illustrating a state in which a flexible wiring board is disconnected.
【図3】上記実施形態の作用を示す説明図である。FIG. 3 is an explanatory diagram showing an operation of the embodiment.
10…フレキシブル配線基板、11…本体基板、12…
信号用配線部、13…検出用配線部、20…プリント基
板、22…断線検出回路。10: flexible wiring board, 11: body board, 12 ...
Signal wiring section, 13: detection wiring section, 20: printed circuit board, 22: disconnection detection circuit.
Claims (4)
1)及びこの本体基板に形成された信号用配線部(1
2)を有するフレキシブル配線基板(10)を、回路基
板(20)に接続してなる接続構造において、 前記本体基板には前記信号用配線部とは独立した検出用
配線部(13)が形成されており、 前記回路基板には、前記検出用配線部が断線したときの
信号を発生する断線信号発生回路手段(22)が形成さ
れていることを特徴とするフレキシブル配線基板の回路
基板への接続構造。An insulative body substrate (1) having flexibility.
1) and the signal wiring portion (1) formed on the main body substrate.
In the connection structure in which the flexible wiring board (10) having the configuration (2) is connected to the circuit board (20), the detection wiring part (13) independent of the signal wiring part is formed on the main body substrate. Connecting the flexible wiring board to the circuit board, wherein the circuit board is provided with a disconnection signal generation circuit means (22) for generating a signal when the detection wiring section is disconnected. Construction.
基板(11)の周辺部にて前記信号用配線部(12)を
囲うように形成されていることを特徴とする請求項1に
記載のフレキシブル配線基板の回路基板への接続構造。2. The detection wiring portion (13) is formed so as to surround the signal wiring portion (12) at a peripheral portion of the main body substrate (11). Connection structure for connecting a flexible wiring board to a circuit board according to the above.
基板に形成された信号用配線部(12)を有するフレキ
シブル配線基板であって、 前記本体基板には前記信号用配線部とは独立した検出用
配線部(13)が形成されていることを特徴とするフレ
キシブル配線基板。3. A flexible wiring board which is used for connecting circuit boards and has a flexible insulating main body substrate (11) and a signal wiring portion (12) formed on the main body substrate. A flexible wiring board, wherein a detection wiring part (13) independent of the signal wiring part is formed on the main body substrate.
基板(11)の周辺部にて前記信号用配線部(12)を
囲うように形成されていることを特徴とする請求項3に
記載のフレキシブル配線基板。4. The detection wiring section (13) is formed so as to surround the signal wiring section (12) at a peripheral portion of the main body substrate (11). The flexible wiring board according to the above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000046800A JP2001230504A (en) | 2000-02-18 | 2000-02-18 | Flexible wiring board and its connection structure to circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000046800A JP2001230504A (en) | 2000-02-18 | 2000-02-18 | Flexible wiring board and its connection structure to circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2001230504A true JP2001230504A (en) | 2001-08-24 |
Family
ID=18569151
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000046800A Withdrawn JP2001230504A (en) | 2000-02-18 | 2000-02-18 | Flexible wiring board and its connection structure to circuit board |
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Country | Link |
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JP (1) | JP2001230504A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006019405A (en) * | 2004-06-30 | 2006-01-19 | Fanuc Ltd | Printed wiring board |
JP2008107863A (en) * | 2006-10-23 | 2008-05-08 | Toshiba Tec Corp | Portable terminal |
JP2010214528A (en) * | 2009-03-17 | 2010-09-30 | Denso Wave Inc | Wiring device for rotary joint of robot |
JP2010214529A (en) * | 2009-03-17 | 2010-09-30 | Denso Wave Inc | Wiring device for rotary joint of robot |
WO2011065010A1 (en) * | 2009-11-27 | 2011-06-03 | パナソニック株式会社 | Substrate and mobile terminal device |
JP5615282B2 (en) * | 2009-09-24 | 2014-10-29 | 株式会社東芝 | Electronic device and damage detection method |
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JP2011114658A (en) * | 2009-11-27 | 2011-06-09 | Panasonic Corp | Portable terminal |
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