JP2001228371A - Optical module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical module with built-in a small-sized, high density mountable and excellent productivity electric circuit, having a stable optical characteristic. SOLUTION: By finally integrating an optical module part 1 and an electric circuit module 2 separately packaged and characteristic valuated, the stable characteristic is obtained without that heat generation of a semiconductor element, etc., of the electric circuit module part affects an optical system of the optical module part 1. Further, by incorporating the electric circuit in the optical module, the optical module containing the electric circuit becomes miniaturized/ high density mountable. Further, by combining various constitution of optical module part 1 and various constitution of electric circuit module part 2, various modules are obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical module, and more particularly to an optical module having a built-in electric circuit in consideration of heat radiation characteristics of an electric circuit section and an optical section.

[0002]

2. Description of the Related Art In an optical communication using an optical fiber, an optical module converts an electric signal into an optical signal and transmits the same through an optical fiber, or converts an optical signal transmitted through an optical fiber into an electric signal. Used to convert. Conventionally,
This type of optical module is disclosed in, for example, "1999 IEICE General Conference" B-10-76.
It is used for the purpose of high-density mounting by downsizing an optical module including an electric circuit and improving characteristics of the optical module.

FIG. 18 is a partial sectional view of a conventional optical module. This conventional optical module 1r includes a semiconductor optical element 3n and an LSI in an optical module package 8j.
(Semiconductor integrated circuit) Subcarrier 5h on which 16f is mounted
Is implemented with high precision. Further, one end of the semiconductor optical element 3n and one end of the optical fiber 4j are fixed in an optical coupling relationship to form an optical system. Further, an electric circuit 15d is formed by the LSI 16f and the electric circuit component 17d mounted on the external mounting board 35. In the optical module 1r, the LSI 16f in the electric circuit 15d is built in the optical module 1r to reduce the size, and the mounting density of the optical module 1r on the mounting board 35 is increased. Further, by mounting the LSI 16f in the vicinity of the semiconductor light receiving element 3n, deterioration of characteristics due to long wiring is improved.

Next, the operation of the optical module 1r will be described. First, the optical signal transmitted by the optical fiber 4j is
The light is coupled to the semiconductor optical device 3n and converted into an electric signal by the semiconductor optical device 3n. The electric signal is amplified by the LSI 16f, and is mounted on the mounting substrate 3 by the module terminal 34.
5 is transmitted to the electric circuit. At this time, the LSI 16f
Is an electric circuit component 1 arranged outside the optical module 1r.
It can be driven by an electric circuit 15d including 7d. The electric circuit 15d including the external electric circuit component 17d includes a circuit pattern provided on the mounting board 35 and the module terminals 34,
The wiring board 7i is connected to the LSI 16f.

[0005]

The above-mentioned conventional optical module has the following problems. First, the operation of the semiconductor optical device is unstable and optical characteristics are deteriorated. The reason is that the heating temperature at the time of driving the LSI adversely affects the driving of the semiconductor optical device having temperature characteristics and causes thermal expansion in the mounting portion of the semiconductor optical device,
This is because an optical axis shift occurs with the optical fiber. This is because the LSI is mounted inside the optical module and is arranged near the semiconductor optical device, so that the semiconductor optical device and the subcarriers on which the semiconductor optical device is mounted directly receive the heat of the LSI.

Second, the mounting density of the conventional optical module cannot be sufficiently increased. Therefore, it is difficult to reduce the size of the device. The reason is that in an optical module including a conventional electric circuit, an electric circuit composed of electric circuit components is provided outside the optical module when mounted on a mounting board. This is because a mounting space is required.

Third, in the conventional optical module, the production yield is poor. The reason for this is that both optical and electrical characteristics are required, and the sensitivity characteristics of light and other problems caused by manufacturing caused by variations in optical axis adjustment of semiconductor optical elements and optical fibers that are key devices of optical modules, This is because variations in electrical characteristics and other defects caused by manufacturing, that is, if a defect occurs in one of the optical portion and the electric portion, the other also causes a defect. In addition, since the combination of the optical characteristics and the electrical characteristics cannot be selected, some of the combined product standards have not been reached.

Fourth, in the conventional optical module, dedicated manufacturing equipment is required for each different optical system and electric circuit configuration, and equipment investment is required for each product. The reason is that designing a package in consideration of both light and electricity requires exclusive design of the package, and requires equipment corresponding to the design.

[0009]

SUMMARY OF THE INVENTION It is an object of the present invention to provide an optical module which has stable optical characteristics, can be mounted in a small size and high density, has excellent mass productivity, and can cope with various specifications by a common production facility. It is to be.

[0010]

According to the optical module of the present invention, an electric circuit module for transmitting an electric signal is integrated with an optical module for transmitting an optical signal via an optical fiber together with a heat radiating member, and an electric and optical module is provided. It has both characteristics.

According to the preferred embodiment of the present invention, the optical module section and the electric circuit module section are selected from a plurality of different configurations and are combined and integrated. By stacking the electric circuit module unit and the optical module unit on each other, the mounting density on the mounting board is increased. Further, the engineering system of the optical module section and the semiconductor integrated circuit of the electric circuit module section are arranged in electrical connection and thermal connection. The optical module unit and the electric circuit module unit are individually manufactured, and after performing comprehensive characteristic evaluations, non-defective products are integrated. Further, the optical module terminal of the optical module section and the terminal mounting section of the electric circuit module section are provided at the same position, and the shapes of the optical module section and the electric circuit module section are unified.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The construction and operation of various embodiments of an optical module according to the present invention will be described below in detail with reference to FIGS.

FIG. 1 is a partial sectional view showing the structure of an optical module according to a first embodiment of the present invention. The optical module according to the first embodiment has a shape in which an optical module 1 for transmitting an optical signal is superimposed on an electric circuit module 2 for transmitting an electric signal. According to this optical module, all forms of the optical module unit 1 and the electric circuit module unit 2 can be considered. Here, the receiving module will be described as an example. In the optical module section 1, a subcarrier 5 on which the semiconductor optical element 3 is mounted in an optical module package 8 is mounted with high precision, and the optical fiber 4 is fixed in an optical coupling relationship with the semiconductor optical element 3 to form an optical system. are doing. The inside of the optical module 1 is sealed with a package cover 13. The subcarrier 5 includes a mounting base substrate 6 on which the semiconductor optical device 3 is mounted and which can be mounted on the optical module package 8, and a wiring substrate 7 which enables wiring connection between the semiconductor optical device 3 and the optical module package 8.

The optical module package 8 is formed of an optical package base substrate 9 on which the subcarrier 5 is mounted, an optical package ring 10 forming a side surface, and an optical module terminal 11 enabling connection of the electric circuit module section 2. More specifically, the optical package base substrate 9 is formed with an optical module terminal hole 901 for enabling the optical module terminal 11 as an external terminal. Further, the optical module terminal 11 is fixed to the optical package base substrate 9 by an insulating material 12 for insulating the optical module terminal 8 from the optical module package 8. Optical package ring 1
0 is provided with a fiber insertion hole 1001 for inserting the optical fiber 4. The semiconductor optical device 3 and the wiring board 7 of the subcarrier 5 are electrically connected by bonding wires 100, and are further connected to the wiring board 7 of the subcarrier 5.
And optical module terminal 11 of optical module package 8
Are electrically connected by a bonding wire 101.

Next, the electric circuit module section 2 will be described. An electric circuit 15 for driving the semiconductor optical device 3 is formed in the electric circuit module package 18. The electric circuit 15 is an electric circuit module package 1
8, an LSI 16, and an electric circuit component 17. The electric circuit module package 18 includes an electric circuit package base substrate 19 for forming the electric circuit 15 and an LS
An LSI mounting block 20 for mounting I16, a heat sink 21 that is thermally coupled to the LSI mounting block 20, an electric circuit package ring 22 which is a side surface of the electric circuit module package 18 and is a connection portion with the optical module 1, and an electric circuit for the outside. Circuit module terminal 2 that enables electrical connection
Contains three. More specifically, in the electric circuit package base substrate 19, the optical module terminal hole 1 that enables electrical connection with the optical module terminal 11 of the optical module unit 1 is provided.
901 are provided. The LSI 16 and the electric circuit package base substrate 19 are formed by bonding wires 200
Are electrically connected to each other. After assembling these modules, the optical module section 1 and the electric circuit module section 2 join the back surface of the optical package base substrate 9 and the sealing surface of the electric circuit package ring 22 and form the optical module terminal 11 and the back surface of the electric circuit package base substrate 19. The pattern is electrically connected and fixed by the fixing member 14 to be integrated.

Next, the operation of the optical module according to the first embodiment of the present invention shown in FIG. 1 will be described. The optical signal sent from the optical fiber 4 is coupled to the semiconductor optical device 3,
The light is converted into an electric signal by the semiconductor optical element 3. The electric signal is sent from the semiconductor optical element 3 to the wiring substrate 7 of the subcarrier 5 via the bonding wire 100 and sent to the optical module terminal 11 of the optical package 8 via the bonding wire 101. Further, the electric signal is sent to the back surface pattern of the electric circuit package base substrate 19 via the fixing member 14. Next, the electric signal is transmitted from the electric circuit package base substrate 19 to the bonding wire 200.
Is sent to the input pad of the LSI 16 via the input wire. This electric signal is amplified by the LSI 16 and sent from the output pad to the electric circuit package base substrate 19 via the output wire of the bonding wire 200. At this time, the LSI 16 is driven by the electric circuit 15 including the electric circuit component 17. The electric signal is sent from the electric circuit package base substrate 19 to the electric circuit module terminal 23 electrically connected. Further, the signal is sent from the terminal 23 to the reception signal circuit of the mounting board.

Next, one of the objects of the present invention, the LSI 1
The heat flow of No. 6 will be described. In an optical module incorporating the LSI 16 serving as a heat source, the operation of the semiconductor optical element 3 which is most susceptible to the influence of heat and the optical axis shift of the optical module 1 are concerned, and this heat is prevented from entering the optical module 1. It is important to make Here, a description will be given with reference to FIG. 2 which is an enlarged view of a part A in FIG. When the LSI 16 is driven, the LSI 16 generates heat. This heat mainly passes through the LSI mounting block 20 forming the heat dissipation path and becomes heat dissipation 302 from the heat sink 21 to the outside of the electric circuit module portion 2 as shown by the heat path 301. On the other hand, the heat path 300 flowing above the LSI 16 flows from the LSI 16 to the optical package base substrate 9 via the air layer. The optical package base substrate 9 blocks this heat from entering the optical system. Thus, an optical module that performs optical transmission and has a built-in electric circuit can be realized.

FIG. 3 is an assembled perspective view of the first embodiment of the optical module according to the present invention. In this optical module, the optical module 1a and the electric circuit module 2a, each of which has been subjected to the characteristic test, are integrally formed.
This makes it possible to eliminate defects in optical characteristics and defects in electrical characteristics individually and combine only non-defective products. Therefore, it is possible to avoid inconvenience of the entire optical module after assembly, and to improve the yield. Also, by unifying the external dimensions on the combined surface of the optical module unit 1a and the electric circuit module unit 2a, modules for various applications can be obtained.

Next, a specific example of the optical module of the present invention will be described in detail. First, the optical module 1 will be described.
The semiconductor optical element 3 converts an optical signal into an electric signal (OE
A light receiving element having a function of performing the conversion is applied. For example, a pin (PIN) photodiode, an avalanche
There are photodiodes and the like. It is preferable that a countermeasure against the reflected light from the air layer is taken on the optical fiber 4 by polishing the end face and applying an anti-reflection film to prevent the deterioration of the optical characteristics due to the reflected light. Also, the optical module package 8
It is preferable to provide a protection component at the introduction portion of the optical fiber, because damage to the optical fiber 4 due to an accident during handling can be prevented. When a conductive metal is used as the subcarrier 5 for the mounting base substrate 6 which is a bonding portion between the semiconductor optical device 3 mounting portion and the optical module package 8, the GND of the semiconductor optical device 3 and the optical module package 8 is strengthened. Is also preferable because the effect of improving characteristics can be obtained at the same time. As a specific example, Kovar is suitable because processing is easy, finishing accuracy is good, and joining with other parts is easy. On the other hand, the wiring board 7 is preferably made of an insulator such as ceramic capable of forming a plating pattern. Ceramics are easy to form, have a multi-layered wiring pattern configuration, and are inexpensive.
Furthermore, since the thermal expansion coefficient is close to that of Kovar used for the mounting base substrate 6, problems such as separation from the mounting base substrate 6 due to heat and cracks are prevented.

The material of the optical module package 8 is the same as that of the subcarrier 5, and is made of an optical package base substrate 9, an optical package ring 10, and an optical module terminal 1.
Kovar 1 is preferably Kovar because the optical module terminal hole 901 and the fiber hole 1001 can be finished with high precision. The insulating material 12, which is a bonding portion between the optical module terminal 11 and the optical package base substrate 9, is preferably an insulating fixing material because it can not only insulate the two but also provide a fixing effect. In particular, in addition to insulation and fixing, fixing with low-melting glass is preferable in order to prevent airtight leakage inside the optical module 1. The optical module terminals 11 can be added not only for signals but also for GND (grounding) with the electric circuit module 2. However, a conductive fixing agent such as a silver brazing material is preferable in the portion of the insulating material 12 because not only the fixing but also the common GND with the optical package 8 is enabled.
Further, it is preferable to apply gold plating to the external appearance of the optical module package 8 for corrosion prevention. In addition, a conductive metal such as Kovar is particularly preferable as the material of the package cover 13 because an effect of strengthening the GND of the optical module 1 can be obtained. For connection with the optical module package 8, the same material as that of the optical module package 8 is optimal. In addition, as a material of the bonding wires 100 and 101, electrical connection between the semiconductor optical element 3 to be wired and the wiring substrate 7 of the subcarrier 5 or electrical connection between the wiring substrate 7 and the optical module terminal 11 is performed. A conductive metal having a small connection area is preferable. The diameter of the wiring pad of the semiconductor optical element 3 is about φ50 to 100 μm. for that reason,
The connection area must be smaller than this diameter. More specifically, a gold wire having a diameter of about 30 μm or less is preferable because it is excellent in wiring, excellent in corrosion resistance, and optimal for electrical connectivity.

Next, the method of construction will be described. The mounting of the semiconductor optical element 3 on the subcarrier 5 also provides an electrical connection effect with the subcarrier 5, and therefore, a conductive fixing material such as a high melting point solder or a silver-containing adhesive is particularly preferable. This allows
The shift is prevented by the thermal manufacturing history of the optical module unit 1.
Since the mounting of the subcarrier 5 on the optical module package 8 has a high fixing strength and an electrical connection effect, it is particularly preferable to fix the subcarrier 5 by welding such as YAG laser welding.
Solder fixing or adhesive fixing may be used. Thereby, it can be fixed instantly after the optical axis adjustment.

Optical module package 8 of optical fiber 4
As for the mounting on the substrate, the fixing by the YAG laser welding is optimal as described above. At this time, it is necessary to provide the optical fiber 4 with a metal protection component capable of YAG laser welding.
This not only enables welding, but also has an effect of preventing damage to the optical fiber 4 due to welding. The joining of the protective component to the optical fiber 4 is preferably performed using a fixing member having an airtight effect for airtightly sealing the inside of the optical module 1. Package cover 1
The mounting of the optical module 3 on the optical module package 8 is preferably performed by welding in terms of fixing strength and electrical connection. In particular, seam welding is optimal in terms of hermeticity and sealing effect. Other examples include sealing by YAG laser welding, solder sealing, adhesive sealing, and resin sealing.

Next, the electric circuit module section 2 will be described. A pre-amplifier, a post-amplifier, a receiver amplifier, and the like for amplifying an input electric signal are applied to the LSI 16. The electric circuit component 17 includes a capacitor, a resistor,
There are coils and transistors. The numbers and combinations of these differ depending on the electric circuit 15 and the LSI 16. As a material configuration of the electric circuit module package 18, the electric circuit package base substrate 19 is preferably made of an insulator that can be plated. This is because the plating pattern is insulated in portions requiring electrical connection, and the other portions are insulated. In particular, ceramics are preferred from the viewpoints of workability, a multi-layer wiring pattern configuration, and economy.

On the other hand, the LSI mounting block 20 and the heat sink 21 are provided with not only the characteristic improvement by strengthening the GND of the LSI 16 to be mounted but also the heat radiation characteristic effect.
A conductive metal having high thermal conductivity such as copper tungsten is preferable. Further, the electric circuit package ring 22 is preferably made of a conductive metal such as Kovar, which is excellent in joining properties such as welding and workability. As a result, the effect of improving the characteristics by connecting the optical module unit 1 and strengthening the GND between the optical module unit 1 and the electric circuit 15 can be obtained at the same time. Also, Kovar is appropriate for the material of the electric circuit module terminals 23. Accordingly, the ceramic used for the electric circuit package base substrate 19 and the copper tungsten used for the LSI mounting block 20 and the heat sink 21 and the Kovar used for the electric circuit package ring 22 and the electric circuit module terminal 23 have a similar coefficient of thermal expansion. Therefore, destruction of the electric circuit module package 18 such as peeling or cracking between members due to heat can be prevented. Here, the electric circuit module terminals 23 can be applied to any of the four side surfaces of the electric circuit package base substrate 19 according to the mounting direction and the terminal shape. Furthermore, electric circuit module terminals 23 can be provided on a plurality of surfaces depending on the circuit configuration.

The material of the bonding wire 200 is preferably a conductive metal having a small connection area in order to electrically connect the LSI 16 to be wired and the electric circuit package base substrate 9 of the electric circuit module package 18. Further, since the wiring pad of the LSI 16 has a square shape of about 120 μm, the connection area needs to be smaller than this area.
A gold wire of μm or less is appropriate. However, when the wiring pad of the LSI 16 is made of an aluminum alloy, an aluminum wire is optimal. In this case, it is necessary to protect the bonding wire 200 to prevent corrosion due to oxidation. For example, the entire electric circuit module 2 is sealed with nitrogen, or the bonding wire 200 is covered with a silicon-based resin. Next, the method of construction will be described. For mounting the LSI 16 on the electric circuit package 18, a conductive fixing material is preferable. This is because an electrical connection effect with the electric circuit package 18 is also obtained. In particular, solder fixing having a high melting point or an adhesive containing silver is suitable. For mounting the electric circuit component 17 on the electric circuit package 18, a conductive fixing material such as solder or an adhesive containing silver is preferable.

Next, the integration of the optical module 1 and the electric circuit module 2 will be described. For the connection between the optical module 1 and the electric circuit module 2, YAG laser welding and fixing are particularly preferable in terms of fixing strength and electric connection.
Thereby, it can be fixed instantly after the optical axis adjustment. The fixing member 14 used for connecting the optical module terminal 11 of the optical module section 1 to the electric circuit package base substrate 19 of the electric circuit module section 2 is a conductive fixing material such as solder and silver-containing adhesive or a mechanical fixing member. A preferred contact fixation is preferred. In the case of making mechanical contact, it is necessary to take measures such as screwing the optical module terminal 11 or fitting a conductive metal ring.

An improvement in productivity, which is one of the objects of the present invention, will be described with reference to FIG. The plurality of optical module sections 1a, 1b,..., 1n and the plurality of electric circuit module sections 2a, 2b,. Therefore, there are n × n combinations of the optical module unit 1 and the electric circuit module unit 2. For example, when n = 2, the optical module 1a and the electric circuit module 2
If there is a defect in b, the number of non-defective products is zero because the combination is invariable in the conventional package integrated type. However, according to the present invention, a non-defective product can be manufactured by integrating the optical module 1b and the electric circuit module 2a. Also, the light receiving sensitivity of the optical module 1a and the amplification characteristics of the electric circuit module 2 are slightly lower than the standard,
If the light receiving sensitivity of the optical module 1b and the amplification characteristics of the electric circuit module 2b have a margin with respect to the standard, two good products can be obtained by combining them.

FIG. 4 is a mounting perspective view of a first embodiment of the optical module according to the present invention. By unifying the outer shape of the electric circuit module unit 2, the optical module unit 1c is different from the electric circuit module units 2c, 2d, 2e, 2f, and 2g in external terminal shape and circuit type, regardless of the substrate to be mounted and the usage. Can be integrated with any of the above. In addition, mass production can be achieved due to the common use of the manufacturing equipment and the common use of the optical module unit 1c, and the cost can be reduced. It should be noted that the present invention is not limited to each of the embodiments, and it is apparent that the present invention can be appropriately modified within the scope of the technical idea of the present invention.

[0029]

Next, a second embodiment of the optical module according to the present invention will be described with reference to a partial sectional view shown in FIG. 5, focusing on the differences from the first embodiment described above. (The same applies to the third embodiment and subsequent embodiments described later). The optical module package 8a of the optical module unit 1d of the second embodiment includes a heat insulating material 24 in the optical package base substrate 9a to absorb heat.
Further, the electric circuit package 18a of the electric circuit module section 2h includes a heat sink 21a formed in a fin shape.

Next, the operation of the second embodiment of the optical module shown in FIG. 5 will be described. When driving the LSI 16a,
The LSI 16a generates heat. This heat is mainly due to heat path 301
a through the LSI mounting block 20a that forms the heat-dissipating path shown in FIG. 3a, heat is discharged from the fin-shaped heat sink 21a to the outside of the electric circuit module unit 2h.
2a results. On the other hand, the heat path 3 above the LSI 16a
00a flows from the LSI 16a toward the optical package base substrate 9a via the air layer. This heat is blocked by the optical package base substrate 9a. Furthermore, heat passing through the optical package base substrate 9a is absorbed and blocked by the heat insulating material 24, so that an optical module that is prevented from entering the optical system including the semiconductor optical element 3a can be realized. This insulation 2
4 is preferably a substance having low thermal conductivity such as polystyrene. By making the shape of the heat sink 21a fin-shaped, the heat radiation characteristics can be further improved. In this case, the number, shape and direction of the fins are not limited to the specific example shown in FIG. 5, and can be changed as needed.

Next, a third embodiment of the optical module according to the present invention will be described with reference to the partial sectional view of FIG. In the optical module 1e, a subcarrier 5a having a semiconductor optical element 3b and a semiconductor optical element 3c whose optical axis is adjusted with the semiconductor optical element 3b is mounted in an optical module package 8b with high accuracy. Further, the semiconductor optical device 3c is provided on the opposite surface of the semiconductor optical device 3c.
b and the optical fiber 4a whose optical axis is adjusted are fixed to form an optical system. Semiconductor optical device 3a and subcarrier 5a
Are electrically connected by bonding wires 100a. The semiconductor optical element 3b and the wiring board 7a are electrically connected by bonding wires 100b. Further, the wiring board 7a of the subcarrier 5a and the optical module terminal 11a of the optical module package 8b
Are electrically connected to the corresponding optical module terminals 11a by the wires for the semiconductor optical element 3b and the wires for the semiconductor optical element 3c of the bonding wire 101a. Describing the electric circuit module section 2i, an electric circuit 15a for driving the semiconductor optical elements 3b and 3c is formed in the electric circuit module package 18b. The electric circuit 15a includes an electric circuit module package 18b,
An LSI 16b and an electric circuit component 17a are included. LSI 16b and electric circuit package base substrate 19
a is electrically connected by a bonding wire 200a.

Next, the operation of the third embodiment of the optical module shown in FIG. 6 will be described. The electric signal sent from the outside is sent from the input terminal of the electric circuit module terminal 23b into the electric circuit module package 18b. This electric signal passes through the circuit wiring of the electric circuit package base board 19a from the electric circuit module terminal 23b, and passes through the input wire of the bonding wire 200a to the LSI.
16b is sent to the input terminal. At this time, the LSI 16b
Is driven by an electric circuit 15a including an electric circuit component 17a. When the LSI 16b is driven, the electric signal becomes L
From the output terminal of SI16b to the bonding wire 200a
Circuit package base substrate 1 through output wires of
9a. Further, it is sent into the optical module via the fixing member 14a and the optical module terminal 11a.
The electric signal passes through the wiring board 7a of the subcarrier 5a via the input wire for the semiconductor optical element 3a of the bonding wire 101a, and is sent to the semiconductor optical element 3b via the input wire of the bonding wire 100a. The electric signal is converted into an optical signal by the semiconductor optical device 3b. The converted optical signal is coupled to the optical fiber 4a from one end of the semiconductor optical element 3b and optically transmitted. In the figure, 9b indicates an optical package base substrate.

An optical signal from the other end of the semiconductor optical device 3b is coupled to the semiconductor optical device 3c. This optical signal is converted into an electric signal by the semiconductor optical element 3c, and is connected to the subcarrier 5a via the bonding wire 100b.
To the wiring board 7a. Further, it is sent to the electric circuit module 2i by the fixing member 14a through the semiconductor optical element 3c output terminal of the optical module terminal 11a via the semiconductor optical element 3c output wire of the bonding wire 101a. The electric signal passes through the wiring circuit of the electric circuit package base substrate 19a and passes through the bonding wire 200a.
Is sent to the monitor input terminal of the LSI 16b via the monitor input wire. By monitoring this electric signal, the LSI 16b is connected to the optical fiber 4 of the semiconductor optical element 3b.
The optical signal to a is controlled. In this case, since the semiconductor optical element 3b that converts an electric signal into an optical signal generates heat by driving itself, an optical monitor using the semiconductor optical element 3c is indispensable to stabilize a characteristic that changes according to a temperature characteristic.

As the semiconductor optical element 3b, a light emitting element for converting an electric signal into an optical signal (EO conversion) is used. Specifically, there are a laser diode, a Fabry-Perot type laser diode, a DFB laser diode, and the like. As the semiconductor optical element 3c, a light receiving element that converts an optical signal into an electric signal (OE conversion) is used. Specifically, there is a monitor photodiode. As the LSI 16b, a laser diode (LD) driver having a function of driving the semiconductor optical element 3b and a function of monitoring and controlling the optical output signal is used. Next, the method of construction will be described. The semiconductor optical elements 3b and 3c are mounted on the subcarrier 5a by using a conductive fixing material such as a high melting point solder or a silver-containing adhesive in order to make electrical connection with the subcarrier. Agents are preferred. Similarly, L
The mounting of the SI 16b to the electric circuit package 18b is also optimally fixed by soldering.

Next, an optical module according to a fourth embodiment of the present invention will be described with reference to the partial sectional view of FIG. The optical module part 1f includes a semiconductor optical element 3d and a subcarrier 5b having a semiconductor optical element 3d and a lens 25 for condensing light whose optical axis has been adjusted in an optical module package 8c.
Is implemented with high precision. Further, an optical system is formed by these and the optical fiber 4b whose optical axis is adjusted.

Next, the operation of the optical module shown in FIG.
This will be described using an example of a light receiving module. The optical signal sent by the optical fiber 4b is emitted from the optical fiber 4b to the air layer with a large radial spread. This optical signal is condensed by the lens 25 and coupled to the semiconductor optical device 3d. Using the lens 25, low-loss optical coupling is performed. This optical signal is converted into an electric signal by the semiconductor optical element 3d. The lens 25 includes a spherical lens, an aspherical lens, a rod lens, a selfoc lens and the like having a structure for condensing and combining light. As another example, it is also effective to use a spherical optical fiber in which the end surface of the optical fiber 4b has a lens structure. Subcarrier 5b of lens 25
It is preferable that the mounting is performed by YAG laser welding or the like in terms of strength. Thereby, it can be fixed instantly after the optical axis adjustment.

Next, a fifth embodiment of the optical module according to the present invention will be described with reference to the partial sectional view of FIG. The optical module 1g has a high subcarrier 5c in which an optical module package 8d is provided with semiconductor optical elements 3e and 3f, a lens 25a for condensing optical signals of the semiconductor optical element 3e, and an optical isolator 26 for cutting reflected return light. Implemented with precision. Further, an optical system is formed by the semiconductor optical element 3e and the optical fiber 4c whose optical axis has been adjusted.

The operation of the fifth embodiment of the optical module shown in FIG. 8 will be described using a light emitting module as an example. The semiconductor optical element 3e that has received the electric signal performs EO conversion, and the optical signal is emitted from both ends of the semiconductor optical element 3e. The optical signal emitted from the rear surface is coupled to the semiconductor optical device 3f and
-E converted. With this electric signal, the semiconductor optical device 3
e emits a stable optical signal which is monitor-controlled. on the other hand,
The optical signal emitted from the front surface is condensed by the lens 25a, coupled to the optical fiber 4c, and optically transmitted by the optical fiber 4c. At this time, an optical isolator 26 is provided between the lens 25a and the optical fiber 4c, and cuts off the reflected return light from the optical fiber 4c to prevent the characteristic deterioration of the semiconductor optical element 3e. The mounting of the optical isolator 26 on the subcarrier 5c is preferably fixed by YAG laser welding in terms of strength. Thereby, it can be fixed instantly after the optical axis adjustment.

Next, a sixth embodiment of the optical module according to the present invention will be described with reference to the partial sectional view of FIG. In the optical module section 1h, a grooved substrate 27 having a semiconductor optical element 3g mounted in an optical module package 8e is mounted with high precision. Further, on the grooved substrate 27, an optical system is formed by the semiconductor optical element 3g and the optical fiber 4d whose optical axis is adjusted. The optical fiber 4d is positioned by a groove dug in the grooved substrate 27 with high precision, and is fixed by the grooved substrate 28 from above. Grooved substrate 27
Is formed with a V-shaped groove for positioning the optical fiber 4d with high precision, and a wiring pattern for enabling a wiring connection between the semiconductor optical element 3g and the optical module terminal 11b is provided. An optical fiber 4d is provided on the grooved substrate 28.
, A highly accurate positioning groove is formed. The wiring pattern of the semiconductor optical element 3g and the grooved substrate 27 is electrically connected by the bonding wire 100c, and the wiring pattern of the grooved substrate 27 and the optical module terminal 11b are electrically connected by the bonding wire 101b. I have.

Next, the operation of the optical module shown in FIG.
The light receiving module will be described as an example. The optical signal transmitted by the optical fiber 4d is coupled from the optical fiber 4d to the semiconductor optical device 3g. The optical signal is OE converted by the semiconductor optical device 3g, passes through the wiring pattern of the grooved substrate 27 via the bonding wire 100c, and further passes through the optical module terminal 11 via the bonding wire 101b.
b. This enables electrical connection to the electrical circuit module. On the grooved substrates 27 and 28,
The optical fiber 4d is mechanically mounted, and the semiconductor optical device 3g
Therefore, a material that can be processed with high precision, such as silicon, which can be processed and plated in submicron units, is preferable. The processing of this optical module will be described. For mounting the grooved substrate 28 on the optical module package 8e, it is desirable to use a high melting point solder and use a solder or silver-containing adhesive. When solder or silver-containing adhesive is used, it is necessary to apply plating to the back surface of the grooved substrate 27 as well. Optical fiber 4 with grooved substrates 27 and 28
Also for the fixing of d, the above-mentioned high melting point soldering is desirable.
Also in this case, it is necessary to plate the fixed surfaces of both the grooved substrates 27 and 28 with plating.

Next, an optical module according to a seventh embodiment of the present invention will be described with reference to the partial sectional view of FIG. The optical module unit 1i includes a semiconductor optical element 3h and a lens 2 having a structure for condensing light in an optical module package 8f.
The subcarrier 5d on which the 5b is mounted is mounted with high accuracy. Further, an optical system is formed by the semiconductor optical element 3h and the optical fiber 4e whose optical axis has been adjusted. Optical fiber 4e
Has a ring-shaped optical fiber support 29 capable of adjusting the optical axis over a wider range. An optical fiber hole 1001a is formed in a pipe shape in the optical package ring 10a, which is an optical fiber 4e introduction portion of the optical module package 8f. Further, a glass 3 for hermetically sealing the inside of the optical module package 8f.
0 is provided.

Next, the operation of the optical module shown in FIG. 10 will be described using a light receiving module as an example. Optical fiber 4
The optical signal from e is collected by the lens 25b, coupled to the semiconductor optical element 3h, and subjected to OE conversion. At this time,
The optical fiber 4e performs an optical axis in a wide range by the fiber support 29 and the optical fiber hole 1001a formed in a pipe shape of the optical module package 8f, and high-efficiency coupling is possible. The material of the fiber support 29 is preferably a metal such as stainless steel from the viewpoints of strength and a function of protecting the optical fiber 4e, easiness of processing and easiness of welding. This allows high-precision YAG to be fixed instantly after the optical axis
Laser welding becomes possible. Optical module package 8f
As for the material of the optical fiber hole 1001a, Kovar is appropriate similarly to the base part of the optical module package of the first embodiment described above. As the glass 30 of the optical module package, it is preferable to use sapphire glass excellent in workability. Further, it is preferable to form antireflection curtains on both end surfaces in order to prevent deterioration of optical characteristics due to reflected light.
Explaining the construction method, the connection of the fiber support 29 to the optical fiber hole 1001a is preferably fixed by YAG laser welding in terms of strength and the like. Thereby, it can be fixed instantly after the optical axis adjustment. In addition, there are solder fixing and adhesive fixing.

Next, an eighth embodiment of the optical module according to the present invention will be described with reference to the partial sectional view of FIG.
In the optical module section 1j, a subcarrier 5e having a semiconductor optical element 3i mounted in an optical module package 8g is mounted with high accuracy. Further, an optical system is formed by the optical fiber 4f and the optical fiber 4g whose optical axis is adjusted. The optical module package 8g is provided with two optical fiber holes 10 on opposite sides of the optical package ring 10b.
01b and 1001c.

Next, the operation of the optical module shown in FIG. 11 will be described using an optical switch module as an example. The optical signal sent by the optical fiber 4f is coupled to the semiconductor optical device 3i. The combined optical signal is output from the semiconductor optical device 3
It becomes an optical signal amplified by i and is coupled to the optical fiber 4g. At this time, the semiconductor optical element 3i amplifies or blocks the optical signal from the optical fiber 4f by the electric circuit module 2h, and drives the optical switch. Next, the connection between the semiconductor optical device 3i and the electric circuit module unit 2h will be described with reference to FIG. 12, which shows a cross-sectional view taken along line BB 'of FIG. The driving electric signal from the electric circuit module unit 2h is transmitted to the optical module terminal 1 of the optical module package 8g.
1c and the bonding wire 1c from the wiring board 7b of the subcarrier 5e via the bonding wire 101c.
00d to the semiconductor optical device 3i. As the semiconductor optical element 3i, an optical switching element such as a semiconductor amplifier gate (SOAG) element is used.

Next, a ninth embodiment of the optical module according to the present invention will be described with reference to the partial sectional view of FIG.
Although various forms of the optical module are conceivable, an example of the transmitting / receiving module will be described here. In the optical module section 1k, a subcarrier 5f on which the semiconductor optical elements 3j, 3k, 31 and the optical waveguide substrate 31 are mounted in the optical module package 8h is mounted with high accuracy. Further, an optical system is formed by this and the optical fiber 4h whose optical axis is adjusted. The waveguide substrate 31 has a Y-branch structure, and includes one port on one side and two ports on the opposite side. To facilitate coupling with the optical fiber 4h, a V-shaped groove for positioning the optical fiber is formed. Electric circuit module 2
i includes the electric circuit 15b and the electric circuit 15c. The electric circuit 15c includes an LSI 16c having a function of amplifying an electric signal from the semiconductor optical element 3k and an electric circuit component 17b forming a circuit. Also, the electric circuit 1
5c is L having a function of driving the semiconductor optical element 3k.
An SI 16d and an electric circuit component 17c that constitutes a circuit are included.

Next, the operation of the ninth embodiment of the present invention will be described.
This will be described with reference to FIG. 14 which is a cross-sectional view taken along line CC ′ of FIG. First, the operation of receiving an optical signal will be described. The optical signal sent by the optical fiber 4h is coupled to the input / output port 3101 of the optical waveguide substrate 31. Next, the optical signal sent into the optical waveguide substrate 31 is output to the output port 310.
2 and is coupled to the semiconductor optical device 3j. The optical signal is OE converted and sent to the optical module terminal 11e through the bonding wire 100e and the pattern of the wiring board 7g of the subcarrier 5f and the bonding wire 101c. The electric signal is sent to the electric circuit module section 2i by the optical module terminal 11e.

Next, the operation of the optical module of the embodiment shown in FIG. 9 according to the present invention will be described for the case of transmitting an optical signal. The electric signal sent from the electric circuit module 2i is sent to the optical module 1k by the optical module terminal 11g. This electric signal passes through the pattern of the wiring board 7g from the optical module terminal 11g via the bonding wire 101e and passes through the bonding wire 100f.
Is transmitted to the semiconductor optical element 3k via Further, the electric signal is subjected to EO conversion by the semiconductor optical element 3k. The converted optical signal is coupled to the optical waveguide 31, enters from the input port 3103, and is output from the input / output port 3101. The output optical signal is coupled to the optical fiber 4h,
Optical transmission is enabled by the optical fiber 4h. At this time,
The optical signal from the other side of the semiconductor optical device 3k is coupled to the semiconductor optical device 31 and is O-E converted by the semiconductor optical device 31. The converted electric signal is sent to the optical module terminal 11f via the bonding wire 100g.
The electric signal is sent to the electric circuit module section 2i by the optical module terminal 11f, thereby enabling the drive control of the semiconductor optical module 3k.

As the optical waveguide substrate 31, an element having an optical waveguide formed in a Y branch, such as a Y branch PLC element, is used.
Thereby, an optical system capable of transmitting and receiving is formed. For mounting the optical waveguide substrate 31 on the subcarrier 5f, a conductive fixing material such as a high melting point solder or a silver-containing adhesive is preferable.
In this embodiment, the transmission and reception optical system has been described. However, it is apparent that the semiconductor optical element and the LSI can be appropriately changed without being limited to this specific example and within the scope of the technical idea. Further, a plurality of optical systems and electric circuits may be used.

Next, a tenth embodiment of the optical module according to the present invention will be described with reference to the partial sectional view of FIG. This optical module can take various forms,
Here, the receiving module will be described as an example. In this optical module, an electric circuit module section 2j is arranged on the optical axis direction of the optical module section 11 and on the surface opposite to the optical fiber 4i. The optical module section 11 includes a subcarrier 5 having a semiconductor optical element 3m mounted in an optical module package 8i.
g is implemented with high precision. Further, an optical system is formed by this and the optical fiber 4i whose optical axis is adjusted. The optical module package 8i includes a wiring board 32 for electrically connecting an electric signal from the semiconductor optical element 3m to the electric circuit module 2j and the optical module terminal 1 adjacent thereto.
1h. The optical package ring 10c includes a heat insulating material 24a for blocking heat from the electric circuit module 2j.

Next, the operation of the optical module shown in FIG. 15 will be described. The optical signal sent from the optical fiber 4i is
The light is coupled to the semiconductor optical device 3m, and OE converted by the semiconductor optical device 3m. The converted electric signal is sent from the semiconductor optical device 3m to the wiring board 7h of the subcarrier 5g via the bonding wire 100h, and is sent to the wiring board 3h of the optical package 8i via the bonding wire 101f.
Sent to 2. Further, the electric signal is transmitted to the optical module terminal 1
1h to the electric circuit module 2j. Next, the heat flow of the optical module will be described. The heat of the LSI 16e, which is a heat source, mainly passes through the LSI mounting block 20b which forms a heat radiation path, and
1b to the electric circuit module 2j and the optical fiber 4i
Is dissipated to the outside in the opposite direction. On the other hand, heat of the LSI 16e in the direction of the optical module 11 flows from the LSI 16e through the air layer toward the optical package ring 10c. This heat is blocked from entering the optical system by the heat insulating material 24a of the optical package ring 10c. Optical package ring 1
The material of the heat insulating material 24a in 0c is preferably an insulator capable of forming a plating pattern such as a ceramic because it is necessary to insulate a plating pattern in a portion where electrical connection is required and to insulate the other. Thereby, the optical package ring 10
Since the thermal expansion coefficient is close to that of Kovar used for c, the occurrence of cracks and the like from the optical package base ring 10c due to heat is prevented.

Next, an eleventh embodiment of the optical module according to the present invention will be described with reference to the partial sectional view of FIG. In this optical module, a plurality of optical modules 33
a and 33b are arranged in an array. Specifically, the optical module sections 1m and 1n and the electric circuit module sections 2k and 21 of the optical modules 33a and 33b are adjacent to each other and integrated. The optical module sections 1m and 1n and the electric circuit module section 2 of the optical modules 33a and 33b
k, 21 can be variously modified and changed within the scope of the technical idea of the present invention. In addition, the direction, shape,
The same applies to the direction of the fiber and the number of optical modules used integrally.

Next, a twelfth embodiment of the optical module according to the present invention will be described with reference to the perspective view of FIG. The optical modules 33c and 33d are arranged in an array. Specifically, the optical modules 33c and 33d are integrated in a state in which the optical module sections 1p and 1q are adjacent to each other and the electric circuit module sections 2m and 2n are not adjacent to each other, that is, in a back-to-back relationship with each other. The optical modules 33c, 33
As the optical module sections 1p and 1q and the electric circuit module sections 2m and 2n, the various module sections described above can be used. Also, the direction and shape of the external terminal, the fiber direction, and the number of optical modules to be integrated can be freely selected.

The configuration and operation of the various embodiments of the optical module according to the present invention have been described above in detail. However, these embodiments are merely examples of the present invention and do not limit the present invention in any way. It will be readily apparent to those skilled in the art that various modifications can be made in accordance with the particular application without departing from the spirit of the invention.

[0054]

As is apparent from the above, according to the optical module of the present invention, the following various remarkable practical effects can be obtained. First, because it does not affect the optical system due to heat,
Stable optical characteristics can be obtained, and no external cooler is required. The reason for this is that the structure takes heat dissipation and cutoff into account.

Second, since the optical module can be mounted at high density, a large-capacity optical communication device can be realized. The reason for this is that an electric circuit conventionally arranged outside is incorporated in the optical module, so that a mounting space for this is not required.

Third, the cost can be reduced because the yield of the optical module is improved. The reason is that the optical module unit and the electric circuit module unit are separately manufactured and integrated after the characteristic test evaluation, thereby preventing one module unit which is a non-defective product from being defective due to one characteristic defect. Because. Further, the combination of the optical module section and the electric circuit module section can increase the number of non-defective products.

Fourth, optical modules of various specifications can be obtained by unifying the outer dimensions of the optical module section and the electric circuit module section and the terminal arrangement for connecting them, and combining them. The reason is that the optical module and the electric circuit module are packaged separately,
This is because a structure that is integrated in the final step is employed.
In addition, because this structure enables the sharing of equipment,
This is because special equipment becomes unnecessary.

[Brief description of the drawings]

FIG. 1 is a partial cross-sectional view showing a configuration of a first embodiment of an optical module according to the present invention.

FIG. 2 is an enlarged view of a portion A of the optical module shown in FIG.

FIG. 3 is an exploded perspective view of the optical module of the present invention shown in FIG.

FIG. 4 is an exploded perspective view for explaining various combinations of optical modules according to the present invention.

FIG. 5 is a partial sectional view showing a configuration of an optical module according to a second embodiment of the present invention.

FIG. 6 is a partial sectional view showing a configuration of an optical module according to a third embodiment of the present invention.

FIG. 7 is a partial sectional view showing a configuration of an optical module according to a fourth embodiment of the present invention.

FIG. 8 is a partial sectional view showing a configuration of an optical module according to a fifth embodiment of the present invention.

FIG. 9 is a partial sectional view showing a configuration of an optical module according to a sixth embodiment of the present invention.

FIG. 10 is a partial sectional view showing a configuration of an optical module according to a seventh embodiment of the present invention.

FIG. 11 is a partial sectional view showing the configuration of an eighth embodiment of the optical module according to the present invention.

FIG. 12 is a cross-sectional view taken along line BB ′ of FIG. 11, showing an operation example of the optical module.

FIG. 13 is a partial sectional view showing the configuration of an optical module according to a ninth embodiment of the present invention.

FIG. 14 is a cross-sectional view taken along the line CC ′ of FIG. 13, showing an operation example of the optical module.

FIG. 15 is a partial sectional view showing a configuration of an optical module according to a tenth embodiment of the present invention.

FIG. 16 is a perspective view showing a configuration of an eleventh embodiment of the optical module according to the present invention.

FIG. 17 is a perspective view showing a configuration of a twelfth embodiment of the optical module according to the present invention.

FIG. 18 is a partial sectional view showing a configuration of a conventional optical module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Optical module part 2 Electric circuit module part 3 Semiconductor optical element 4 Optical fiber 5 Subcarrier 6 Mounting base substrate 7, 32 Wiring board 8 Optical module package 9 Optical package base substrate 10 Optical package ring 11 Optical module terminal 12 Insulating material 13 Light Package cover 14 Fixing material 15 Electric circuit 16 Semiconductor integrated circuit (LSI) 17 Electric circuit component 18 Electric circuit module package 19 Electric circuit package base substrate 20 LSI mounting block 21 Heat dissipation member (heat sink) 22 Electric circuit package ring 23 Electric circuit module terminal Reference Signs List 24 Insulation material 25 Lens 26 Optical isolator 27, 28 Substrate with groove 29 Optical fiber support 30 Glass 31 Optical waveguide substrate 33 Optical module with built-in electric circuit 34 Module terminal 35 Instrumentation board

Claims (6)

[Claims] An electric circuit module for transmitting an electric signal is integrated with a heat radiating member to an optical module for transmitting an optical signal via an optical fiber, and has both electric and optical characteristics. Optical module. 2. The optical module according to claim 1, wherein the optical module section and the electric circuit module section are selected from a plurality of different configurations and are combined and integrated. 3. The optical module according to claim 1, wherein the electric circuit module section and the optical module section are stacked on each other to increase the mounting density on a mounting board. 4. The optical module according to claim 1, wherein the optical system of the optical module section and the semiconductor integrated circuit of the electric circuit module section are electrically connected and thermally connected. 5. The optical module according to claim 1, wherein said optical module section and said electric circuit module section are manufactured individually, and after a comprehensive characteristic evaluation, non-defective products are integrated. 6. The optical module terminal of the optical module section and the terminal mounting section of the electric circuit module section are provided at the same position, and the shapes of the optical module section and the electric circuit module section are unified. The optical module according to claim 1.