JP2001223452A5 - - Google Patents
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- Publication number
- JP2001223452A5 JP2001223452A5 JP2000030405A JP2000030405A JP2001223452A5 JP 2001223452 A5 JP2001223452 A5 JP 2001223452A5 JP 2000030405 A JP2000030405 A JP 2000030405A JP 2000030405 A JP2000030405 A JP 2000030405A JP 2001223452 A5 JP2001223452 A5 JP 2001223452A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000030405A JP4510975B2 (en) | 2000-02-08 | 2000-02-08 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000030405A JP4510975B2 (en) | 2000-02-08 | 2000-02-08 | Circuit board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001223452A JP2001223452A (en) | 2001-08-17 |
| JP2001223452A5 true JP2001223452A5 (en) | 2007-03-22 |
| JP4510975B2 JP4510975B2 (en) | 2010-07-28 |
Family
ID=18555424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000030405A Expired - Fee Related JP4510975B2 (en) | 2000-02-08 | 2000-02-08 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4510975B2 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5255592B2 (en) * | 2010-04-15 | 2013-08-07 | 古河電気工業株式会社 | substrate |
| EP2560466A4 (en) * | 2010-04-15 | 2015-05-06 | Furukawa Electric Co Ltd | Board and method for manufacturing board |
| JP5697020B2 (en) * | 2010-11-22 | 2015-04-08 | 古河電気工業株式会社 | Substrate and substrate manufacturing method |
| JP5449237B2 (en) * | 2011-03-09 | 2014-03-19 | 古河電気工業株式会社 | Substrate and substrate manufacturing method |
| JP6082233B2 (en) * | 2012-10-31 | 2017-02-15 | イビデン株式会社 | Wiring board and manufacturing method thereof |
| JP6473595B2 (en) * | 2014-10-10 | 2019-02-20 | イビデン株式会社 | Multilayer wiring board and manufacturing method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58166049U (en) * | 1982-04-30 | 1983-11-05 | 富士通株式会社 | Heat dissipation structure of hybrid IC |
| JP3157362B2 (en) * | 1993-09-03 | 2001-04-16 | 株式会社東芝 | Semiconductor device |
| JPH08195534A (en) * | 1995-01-13 | 1996-07-30 | Toshiba Corp | Circuit board |
| JP3906510B2 (en) * | 1997-03-19 | 2007-04-18 | 松下電器産業株式会社 | Heat dissipation board for mounting electronic components |
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2000
- 2000-02-08 JP JP2000030405A patent/JP4510975B2/en not_active Expired - Fee Related