JP2001217547A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2001217547A5 JP2001217547A5 JP2000025957A JP2000025957A JP2001217547A5 JP 2001217547 A5 JP2001217547 A5 JP 2001217547A5 JP 2000025957 A JP2000025957 A JP 2000025957A JP 2000025957 A JP2000025957 A JP 2000025957A JP 2001217547 A5 JP2001217547 A5 JP 2001217547A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000025957A JP3690723B2 (ja) | 2000-02-03 | 2000-02-03 | 回路基板、回路基板の中間体およびそれらの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000025957A JP3690723B2 (ja) | 2000-02-03 | 2000-02-03 | 回路基板、回路基板の中間体およびそれらの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001217547A JP2001217547A (ja) | 2001-08-10 |
| JP2001217547A5 true JP2001217547A5 (https=) | 2005-07-28 |
| JP3690723B2 JP3690723B2 (ja) | 2005-08-31 |
Family
ID=18551744
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000025957A Expired - Lifetime JP3690723B2 (ja) | 2000-02-03 | 2000-02-03 | 回路基板、回路基板の中間体およびそれらの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3690723B2 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5083906B2 (ja) * | 2008-10-30 | 2012-11-28 | 京セラＳｌｃテクノロジー株式会社 | 配線基板の製造方法 |
| KR101829316B1 (ko) * | 2016-12-22 | 2018-02-14 | 제이앤케이티(주) | 솔더링 방식을 이용한 인쇄회로기판 제조 방법 |
| CN115379669B (zh) * | 2021-05-20 | 2025-11-14 | 鹏鼎控股(深圳)股份有限公司 | 多层线路板及其制造方法 |
-
2000
- 2000-02-03 JP JP2000025957A patent/JP3690723B2/ja not_active Expired - Lifetime