JP2001210521A - Chip inductor - Google Patents
Chip inductorInfo
- Publication number
- JP2001210521A JP2001210521A JP2000015306A JP2000015306A JP2001210521A JP 2001210521 A JP2001210521 A JP 2001210521A JP 2000015306 A JP2000015306 A JP 2000015306A JP 2000015306 A JP2000015306 A JP 2000015306A JP 2001210521 A JP2001210521 A JP 2001210521A
- Authority
- JP
- Japan
- Prior art keywords
- main body
- chip inductor
- electrode
- conductor layer
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- Coils Or Transformers For Communication (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は電子機器、通信機器
等に用いるチップインダクタに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip inductor used for electronic equipment, communication equipment and the like.
【０００２】[0002]
【従来の技術】以下、従来のチップインダクタについて
図面を参照しながら説明する。2. Description of the Related Art A conventional chip inductor will be described below with reference to the drawings.
【０００３】従来のチップインダクタとしては、特開平
９−５５３２１号に記載されたものが知られている。As a conventional chip inductor, the one described in Japanese Patent Application Laid-Open No. 9-55321 is known.
【０００４】図５は従来のチップインダクタの斜視図、
図６は同チップインダクタの本体の斜視図、図７は同チ
ップインダクタの断面図である。FIG. 5 is a perspective view of a conventional chip inductor.
FIG. 6 is a perspective view of the main body of the chip inductor, and FIG. 7 is a sectional view of the chip inductor.
【０００５】図５〜図７において、従来のチップインダ
クタは、絶縁材料からなる柱状の本体１１と、この本体
１１を被覆した導体層１２と、この導体層１２を溝切切
削した溝切部１３と、この溝切部１３を螺旋状にして形
成したコイル部１４と、本体１１の両端部に有した電極
部１６と、コイル部１４を被覆した絶縁樹脂からなる外
装部１５とを備えている。Referring to FIGS. 5 to 7, a conventional chip inductor comprises a columnar main body 11 made of an insulating material, a conductor layer 12 covering the main body 11, and a groove 13 formed by cutting the conductor layer 12 into grooves. And a coil portion 14 formed by spirally forming the groove 13, electrode portions 16 provided at both ends of the main body 11, and an exterior portion 15 made of an insulating resin covering the coil portion 14. .
【０００６】また、本体１１は、両端部間に段差１７を
有して凹部１８を設けた形状とし、この凹部１８にコイ
ル部１４を形成している。The main body 11 has a shape in which a concave portion 18 is provided with a step 17 between both ends, and the coil portion 14 is formed in the concave portion 18.
【０００７】さらに、本体１１の両端部の端面に絶縁樹
脂を被覆していない非外装部を設け、電極部１６は、非
外装部における導体層１２を介して本体１１の端面と電
気的に接続させた構成である。Further, non-exterior portions which are not coated with an insulating resin are provided on both end surfaces of the main body 11, and the electrode portions 16 are electrically connected to the end surfaces of the main body 11 through the conductor layer 12 in the non-exterior portions. This is the configuration.
【０００８】[0008]
【発明が解決しようとする課題】上記従来の構成では、
コイル部１４の両端に電極部１６を形成するので、本体
１１の外径寸法を規定すると、電極部１６の形成幅の分
だけ、コイル部１４の形成幅を短くしなければならず、
螺旋状に有する溝切部１３の長さも、その分だけ制限さ
れ、インダクタンス値のカバーレンジが小さくなるとい
う問題点を有していた。In the above-mentioned conventional configuration,
Since the electrode portions 16 are formed at both ends of the coil portion 14, when the outer diameter of the main body 11 is defined, the width of the coil portion 14 must be reduced by the width of the electrode portion 16.
The length of the spiral grooved portion 13 is also limited by that amount, and there is a problem that the inductance range is reduced.
【０００９】本発明は上記問題点を解決するもので、コ
イル部の幅が電極部の形成幅に左右されず、インダクタ
ンス値のカバーレンジを本体に対して最大限大きくした
チップインダクタを提供することを目的としている。SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned problems, and to provide a chip inductor in which the width of the coil portion is not influenced by the width of the electrode portion and the inductance value coverage range is maximized with respect to the main body. It is an object.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に本発明は、絶縁材料からなる柱状の本体と、前記本体
の全面を被覆した導体層と、前記本体の外周面の導体層
を螺旋状に切削したコイル部と、前記本体の両端部に設
けた電極部と、前記コイル部を被覆した絶縁樹脂からな
る外装部とを備え、前記本体の端面に前記絶縁樹脂で被
覆していない非外装部を設け、前記電極部は、前記非外
装部を介して前記導体層と電気的に接続させるととも
に、この電極部の外周端は前記コイル部の少なくとも両
端部に位置する螺旋状切削部上まで延長配置した構成で
ある。SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a column-shaped main body made of an insulating material, a conductor layer covering the entire surface of the main body, and a conductor layer on the outer peripheral surface of the main body. A coil portion cut into a shape, electrode portions provided at both end portions of the main body, and an exterior portion made of an insulating resin covering the coil portion, and an end surface of the main body not covered with the insulating resin. An exterior portion is provided, the electrode portion is electrically connected to the conductor layer through the non-exterior portion, and an outer peripheral end of the electrode portion is formed on a spiral cutting portion located at least at both ends of the coil portion. It is a configuration that is extended up to
【００１１】上記構成により、電極部は、非外装部にお
ける導体層を介して本体の端面と電気的に接続させると
ともに、外装部を介してコイル部の少なくとも両端部の
螺旋状切削部上まで配置しているので、電極部はコイル
部上に配置することができ、コイル部の幅が電極部の形
成幅に左右されず、インダクタンス値のカバーレンジを
本体に対して最大限大きくすることができる。According to the above configuration, the electrode portion is electrically connected to the end face of the main body via the conductor layer in the non-exterior portion, and is disposed at least on the helical cutting portions at both ends of the coil portion via the outer portion. As a result, the electrode portion can be arranged on the coil portion, the width of the coil portion is not affected by the width of the electrode portion, and the inductance value coverage can be maximized relative to the main body. .
【００１２】[0012]
【発明の実施の形態】本発明の請求項１記載の発明は、
絶縁材料からなる柱状の本体と、前記本体の全面を被覆
した導体層と、前記本体の外周面の導体層を螺旋状に切
削したコイル部と、前記本体の両端部に設けた電極部
と、前記コイル部を被覆した絶縁樹脂からなる外装部と
を備え、前記本体の端面に前記絶縁樹脂で被覆していな
い非外装部を設け、前記電極部は、前記非外装部を介し
て前記導体層と電気的に接続させるとともに、この電極
部の外周端は前記コイル部の少なくとも両端部に位置す
る螺旋状切削部上まで延長配置した構成である。BEST MODE FOR CARRYING OUT THE INVENTION
A columnar main body made of an insulating material, a conductor layer covering the entire surface of the main body, a coil portion obtained by spirally cutting the conductor layer on the outer peripheral surface of the main body, and electrode portions provided at both ends of the main body, An exterior part made of an insulating resin covering the coil part, a non-exterior part not covered with the insulating resin is provided on an end face of the main body, and the electrode part is provided with the conductor layer via the non-exterior part. And an outer peripheral end of the electrode portion is extended and extended to a spiral cutting portion located at least at both ends of the coil portion.
【００１３】上記構成により、電極部は、非外装部にお
ける導体層を介して本体の端面と電気的に接続させると
ともに、外装部を介してコイル部の少なくとも両端部の
螺旋状切削部上まで配置しているので、電極部はコイル
部上に配置することができ、コイル部の幅が電極部の形
成幅に左右されず、インダクタンス値のカバーレンジを
本体に対して最大限大きくすることができる。According to the above configuration, the electrode portion is electrically connected to the end face of the main body via the conductor layer in the non-exterior portion, and is disposed at least on the helical cut portions at both ends of the coil portion via the outer portion. As a result, the electrode portion can be arranged on the coil portion, the width of the coil portion is not affected by the width of the electrode portion, and the inductance value coverage can be maximized relative to the main body. .
【００１４】本発明の請求項２記載の発明は、請求項１
記載の発明において、コイル部の両端に位置する螺旋状
切削部は、本体の端面に近接させた構成である。[0014] The second aspect of the present invention is the first aspect.
In the described invention, the spiral cutting portions located at both ends of the coil portion are configured to be close to the end face of the main body.
【００１５】上記構成により、本体に対して、螺旋状切
削部によるコイル部を長く形成でき、インダクタンス値
のカバーレンジを大きくすることができる。According to the above configuration, the coil portion formed by the spiral cutting portion can be formed longer than the main body, and the coverage of the inductance value can be increased.
【００１６】本発明の請求項３記載の発明は、請求項１
記載の発明において、導体層は、本体と接触する下層
と、前記下層上に形成する上層とを有し、前記下層の材
料は、銅にするとともに、前記上層の材料は、銅よりも
耐酸化性のある物質とした構成である。The third aspect of the present invention is the first aspect of the present invention.
In the described invention, the conductor layer has a lower layer in contact with the main body and an upper layer formed on the lower layer, and the material of the lower layer is copper, and the material of the upper layer is more oxidation-resistant than copper. It is a composition that has a substance with the property.
【００１７】上記構成により、絶縁樹脂からなる外装部
を導体層上に形成するとき等、導体層が酸化しやすいと
きに、上層の材料を下層の銅よりも耐酸化性のある物質
としているので、電極部と接する上層との間で、酸化に
よる剥離等を防止でき、接触抵抗を安定させて、信頼性
を向上することができる。According to the above configuration, when the conductor layer is easily oxidized, for example, when the exterior part made of an insulating resin is formed on the conductor layer, the material of the upper layer is made of a material having more oxidation resistance than the copper of the lower layer. In addition, separation between the electrode portion and the upper layer in contact with the electrode portion can be prevented, and the contact resistance can be stabilized and the reliability can be improved.
【００１８】本発明の請求項４記載の発明は、請求項３
記載の発明において、耐酸化性のある物質として、金を
用いた構成である。The invention according to claim 4 of the present invention is the invention according to claim 3.
In the described invention, gold is used as the oxidation-resistant substance.
【００１９】上記構成により、Ｑ特性の向上が図れ、信
頼性をより向上することができる。With the above configuration, the Q characteristic can be improved, and the reliability can be further improved.
【００２０】本発明の請求項５記載の発明は、請求項３
記載の発明において、上層の厚さは、下層の厚さの１／
２０よりも小さくした構成である。The invention according to claim 5 of the present invention is the invention according to claim 3.
In the described invention, the thickness of the upper layer is 1 / th of the thickness of the lower layer.
The configuration is smaller than 20.
【００２１】上記構成により、導体層の厚さを必要以上
に厚くすることを抑制し、外径寸法を大きくすることが
なく、小型化を図ることができる。According to the above configuration, it is possible to suppress the conductor layer from being unnecessarily thick, and to reduce the size without increasing the outer diameter.
【００２２】本発明の請求項６記載の発明は、請求項１
記載の発明において、本体のコイル部上に配置した電極
部の形成幅は、前記本体の全長の最外径寸法の１／３よ
りも小さくした構成である。The invention according to claim 6 of the present invention is the invention according to claim 1.
In the invention described in the above description, the width of the electrode portion arranged on the coil portion of the main body is smaller than 1/3 of the outermost diameter of the entire length of the main body.
【００２３】上記構成により、コイル部上に電極部が形
成されることによって生じる特性値への悪影響を抑制す
ることができる。With the above configuration, it is possible to suppress an adverse effect on the characteristic value caused by forming the electrode portion on the coil portion.
【００２４】本発明の請求項７記載の発明は、請求項１
記載の発明において、電極部の厚さは、前記電極部に対
向する外装部の厚さの０．５倍から１．５倍の間の厚さ
とした構成である。The seventh aspect of the present invention is the first aspect of the present invention.
In the invention described in the above, the thickness of the electrode portion is between 0.5 and 1.5 times the thickness of the exterior portion facing the electrode portion.
【００２５】上記構成により、コイル部上に電極部が形
成されることによって生じる特性値への悪影響を抑制す
ることができるとともに、外装部および電極部の厚さを
必要以上に厚くすることを抑制し、外径寸法を大きくす
ることがなく、小型化を図ることができる。With the above configuration, it is possible to suppress the adverse effect on the characteristic value caused by the formation of the electrode portion on the coil portion, and to suppress the thickness of the exterior portion and the electrode portion from being unnecessarily thick. However, the size can be reduced without increasing the outer diameter.
【００２６】本発明の請求項８記載の発明は、請求項１
記載の発明において、本体は四角柱とした構成である。The invention according to claim 8 of the present invention is the invention according to claim 1.
In the described invention, the main body has a square pillar configuration.
【００２７】上記構成により、本体を形成しやすく、生
産性を向上することができる。With the above configuration, the main body can be easily formed, and the productivity can be improved.
【００２８】（実施の形態１）以下、本発明の一実施の
形態におけるチップインダクタについて、図面を参照し
ながら説明する。(Embodiment 1) Hereinafter, a chip inductor according to an embodiment of the present invention will be described with reference to the drawings.
【００２９】図１は本発明の一実施の形態におけるチッ
プインダクタの断面図、図２は同チップインダクタの斜
視図、図３は同チップインダクタのコイル部上に配置し
た電極部近傍の図１のＡ部分の拡大断面図、図４は同チ
ップインダクタのＱ特性図である。FIG. 1 is a sectional view of a chip inductor according to an embodiment of the present invention, FIG. 2 is a perspective view of the chip inductor, and FIG. 3 is a view of FIG. 1 near an electrode portion disposed on a coil portion of the chip inductor. FIG. 4 is an enlarged sectional view of a portion A, and FIG. 4 is a Q characteristic diagram of the chip inductor.
【００３０】図１〜図３において、本発明の一実施の形
態におけるチップインダクタは、セラミックなどの絶縁
材料からなる正四角柱の本体１と、この本体１の全周面
を被覆した導体層２と、この導体層２をレーザ光等で溝
切切削した溝切部３と、この溝切部３を本体１の外周面
に螺旋状に形成することにより構成したコイル部４と、
本体１の両端部に有した導電性樹脂からなる電極部６
と、コイル部４を被覆した絶縁樹脂からなる外装部５と
を備えている。このとき、本体１の外径寸法は、端面７
の縦横（Ｔ）が３００μｍ、幅（Ｗ）が６００μｍにな
るようにしている。1 to 3, a chip inductor according to an embodiment of the present invention comprises a main body 1 of a square prism made of an insulating material such as ceramic, and a conductor layer 2 covering the entire peripheral surface of the main body 1. A groove portion 3 formed by cutting the conductor layer 2 with a laser beam or the like; a coil portion 4 formed by forming the groove portion 3 in a spiral shape on the outer peripheral surface of the main body 1;
Electrode portions 6 made of conductive resin and provided at both ends of main body 1
And an exterior part 5 made of an insulating resin that covers the coil part 4. At this time, the outer diameter of the main body 1
And the width (W) are set to 300 μm and 600 μm, respectively.
【００３１】また、本体１の端面７に絶縁樹脂を被覆し
ていない非外装部を設け、電極部６は、非外装部におけ
る導体層２を介して本体１の端面７と電気的に接続させ
るとともに、外装部５を介してコイル部４の少なくとも
両端に位置する溝切部３上まで配置している。このと
き、コイル部４の両端に位置する溝切部３は、本体１の
端面７までの寸法（Ｓ）を１００μｍと近接させてい
る。Further, a non-exterior part not covered with an insulating resin is provided on the end face 7 of the main body 1, and the electrode part 6 is electrically connected to the end face 7 of the main body 1 via the conductor layer 2 in the non-exterior part. At the same time, the coil unit 4 is arranged at least on both ends of the groove portion 3 via the exterior unit 5. At this time, the dimensions (S) of the grooved portions 3 located at both ends of the coil portion 4 up to the end face 7 of the main body 1 are close to 100 μm.
【００３２】さらに、導体層２は、本体１と接触する下
層８と、この下層８上に形成する上層９とを有し、上層
９の厚さを０．２μｍ、下層８の厚さを２０μｍとし、
上層９の厚さは下層８の厚さの１／２０よりも小さくす
るとともに、下層８の材料として、銅を用い、上層９の
材料として、銅よりも耐酸化性のある物質の金を用いて
いる。Further, the conductor layer 2 has a lower layer 8 in contact with the main body 1 and an upper layer 9 formed on the lower layer 8, and the upper layer 9 has a thickness of 0.2 μm and the lower layer 8 has a thickness of 20 μm. age,
The thickness of the upper layer 9 is made smaller than 1/20 of the thickness of the lower layer 8, and copper is used as the material of the lower layer 8, and gold, which is a substance more resistant to oxidation than copper, is used as the material of the upper layer 9. ing.
【００３３】そして、電極部６の厚さを１５μｍ、外装
部５の厚さを１５μｍとし、電極部６の厚さが、電極部
６に対向する外装部５の厚さの０．５倍から１．５倍の
間の厚さになるようにするとともに、本体１のコイル部
４上に配置した電極部６の形成幅は１５０μｍとし、本
体１の端面７の最外径寸法（図２のＷで６００μｍ）の
１／３よりも小さくした構成である。The thickness of the electrode part 6 is 15 μm, the thickness of the exterior part 5 is 15 μm, and the thickness of the electrode part 6 is 0.5 times the thickness of the exterior part 5 facing the electrode part 6. The thickness of the electrode portion 6 disposed on the coil portion 4 of the main body 1 was set to 150 μm, and the outermost diameter of the end face 7 of the main body 1 (see FIG. (W is 600 μm).
【００３４】上記構成のチップインダクタについて、以
下その動作を説明する。The operation of the above-structured chip inductor will be described below.
【００３５】上記構成により、電極部６は、非外装部に
おける導体層２を介して本体１の端面７と電気的に接続
させるとともに、外装部５を介してコイル部４の少なく
とも両端に位置する溝切部３上まで配置しているので、
電極部６はコイル部４上に配置することができ、コイル
部４の幅が電極部６の形成幅に左右されず、インダクタ
ンス値のカバーレンジを本体に対して最大限大きくする
ことができる。With the above configuration, the electrode portion 6 is electrically connected to the end face 7 of the main body 1 via the conductor layer 2 in the non-exterior portion, and is located at least at both ends of the coil portion 4 via the outer portion 5. Since it is arranged up to the groove cut part 3,
The electrode section 6 can be arranged on the coil section 4, and the width of the coil section 4 is not influenced by the width of the electrode section 6, so that the inductance range can be maximized relative to the main body.
【００３６】特に、コイル部４の両端に位置する溝切部
３は、本体１の端面７に近接させているので、本体１に
対して、コイル部４の溝切部３を長く形成でき、インダ
クタンス値のカバーレンジをより大きくすることができ
る。In particular, since the grooved portions 3 located at both ends of the coil portion 4 are close to the end face 7 of the main body 1, the grooved portion 3 of the coil portion 4 can be formed longer than the main body 1. The cover range of the inductance value can be further increased.
【００３７】また、導体層２は、本体１と接触する下層
８と、この下層８上に形成する上層９とを有し、下層８
の材料は、銅にするとともに、上層９の材料は、銅より
も耐酸化性のある物質としているので、絶縁樹脂からな
る外装部５を導体層２上に形成するとき等（外装部５を
形成する絶縁樹脂の硬化時の加熱や電極部６を形成する
導電性樹脂の硬化時の加熱）、導体層２が酸化しやすい
ときに、上層９の材料を下層８の銅よりも耐酸化性のあ
る物質としているので、電極部６と接する上層９との間
で、酸化による剥離等を防止でき、接触抵抗を安定させ
て、信頼性を向上することができる。このとき、耐酸化
性のある物質として、金を用いることにより、図４に示
すように、Ｑ特性の向上が図れ、信頼性をより向上する
ことができる。The conductor layer 2 has a lower layer 8 in contact with the main body 1 and an upper layer 9 formed on the lower layer 8.
Is made of copper, and the material of the upper layer 9 is a material having higher oxidation resistance than copper. Therefore, when the exterior part 5 made of an insulating resin is formed on the conductor layer 2, etc. When the insulating resin to be formed is cured or the conductive resin forming the electrode portion 6 is cured), when the conductor layer 2 is easily oxidized, the material of the upper layer 9 is more resistant to oxidation than the copper of the lower layer 8. Since it is a substance having a certain characteristic, it is possible to prevent separation due to oxidation or the like between the electrode layer 6 and the upper layer 9 in contact with the electrode part 6, to stabilize contact resistance and improve reliability. At this time, by using gold as the oxidation resistant substance, as shown in FIG. 4, the Q characteristic can be improved, and the reliability can be further improved.
【００３８】さらに、導体層２は、上層９の厚さを、下
層８の厚さの１／２０よりも小さくしているので、導体
層２の厚さを必要以上に厚くすることを抑制し、外径寸
法を大きくすることがなく、小型化を図ることができ
る。Further, since the thickness of the upper layer 9 of the conductor layer 2 is smaller than 1/20 of the thickness of the lower layer 8, it is possible to prevent the thickness of the conductor layer 2 from being increased more than necessary. The size can be reduced without increasing the outer diameter.
【００３９】その上、本体１のコイル部４上に配置した
電極部６の形成幅は、本体１の端面７の最外径寸法（図
２のＷ）の１／３よりも小さくしているので、コイル部
４上に電極部６が形成されることによって生じる特性値
への悪影響を抑制することができるとともに、電極部６
の厚さは、電極部６に対向する外装部５の厚さの０．５
倍から１．５倍の間の厚さとしているので、外装部５お
よび電極部６の厚さを必要以上に厚くすることを抑制
し、外径寸法を大きくすることがなく、小型化を図るこ
とができる。In addition, the formation width of the electrode portion 6 disposed on the coil portion 4 of the main body 1 is smaller than １ ／ of the outermost dimension (W in FIG. 2) of the end face 7 of the main body 1. Therefore, it is possible to suppress the adverse effect on the characteristic value caused by the formation of the electrode section 6 on the coil section 4 and to prevent the electrode section 6 from being formed.
Is 0.5 times the thickness of the exterior part 5 facing the electrode part 6.
Since the thickness is between 1.5 times and 1.5 times, it is possible to suppress the thickness of the exterior portion 5 and the electrode portion 6 from being unnecessarily thick, and to reduce the size without increasing the outer diameter. be able to.
【００４０】そして、本体１は四角柱なので、製造時、
形成しやすく、生産性を向上することができる。Since the main body 1 is a square pole,
It is easy to form, and productivity can be improved.
【００４１】このように本発明の一実施の形態によれ
ば、コイル部４の幅が電極部６の形成幅に左右されず、
本体１に対してコイル部４の溝切部３を長く形成でき、
インダクタンス値のカバーレンジを最大限大きくするこ
とができる。As described above, according to the embodiment of the present invention, the width of the coil part 4 is not affected by the width of the electrode part 6,
The grooved portion 3 of the coil portion 4 can be formed longer than the main body 1,
The inductance value coverage range can be maximized.
【００４２】また、電極部６と接する導体層２の上層９
との間で、酸化による剥離等を防止でき、接触抵抗を安
定させて、信頼性を向上することができるとともに、耐
酸化性のある物質として、金を用いれば、Ｑ特性の向上
も図れ、信頼性をより向上することができる。The upper layer 9 of the conductor layer 2 in contact with the electrode portion 6
In addition to this, it is possible to prevent peeling due to oxidation, stabilize contact resistance, improve reliability, and improve the Q characteristic by using gold as an oxidation-resistant substance. Reliability can be further improved.
【００４３】さらに、コイル部４上に電極部６が形成さ
れることによって生じる特性値への悪影響を抑制するこ
とができる。Further, it is possible to suppress the adverse effect on the characteristic value caused by forming the electrode section 6 on the coil section 4.
【００４４】そして、外径寸法を大きくすることなく小
型化を図ることもできるとともに、製造時における生産
性も向上することができる。Further, the size can be reduced without increasing the outer diameter, and the productivity at the time of manufacturing can be improved.
【００４５】なお、本発明の一実施の形態では、耐酸化
性物質としては、金を用いたが、銀、白金などでもよ
い。Although gold is used as the oxidation-resistant substance in one embodiment of the present invention, silver or platinum may be used.
【００４６】[0046]
【発明の効果】以上のように本発明によれば、電極部
は、非外装部における導体層を介して本体の端面と電気
的に接続させるとともに、外装部を介してコイル部を形
成するための螺旋状切削部上まで配置しているので、電
極部はコイル部上に配置することができ、コイル部の幅
が電極部の形成幅に左右されず、インダクタンス値のカ
バーレンジを本体に対して最大限大きくしたチップイン
ダクタを提供することができる。As described above, according to the present invention, the electrode portion is electrically connected to the end face of the main body through the conductor layer in the non-exterior portion, and the coil portion is formed through the outer portion. The electrode section can be arranged on the coil section because the spiral cutting section is located above the coil section.The width of the coil section is not affected by the width of the electrode section, and the inductance value cover range is To provide a chip inductor with a maximum size.
【図１】本発明の一実施の形態におけるチップインダク
タの断面図FIG. 1 is a cross-sectional view of a chip inductor according to an embodiment of the present invention.
【図２】同チップインダクタの斜視図FIG. 2 is a perspective view of the chip inductor.
【図３】同チップインダクタのコイル部上に配置した電
極部近傍の図１のＡ部分の拡大断面図FIG. 3 is an enlarged cross-sectional view of a portion A in FIG. 1 near an electrode portion arranged on a coil portion of the chip inductor.
【図４】同チップインダクタのＱ特性図FIG. 4 is a Q characteristic diagram of the chip inductor.
【図５】従来のチップインダクタの斜視図FIG. 5 is a perspective view of a conventional chip inductor.
【図６】同チップインダクタの本体の斜視図FIG. 6 is a perspective view of a main body of the chip inductor.
【図７】同チップインダクタの断面図FIG. 7 is a sectional view of the chip inductor.
１ 本体 ２ 導体層 ３ 溝切部 ４ コイル部 ５ 外装部 ６ 電極部 ７ 端面 DESCRIPTION OF SYMBOLS 1 Main body 2 Conductive layer 3 Groove cutting part 4 Coil part 5 Exterior part 6 Electrode part 7 End surface
───────────────────────────────────────────────────── フロントページの続き (72)発明者 田岡 幹夫 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 中山 英明 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 Ｆターム(参考） 5E070 AA11 AB01 AB04 BA07 CB12 CC03 DA15 DB02 EA01 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mikio Taoka 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. (72) Hideaki Nakayama 1006 Odaka Kazuma Kadoma City, Osaka Prefecture Matsushita Electric Industrial F Terms (reference) 5E070 AA11 AB01 AB04 BA07 CB12 CC03 DA15 DB02 EA01
Claims (8)
体の全面を被覆した導体層と、前記本体の外周面の導体
層を螺旋状に切削したコイル部と、前記本体の両端部に
設けた電極部と、前記コイル部を被覆した絶縁樹脂から
なる外装部とを備え、前記本体の端面に前記絶縁樹脂で
被覆していない非外装部を設け、前記電極部は、前記非
外装部を介して前記導体層と電気的に接続させるととも
に、この電極部の外周端は前記コイル部の少なくとも両
端部に位置する螺旋状切削部上の外装部上まで延長配置
したチップインダクタ。1. A pillar-shaped main body made of an insulating material, a conductor layer covering the entire surface of the main body, a coil portion obtained by spirally cutting the conductor layer on the outer peripheral surface of the main body, and provided at both ends of the main body. Electrode part, and an exterior part made of an insulating resin covering the coil part, a non-exterior part not covered with the insulating resin is provided on an end surface of the main body, and the electrode part comprises the non-exterior part. A chip inductor that is electrically connected to the conductor layer through the outer periphery of the spiral cut portion located at least at both ends of the coil portion.
は、本体の端面に近接させた請求項１記載のチップイン
ダクタ。2. The chip inductor according to claim 1, wherein the spiral cutting portions located at both ends of the coil portion are close to the end surface of the main body.
下層上に形成する上層とを有し、前記下層の材料は、銅
にするとともに、前記上層の材料は、銅よりも耐酸化性
のある物質とした請求項１記載のチップインダクタ。3. The conductor layer has a lower layer in contact with the main body and an upper layer formed on the lower layer, wherein the material of the lower layer is copper, and the material of the upper layer is more oxidation-resistant than copper. 2. The chip inductor according to claim 1, wherein the chip inductor is a substance having a property.
請求項３記載のチップインダクタ。4. The chip inductor according to claim 3, wherein gold is used as the oxidation-resistant substance.
りも小さくした請求項３記載のチップインダクタ。5. The chip inductor according to claim 3, wherein the thickness of the upper layer is smaller than 1/20 of the thickness of the lower layer.
成幅は、前記本体の全長の１／３よりも小さくした請求
項１記載のチップインダクタ。6. The chip inductor according to claim 1, wherein the width of the electrode portion arranged on the coil portion of the main body is smaller than one third of the entire length of the main body.
外装部の厚さの０．５倍から１．５倍の間の厚さとした
請求項１記載のチップインダクタ。7. The chip inductor according to claim 1, wherein the thickness of the electrode portion is between 0.5 and 1.5 times the thickness of the exterior portion facing the electrode portion.
プインダクタ。8. The chip inductor according to claim 1, wherein the main body is a square pole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000015306A JP2001210521A (en) | 2000-01-25 | 2000-01-25 | Chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000015306A JP2001210521A (en) | 2000-01-25 | 2000-01-25 | Chip inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001210521A true JP2001210521A (en) | 2001-08-03 |
Family
ID=18542626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000015306A Pending JP2001210521A (en) | 2000-01-25 | 2000-01-25 | Chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001210521A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004013875A1 (en) * | 2002-08-05 | 2004-02-12 | Matsushita Electric Industrial Co., Ltd. | Coil part and method of producing the same |
| US7115984B2 (en) * | 2002-06-18 | 2006-10-03 | Micron Technology, Inc. | Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices |
| US7208335B2 (en) | 2003-09-30 | 2007-04-24 | Micron Technology, Inc. | Castellated chip-scale packages and methods for fabricating the same |
| US7226809B2 (en) | 2002-06-18 | 2007-06-05 | Micron Technology, Inc. | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
-
2000
- 2000-01-25 JP JP2000015306A patent/JP2001210521A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7115984B2 (en) * | 2002-06-18 | 2006-10-03 | Micron Technology, Inc. | Semiconductor devices including peripherally located bond pads, intermediates thereof, assemblies, and packages including the semiconductor devices, and support elements for the semiconductor devices |
| US7226809B2 (en) | 2002-06-18 | 2007-06-05 | Micron Technology, Inc. | Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
| US7285850B2 (en) | 2002-06-18 | 2007-10-23 | Micron Technology, Inc. | Support elements for semiconductor devices with peripherally located bond pads |
| WO2004013875A1 (en) * | 2002-08-05 | 2004-02-12 | Matsushita Electric Industrial Co., Ltd. | Coil part and method of producing the same |
| US7208335B2 (en) | 2003-09-30 | 2007-04-24 | Micron Technology, Inc. | Castellated chip-scale packages and methods for fabricating the same |
| US7633159B2 (en) | 2003-09-30 | 2009-12-15 | Micron Technology, Inc. | Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages |
| US8063493B2 (en) | 2003-09-30 | 2011-11-22 | Micron Technology, Inc. | Semiconductor device assemblies and packages |
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