JP2001210307A - Connecting method of ptc element, jig for connecting ptc element and ptc element - Google Patents

Connecting method of ptc element, jig for connecting ptc element and ptc element

Info

Publication number
JP2001210307A
JP2001210307A JP2000018934A JP2000018934A JP2001210307A JP 2001210307 A JP2001210307 A JP 2001210307A JP 2000018934 A JP2000018934 A JP 2000018934A JP 2000018934 A JP2000018934 A JP 2000018934A JP 2001210307 A JP2001210307 A JP 2001210307A
Authority
JP
Japan
Prior art keywords
ptc element
electrode plate
metal electrode
lead wire
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000018934A
Other languages
Japanese (ja)
Inventor
Kazuhiko Sakuma
和彦 佐久間
Chiaki Anzai
千秋 安西
Fumiya Sato
文哉 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2000018934A priority Critical patent/JP2001210307A/en
Publication of JP2001210307A publication Critical patent/JP2001210307A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

Landscapes

  • Connection Of Batteries Or Terminals (AREA)

Abstract

PROBLEM TO BE SOLVED: To enable that the soldering of lead wire with a metal-electrode plate of PTC element directly without raising the initial resistor value of the PTC element, and aim at a cost reduction, and eliminate the failure due to resistance welding. SOLUTION: In a connecting method of PTC element 2 to have a metal- electrode plate 2b, the soldering of lead wire 5 with a connecting part of this metal-electrode plate 2b is made in the state that heat radiation plates 20, 22 are surface contacted between PTC element main body 2a side and the connecting part.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は例えばリチウムイオ
ン二次電池を複数本組み込む、バッテリーパックを製造
するときに使用して好適なPTC素子の接続方法及びP
TC素子の接続用治具並びにPTC素子に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting a PTC element which incorporates a plurality of lithium ion secondary batteries and is suitable for use in manufacturing a battery pack.
The present invention relates to a jig for connecting a TC element and a PTC element.

【0002】[0002]

【従来の技術】従来、複数本例えば6本のリチウムイオ
ン二次電池を使用したバッテリーパックが提案されてい
る。このバッテリーパックの構成は例えば図5に示す如
くであり、6本のリチウムイオン二次電池1a〜1fを
2本づつ並列接続したものを3組直列に接続し、この正
極をPTC素子2及び温度ヒューズ3の直列回路を介し
て、このバッテリーパックの正極端子4aに接続し、こ
のリチウムイオン二次電池1a〜1fの2本づつ並列接
続したものの3組の直列回路の負極をこのバッテリーパ
ックの負極端子4bに接続するようにしたものである。
2. Description of the Related Art Conventionally, a battery pack using a plurality of, for example, six, lithium ion secondary batteries has been proposed. The configuration of this battery pack is, for example, as shown in FIG. 5, in which three sets of six lithium ion secondary batteries 1a to 1f connected in parallel are connected in series, and the positive electrode is connected to the PTC element 2 and the temperature. The negative electrode of three sets of serial circuits of two lithium ion secondary batteries 1a to 1f connected in parallel to each other through a series circuit of fuses 3 and connected to the positive terminal 4a of this battery pack is connected to the negative electrode of this battery pack. This is connected to the terminal 4b.

【0003】このPTC素子2は、図6に示す如きもの
で温度が上昇すると抵抗値が増大する特性を有する導電
性高分子材料(素子本体)2aに例えばニッケル板より
成る金属電極板2b,2bを設けた電気抵抗素子で過電
流、過熱の保護素子として使用している。
The PTC element 2 is a metal electrode plate 2b made of, for example, a nickel plate on a conductive polymer material (element body) 2a having a characteristic that the resistance value increases as the temperature rises as shown in FIG. Are used as overcurrent and overheat protection elements.

【0004】即ち、このPTC素子2は、過電流が流れ
又は過熱されたときに電気抵抗値が増大してバッテリー
パックの正極及び負極端子4a及び4b間の電流を微少
に制限し回路等を保護することができる。
That is, in the PTC element 2, when an overcurrent flows or is overheated, the electric resistance increases, and the current between the positive and negative terminals 4a and 4b of the battery pack is minutely limited to protect a circuit and the like. can do.

【0005】そして、電源をオフとし、このPTC素子
2の温度が下がれば、このPTC素子2の抵抗値が下が
るため、交換せずに再び使用することができる。
When the power is turned off and the temperature of the PTC element 2 drops, the resistance value of the PTC element 2 drops, so that the PTC element 2 can be used again without replacement.

【0006】然しながら、このPTC素子2は、例えば
130℃以上に過熱し、高抵抗値になったときには、常
温に戻っても初期抵抗値が上昇する現象があり、例えば
初期抵抗値が30mΩであったPTC素子2が1時的に
例えば130℃以上に過熱し、高抵抗値となったときに
は、常温に戻っても初期抵抗値が40mΩとなる現象が
ある。
However, when the PTC element 2 is heated to, for example, 130 ° C. or more and has a high resistance value, there is a phenomenon that the initial resistance value increases even when the temperature returns to room temperature. For example, the initial resistance value is 30 mΩ. When the PTC element 2 temporarily overheats to, for example, 130 ° C. or more and becomes a high resistance value, the initial resistance value becomes 40 mΩ even when the temperature returns to the normal temperature.

【0007】このため、このPTC素子2を図5に示す
如く回路内に接続するのに、このPTC素子2の金属電
極板2bにリード線5を半田付けしたときには、この素
子本体2aが150℃以上となり、このPTC素子2の
初期抵抗値が上昇する不都合があるので、従来は図7に
示す如く、先ずリード線5の一端をタブ6の孔6aに挿
入した後にこのリード線5の一端をタブ6に半田付け
し、その後、このタブ6をPTC素子2の金属電極板2
bの接続部に抵抗溶接により接続する如くしていた。
Therefore, when the lead wire 5 is soldered to the metal electrode plate 2b of the PTC element 2 in order to connect the PTC element 2 in a circuit as shown in FIG. As described above, there is a disadvantage that the initial resistance value of the PTC element 2 is increased. Therefore, conventionally, as shown in FIG. 7, one end of the lead wire 5 is first inserted into the hole 6a of the tab 6, and then the other end of the lead wire 5 is connected. After soldering to the tab 6, the tab 6 is attached to the metal electrode plate 2 of the PTC element 2.
The connection portion b was connected by resistance welding.

【0008】[0008]

【発明が解決しようとする課題】従って従来は、このP
TC素子2を回路内に接続するのに、先ずリード線5を
タブ6に半田付けし、その後このタブ6をPTC素子2
の金属電極板2bに抵抗溶接する如くしていたので、P
TC素子2の金属電極板2bに直接半田付けするものに
比較し、接続工数が多くなると共に使用部品が多くな
り、製品(バッテリーパック)のコストアップとなる不
都合があると共に抵抗溶接の作業工程にも不良が発生
し、信頼性、歩留り低下の要因になる不都合があった。
Therefore, conventionally, this P
To connect the TC element 2 in the circuit, first, the lead wire 5 is soldered to the tab 6, and then the tab 6 is connected to the PTC element 2.
Resistance welding to the metal electrode plate 2b of
Compared to a device that is directly soldered to the metal electrode plate 2b of the TC element 2, the number of connection steps and the number of parts used are increased, so that the cost of the product (battery pack) increases. Also, there was a problem that a defect occurred, which caused a decrease in reliability and yield.

【0009】本発明は斯る点に鑑み、PTC素子の初期
抵抗値を上昇することなく、このPTC素子の金属電極
板にリード線を直接半田付け出来るようにし、コストダ
ウンを図ると共に抵抗溶接による不良を無くすようにし
たことを目的とする。
In view of the above, the present invention enables a lead wire to be directly soldered to a metal electrode plate of a PTC element without increasing the initial resistance value of the PTC element, thereby reducing costs and using resistance welding. The purpose is to eliminate defects.

【0010】[0010]

【課題を解決するための手段】本発明PTC素子の接続
方法は、金属電極板を有するPTC素子の接続方法にお
いて、この金属電極板のPTC素子本体側と接続部と間
に放熱板を面接触した状態でリード線をこの金属電極板
の接続部に半田付けするようにしたものである。
According to the present invention, there is provided a method of connecting a PTC element, the method comprising the steps of: connecting a heat radiating plate between the PTC element body side of the metal electrode plate and the connecting portion; In this state, the lead wire is soldered to the connection portion of the metal electrode plate.

【0011】本発明によれば、金属電極板のPTC素子
本体側と接続部と間に放熱板を面接触した状態でリード
線を接続部に半田付けするので、半田付けしたときの熱
が放熱板を介して放熱され、この金属電極板の接続部に
リード線を直接半田付けしてもこのPTC素子本体の熱
は例えば130℃までは上昇せず、このPTC素子の初
期抵抗値は上昇することはない。
According to the present invention, the lead wire is soldered to the connection portion in a state where the heat radiating plate is in surface contact between the PTC element body side of the metal electrode plate and the connection portion. The heat is radiated through the plate, and even if the lead wire is directly soldered to the connection portion of the metal electrode plate, the heat of the PTC element main body does not increase up to, for example, 130 ° C., and the initial resistance value of the PTC element increases. Never.

【0012】本発明PTC素子の接続用治具は、少なく
とも一方が熱伝導性の良い金属より成る上ブロック及び
下ブロックより成り、この上ブロックのPTC素子の金
属電極板のリード線との接続部に対応する部分に半田付
け用孔を形成すると共にこの上ブロック及び下ブロック
の金属より成るブロックをこの金属電極板のPTC素子
本体側と接続部と間において面接触するようにしたもの
である。
The jig for connecting a PTC element according to the present invention comprises an upper block and a lower block, at least one of which is made of a metal having good heat conductivity, and a connection portion of the upper block with a lead wire of a metal electrode plate of the PTC element. A hole for soldering is formed in a portion corresponding to the above, and the blocks made of metal of the upper block and the lower block are brought into surface contact between the PTC element body side of the metal electrode plate and the connection portion.

【0013】斯る本発明によれば、上ブロック及び下ブ
ロックの金属より成るブロックをこの金属電極板のPT
C素子本体側と接続部と間において面接触するようにし
たので、金属電極板の接続部にリード線を半田付けした
ときの熱がこの金属より成るブロックを介して放熱さ
れ、この金属電極板の接続部にリード線を直接半田付け
してもこのPTC素子本体の熱は例えば130℃までは
上昇せず、このPTC素子の初期抵抗値は上昇すること
はない。
According to the present invention, the block made of the metal of the upper block and the lower block is replaced with the PT of the metal electrode plate.
Since the C-element body and the connecting portion are in surface contact with each other, the heat generated when the lead wire is soldered to the connecting portion of the metal electrode plate is radiated through the block made of the metal, and Even if a lead wire is directly soldered to the connection part, the heat of the PTC element main body does not increase up to, for example, 130 ° C., and the initial resistance value of the PTC element does not increase.

【0014】[0014]

【発明の実施の形態】以下、図面を参照して本発明PT
C素子の接続方法、PTC素子の接続用治具及びPTC
素子の実施の形態の例につき説明しよう。
BRIEF DESCRIPTION OF THE DRAWINGS FIG.
Method for connecting C element, jig for connecting PTC element, and PTC
An example of an embodiment of the device will be described.

【0015】先ず、図1A,B及び図4を参照して、本
発明PTC素子の接続方法の実施の形態の一例につき説
明する。本例においては、図1Aに示す如く図6に示す
如き、PTC素子2の金属電極板2bのリード線5の接
続部に、リード線5の挿入用の孔10を形成しておく。
この場合この金属電極板2bのリード線5の接続部に半
田メッキするを可とする。
First, an example of an embodiment of a method for connecting a PTC element according to the present invention will be described with reference to FIGS. In the present example, as shown in FIG. 1A, as shown in FIG. 6, a hole 10 for inserting the lead wire 5 is formed in the connecting portion of the lead wire 5 of the metal electrode plate 2b of the PTC element 2.
In this case, solder plating can be applied to the connection portion of the lead wire 5 of the metal electrode plate 2b.

【0016】このPTC素子2を例えばバッテリーパッ
クの製造工程で接続するときには、先ず図1Bに示す如
く、リード線5の一端を、このPTC素子2の金属電極
板2bの孔10に挿入し、その後図4に示す如きPTC
素子の接続用治具を使用して、この金属電極板2bの接
続部にリード線5の一端を接続する如くする。図1A,
Bにおいて、3は温度ヒューズである。
When connecting the PTC element 2 in, for example, a battery pack manufacturing process, first, as shown in FIG. 1B, one end of the lead wire 5 is inserted into the hole 10 of the metal electrode plate 2b of the PTC element 2, and then PTC as shown in FIG.
One end of the lead wire 5 is connected to the connection portion of the metal electrode plate 2b using a jig for connecting the elements. FIG. 1A,
In B, 3 is a thermal fuse.

【0017】図4において、20は熱伝導性の良い金属
例えばアルミニウム、銅、金属硅素、ゲルマニウム及び
之等を主とする合金等より成る直方体の上ブロックを示
し、この上ブロック20のPTC素子2の金属電極板2
bのリード線5との接続部即ち、金属電極板2bの孔1
0が形成された部分に対応する部分にこの上ブロック2
0を貫通する所定大きさの半田付け孔21を形成する。
また、この上ブロック20の下面にPTC素子本体2a
及び温度ヒューズ3を納める凹部20a及び20bを形
成する。
In FIG. 4, reference numeral 20 denotes a rectangular parallelepiped upper block made of a metal having good heat conductivity, for example, aluminum, copper, metal silicon, germanium, and alloys mainly including these metals. Metal electrode plate 2
b of the metal electrode plate 2b.
The upper block 2 is added to a portion corresponding to the portion where 0 is formed.
A soldering hole 21 having a predetermined size penetrating through 0 is formed.
A PTC element body 2a is provided on the lower surface of the upper block 20.
And recesses 20a and 20b for accommodating the thermal fuse 3 are formed.

【0018】また、図4において、22は熱伝導性の良
い金属例えばアルミニウム、銅、金属硅素、ゲルマニウ
ム及び之等を主とする合金等より成る直方体の下ブロッ
クを示し、この下ブロック22の上面にPTC素子2の
PTC素子本体2a及び金属電極板2b、リード線5、
温度ヒューズ3を納める凹部を形成する。
In FIG. 4, reference numeral 22 denotes a rectangular parallelepiped lower block made of a metal having good heat conductivity, for example, aluminum, copper, silicon metal, germanium, or an alloy mainly containing these metals. A PTC element body 2a and a metal electrode plate 2b of the PTC element 2;
A recess for accommodating the thermal fuse 3 is formed.

【0019】この下ブロック22に蝶番を介して上ブロ
ック20を開閉自在に固定する如くする。また下ブロッ
ク22の上面の凹部のPTC素子2の金属電極板2bの
PTC素子本体2a側と接続部と間に対応する部分に合
成ゴム、シリコン等の弾力性のある熱伝導材料を配し、
このPTC素子2を、この下ブロック22の上面の所定
位置に配し、上ブロック20を閉じたときに、この上ブ
ロック20の下面が、このPTC素子2の金属電極板2
bのPTC素子本体2a側と接続部との間に良好に面接
触する如くする。
The upper block 20 is fixed to the lower block 22 via a hinge so as to be openable and closable. Also, an elastic heat conductive material such as synthetic rubber or silicon is disposed on a portion of the concave portion on the upper surface of the lower block 22 corresponding to a portion between the PTC element body 2a side of the PTC element 2 and the connection portion of the PTC element 2;
The PTC element 2 is arranged at a predetermined position on the upper surface of the lower block 22, and when the upper block 20 is closed, the lower surface of the upper block 20 contacts the metal electrode plate 2 of the PTC element 2.
b so as to make good surface contact between the PTC element body 2a side and the connection portion.

【0020】また、23a及び23bは夫々上ブロック
20の下面及び下ブロック22の上面に設けたマグネッ
トであり、このマグネット23a及び23bはこの上ブ
ロック20を閉じたときに互に吸引する如くなしたもの
である。
Reference numerals 23a and 23b denote magnets provided on the lower surface of the upper block 20 and the upper surface of the lower block 22, respectively. The magnets 23a and 23b attract each other when the upper block 20 is closed. Things.

【0021】次に、この図4に示す如きPTC素子の接
続用治具を使用して、PTC素子2の金属電極板2bの
接続部にリード線5を直接半田付けする場合につき説明
する。
Next, a case where the lead wire 5 is directly soldered to the connection part of the metal electrode plate 2b of the PTC element 2 using the jig for connecting the PTC element as shown in FIG. 4 will be described.

【0022】先ず、図4に示す如くこの上ブロック20
を開いた状態で、このPTC素子2のPTC素子本体2
a及び金属電極板2bを下ブロック22の上面の凹部の
所定位置に載置すると共に温度ヒューズ3付きの一方の
リード線5及び他方のリード線5の先端を夫々一方及び
他方の金属電極板2b及び2bの夫々の接続部に形成し
た孔10及び10に夫々挿入して下ブロック22の上面
の凹部の所定位置に載置する。
First, as shown in FIG.
With the PTC element 2 open,
a and the metal electrode plate 2b are placed at predetermined positions of the recesses on the upper surface of the lower block 22, and the tips of the one lead wire 5 and the other lead wire 5 with the thermal fuse 3 are respectively connected to the one and the other metal electrode plate 2b. And 2b are respectively inserted into holes 10 and 10 formed in the connection portions, and are mounted at predetermined positions of the concave portions on the upper surface of the lower block 22.

【0023】この場合、一方及び他方の金属電極板2b
及び2bの夫々の接続部即ち孔10及び10が形成され
リード線5及び5が挿入された部分が上ブロック20の
半田付け孔21及び21に対応する如くする。
In this case, one and the other metal electrode plates 2b
2b, that is, the holes 10 and 10 are formed, and the portions where the lead wires 5 and 5 are inserted correspond to the soldering holes 21 and 21 of the upper block 20.

【0024】次に、この上ブロック20を閉じマグネッ
ト23a及び23bでチャックする如くする。このとき
は、PTC素子2の金属電極板2bのPTC素子本体2
aとこの接続部と間が上ブロック20の下面に面接触す
る如くなる。
Next, the upper block 20 is closed and chucked by the magnets 23a and 23b. At this time, the PTC element body 2 of the metal electrode plate 2b of the PTC element 2
a and the connecting portion are in surface contact with the lower surface of the upper block 20.

【0025】次に、この上ブロック20の半田付け孔2
1及び21を通して、この金属電極板2bの接続部とリ
ード線5とを直接半田付けする如くする。この場合半田
付けのときの熱は、熱伝導性の良い金属例えばアルミニ
ウム、銅、金属硅素、ゲルマニウム及び之等を主とする
合金等の上ブロック20及び下ブロック22を介して放
熱され、この半田付けによる熱がほとんどPTC素子本
体2aに伝達されず、このPTC素子本体2aは例えば
130℃まで熱せられることがなく、初期抵抗値が上昇
することがない。
Next, the soldering holes 2 of the upper block 20
Through 1 and 21, the connection portion of the metal electrode plate 2b and the lead wire 5 are directly soldered. In this case, heat at the time of soldering is radiated through the upper block 20 and the lower block 22 of a metal having good heat conductivity, such as aluminum, copper, metal silicon, germanium, and alloys mainly including these metals. Almost no heat is transferred to the PTC element main body 2a, and the PTC element main body 2a is not heated to, for example, 130 ° C., and the initial resistance value does not increase.

【0026】従って本例によればPTC素子2の金属電
極板2bにリード線5を直接半田付けできるので、従来
に比較し、タブ6を必要とせず且つ抵抗溶接の必要性が
ないので、使用部品点数が少なくなると共に接続工数が
少なくなり、コストダウンを図ることができると共に抵
抗溶接による不良を無くすことができる。
Therefore, according to this embodiment, the lead wire 5 can be directly soldered to the metal electrode plate 2b of the PTC element 2, so that the tab 6 is not required and the need for resistance welding is eliminated as compared with the prior art. The number of parts is reduced and the number of connection steps is reduced, so that cost can be reduced and defects due to resistance welding can be eliminated.

【0027】また、この場合、PTC素子2の金属電極
板2bの接続部に孔10を設けなくても良いが、この孔
10を設け、この孔10にリード線5を挿入した方が迅
速に半田付けが出来る。
In this case, it is not necessary to provide the hole 10 at the connection portion of the metal electrode plate 2b of the PTC element 2, but it is faster to provide the hole 10 and insert the lead wire 5 into the hole 10. Solderable.

【0028】図1例では、PTC素子2の金属電極板2
bの接続部に孔10を設けた例につき述べたが、この代
わりに図2A,Bに示す如く、この金属電極板2bの接
続部の両側に切り欠き11を形成し、この切り欠き11
に図2Bに示す如く、リード線5を巻き付けた後に、上
述同様にして半田付けを行うようにしても良いし、また
図3A,Bに示す如く、この金属電極板2bの接続部に
この金属電極板2bに直交する方向に延長した延長片1
2を設け、この延長片12を図3Bに示す如く折り曲げ
てリード線5を挟み込んだ後に上述同様にして半田付け
行うようにしても良い。
In the example of FIG. 1, the metal electrode plate 2 of the PTC element 2
2A and 2B, cutouts 11 are formed on both sides of the connection portion of the metal electrode plate 2b, and the cutouts 11 are formed as shown in FIGS.
As shown in FIG. 2B, after the lead wire 5 is wound, soldering may be performed in the same manner as described above, or as shown in FIGS. Extension piece 1 extending in a direction perpendicular to electrode plate 2b
2 may be provided, and the extension piece 12 may be bent as shown in FIG.

【0029】尚上述例では、上ブロック20及び下ブロ
ック22の両方を熱伝導性の良い金属で形成したが、こ
の上ブロック20又は下ブロック22の一方を熱伝導性
の良い金属で形成し、他方をベークライト等で形成する
ようにしても良い。この場合熱伝導性の良い金属で形成
したブロックの面がPTC素子2の金属電極板2bのP
TC素子本体2a側と接続部と間に面接触する如くす
る。
In the above example, both the upper block 20 and the lower block 22 are formed of a metal having good heat conductivity. However, one of the upper block 20 and the lower block 22 is formed of a metal having good heat conductivity. The other may be formed by bakelite or the like. In this case, the surface of the block formed of a metal having good heat conductivity is the P of the metal electrode plate 2b of the PTC element 2.
Surface contact is made between the TC element body 2a side and the connection part.

【0030】また上述例では熱伝導性の良い金属ブロッ
クを用いた例につき述べたが、熱伝導性の良い放熱板を
用い、この放熱板をPTC素子2の金属電極板2bのP
TC素子本体2a側と接続部と間に面接触するように
し、リード線5をこの接続部に直接半田付けしても上述
同様の作用効果が得られることは容易に理解できよう。
In the above example, a metal block having good heat conductivity is used. However, a heat radiating plate having good heat conductivity is used, and this heat radiating plate is used as the P electrode of the metal electrode plate 2b of the PTC element 2.
It can be easily understood that the same operation and effect as described above can be obtained even if the TC element main body 2a is brought into surface contact between the connection portion and the lead wire 5 is directly soldered to this connection portion.

【0031】また、本発明は上述例に限ることなく本発
明の要旨を逸脱することなく、その他種々の構成が採り
得ることは勿論である。
Further, the present invention is not limited to the above-described example, but may adopt various other configurations without departing from the gist of the present invention.

【0032】[0032]

【発明の効果】本発明によれば、PTC素子の金属電極
板のPTC素子本体側と接続部と間に放熱板(金属ブロ
ック)を面接触した状態でリード線を接続部に半田付け
するので、半田付けしたときの熱がこの放熱板(金属ブ
ロック)を介して放熱され、この金属電極板の接続部に
リード線を直接半田付けしても、このPTC素子本体の
熱は例えば130℃までは上昇せず、このPTC素子の
初期抵抗値は上昇することはない。
According to the present invention, the lead wire is soldered to the connection part in a state where the heat radiating plate (metal block) is in surface contact between the connection part and the PTC element body side of the metal electrode plate of the PTC element. The heat generated by the soldering is dissipated through the heat radiating plate (metal block), and even if the lead wire is directly soldered to the connection portion of the metal electrode plate, the heat of the PTC element main body is, for example, 130 ° C. Does not increase, and the initial resistance value of the PTC element does not increase.

【0033】従って、本発明によればPTC素子の金属
電極板にリード線を直接半田付けできるので、従来比較
し、タブを必要とせず且つ抵抗溶接の必要性がないの
で、使用部品点数が少なくなると共に接続工数が少なく
なりコストダウンを図ることができると共に抵抗溶接に
よる不良を無くすことができる。
Therefore, according to the present invention, the lead wire can be directly soldered to the metal electrode plate of the PTC element, so that no tab is required and there is no need for resistance welding as compared with the prior art, so that the number of parts used is small. In addition, the number of connection steps is reduced, cost can be reduced, and defects due to resistance welding can be eliminated.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明PTC素子の接続方法の工程の要部の一
例を示す構成図である。
FIG. 1 is a configuration diagram showing an example of a main part of a process of a method for connecting a PTC element of the present invention.

【図2】本発明PTC素子の接続方法の工程の要部の他
の例を示す構成図である。
FIG. 2 is a configuration diagram showing another example of the main part of the steps of the method for connecting a PTC element of the present invention.

【図3】本発明PTC素子の接続方法の工程の要部の他
の例を示す構成図である。
FIG. 3 is a configuration diagram showing another example of the main part of the steps of the method for connecting a PTC element of the present invention.

【図4】本発明PTC素子の接続用治具の実施の形態の
例を示す構成図である。
FIG. 4 is a configuration diagram showing an example of an embodiment of a connection jig for a PTC element of the present invention.

【図5】バッテリーブロックの例を示す接続図である。FIG. 5 is a connection diagram illustrating an example of a battery block.

【図6】PTC素子の例を示す平面図である。FIG. 6 is a plan view showing an example of a PTC element.

【図7】従来のPTC素子の接続例を示す構成図であ
る。
FIG. 7 is a configuration diagram showing a connection example of a conventional PTC element.

【符号の説明】[Explanation of symbols]

2‥‥PTC素子、2a‥‥PTC素子本体、2b‥‥
金属電極板、5‥‥リード線、10‥‥孔、11‥‥切
り欠き、12‥‥延長片、20‥‥上ブロック、21‥
‥半田付け孔、22‥‥下ブロック、23a,23b‥
‥マグネット
2 ‥‥ PTC element, 2a ‥‥ PTC element body, 2b ‥‥
Metal electrode plate, 5mm lead wire, 10mm hole, 11mm notch, 12mm extension piece, 20mm upper block, 21mm
{Soldering hole, 22} Lower block, 23a, 23b}
‥magnet

フロントページの続き (72)発明者 佐藤 文哉 福島県郡山市日和田町高倉字下杉下1−1 株式会社ソニー・エナジー・テック内 Fターム(参考) 5H022 AA09 AA19 BB13 CC12 KK01Continuation of the front page (72) Inventor Fumiya Sato 1-1 Shimosugishita, Takakura, Hiwada-cho, Koriyama-shi, Fukushima F-term in Sony Energy Tech Co., Ltd. (reference) 5H022 AA09 AA19 BB13 CC12 KK01

Claims (8)

【特許請求の範囲】[Claims] 【請求項1】 金属電極板を有するPTC素子の接続方
法において、 前記金属電極板のPTC素子本体側と接続部と間に放熱
板を面接触した状態でリード線を前記金属電極板の接続
部に半田付けするようにしたことを特徴とするPTC素
子の接続方法。
1. A method of connecting a PTC element having a metal electrode plate, wherein a lead wire is connected to the connection part of the metal electrode plate in a state in which a heat sink is in surface contact between the PTC element body side of the metal electrode plate and the connection part. A method of connecting a PTC element, wherein the PTC element is soldered.
【請求項2】 請求項1記載のPTC素子の接続方法に
おいて、 前記金属電極板の接続部に孔を設け、該孔に前記リード
線を挿入した後に半田付けを行うようにしたことを特徴
とするPTC素子の接続方法。
2. The method of connecting a PTC element according to claim 1, wherein a hole is provided in a connection portion of the metal electrode plate, and soldering is performed after inserting the lead wire into the hole. Method of connecting PTC elements.
【請求項3】 請求項1記載のPTC素子の接続方法に
おいて、 前記金属電極板の接続部に切り欠きを設け、該切り欠き
に前記リード線を巻き付けた後に半田付けを行うように
したことを特徴とするPTC素子の接続方法。
3. The method for connecting a PTC element according to claim 1, wherein a notch is provided in a connection portion of the metal electrode plate, and soldering is performed after the lead wire is wound around the notch. Characteristic connection method of PTC element.
【請求項4】 請求項1記載のPTC素子の接続方法に
おいて、 前記金属電極板の接続部にこの金属電極板に直交する方
向に延長した延長片を設け、該延長片を折り曲げて前記
リード線を挟み込んだ後に半田付けを行うようにしたこ
とを特徴とするPTC素子の接続方法。
4. The method for connecting a PTC element according to claim 1, wherein an extension piece extending in a direction perpendicular to the metal electrode plate is provided at a connection portion of the metal electrode plate, and the extension piece is bent to form the lead wire. A method of connecting a PTC element, wherein soldering is performed after the PTC element is sandwiched.
【請求項5】 少なくとも一方が熱伝導性の良い金属よ
り成る上ブロック及び下ブロックより成り、前記上ブロ
ックのPTC素子の金属電極板のリード線との接続部に
対応する部分に半田付け用孔を形成すると共に前記上ブ
ロック及び下ブロックの金属より成るブロックを前記金
属電極板の前記PTC素子本体側と前記接続部と間にお
いて面接触するようにしたことを特徴とするPTC素子
の接続用治具。
5. A soldering hole is provided at a portion corresponding to a connection portion of a metal electrode plate of a PTC element of the upper block with at least one of which is made of a metal having good heat conductivity. And a block made of metal of the upper block and the lower block is brought into surface contact between the metal electrode plate and the PTC element body side and the connecting portion. Utensils.
【請求項6】 金属電極板を有するPTC素子におい
て、 前記金属電極板のリード線の接続部に前記リード線を挿
入する孔を設けたことを特徴とするPTC素子。
6. A PTC element having a metal electrode plate, wherein a hole for inserting the lead wire is provided in a connection portion of the metal electrode plate where the lead wire is connected.
【請求項7】 金属電極板を有するPTC素子におい
て、 前記金属電極板のリード線の接続部に前記リード線を巻
き付ける切り欠きを設けたことを特徴とするPTC素
子。
7. A PTC element having a metal electrode plate, wherein a notch for winding the lead wire is provided at a connection part of the lead wire of the metal electrode plate.
【請求項8】 金属電極板を有するPTC素子におい
て、 前記金属電極板のリード線の接続部に前記リード線を挟
持する前記金属電極板に直交する方向に延長した延長片
を設けたことを特徴とするPTC素子。
8. A PTC element having a metal electrode plate, wherein an extension piece extending in a direction orthogonal to the metal electrode plate that sandwiches the lead wire is provided at a connection portion of the lead wire of the metal electrode plate. PTC element.
JP2000018934A 2000-01-27 2000-01-27 Connecting method of ptc element, jig for connecting ptc element and ptc element Pending JP2001210307A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000018934A JP2001210307A (en) 2000-01-27 2000-01-27 Connecting method of ptc element, jig for connecting ptc element and ptc element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000018934A JP2001210307A (en) 2000-01-27 2000-01-27 Connecting method of ptc element, jig for connecting ptc element and ptc element

Publications (1)

Publication Number Publication Date
JP2001210307A true JP2001210307A (en) 2001-08-03

Family

ID=18545714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000018934A Pending JP2001210307A (en) 2000-01-27 2000-01-27 Connecting method of ptc element, jig for connecting ptc element and ptc element

Country Status (1)

Country Link
JP (1) JP2001210307A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100811674B1 (en) 2006-05-18 2008-03-11 주식회사 이랜텍 Welding machine and methode of battery cell positive temperature coefficient
CN100448068C (en) * 2004-07-28 2008-12-31 三星Sdi株式会社 Secondary protective element for secondary battery

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100448068C (en) * 2004-07-28 2008-12-31 三星Sdi株式会社 Secondary protective element for secondary battery
KR100811674B1 (en) 2006-05-18 2008-03-11 주식회사 이랜텍 Welding machine and methode of battery cell positive temperature coefficient

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