JP2001206727A5 - - Google Patents
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- JP2001206727A5 JP2001206727A5 JP2000012079A JP2000012079A JP2001206727A5 JP 2001206727 A5 JP2001206727 A5 JP 2001206727A5 JP 2000012079 A JP2000012079 A JP 2000012079A JP 2000012079 A JP2000012079 A JP 2000012079A JP 2001206727 A5 JP2001206727 A5 JP 2001206727A5
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- Japan
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000012079A JP4158003B2 (ja) | 2000-01-20 | 2000-01-20 | ガラス板の加工方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000012079A JP4158003B2 (ja) | 2000-01-20 | 2000-01-20 | ガラス板の加工方法及びその装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001206727A JP2001206727A (ja) | 2001-07-31 |
| JP2001206727A5 true JP2001206727A5 (enExample) | 2005-10-06 |
| JP4158003B2 JP4158003B2 (ja) | 2008-10-01 |
Family
ID=18539852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000012079A Expired - Fee Related JP4158003B2 (ja) | 2000-01-20 | 2000-01-20 | ガラス板の加工方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4158003B2 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1408012B1 (en) * | 2001-07-18 | 2010-11-03 | Mitsuboshi Diamond Industrial Co., Ltd. | Scribing head |
| EP1604794A4 (en) | 2002-11-22 | 2011-03-23 | Mitsuboshi Diamond Ind Co Ltd | CARRIER CUTTING SYSTEM, CARRIER MANUFACTURING DEVICE, CARRIAGE CARRIER PROCEDURE AND CARRIER CUTTING PROCESS |
| US20070214925A1 (en) * | 2003-09-24 | 2007-09-20 | Mitsubishi Diamond Industrial Co., Ltd | Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method |
| US7676937B2 (en) * | 2003-12-29 | 2010-03-16 | Mitsuboshi Diamond Industrial Co., Ltd. | Scribe head and scribe device |
| WO2005087458A1 (ja) | 2004-03-15 | 2005-09-22 | Mitsuboshi Diamond Industrial Co., Ltd. | 基板分断システム、基板製造装置、基板スクライブ方法および基板分断方法 |
| TWI342302B (en) | 2007-03-30 | 2011-05-21 | Au Optronics Corp | A substrate splitting apparatus and a mehtod for splitting a substrate |
| JP5339210B2 (ja) | 2007-04-27 | 2013-11-13 | 旭硝子株式会社 | 帯状板ガラスの切線加工装置及び方法、並びに板ガラスの製造方法 |
| WO2009088085A1 (ja) * | 2008-01-10 | 2009-07-16 | Mg Grow Up Corp. | 静止型流体混合装置 |
| JP2015027933A (ja) * | 2013-06-27 | 2015-02-12 | 日本電気硝子株式会社 | 強化ガラス板のスクライブ方法 |
| CN105967509B (zh) * | 2016-05-06 | 2018-09-11 | 藤仓烽火光电材料科技有限公司 | 制造光纤预制棒的旋转刃式玻璃棒切割机、电路及方法 |
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2000
- 2000-01-20 JP JP2000012079A patent/JP4158003B2/ja not_active Expired - Fee Related