JP2001205585A - Disc carrying device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a disc carrying device allowing the manufacture of high- quality discs with less waviness. SOLUTION: The disc carrying device comprises a suction part provided in the peripheral direction of a disc substrate to be sucked with uniform density and a temperature control mechanism installed thereon for controlling the temperature of the suction part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates generally to the production of record carriers, and more particularly to an injection molding system for injection molding a disk substrate such as an optical disk, and transporting the injection molded disk substrate to a next-stage apparatus. To a disk transport device that performs

[0002]

2. Description of the Related Art In recent years, use of an optical record carrier such as a magneto-optical (MO) disk or a digital versatile disk (DVD) suitable for large-capacity recording and reproduction of music and images has been increasing. Such an optical record carrier is composed of a recording film, a reflective film, a protective film and the like laminated on a resin substrate such as polycarbonate. Usually, a resin substrate is manufactured by injection molding a resin melted in a mold called a stamper capable of duplicating a preformat signal and a data signal. The stamper is a mold having a concave and convex shape opposite to that of a desired product (replica: an optical record carrier to be mass-produced), and is made of a nickel (Ni) material. Since injection molding using a mold involves all replica production, injection molding with high precision and high production capacity is desired. In particular, in recent years, demands for mechanical properties and transferability of a molded article have become strict with the increase in density of disks and thinning of substrates.

FIG. 10 shows a schematic view of a conventional injection mold for an optical disk. Here, FIG. 10 is a schematic perspective view of a take-out machine of a conventional disk injection molding system. The disk mold has a fixed mold 1 and a movable mold 2 opposed thereto, and the fixed mold 1 is a fixed platen 3 on a molding machine.
The movable mold 2 is similarly fixed to the movable platen 4. The fixed platen 3 is installed on the frame of the molding machine,
The movable platen 4 faces the movable platen 4 via four tie bars 5. The movable platen 4 is connected to a mold clamping mechanism (not shown), and moves forward and backward on the diver 5. The temperature of the fixed mold 1 and the movable mold 2 is controlled, and the temperature of the space (cavity) filled with the molten resin via the spool is kept constant. When the fixed mold 1 and the movable mold 2 are closed by mold clamping, both molds need to be strictly and accurately aligned in order to produce a highly accurate replica. The male ring-shaped tapered surface 101 and the female ring-shaped tapered surface 102 of the movable mold 2 are fitted to each other to perform centering.

After the completion of the injection molding, the take-out machine 6 takes out the disk substrate and transports it to the next apparatus. Extractor 6
Has a substantially U-shaped holding portion 7 having an opening 10 as shown in FIG. The holding section 7 is provided with a plurality (four in FIG. 11) of suction pads 8 and chuck sections 9. The suction pad 8 sucks the disk substrate by vacuum suction, and the chuck unit 9 chucks the resin taken out from a spool extending from the center of the disk substrate. The next-stage apparatus also has a holding unit having a structure similar to that shown in FIG. 11, and receives the disk substrate transported by the unloader 6 by vacuum suction. Note that the injection molding machine and the take-out machine 6 may be called a primary side, and the next-stage apparatus may be called a secondary side.

[0005]

However, the conventional injection molding system cannot produce a high quality disk substrate. More specifically, the conventional injection molding system has a problem in that the disk substrate has undulations that disable tracking servo. As a result of intensive studies, the inventors of the present invention have found that as described below, the transfer from the injection molding machine to the next device by the transfer device (take-out machine) and the operations before and after the transfer are affected.
That is, the present inventors have discovered that a disk substrate immediately after injection molding is easily deformed at a high temperature, and therefore requires high-precision operation before and after transportation. In addition, “undulation” represents a variation in warpage in one circumference of the disk substrate. The “warp” is, for example, the suction pad 8 of the disk substrate.
This occurs only in the portion held by the (4 locations in FIG. 11). As a result, warpage occurs only at four locations on the disk substrate, and the warpage varies within the circumference, so that undulation is generated as a whole.

First, the present inventors have paid attention to the fact that non-uniform vacuum suction is performed in the circumferential direction of a disk by a conventional transfer device (take-out device 6). In other words, the holding unit 7
Suction pad 8 does not coincide with the circumferential direction of the disc,
Alternatively, since the discs are not continuous even if they are matched, the holding unit 7 has not vacuum-sucked the disc at a uniform density along the circumferential direction. It has been discovered that such non-uniform vacuum attraction degrades the mechanical properties of the disk substrate. On the other hand, the opening 10 is necessary because it is necessary to chuck the resin taken out of the spool, and the presence of the opening 10 prevents the suction pads 8 from being uniformly arranged in the circumferential direction. The same was true for the secondary device.

Further, the inventors of the present invention have not controlled the temperature of the holding unit of the conventional transfer device, so that the temperature difference from the disk substrate is large, and this temperature difference causes the disk to undulate, and the disk mechanical It was found that the characteristics were deteriorated. The same was true for the secondary device.

[0008]

SUMMARY OF THE INVENTION Accordingly, it is an exemplary general object of the present invention to provide a new and useful disk transport apparatus which solves the above-mentioned conventional problems.

More specifically, it is an exemplary object of the present invention to provide a disk transport device which enables the production of high quality disks with little waviness.

In order to achieve the above object, a disk transport device as an exemplary embodiment of the present invention transports a disk substrate injection-molded by an injection molding machine to a next device.
A suction unit that sucks the disk substrate at a uniform density along a circumferential direction of the disk substrate; and a disk substrate that is connected to the suction unit and sucked by the suction unit. And a movable part that moves between the above-mentioned devices. According to such a disk transport device, undulations on the disk substrate are reduced by uniform suction by the suction section.

[0011] Further, a disk transport device as another exemplary embodiment of the present invention is a suction device that transports a disk substrate injection-molded by an injection molding machine to a subsequent device, and sucks the disk substrate. A temperature controller that controls the temperature of the suction unit, and a movable unit that is connected to the suction unit and moves the disk substrate that is suctioned by the suction unit between the injection molding machine and the next-stage device. Having. According to such a disk transport device, it is possible to prevent the temperature distribution of the disk substrate from being varied due to the temperature control of the suction unit brought into contact with the suction unit, and to provide a disk with less waviness.

[0012] A processing apparatus as an exemplary embodiment of the present invention includes a suction unit that receives a disk substrate injection-molded by an injection molding machine from a transfer device and suctions the disk substrate at a uniform density in a circumferential direction of the disk substrate. The injection molding machine includes a holding unit that supports the suction unit, and is disposed at a subsequent stage of the injection molding machine.
According to such a disk transport device, undulations on the disk substrate are reduced by uniform suction by the suction section.

Further, a processing apparatus as another exemplary embodiment of the present invention includes a holding unit that receives and holds a disk substrate injection-molded by an injection molding machine from a transfer device, and controls a temperature of the holding unit. It has a temperature control section and is arranged at the subsequent stage of the injection molding machine. According to such a processing apparatus, it is possible to prevent the temperature distribution of the disk substrate from being varied due to the temperature control of the holding unit brought into contact with the holding unit, and to provide a disk with less waviness.

A disk manufacturing method as one exemplary embodiment of the present invention includes a step of forming a disk substrate by injection molding, a step of adsorbing the disk substrate at a uniform density along a circumferential direction of the disk substrate, Transporting the disk substrate to a subsequent device. According to this manufacturing method, the undulation on the disk substrate is reduced by the uniform suction.

[0015] In another aspect of the present invention, a disk manufacturing method includes a step of forming a disk substrate by injection molding, a step of transporting the disk substrate to a next device, and a step of transporting the disk substrate. And performing a temperature control. According to such a manufacturing method, the waviness of the disk substrate is reduced by the temperature control.

Further objects and other features of the present invention will become apparent from the embodiments described below with reference to the accompanying drawings.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Referring to FIGS.
The disk transport device 100 according to the present invention will be described. Here, FIG. 1 is a schematic cross-sectional view of a disk transport device 100 as an exemplary embodiment of the present invention. FIG. 2 is a schematic diagram of the holding unit 110 provided in the disk transport device 100. FIG. 3 is a schematic diagram when the holding unit 110 of FIG. 2 is open. In each of the drawings, the same reference numerals denote the same members, and redundant description will be omitted. The disk transport device (ejector) 100 includes a holding unit 110, an arm unit 120, a driving unit 130, and a control unit 140 (not shown).
And

The holding unit 110 holds the disk substrate after the injection molding, takes it out of the molding machine, and conveys it to the next device. More details will be described with reference to FIGS.
According to FIGS. 2 and 3, the holding unit 110 includes a movable unit 110 a that can rotate around B, and a fixed unit 110.
b, and for example, stainless steel is used as a material. Further, the holding unit 110 has a suction unit 112, a chuck unit 114, and an opening / closing opening 116.

The suction portion 112 is formed by two substantially semicircular (horse-shoe-shaped) suction cups, and suctions the disk substrate by vacuum suction. As a material of such a sucker,
For example, silicon or urethane is used. As shown in FIG. 2, when the opening 116 is closed, the two suction cups form a substantially circular shape. At this time, the resin taken out of the spool is chucked by a chuck unit 114 described later. Since the suction cup of the suction section 112 forms a concentric circle with the disk substrate, the disk substrate can be suctioned over the entire circle at the time of suction. That is, the suction section 112 can suction at a uniform density on a circumference having a certain distance from the center of the disk substrate. Here, the uniform density means
Instead of equally dividing and adsorbing the circumference, the entire circumference is adsorbed with the same suction force.

It is considered that the disk held by the suction unit 112 is uniformly warped with respect to the center of the disk. Such a warp can be eliminated by using a bonding step in the case of a DVD or the like. In the laminating step, a flat planar disk can be formed by laminating substrates having uniform warpage. On the other hand, it is difficult to cancel the waviness in the laminating process even if the disks having the warpage are varied in the circumference and the waviness is generated. However, the disk transport device 100 of the present invention
Has a suction portion 112 for sucking a disk at a uniform density, and since warpage does not vary in the circumference, undulation can be reduced.

As described above, the holding section 110 can vacuum-suck the disk at a uniform density along the circumferential direction. As a result, a large area of the resin substrate is uniformly vacuum-suctioned by the suction section 112, so that even a substrate that is not completely solidified can be transported without causing deformation (undulation). In addition, the holding unit 110 includes a suction unit 112.
It also has a mechanism for adjusting the temperature of

The chuck portion 114 chucks (holds) the resin 115 taken out from a spool 260 described later extending from the center of the disk substrate. Therefore, the chuck portion 114 is composed of two members that can be freely opened and closed. 2 and 3
As shown in FIG.
It is installed at the center of a circle formed by 10a and fixed portion 110b, and is movable by a control signal or the like, for example.

The opening / closing port 116 is connected to the movable section 1 of the holding section 110.
This is a gap between 10a and the fixing portion 110b. Opening 116
The size changes when the movable portion 110a moves around the axis B. Since the opening / closing opening 116 is freely openable / closable, it is possible to make the suction cup of the suction portion 112 circular, and it is also possible to chuck the resin 115 taken out from a spool 260 which will be described later, as in the conventional case. I have.

The arm unit 120 includes the holding unit 110 and the driving unit 1
This member connects between the drive units 30 and can rotate in the direction of arrow C about the axis A with the drive unit 130.
The arm unit 120 is movable to insert the holding unit 110 between a fixed mold 210 and a movable mold 220 of an injection mold 200 described later. By rotating the arm unit 120 in the direction of the arrow, the disk substrate held by the holding unit 110 can be transported to the next-stage apparatus 400 described later.

The drive section 130 has a drive source such as a motor, for example. With such a driving source, the holding unit 110
The opening and closing of the opening and closing port 116, the rotation operation of the arm unit 120, and the vacuum suction of the suction unit 112 are performed. Further, the driving unit 130 may include the vacuum pump 150 therein. The vacuum pump 150 is connected to the suction unit 112 of the holding unit 110 and decompresses a space formed by the disk and the suction unit 112. The vacuum pump 150 is also controlled by the control unit 140. The control unit 140 controls the driving unit 130 and sets the arm unit 12 for setting the position of the holding unit 110.
0 is controlled. Also, as described later, the holding unit 11
Control of the 0 heating mechanism can also be performed.

The above-described disk transport device 100 further has a temperature control mechanism. The temperature adjustment mechanism uses, for example, a hot wire heater or the like, and holds the holding unit 110 (particularly, the suction unit 11).
2) The temperature can be adjusted. According to the injection molding operation described later, when the suction unit 112 sucks the molded substrate, the substrate is in a high temperature state. For this reason, the adsorption unit 1 at room temperature
When 12 comes into contact with such a substrate, the substrate at the contact portion is rapidly cooled, and a large temperature gradient is generated on the substrate. In particular, since the substrate is formed of a resin, the substrate is significantly deformed by temperature. As a result, a deformation called waviness occurs due to a temperature gradient generated on the substrate. In order to solve this problem, the disk transport device 100 of the present invention is provided with a temperature adjusting mechanism for making the temperature of the suction unit 112 equal to the substrate temperature.

The temperature control mechanism has, for example, a structure as shown in FIG. As shown in FIG.
, A sensor 164, and a cooler 166. The suction unit 112 heated by the heater 162 is
4, the temperature is measured. The sensor 164 transmits the detected temperature information to a control unit 168 (not shown).
The controller 168 adjusts the temperature by controlling the energizing time of the heater 162 and the magnitude of the current in consideration of the received temperature information. The cooler 166 can lower the temperature in the disk transport device 100 that has become high with the heating of the heater 162. In addition, the temperature of the suction unit 112 is maintained at a temperature higher than room temperature, for example, by taking out the substrate from the mold, transferring the substrate to the next-stage device, and heating the suction unit 112 of the transfer device in standby by blowing hot air from outside. The same effect can be obtained if it can be done.

The temperature adjusting mechanism is suitable for the tendency of the substrate to be thin. At present, a substrate of 1.2 mm is usually formed, but in the future, a manufacturing method for forming a disk by forming a thin substrate of 0.6 mm like a DVD or the like and bonding them together is desired. Thus, the thickness of the substrate is
, The substrate strength is reduced to 1/8, so that it is easily affected by temperature changes. Therefore, according to the present invention, as described above, the temperature adjustment mechanism is provided in the disk transfer device 100 to reduce and prevent the deformation of the thin substrate due to the temperature.

FIG. 1 and FIG. 4 show a disk transfer apparatus 100 and a disk injection mold 200 according to the present invention.
This will be described with reference to FIG. Here, FIG. 4 is a schematic sectional view of an injection molding machine 300 having an injection mold 200 for a disk. FIG. 4 shows a state in which a mold clamping force is generated, the cavity 270 is completely closed, and a molten resin (such as polycarbonate or polyolefin) is filled in the cavity 270. FIG. The cavity 270 is opened by the opening, and the molded substrate is separated from the fixed mold 220.

Referring to FIG. 1, an injection mold 200 for a disk according to the present invention comprises a fixed mold 210 and a movable mold 22.
0, a fixed platen 230, a movable platen 240,
It has a tie bar 250, a spool 260, a cavity 270 (not shown), and a stamper 280. The direction of gravity is, for example, downward.

The fixed mold 210 and the movable mold 220 are arranged to face each other. For example, the fixed mold 210 has a male taper surface 212 (not shown), and the movable mold 220 has a female taper surface 222 (not shown). have. However,
The fixed mold 210 may have a female tapered surface 222 and the movable mold 220 may have a male tapered surface 212,
Further, the engagement surfaces of the molds 210 and 220 are not limited to the tapered shape as in the present embodiment. Tapered surface 21
2 and 222 cooperate to define an optical disk substrate molding cavity 270.

The fixed mold 210 is fixed to a fixed platen 230, and the movable mold 220 is fixed to a movable platen 240. The movable platen 240 has four tie bars 25
0 penetrates the movable platen 240 and the tie bar 25
It can move relative to the fixed platen 230 along zero. As a result, the movable mold 220 is fixed to the fixed mold 21.
It can move relatively to zero. Movable platen 24
As the zero moving mechanism, a desired mechanism such as a direct pressure type or a toggle type can be adopted.

The spool 260 is a passage space for transporting the melted resin to the cavity 270. The spool 260 is provided perpendicular to the substrate to be formed, as shown in FIG. The cavity 270 is shown in FIGS.
The space between the molds 210 and 220 is filled with the resin that has entered from the spool 260 as shown in FIG. Cavity 2
The resin filled in 70 is cooled and solidified to form a molded substrate. At this time, since the spool 260 and the cavity 270 are continuous spaces, when the supply of the molten resin ends,
The resin in the spool 260 and the resin in the cavity 270 are solidified together, and the resin 115 taken out of the spool 260 is formed simultaneously with the substrate. Chuck 114 described above
Is a member for holding the resin 115 taken out from the spool 260 thus formed. The stamper 280 is a mold in which a concave and convex shape opposite to that of a molded product is engraved.

Referring to FIG. 4 again, an injection molding machine 300 as an exemplary embodiment of the present invention will be described.
The injection molding machine 300 includes a control unit 310 (not shown), a temperature control device 320 (not shown), an injection unit 330, and a servomotor 340 for clamping, in addition to the above-described transfer device 100 and mold 200. . Movable mold 2
A stamper 280 is mounted on the surface (mirror surface) of the fixed die 210 facing the fixed die 210. The stamper 280 has a thickness of 0.
Made of 3mm pure nickel material, its surface has track pitch 0.8μm, width 0.3μm, depth 0.2μm
Of the U-shaped groove and a preformat pattern such as an address pitch and a servo pit are formed on the surface of the optical disk substrate. The stamper 280 may be provided on either the fixed mold 210 or the movable mold 220.

The control unit 310 is connected to the temperature control device 320, the injection unit 330, and the servomotor 340 for mold clamping, and controls these operations. However, one or more control units may be provided to control these operations.

The temperature control device 320 includes the movable platen 23
Pipes are provided in 0 and 240 to control the temperature. The temperature control device 320 is configured by a heating device such as a heater wire and cooling water. The heating device is composed of, for example, a heater wire wound around a pipe. The platen 23 is controlled by controlling the magnitude of the current flowing through the heater wire.
The temperature of the water flowing through the piping in 0 and 240 can be adjusted. Other types of refrigerants (alcohol,
Galden, Freon, etc.) can be used.

The control unit 310 includes platens 230 and 24
The current supplied to the heating device is feedback-controlled (for example, using a variable resistor or the like) so that the temperature of 0 becomes a predetermined temperature (the temperature may be different or the same). The temperature for adjusting the parallelism between the fixed platen 230 and the movable platen 240 is preferably adjusted to the platen temperature at the time of performing the injection molding, and specifically, a temperature in the range of 25 ° C. to 60 ° C. higher than the normal temperature. It is. When the temperatures of the fixed platen 230 and the movable platen 240 are different, the temperature difference is preferably within 15 ° C. Further, the platen parallelism adjustment temperature may have a temperature range of ± 5 ° C., preferably ± 2 ° C. at the same location.

The injection unit 330 has the same structure as that used in a normal injection molding machine, and includes a heating cylinder 332, a screw 334, a hydraulic cylinder (or servomotor) 336 (not shown), and the like. During injection molding, a molten resin such as polycarbonate is injected into the cavity 270 from the injection unit 330. The control unit 310 can control the temperature of the heating cylinder 332, the rotation speed of the screw 334, and the output of the hydraulic cylinder (or servomotor) 336.

The servomotor 340 for clamping is, for example,
Any motorized clamping mechanism known in the art, such as FANUC's ROBOSHOT, can be applied. The control unit 310 can control the mold clamping force by controlling, for example, the number of revolutions of the servomotor and the current flowing through the motor.

In the injection molding machine of the present invention, the mold clamping mechanism is not limited to the electric type, but may be any type known in the art such as a direct pressure mechanism using a hydraulic cylinder and a toggle mechanism using a magic hand. A tightening mechanism can also be used. Hereinafter, operations of the mold 200 and the injection molding machine 300 will be described.

Prior to injection molding, the control unit 310 controls the temperature of the fixed and movable platens 230 and 240 by controlling the temperature adjusting device 320 in advance. Then, the fixed and movable platens 23
The parallelism of 0 and 240 was adjusted. First, fixed mold 2
The temperature of 10 is 126 ° C. and the temperature of the movable mold 220 is 116
° C, and the control unit 310 controls the platens 230 and 240
The feedback control was set to maintain the temperature. The heating temperature of the molten resin in the injection unit 330 was set to 380 ° C.

Next, the mold clamping servomotor 340 is driven to fix the fixed mold 210 and the movable mold 220 to the mold clamping pressure 1.
The mold was clamped at 5 tons. After the mold temperature reaches the above temperature,
Immediately, the polycarbonate resin heated and melted at 380 ° C. was injected into the cavity 270. As shown in FIG.
The cavity 270 is filled with resin. At the time of mold clamping, the alignment is performed by the guide mechanism of the tapered surfaces 212 and 222, and they are completely abutted. Further, a disk substrate on which the signal pattern of the stamper 280 is transferred on one side is formed. At this time, when the supply of the resin ends,
Resin removed from a spool extending from the center of the substrate together with the disk substrate is also formed.

Next, the movable platen 230 is moved by the servo motor 340, and the movable mold 220 is moved to the fixed mold 2.
The mold is opened apart from 10. The substrate cooled in the cavity 270 by opening the mold separates from the fixed mold 210 and remains only in the movable mold 220. At this time, the molded substrate remains adsorbed on the stamper 280 adsorbed on the movable mold 220.

Thereafter, as shown in FIG. 1, the arm portion 120 of the disk transport device 100 of the present invention described above pivots and enters between the dies 210 and 220. The opening / closing opening 1 of the holding unit 110 installed at the tip of the arm unit 120
An opening 16 is provided for chucking the resin taken out of the spool. At the same time that the chuck unit 114 chucks the resin taken out of the spool, the disk substrate is removed from the mold 220 by the vacuum suction of the suction unit 112.
Here, the temperature of the suction section 112 is equal to the temperature of the contacting substrate by the temperature control mechanism. Thereafter, the disk substrate is transported to the next device such as a cooling device or a coating device by rotation of the arm unit 120.

Hereinafter, a method of transporting the disk to the next stage will be described with reference to FIG. 1 again. Here, FIG. 1 is a schematic sectional view for explaining a method of transferring a disk to the next stage by the disk transfer device 100 of the present invention. As mentioned above,
When the injection molding process is completed, it is necessary to move from the mold to the next device for cooling, thin film formation, and the like. The disk transport device 100 is provided with the separated molds 200 (210 and 220).
The arm portion 120 is inserted between them, the resin taken out of the spool by the holding portion 110 is held, and the disk substrate is vacuum-sucked. Then, arm part 1
Reference numeral 20 instantaneously rotates in the direction of arrow C to move the disk at high speed.

Thereafter, the disk D is received by the receiving section 410 of the next-stage apparatus 400, and is completed through further processing steps (for example, formation of a recording film or a protective film). Here, the structure of the receiving unit 410 will be described with reference to FIG. FIG. 5 is a schematic diagram of the receiving section 410 provided in the next-stage apparatus 400. Here, the holding unit 110 and the receiving unit 4 described above are used.
10 has almost the same structure, and will be described below in comparison. In addition, during the injection molding, the resin 115 taken out of the spool 260 together with the substrate may not be formed. In this case, since the holding unit 110 does not need the chuck unit 114 and the opening / closing opening 116, the holding unit 1
10 and the receiving section 410 have the same shape.

Referring to FIG. 5, the receiving section 410 is provided with a suction section 412. As shown in FIG. 1, the disk receiving unit 410 holds a surface opposite to the surface on which the holding unit 110 is sucked, and thus the chuck unit 114 for chucking the resin 115 taken out from the spool 260. Is not necessary. In addition, opening and closing opening 1 for that
No 16 is needed. As a result, the receiving section 410 and the suction section 412 form a complete circle. The suction portion 412 is formed by a suction cup made of silicon, urethane, or the like.
The pressure is reduced by a vacuum pump (not shown) to perform vacuum suction. Further, it is desirable that the suction area of the suction unit 412 and the disk substrate be increased in order to more stably suck the disk.

Further, a suction cup (suction section) 412 provided in the receiving section 410 coincides with the circumferential direction of the disk.
Since the disk is continuous, the receiving unit 410 can vacuum-suck the disk at a uniform density along the circumferential direction. As a result, the substrate can be received without being locally attracted, so that the disk can be transported without causing deformation. The disc received by the receiving unit 410 is then transported into the next-stage device, where various processing is performed. Also, the substrate may not be sufficiently cooled even when the suction section 412 is sucked, so it is desirable that the substrate be heated to some extent.

[0049]

【Example】

Embodiment 1 Injection molding machine 3 having disk transport device 100 of the present invention
Molding experiment 1 was performed using 00. The substrate to be molded is
The thickness was 0.6 mm, the inner diameter was 15 mm, and the outer diameter was 120 mm. As the disc transporting device, U-Shin Seiki DRD Series Servo6000 was used. The molding machine is a direct pressure molding machine SD30 manufactured by Sumitomo Heavy Industries, and the stamper is a recording capacity of 2.6 GB on one side (5.2 GB on both sides).
DVD-RAM format was used. As the molding conditions, the temperature of the fixed mold was controlled at 126 ° C, the movable mold at 116 ° C, and the melt temperature of the resin at 380 ° C. The cycle for forming one substrate was 11.5 s.

The evaluation of the injection molding machine 300 having the disk transfer device 100 was carried out by measuring the variation in the Tilt circumference (undulation) of the molded substrate. The smaller the Tilt circumference variation, the smaller the undulation, and the more accurate the molding. As a comparative control, a similar substrate was manufactured using the conventional holding unit 7 (see FIG. 11), and the Tilt circumference fluctuation was measured. DVD-RAM
Thirty substrates were formed, and the variation in Tilt circumference at the outer periphery (radius 57 mm) of the substrate was measured. Tilt circumference fluctuation is a warp angle evaluation device (S3DL-3M manufactured by Admond Science)
Measured according to I). FIG. 6 shows the results.

In FIG. 6, the vertical axis represents the Tilt circumference variation, the right end of the horizontal axis represents the present embodiment (holding section 110), and the left end of the horizontal axis represents the conventional holding section 7. According to this, the holding unit 11
The value of the Tilt circumference fluctuation of the molded substrate using 0 is 3.0 m.
Below rad, the variation is also concentrated in the range of about 0.6 mrad. On the other hand, the value of the Tilt circumference variation of the molded substrate using the conventional holding unit 7 is 2.8 to 4.2 mr.
Ad is distributed over a wide range, and the shape of the substrate is less uniform. Even if you compare the average of the Tilt circumference fluctuation,
The substrate using the holding unit 110 of this embodiment has a smaller value than the case where the conventional holding unit 7 is used.
This is because the suction unit 1 used for the holding unit 110 of this embodiment is
The shape and function of No. 12 indicate that the molded substrate was transported with stable mechanical characteristics while maintaining high accuracy.

Embodiment 2 Injection molding machine 3 having disk transport device 100 of the present invention
A molding experiment 2 was performed using 00. In order to measure the effect of the temperature of the suction unit 112 of the holding unit 110 on the molded substrate, a temperature control mechanism 160 was provided outside the disk transfer device 100 as shown in FIG. FIG. 7 is a schematic diagram of a temperature control mechanism 160 as an exemplary embodiment. Temperature control mechanism 16
0 indicates a heater 162, a sensor 164, and a cooler 166.
And a control unit 168 (not shown). Heater 16
Reference numeral 2 denotes, for example, a hot-wire heater, which comes into contact with the holding unit 110 made of stainless steel, and the suction unit 1 through the holding unit 110.
The temperature of 12 is adjusted (heated). The sensor 164 uses, for example, a thermocouple or the like to signal the temperature of the suction unit 112. Such a signal is sent to the control unit 168 and the output device.
The temperature can be reduced. Because the heater 16
The heat generated by the control unit 2 is transmitted to the disk transfer device 100 via the arm unit 120 and the like, causing a problem such as a malfunction of the control unit 140. It is desirable to cool the disk transport device 100 in order to prevent a malfunction of the control unit 140. Further, even if the cooling water is merely passed without using the cooler 166, there is an effect.

Using the temperature control mechanism 160, a molding experiment 2 was performed. The temperature of the adsorption unit 112 is 40 ° C., 60 ° C.,
The temperature was changed in four stages of 80 ° C and 100 ° C. Other conditions are the same as those in the molding experiment 1 described above. In this experiment, T
Ilt circumference fluctuation was measured and evaluated. FIG. 8 shows the results.
In FIG. 8, the vertical axis represents the Tilt circumference fluctuation, and the horizontal axis represents the adsorption section 112.
The temperature is taken. According to this, the value of the Tilt circumference fluctuation decreases as the temperature of the adsorption unit 112 increases.
In particular, when the temperature of the adsorption section 112 rises from 40 ° C. to 100 ° C., the average value of the Tilt circumference fluctuation is 4.1 mrad.
From ｍ to 1.3 mrad, which is 1/3. The temperature of the substrate formed by this experiment is estimated to be about 100 ° C. According to the consideration of FIG. 8, the less the temperature difference between the formed substrate and the suction unit 112, the lower the Tilt circumference fluctuation can be. The DVD-RAM substrate is 2 mrad
The following Tilt circumference fluctuations are considered desirable.

Further, molding experiment 3 was performed using the temperature control mechanism 160. As an application of the molding experiment 2, the mold cavity and the pressing amount, which is the molding condition, are adjusted, and the plate thickness is adjusted to 0.4.
mm-DVD-RAM substrate was formed. Other conditions and evaluation methods are the same as in Experiment 2. FIG. 9 shows the results. Experiments 2 and 3 were performed under the conditions that only the thicknesses of the substrates were different.
And FIG. 9 tend to be similar. However, the value of the Tilt circumference fluctuation is larger on a substrate with a plate thickness of 0.4 mm (Experiment 3) than on a substrate with a plate thickness of 0.6 mm (Experiment 2). For example, under the experimental conditions of 40 ° C., the Tilt circumference fluctuation value of Experiment 3 is almost twice that of Experiment 2. In addition, the average reduction rate of the Tilt circumference fluctuation when the temperature of the adsorption section 112 rises from 40 ° C. to 100 ° C. is larger in the case of the 0.4 mm-thick substrate (Experiment 3), and is reduced to about ４. did.

From the above experimental results, the disk transfer device 100 of the present invention can form a substrate with less undulation than the conventional one. Further, by the temperature control mechanism 160,
Further, undulation of the substrate can be reduced. It has also been found that the effect of the temperature control mechanism 160 increases as the thickness of the substrate decreases.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of the invention. For example, in the present invention, the type of disk (such as a magneto-optical disk and a DVD) is not limited as long as the disk substrate is formed by injection molding.

[0058]

According to the disk transport device as an exemplary embodiment of the present invention, the disk is suctioned at a uniform density along the circumferential direction by the suction portion of the holding portion, so that a disk with less waviness can be provided. it can. Further, since the suction unit has a heating mechanism and the temperature of the suction unit can be made equal to the substrate temperature at the time of molding, a disk with less undulation can be provided. In addition, when a thin substrate is formed, in addition to the above-described effects, it is possible to transfer a substrate with stable mechanical characteristics.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a disk transport device and a next-stage device as an exemplary embodiment of the present invention.

FIG. 2 is a schematic diagram of a holding unit provided in the disk transport device of FIG.

FIG. 3 is a schematic diagram when an opening and closing opening of a holding unit in FIG. 2 is open.

FIG. 4 is a schematic sectional view of an injection molding machine having an injection molding die for a disk.

FIG. 5 is a schematic diagram of a receiving unit provided in a next-stage apparatus.

FIG. 6 is a view showing the result of molding experiment 1.

FIG. 7 is a schematic diagram of a temperature control mechanism as an exemplary embodiment.

FIG. 8 is a view showing the result of molding experiment 2.

FIG. 9 is a view showing the result of molding experiment 3.

FIG. 10 is a schematic perspective view of a removal machine of a conventional disk injection molding system.

FIG. 11 is a schematic view of a holding unit provided in a take-out machine of the disk injection molding system of FIG.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 fixed mold 2 movable mold 3 fixed platen 4 movable platen 5 tie bar 6 extractor (transfer device) 7 holding unit 8 suction pad 9 chuck unit 10 opening 100 disk transfer device 110 holding unit 120 arm unit 130 drive unit 140 control Unit 150 Vacuum pump 160 Temperature control mechanism 200 Injection mold for disk 210 Fixed mold 220 Movable mold 230 Fixed platen 240 Movable platen 250 Tie bar 260 Spool 270 Cavity 280 Stamper 212 Tapered surface 222 Tapered surface 300 Injection molding machine 310 Control unit 320 Temperature control device 330 Injection unit 340 Servo motor for mold clamping 400 Next stage device 410 Receiving unit

Continued on the front page F-term (reference) 3C007 DS05 ES02 ET02 EV02 EV22 EW00 FS01 FT06 FU01 FU02 GU03 NS09 NS11 3F060 AA01 AA07 CA21 DA10 EB02 EB12 GA03 GA14 HA00 HA03 3F061 AA03 BA02 BB02 BE02 BE42 BF00 DC01 DB02 CC02 DD05 DD13 DD17 GG07 GG22 GG28 JJ03

Claims (10)

[Claims] 1. A disk transport device for transporting a disk substrate injection-molded by an injection molding machine to a subsequent device, wherein the disk substrate is adsorbed on the disk substrate at a uniform density along a circumferential direction of the disk substrate. A disk transport device having a suction unit and a movable unit connected to the suction unit and moving the disk substrate sucked by the suction unit between the injection molding machine and the next device. 2. The suction unit has an opening and closing mechanism for opening and closing,
2. The disk transport device according to claim 1, comprising a substantially circular suction pad. 3. The disk transport device according to claim 1, further comprising a temperature control unit for controlling a temperature of the suction unit. 4. The disk transport device according to claim 3, wherein the temperature control unit controls the temperature of the suction unit so that the temperature of the suction unit is close to the temperature at which the disk substrate is taken out. 5. A disk transport device for transporting a disk substrate injection-molded by an injection molding machine to a next-stage device, comprising: a suction unit for sucking the disk substrate; and a temperature controller for controlling a temperature of the suction unit. And a movable part connected to the suction part and moving the disk substrate sucked by the suction part between the injection molding machine and the next-stage device. 6. The disk transport device according to claim 5, wherein the temperature control unit controls the temperature of the suction unit so that the temperature of the suction unit is close to the temperature at which the disk substrate is taken out. 7. A holding section for receiving and holding a disk substrate injection-molded by an injection molding machine from a transfer device, and a temperature control section for controlling a temperature of the holding section, and provided at a subsequent stage of the injection molding machine. Disposed processing equipment. 8. The processing apparatus according to claim 7, wherein the temperature control unit controls the temperature of the holding unit so that the temperature of the holding unit is close to the temperature at which the disk substrate is received. 9. A step of forming a disk substrate by injection molding; a step of sucking the disk substrate at a uniform density along a circumferential direction of the disk substrate; and a step of transporting the disk substrate to a next-stage apparatus. A disk manufacturing method comprising: 10. A disk manufacturing method, comprising: a step of forming a disk substrate by injection molding; a step of transporting the disk substrate to a next-stage device; and a step of controlling the temperature of the transported disk substrate.