JP2001198823A - Recovery device for abrasive - Google Patents

Recovery device for abrasive

Info

Publication number
JP2001198823A
JP2001198823A JP2000006758A JP2000006758A JP2001198823A JP 2001198823 A JP2001198823 A JP 2001198823A JP 2000006758 A JP2000006758 A JP 2000006758A JP 2000006758 A JP2000006758 A JP 2000006758A JP 2001198823 A JP2001198823 A JP 2001198823A
Authority
JP
Japan
Prior art keywords
slurry
abrasive
storage tank
polishing
washing water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000006758A
Other languages
Japanese (ja)
Inventor
Akira Matsumoto
章 松本
Makoto Nomura
誠 埜村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurita Water Industries Ltd
Original Assignee
Kurita Water Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Industries Ltd filed Critical Kurita Water Industries Ltd
Priority to JP2000006758A priority Critical patent/JP2001198823A/en
Publication of JP2001198823A publication Critical patent/JP2001198823A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

PROBLEM TO BE SOLVED: To miniaturizing the whole device by significantly reducing the amount of cleaning water necessary for removing soluble impurities, fine grinding chips and the like by cleaning, thereby minimizing the capacities of a cleaning water storage tank and a slurry storage tank, in recovering abrasive from grinding process drainage. SOLUTION: This recovery device for abrasive concentrates grinding process drainage with a centrifugal separator 4, wherein switching is conducted between introduction of grinding process drainage into the centrifugal separator 4 and introduction of cleaning water from the cleaning water storage tank 3 to conduct cleaning and concentration with the centrifugal separator 4.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体製造工程等
における化学的機械研磨(CMP:Chemical
Mechanical Polishing)工程から
排出される研磨工程排水から、研磨材粒子を効率的に回
収して再利用するための装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chemical mechanical polishing (CMP) in a semiconductor manufacturing process or the like.
TECHNICAL FIELD The present invention relates to an apparatus for efficiently collecting and reusing abrasive particles from wastewater from a polishing step discharged from a mechanical polishing step.

【0002】[0002]

【従来の技術及び先行技術】半導体ウエハ及びその上に
形成された絶縁膜、メタル薄膜等の被膜の表面は高度な
平坦面であることが望まれる。従来、ウエハや、その上
に形成された被膜の平坦化には、研磨材のスラリを用い
て化学的機械研磨(CMP)する方法が採用されてい
る。この方法では、研磨パッド等の研磨部材と半導体ウ
エハとの間に研磨材スラリを介在させた状態で研磨を行
い、半導体ウエハあるいはシリコン酸化膜や金属薄膜等
の被膜表面を平坦化する。このCMPで用いられる研磨
材としては、分散性が良好で、平均粒子径が揃っている
シリカ微粒子(コロイダルシリカ)が一般的に使用され
ている。また、研磨速度の高い酸化セリウム(Ce
)や、硬度が高く安定なアルミナ(Al)等
も使用されている。酸化セリウムやアルミナ等の無機酸
化物は、平均粒子径が0.05〜0.5μm程度の粒子
が水中に分散したスラリとして使用されており、通常、
このスラリ中には、pH調整剤(KOH,NHOH,
有機酸,アミン類)や界面活性剤(分散剤)、酸化剤
(H,KIO,Fe(NO)等が別途添
加されて使用される。
2. Description of the Related Art It is desired that the surfaces of semiconductor wafers and films formed thereon, such as insulating films and metal thin films, be highly flat. 2. Description of the Related Art Conventionally, for planarizing a wafer and a film formed thereon, a method of performing chemical mechanical polishing (CMP) using a slurry of an abrasive has been adopted. In this method, polishing is performed with an abrasive slurry interposed between a polishing member such as a polishing pad and a semiconductor wafer to flatten the surface of the semiconductor wafer or a coating film such as a silicon oxide film or a metal thin film. As the abrasive used in the CMP, silica fine particles (colloidal silica) having good dispersibility and uniform average particle diameter are generally used. In addition, cerium oxide (Ce) having a high polishing rate
O 2), or the like high hardness stable alumina (Al 2 O 3) are also used. Inorganic oxides such as cerium oxide and alumina are used as a slurry in which particles having an average particle diameter of about 0.05 to 0.5 μm are dispersed in water.
In this slurry, a pH adjuster (KOH, NH 4 OH,
Organic acids and amines), a surfactant (dispersant), an oxidizing agent (H 2 O 2 , KIO 3 , Fe (NO 3 ) 3 ) and the like are separately added and used.

【0003】この研磨材スラリは、1枚のウエハ当りの
使用量が多く、しかも非常に高価であることから、ウエ
ハのCMP工程から排出される排水から研磨材を回収
し、回収した研磨材を用いて所定の組成の研磨材スラリ
を調整し、これを再利用することが望まれる。このよう
な回収再利用は廃液処理量の低減の面からも重要であ
る。
[0003] Since this abrasive slurry is used in a large amount per one wafer and is very expensive, the abrasive is recovered from wastewater discharged from a wafer CMP process, and the recovered abrasive is collected. It is desired to adjust the abrasive slurry having a predetermined composition by using the slurry and reuse the slurry. Such recovery and reuse is also important from the viewpoint of reducing the amount of waste liquid treatment.

【0004】しかし、CMP工程から排出される排水は
その使用により稀釈されて研磨材濃度が低下している上
に、被研磨物である半導体ウエハや被膜層を形成する薄
膜材料或いは研磨パッド等の研磨部材が削り取られた研
磨屑、研磨材としての無機酸化物粒子が破壊された微細
粒子や、研磨された薄膜材料片等と研磨粒子とが凝集す
ることによって生じる粒径の大きな研磨屑等の不純物が
混入したものである。このため、このような研磨工程排
水を無処理で研磨材として再利用すると、ウエハ表面に
キズを発生させたり、研磨屑の蓄積により研磨力が低下
したり、更には研磨材濃度の低下による研磨速度低下に
つながることから、この研磨工程排水はそのまま循環再
利用することはできない。従って、研磨工程排水の再利
用に当っては、不純物の除去、濃縮等の処理を行って研
磨材を回収し、所定の組成の研磨材スラリを再調整する
ことが必要となる。
However, the wastewater discharged from the CMP process is diluted by its use to reduce the abrasive concentration, and furthermore, a semiconductor wafer to be polished, a thin film material for forming a coating layer, a polishing pad, or the like. Polishing debris from which the polishing member has been scraped, fine particles in which inorganic oxide particles as abrasive have been destroyed, and polishing debris having a large particle diameter caused by agglomeration of the polished thin film material pieces and the polishing particles. It is a mixture of impurities. For this reason, if such polishing process wastewater is reused as an abrasive without treatment, scratches are generated on the wafer surface, polishing power is reduced due to accumulation of polishing debris, and polishing due to a decrease in abrasive concentration is further reduced. The polishing process wastewater cannot be circulated and reused as it is because it leads to a reduction in speed. Therefore, in reusing the wastewater from the polishing step, it is necessary to recover the abrasive by performing a process such as removal of impurities and concentration, and to readjust an abrasive slurry having a predetermined composition.

【0005】本出願人は、この研磨工程排水から研磨材
を回収して再利用するための技術として、酸化セリウム
やアルミナ等の研磨材粒子の比重が大きいことに着目
し、遠心分離機を用いてこれを濃縮し、遠心分離後の濃
縮スラリから塩類や有機物、微小な研磨屑などの不純物
を除去するために水洗浄を行って、研磨材を回収する装
置を先に提案した(特願平11−189347号等。以
下「先願」という。)。
As a technique for recovering and reusing the abrasive from the polishing process wastewater, the present applicant has focused on the fact that abrasive particles such as cerium oxide and alumina have a large specific gravity, and have used a centrifugal separator. We have previously proposed a device that concentrates the water and removes impurities such as salts, organic matter, and fine polishing debris from the concentrated slurry after centrifugation, and then recovers the polishing material (Japanese Patent Application No. Hei 10-26139). No. 11-189347, etc., hereinafter referred to as “first application”).

【0006】[0006]

【発明が解決しようとする課題】先願の装置によれば、
研磨工程排水から研磨材として容易に再利用可能な研磨
材粒子を効率的に回収することができるが、先願の装置
では、遠心分離機で濃縮したスラリ中に含まれる溶解性
の不純物や微細な研磨屑等を洗浄除去するために、濃縮
スラリの全量を洗浄水で希釈洗浄した後、これを遠心分
離機に循環するなどして濃縮していた。このように濃縮
スラリの全量を洗浄水で希釈洗浄する方法では、大量の
洗浄水が必要となり、従って、洗浄水を貯留するための
洗浄水貯槽も大容量のものが必要となる。また、一旦濃
縮したスラリを希釈するため、濃縮率を上げることがで
きず、更には、この希釈スラリを受け入れるための貯槽
も大型化することから、装置の設置面積に制約を受ける
結果となっていた。
According to the device of the prior application,
Abrasive particles that can be easily reused as abrasive can be efficiently recovered from the polishing process wastewater.However, in the device of the prior application, soluble impurities and fine particles contained in the slurry concentrated by the centrifugal separator are used. In order to wash and remove unnecessary polishing debris and the like, the entire amount of the concentrated slurry was diluted and washed with washing water, and then concentrated by circulating through a centrifuge. The method of diluting and washing the entire amount of the concentrated slurry with the washing water as described above requires a large amount of washing water, and therefore requires a large-capacity washing water storage tank for storing the washing water. Also, since the once concentrated slurry is diluted, the concentration rate cannot be increased, and the storage tank for receiving the diluted slurry is also increased in size, resulting in a restriction on the installation area of the apparatus. Was.

【0007】本発明は、このような問題点を解決し、研
磨工程排水から研磨材を回収するに当たり、溶解性の不
純物や微細な研磨屑等を洗浄除去するために必要とされ
る洗浄水量を大幅に低減して、洗浄水貯槽やスラリ貯槽
を小容量化し、装置全体を小型化することができる研磨
材の回収装置を提供することを目的とする。
SUMMARY OF THE INVENTION The present invention solves such a problem and, when recovering the abrasive from the polishing process wastewater, reduces the amount of cleaning water required for cleaning and removing soluble impurities and fine polishing debris. It is an object of the present invention to provide an abrasive recovery apparatus capable of greatly reducing the size of a washing water storage tank or a slurry storage tank and reducing the size of the entire apparatus.

【0008】[0008]

【課題を解決するための手段】本発明の研磨材の回収装
置は、研磨工程排水から研磨材を回収する装置におい
て、固液分離手段と、該固液分離手段に研磨工程排水を
導入する手段と、洗浄水貯槽と、前記固液分離手段に該
洗浄水貯槽中の洗浄水を導入する手段と、前記固液分離
手段への研磨工程排水の導入と洗浄水の導入とを切り替
える切り替え手段とを備えてなることを特徴とする。
SUMMARY OF THE INVENTION The present invention relates to an apparatus for recovering abrasives from a polishing process wastewater, comprising: a solid-liquid separating means; and a means for introducing the polishing process wastewater to the solid-liquid separating means. A washing water storage tank, a means for introducing the washing water in the washing water storage tank to the solid-liquid separation means, and a switching means for switching between introduction of the polishing process wastewater and introduction of the washing water to the solid-liquid separation means. It is characterized by comprising.

【0009】本発明の研磨材の回収装置では、固液分離
手段への研磨工程排水の導入と洗浄水の導入とを切り替
え、研磨工程排水を固液分離して得られる分離液を洗浄
水で置換するようにして洗浄を行うことにより、溶解性
の不純物や微細な研磨屑等を、少ない洗浄水量で効率的
に洗浄除去することができる。
In the apparatus for recovering abrasives of the present invention, the introduction of wastewater from the polishing step and the introduction of washing water into the solid-liquid separation means are switched, and the separated liquid obtained by solid-liquid separation of the wastewater from the polishing step is washed with washing water. By performing the cleaning by replacing, it is possible to efficiently remove soluble impurities and fine polishing debris with a small amount of cleaning water.

【0010】本発明においては、特に固液分離手段とし
て遠心分離手段を用いるのが好ましい。この場合、遠心
分離手段に研磨工程排水を導入して遠心分離を行うと、
研磨工程排水中の固形物は遠心分離手段のローターの周
壁に集積し、分離液は中心部に集められる。この状態
で、切り替え手段により遠心分離手段に導入する液を研
磨工程排水から洗浄水に切り替えると、分離液が導入さ
れた洗浄水で押し出され、溶解性の不純物や微細な研磨
屑等を含んだ分離液が洗浄水で置換され、良好な洗浄効
果が得られる。
In the present invention, it is particularly preferable to use a centrifugal separator as the solid-liquid separator. In this case, when the polishing process wastewater is introduced into the centrifugal separator and centrifuged,
The solids in the wastewater from the polishing process accumulate on the peripheral wall of the rotor of the centrifugal separator, and the separated liquid is collected at the center. In this state, when the liquid to be introduced into the centrifugal separation means is switched from the polishing step wastewater to the washing water by the switching means, the separated liquid is pushed out by the introduced washing water, and contains soluble impurities and fine polishing debris. The separated liquid is replaced with washing water, and a good washing effect is obtained.

【0011】[0011]

【発明の実施の形態】以下に図面を参照して本発明の実
施の形態を詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0012】図1(a)は本発明の研磨材の回収装置の
実施の形態を示す系統図であり、図1(b)は図1
(a)の要部(洗浄水貯槽、遠心分離機及びスラリ貯
槽)拡大図である。
FIG. 1A is a system diagram showing an embodiment of an apparatus for collecting abrasives according to the present invention, and FIG.
It is an enlarged view of the important section (a) (wash water storage tank, centrifuge, and slurry storage tank) of (a).

【0013】図1の研磨材の回収装置では、CMPの研
磨工程から排出された研磨材を含む研磨工程排水を、貯
留槽1を経て、まず、MF(精密濾過)膜分離装置2に
導入して全量を膜濾過することにより、研磨工程で発生
する研磨パット屑などの、研磨材粒子に比べて粒径の大
きな不純物を除去する。
In the apparatus for recovering abrasives shown in FIG. 1, polishing process wastewater containing abrasives discharged from the CMP polishing step is first introduced into a MF (microfiltration) membrane separation device 2 through a storage tank 1. By performing membrane filtration on the entire amount, impurities having a larger particle size than the abrasive particles, such as polishing pad debris generated in the polishing step, are removed.

【0014】この不純物の除去に用いる膜分離装置は、
MF膜分離装置に限らず、UF(限外濾過)膜分離装置
でも良く、用いるMF膜又はUF膜としては、このよう
な大粒径の不純物が除去できればよく、一般的には孔径
25〜30μm程度のものが好適である。MF膜材質と
しては、ポリプロピレン、ポリカーボネート、三酢化セ
ルロース、ポリアミド、ポリ塩化ビニル、ポリフッ化ビ
ニリデン等が用いられる。また、UF膜材質としては、
ポリサルフォン、セルロース、酢酸セルロース、ポリエ
チレンなどが例示される。特に、これらのいずれかの単
繊維をワインドしたワインドタイプの濾過エレメントを
有するMF膜やUF膜を用いるのが好ましい。
The membrane separation apparatus used for removing the impurities is as follows:
Not limited to the MF membrane separator, a UF (ultrafiltration) membrane separator may be used. The MF membrane or the UF membrane to be used only needs to be able to remove such large-diameter impurities, and generally has a pore diameter of 25 to 30 μm. A degree is preferred. As the MF film material, polypropylene, polycarbonate, cellulose triacetate, polyamide, polyvinyl chloride, polyvinylidene fluoride and the like are used. Also, as the UF film material,
Examples thereof include polysulfone, cellulose, cellulose acetate, and polyethylene. In particular, it is preferable to use an MF membrane or a UF membrane having a wind-type filtration element obtained by winding any of these single fibers.

【0015】この膜濾過条件としては、基本的には全量
濾過方式とする。運転に際しては入口と出口の差圧が1
kgf/cm以上になったら逆洗をかけるか、又は膜
の交換を行うのが好ましい。
The membrane filtration conditions are basically a whole volume filtration system. During operation, the differential pressure between the inlet and outlet is 1
It is preferable to perform backwashing or exchange the membrane when the weight becomes kgf / cm 2 or more.

【0016】なお、この粗大不純物除去のための膜分離
装置は、必ずしも必要とされず、また、次の遠心分離機
4の後段に設けても良い。
The membrane separation device for removing the coarse impurities is not always required, and may be provided at the subsequent stage of the next centrifuge 4.

【0017】MF膜分離装置2の透過液(以下「前処理
スラリ」又は「原水」と称す場合がある。)は次いで遠
心分離機4等の固液分離手段に導入されて濃縮される。
この固液分離手段としては、MF膜分離装置2で粗大不
純物が除去された研磨工程排水を濃縮できるものであれ
ば良く、遠心分離機4の他、適当な分画分子量又は孔径
を選定することにより、MF又はUF膜分離装置を用い
ることもできるが、後述の洗浄水の置換による良好な洗
浄効果が得られる点で遠心分離機を用いるのが好まし
い。
The permeate of the MF membrane separation device 2 (hereinafter sometimes referred to as “pre-treatment slurry” or “raw water”) is then introduced into a solid-liquid separation means such as a centrifuge 4 and concentrated.
As the solid-liquid separation means, any means can be used as long as it can concentrate the polishing process wastewater from which coarse impurities have been removed by the MF membrane separation device 2. In addition to the centrifugal separator 4, an appropriate fractionated molecular weight or pore size should be selected. , A MF or UF membrane separation apparatus can be used, but it is preferable to use a centrifugal separator in that a good washing effect can be obtained by replacing washing water as described below.

【0018】図1の研磨材の回収装置では、固液分離手
段として遠心分離機4を用いて濃縮を行う。なお、この
遠心分離機4には、後段のスラリ貯槽5の洗浄濃縮スラ
リが循環される。
In the apparatus for recovering abrasives shown in FIG. 1, concentration is performed using a centrifugal separator 4 as solid-liquid separating means. The washing / concentrating slurry in the slurry storage tank 5 at the subsequent stage is circulated through the centrifugal separator 4.

【0019】本発明では、この遠心分離機4への前処理
スラリの導入と、洗浄水貯槽3からの洗浄水の導入とを
弁の開閉により切り換える。
In the present invention, the introduction of the pretreatment slurry into the centrifugal separator 4 and the introduction of the washing water from the washing water storage tank 3 are switched by opening and closing a valve.

【0020】以下に、この切り換え操作の手順について
説明する。
The procedure of the switching operation will be described below.

【0021】1.原水導入 弁V,V開、弁V,Vを閉、ポンプP,P
停止で、原水を遠心分離機4に導入する。このとき、濃
縮水を連続排出し、スラリ貯槽5内に貯留させる。この
原水導入工程は予め設定された時間又は、スラリ貯槽が
一定水位になるまで、即ち、レベルスイッチが所定水位
を検知するまで実施される。
1. Raw water inlet valve V 1, V 4 to open, the valve V 2, V 3 closed, pump P 1, P 2
At the stop, the raw water is introduced into the centrifuge 4. At this time, the concentrated water is continuously discharged and stored in the slurry storage tank 5. This raw water introduction step is performed for a preset time or until the slurry storage tank reaches a certain water level, that is, until the level switch detects a predetermined water level.

【0022】2.再濃縮 弁V開、弁V,V,Vを閉、ポンプP停止、
ポンプP起動で、スラリ貯槽5内の洗浄濃縮スラリを
遠心分離機4に導入する。このときの濃縮水は遠心分離
機4内に貯留させ排出しない。これにより、洗浄濃縮ス
ラリが再濃縮される。
2. Reconcentrated valve V 3 opens, the valve V 1, V 2, V 4 closed, pump P 1 stop,
In the pump P 2 starts, to introduce wash thickened slurry in the slurry storage tank 5 to the centrifuge 4. The concentrated water at this time is stored in the centrifuge 4 and is not discharged. Thereby, the washing concentration slurry is re-concentrated.

【0023】この再濃縮工程は、スラリ貯槽5が空にな
るまで、実施される。従って、スラリ貯槽5には、水位
計(レベルスイッチ)を設け、スラリ貯槽5内のスラリ
がなくなったことを検知するようにするのが好ましい。
This re-concentration step is performed until the slurry storage tank 5 becomes empty. Therefore, it is preferable to provide a water level gauge (level switch) in the slurry storage tank 5 so as to detect that the slurry in the slurry storage tank 5 has run out.

【0024】3.洗浄水導入 弁V開、弁V,V,Vを閉、ポンプP起動、
ポンプP停止で、再濃縮された洗浄濃縮スラリが貯留
されている遠心分離機4内に、洗浄水貯槽3内の洗浄水
を導入する。これにより、遠心分離機4内に残留する分
離液が洗浄水により置換され濃縮スラリが洗浄される。
この洗浄水導入工程は、予め設定された時間実施され
る。
3. Washing water introduction valve V 2 opens, the valve V 1, V 3, V 4 closed, pump P 1 starts,
In the pump P 2 stop, in a centrifuge 4 which cleaning concentrate slurry which is reconcentrated are stored, introducing washing water in the washing water storage tank 3. Thereby, the separated liquid remaining in the centrifugal separator 4 is replaced by the washing water, and the concentrated slurry is washed.
This washing water introduction step is performed for a preset time.

【0025】4.スラリ排出 弁V,V開、弁V,V閉、ポンプP起動、ポ
ンプP停止で、遠心分離機4内に貯留されているスラ
リを洗浄水によって、スラリ貯槽5に押し出す。このス
ラリ排出工程はスラリ貯槽5が一定の水位になるまで、
即ち、レベルスイッチが所定水位を検知するまで実施さ
れる。
4. When the slurry discharge valves V 2 and V 4 are opened, the valves V 1 and V 3 are closed, the pump P 1 is started, and the pump P 2 is stopped, the slurry stored in the centrifuge 4 is pushed out into the slurry storage tank 5 by the washing water. . This slurry discharge process is performed until the slurry storage tank 5 reaches a certain water level.
That is, the operation is performed until the level switch detects the predetermined water level.

【0026】5.繰返確認 弁V〜V閉、ポンプP,P停止状態とし、[繰
返回数]に1を加算した後、上記の工程を予め設定して
ある設定回数と繰返回数とを比較し、[設定回数]>
[繰返回数]の場合:1の原水導入工程へ戻る。 [設定回数]=[繰返回数]の場合:6の完了工程へ移
行し処理を完了する。
[5] Repetitive check valve V 1 ~V 4 closed, the pump and P 1, P 2 stop state, adds 1 to the number of repetitions, and a set number of times and repeat count that is set in advance the above step Compare, [Set times]>
In the case of [the number of repetitions], the process returns to the raw water introduction step of 1. If [Set number] = [Repeat number]: Move to the completion step 6 to complete the process.

【0027】6.完了 処理を完了すると共に、繰返回数を0(クリア)にす
る。
6. Completion The processing is completed and the number of repetitions is set to 0 (clear).

【0028】上記一連の工程における弁及びポンプの操
作手順は表1にまとめて示す。
The operating procedure of the valves and pumps in the above series of steps is summarized in Table 1.

【0029】[0029]

【表1】 [Table 1]

【0030】なお、このような一連の処理を自動制御す
る場合は、シーケンサなどの公知の制御装置を用いて、
工程歩進や工程ジャンプを実施させれば良い。
When such a series of processing is automatically controlled, a known control device such as a sequencer is used.
What is necessary is just to carry out a process step or a process jump.

【0031】このように遠心分離機4による濃縮と洗浄
水導入による洗浄と押し出しを行うことにより、少ない
洗浄水量にて効率的な濃縮、洗浄を行うことができ、溶
解性の不純物や微細な研磨屑等が除去される。
By performing the concentration by the centrifugal separator 4 and the washing and the extrusion by introducing the washing water in this manner, efficient concentration and washing can be performed with a small amount of washing water, and soluble impurities and fine polishing can be performed. Debris is removed.

【0032】なお、遠心分離機4としては、遠心力を利
用した一般的な分離手段、例えば、分離板式デカンタ、
サイクロン、回転円筒式等の各種の遠心分離手段を用い
ることができる。この遠心分離機4による濃縮の程度に
は特に制限はないが、通常の場合、濃縮液中のスラリ
(SS)濃度が5〜50重量%程度となるような濃縮条
件とするのが好ましい。
As the centrifugal separator 4, a general separating means utilizing centrifugal force, for example, a separating plate type decanter,
Various types of centrifugal separation means such as a cyclone and a rotating cylindrical type can be used. The degree of concentration by the centrifugal separator 4 is not particularly limited, but in general, it is preferable to set the concentration conditions such that the concentration of the slurry (SS) in the concentrate is about 5 to 50% by weight.

【0033】この遠心分離機4で分離した水(分離液)
は系外へ排出して廃水処理する。
Water (separated liquid) separated by the centrifuge 4
Is discharged outside the system for wastewater treatment.

【0034】この研磨材の回収装置では、洗浄水として
分散剤水溶液(分散剤を洗浄水としての超純水に溶解し
たもの)を用い、分散剤水溶液で洗浄を行う。
In this abrasive recovery apparatus, an aqueous dispersant solution (a dispersant dissolved in ultrapure water as the wash water) is used as the wash water, and washing is performed with the aqueous dispersant solution.

【0035】ここで用いられる分散剤としては、研磨材
の分散剤として一般的に使用されるもので良く、例え
ば、以下に示すような金属イオン類を含まない分散剤が
挙げられる。
The dispersant used here may be any one generally used as a dispersant for an abrasive, and examples thereof include the following dispersants that do not contain metal ions.

【0036】アクリル酸重合体及びそのアンモニウム
塩、メタクリル酸重合体及びそのアンモニウム塩、ポリ
ビニルアルコール等の水溶性有機高分子類 ラウリル硫酸アンモニウム、ポリオキシエチレンラウリ
ルエーテル硫酸アンモニウム等の水溶性陰イオン性界面
活性剤 ポリオキシエチレンラウリルエーテル、ポリエチレング
リコールモノステアレート等の水溶性非イオン性界面活
性剤 モノエタノールアミン、ジエタノールアミン等の水溶性
アミン類 この分散剤水溶液は、薬剤貯槽(図示せず)又は洗浄水
貯槽で超純水に分散剤を添加して所定濃度に調整したも
のを添加すれば良く、この分散剤水溶液中の分散剤の濃
度には特に制限はないが、通常の場合、10〜1000
0ppmの範囲で洗浄温度や回収スラリに要求される分
散剤濃度等に応じて適宜決定される。
Water-soluble organic polymers such as acrylic acid polymers and their ammonium salts, methacrylic acid polymers and their ammonium salts, polyvinyl alcohol, etc. Water-soluble anionic surfactants such as ammonium lauryl sulfate and ammonium polyoxyethylene lauryl ether sulfate Water-soluble nonionic surfactants such as polyoxyethylene lauryl ether and polyethylene glycol monostearate Water-soluble amines such as monoethanolamine and diethanolamine This aqueous dispersant solution is used in a chemical storage tank (not shown) or a washing water storage tank. What is necessary is just to add a dispersant adjusted to a predetermined concentration by adding a dispersant to ultrapure water, and the concentration of the dispersant in the aqueous solution of the dispersant is not particularly limited.
In the range of 0 ppm, it is appropriately determined according to the washing temperature, the dispersant concentration required for the recovered slurry, and the like.

【0037】このように洗浄水として分散剤水溶液を用
いることにより、洗浄中における分散剤濃度の低下や研
磨材粒子表面の分散剤の剥離の問題は解消される。
As described above, by using the aqueous solution of the dispersant as the washing water, the problems of the decrease in the concentration of the dispersant during the washing and the peeling of the dispersant on the surface of the abrasive particles are eliminated.

【0038】即ち、研磨材は、その使用に当り、スラリ
中で所定の粒子径に凝集分散するように、その表面が分
散剤で被覆されている。しかし、回収工程で水洗浄を行
うと、この分散剤の濃度低下が生じ、水洗浄の時間、水
量、頻度等によっては、研磨材表面や近傍に存在する分
散剤が洗浄除去されてしまう場合が生じる。特に、研磨
材表面や、その近傍の分散剤が除去されてしまうと、研
磨材粒子が凝集粗大化してしまい、所定の粒子径に再分
散させるのが困難ないし不可能になることがある。従っ
て、このような不具合を生じないようにするためには、
水洗浄の時間、水量、頻度等の洗浄条件を厳密に管理す
ることが必要となる。
That is, when the abrasive is used, its surface is coated with a dispersant such that the abrasive is coagulated and dispersed to a predetermined particle size in the slurry. However, when the water washing is performed in the recovery step, the concentration of the dispersant decreases, and depending on the time of water washing, the amount of water, the frequency, and the like, the dispersant present on or near the abrasive material may be washed away. Occurs. In particular, if the dispersant on or near the abrasive surface is removed, the abrasive particles are agglomerated and coarsened, and it may be difficult or impossible to redisperse the particles to a predetermined particle diameter. Therefore, in order to avoid such a problem,
It is necessary to strictly control the cleaning conditions such as the time, amount of water, and frequency of water cleaning.

【0039】これに対して、分散剤を含む洗浄水であれ
ば、この問題が解消され、研磨工程排水から研磨材とし
て容易に再利用可能な研磨材粒子のスラリをより一層容
易かつ効率的に回収することが可能となる。
On the other hand, if the washing water contains a dispersant, this problem is solved, and the slurry of the abrasive particles that can be easily reused as the abrasive from the wastewater in the polishing process can be more easily and efficiently. It becomes possible to collect.

【0040】この洗浄に用いる分散剤水溶液の量が少な
すぎると十分な洗浄効果が得られず、逆に過度に多いと
使用水量が増大して回収処理コストが増大するため、通
常の場合、遠心分離機4の濃縮液に対して1〜100容
量倍の分散剤水溶液を用いるのが好ましい。
If the amount of the aqueous solution of the dispersant used for this washing is too small, a sufficient washing effect cannot be obtained. Conversely, if the amount is too large, the amount of water used increases and the cost of the recovery treatment increases. It is preferable to use 1 to 100 times the volume of the aqueous dispersant solution with respect to the concentrated liquid of the separator 4.

【0041】このようにMF膜分離装置2での粗大固形
物の膜分離と、遠心分離機4での循環洗浄、濃縮を行う
ことにより、研磨材粒子よりも粒径の大きい不純物や塩
類、有機物等の溶解成分或いは微細な研磨屑等の不純物
が除去された研磨粒子のスラリを得ることができるが、
このスラリには、なお更に洗浄、濃縮工程での研磨材粒
子の再凝集で粗大化した粗大凝集物が含有されている。
As described above, the membrane separation of the coarse solids in the MF membrane separation device 2 and the circulating washing and concentration in the centrifugal separator 4 perform impurities, salts and organic substances having a particle size larger than the abrasive particles. It is possible to obtain a slurry of abrasive particles from which impurities such as dissolved components or fine polishing debris have been removed.
The slurry further contains coarse aggregates that are coarsened by reagglomeration of the abrasive particles in the washing and concentration steps.

【0042】図1の研磨材の回収装置では、この粗大凝
集物を含むスラリを膜分離装置でなお更に残留する粗大
粒子を膜分離除去する。
In the apparatus for collecting abrasives shown in FIG. 1, the slurry containing the coarse aggregates is further separated by a membrane separation apparatus to remove coarse particles still remaining.

【0043】図1の研磨材の回収装置では、この膜分離
装置として2機のMF膜分離装置6,7を直列に設置し
て2段膜分離処理を行う。このように膜分離装置を多段
に設け、後段の膜分離装置程、膜孔径の小さいものを用
いるようにすることにより、膜の目詰まりをより一層効
果的に防止して効率的な処理を行うことが可能となる。
In the abrasive recovery apparatus shown in FIG. 1, two MF membrane separators 6 and 7 are installed in series as the membrane separator to perform a two-stage membrane separation process. As described above, the membrane separation devices are provided in multiple stages, and the one having a smaller membrane pore diameter is used in a later stage of the membrane separation device, whereby clogging of the membrane is more effectively prevented and efficient processing is performed. It becomes possible.

【0044】この場合、MF膜の孔径は1〜10μm程
度の範囲で変化させるのが好ましく、例えば、図1に示
す如く、MF膜分離装置6,7を2段に直列配置した場
合には、前段のMF膜分離装置6の孔径を5〜10μm
程度、後段のMF膜分離装置7の孔径を3〜5μm程度
とするのが好ましい。また、膜分離装置を3段に配置す
る場合には、更にMF膜分離装置7の後段に孔径1〜3
μm程度のMF膜分離装置を配置するのが好ましい。
In this case, the pore size of the MF membrane is preferably changed in a range of about 1 to 10 μm. For example, as shown in FIG. 1, when the MF membrane separation devices 6 and 7 are arranged in two stages, The pore size of the MF membrane separation device 6 in the former stage is 5 to 10 μm
It is preferable that the pore diameter of the MF membrane separation device 7 in the subsequent stage is about 3 to 5 μm. When the membrane separation devices are arranged in three stages, the MF membrane separation device 7 is further provided with a hole diameter of 1-3.
It is preferable to arrange an MF membrane separation device of about μm.

【0045】なお、MF膜の材質としては、前述のMF
膜分離装置2の膜材質として例示したものを用いること
ができる。
The material of the MF film is the same as the MF film described above.
What was illustrated as a membrane material of the membrane separation device 2 can be used.

【0046】MF膜分離装置6,7で順次残留粗大粒子
を除去した液は、調整槽8で超純水と必要に応じて水酸
化カリウム、アンモニア、塩酸、硫酸等のpH調整剤、
その他の薬剤を添加して新スラリと同等の研磨粒子濃
度、更には、新スラリと同等の液性状に調整して再生ス
ラリを得る。
The liquid from which the residual coarse particles have been sequentially removed by the MF membrane separation devices 6 and 7 is mixed with ultrapure water and, if necessary, a pH adjuster such as potassium hydroxide, ammonia, hydrochloric acid, sulfuric acid or the like in an adjustment tank 8.
By adding other chemicals, the reconstituted slurry is obtained by adjusting the abrasive particle concentration to be equal to that of the new slurry and further to the liquid property equivalent to that of the new slurry.

【0047】図1に示す研磨材の回収装置は、本発明の
研磨材の回収装置の実施の形態の一例であって、本発明
はその要旨を超えない限り図示のものに何ら限定される
ものではない。例えば、MF膜分離装置7と調整槽8と
の間には、分級器を設け、なお残留する研磨屑などの微
粒子や大粒子を除去して粒径をより均一なものとしても
良い。この場合、粒度調整用の分級器としては、重力
式、機械式、水力式等の各種のものを用いることができ
る。
The apparatus for collecting abrasives shown in FIG. 1 is an example of an embodiment of the apparatus for recovering abrasives of the present invention, and the present invention is not limited to the illustrated one unless it exceeds the gist. is not. For example, a classifier may be provided between the MF membrane separation device 7 and the adjusting tank 8 to remove fine particles and large particles such as remaining polishing dust to make the particle size more uniform. In this case, as the classifier for adjusting the particle size, various types such as a gravity type, a mechanical type, and a hydraulic type can be used.

【0048】また、MF膜分離装置6の前段に、超音波
照射手段を設け、スラリ貯槽5からのスラリに超音波を
照射して粗大凝集物の再分散を行った後、膜分離処理し
ても良い。この場合、超音波照射手段としては特に制限
はなく、貯槽内に振動子を浸漬したもの、貯槽外に振動
子を取り付けたもの、或いはスラリの導入配管の外周に
振動子を取り付けたもの等を用いることができる。ま
た、照射する超音波の周波数は20〜100kHz、特
に40〜60kHz程度であることが好ましく、照射時
間は凝集粒子の再分散効果が十分に得られる程度に適宜
決定される。
Further, an ultrasonic wave irradiating means is provided in a stage preceding the MF membrane separation device 6, and the slurry from the slurry storage tank 5 is irradiated with ultrasonic waves to re-disperse the coarse aggregates, and then subjected to a membrane separation treatment. Is also good. In this case, there is no particular limitation on the ultrasonic irradiation means, and a device in which a vibrator is immersed in a storage tank, a device in which a vibrator is mounted outside the storage tank, a device in which a vibrator is mounted on the outer periphery of a slurry introduction pipe, or the like is used. Can be used. Further, the frequency of the ultrasonic waves to be irradiated is preferably 20 to 100 kHz, particularly preferably about 40 to 60 kHz, and the irradiation time is appropriately determined so that the effect of re-dispersing the aggregated particles can be sufficiently obtained.

【0049】このような超音波照射により凝集粒子は分
散化(再分散)し、また、以後の処理において研磨材粒
子の再凝集が防止され、MF膜分離装置6,7の膜の目
詰まりを有効に防止することができる。これにより、膜
の交換頻度を低減してランニングコストを低減すると共
に、長期に亘り装置を安定に運転することができるよう
になる。
Agglomerated particles are dispersed (redispersed) by such ultrasonic irradiation, and reagglomeration of the abrasive particles is prevented in the subsequent processing, and the clogging of the membranes of the MF membrane separation devices 6 and 7 is prevented. It can be effectively prevented. As a result, the frequency of replacing the membrane is reduced, the running cost is reduced, and the apparatus can be operated stably for a long period of time.

【0050】本発明においては、このような研磨材の回
収装置により、好ましくは、研磨材濃度が1〜30重量
%、研磨材粒子の粒子径範囲が0.1〜0.5μmで、
分散剤濃度が研磨材100重量部に対して0.01〜1
0重量部であるような再生スラリを得る。この再生スラ
リ中の研磨材濃度に特に制限はないが、再生スラリの取
り扱い性の面から1〜30重量%の範囲とするのが好ま
しい。また、分散剤濃度は、再生スラリ中の研磨材粒子
の分散性及び沈降防止性等の面から、上記範囲とするの
が好ましい。
In the present invention, such an apparatus for collecting abrasives preferably has an abrasive concentration of 1 to 30% by weight, an abrasive particle size range of 0.1 to 0.5 μm,
The dispersant concentration is 0.01 to 1 with respect to 100 parts by weight of the abrasive.
A regenerated slurry is obtained which is 0 parts by weight. The concentration of the abrasive in the regenerated slurry is not particularly limited, but is preferably in the range of 1 to 30% by weight from the viewpoint of handleability of the regenerated slurry. The concentration of the dispersant is preferably in the above range from the viewpoint of the dispersibility of the abrasive particles in the regenerated slurry and the anti-settling property.

【0051】[0051]

【発明の効果】以上詳述した通り、本発明の研磨材の回
収装置によれば、研磨工程排水から研磨材を回収するに
当たり、溶解性の不純物や微細な研磨屑等を洗浄除去す
るために必要とされる洗浄水量を大幅に低減して、洗浄
水貯槽やスラリ貯槽を小容量化し、装置全体を小型化す
ることができる。
As described above in detail, according to the apparatus for recovering abrasives of the present invention, when recovering abrasives from wastewater in the polishing step, it is necessary to wash and remove soluble impurities and fine polishing debris. The required amount of washing water can be greatly reduced, the capacity of the washing water storage tank and the slurry storage tank can be reduced, and the size of the entire apparatus can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図1(a)は本発明の研磨材の回収装置の実施
の形態を示す系統図であり、図1(b)は図1(a)の
要部(洗浄水貯槽、遠心分離機及びスラリ貯槽)拡大図
である。
FIG. 1 (a) is a system diagram showing an embodiment of an abrasive recovery apparatus of the present invention, and FIG. 1 (b) is a main part (washing water storage tank, centrifugal separator) of FIG. 1 (a). FIG. 2 is an enlarged view of a machine and a slurry storage tank).

【符号の説明】[Explanation of symbols]

1 貯留槽 2,6,7 MF膜分離装置 3 洗浄水貯槽 4 遠心分離機 5 スラリ貯槽 8 調整槽 DESCRIPTION OF SYMBOLS 1 Storage tank 2, 6, 7 MF membrane separation apparatus 3 Washing water storage tank 4 Centrifuge 5 Slurry storage tank 8 Adjustment tank

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 研磨工程排水から研磨材を回収する装置
において、 固液分離手段と、 該固液分離手段に研磨工程排水を導入する手段と、 洗浄水貯槽と、 前記固液分離手段に該洗浄水貯槽中の洗浄水を導入する
手段と、 前記固液分離手段への研磨工程排水の導入と洗浄水の導
入とを切り替える切り替え手段とを備えてなることを特
徴とする研磨材の回収装置。
1. An apparatus for recovering an abrasive from waste water from a polishing step, comprising: a solid-liquid separating means; a means for introducing the waste water from the polishing step to the solid-liquid separating means; a washing water storage tank; A polishing material collecting apparatus comprising: means for introducing washing water in a washing water storage tank; and switching means for switching between introduction of polishing process wastewater and introduction of washing water to the solid-liquid separation means. .
【請求項2】 請求項1において、該固液分離手段が遠
心分離手段であることを特徴とする研磨材の回収装置。
2. The apparatus according to claim 1, wherein said solid-liquid separation means is a centrifugal separation means.
JP2000006758A 2000-01-14 2000-01-14 Recovery device for abrasive Pending JP2001198823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000006758A JP2001198823A (en) 2000-01-14 2000-01-14 Recovery device for abrasive

Publications (1)

Publication Number Publication Date
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Family

ID=18535236

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103347656A (en) * 2011-02-25 2013-10-09 野村微科学股份有限公司 Abrasive recovery method and abrasive recovery device
WO2018173376A1 (en) * 2017-03-23 2018-09-27 住友電気工業株式会社 Grinding fluid regeneration device and grinding fluid regeneration method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103347656A (en) * 2011-02-25 2013-10-09 野村微科学股份有限公司 Abrasive recovery method and abrasive recovery device
WO2018173376A1 (en) * 2017-03-23 2018-09-27 住友電気工業株式会社 Grinding fluid regeneration device and grinding fluid regeneration method
CN110461544A (en) * 2017-03-23 2019-11-15 住友电气工业株式会社 The regenerating unit of grinding fluid and the regeneration method of grinding fluid
JPWO2018173376A1 (en) * 2017-03-23 2020-01-23 住友電気工業株式会社 Grinding fluid regeneration device and grinding fluid regeneration method
JP7003986B2 (en) 2017-03-23 2022-01-21 住友電気工業株式会社 Grinding fluid regeneration device and grinding fluid regeneration method

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