JP2001198825A - Recovery apparatus for abrasive - Google Patents

Recovery apparatus for abrasive

Info

Publication number
JP2001198825A
JP2001198825A JP2000006759A JP2000006759A JP2001198825A JP 2001198825 A JP2001198825 A JP 2001198825A JP 2000006759 A JP2000006759 A JP 2000006759A JP 2000006759 A JP2000006759 A JP 2000006759A JP 2001198825 A JP2001198825 A JP 2001198825A
Authority
JP
Japan
Prior art keywords
membrane
abrasive
membrane separation
polishing
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000006759A
Other languages
Japanese (ja)
Inventor
Akira Matsumoto
章 松本
Makoto Nomura
誠 埜村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurita Water Industries Ltd
Original Assignee
Kurita Water Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Industries Ltd filed Critical Kurita Water Industries Ltd
Priority to JP2000006759A priority Critical patent/JP2001198825A/en
Publication of JP2001198825A publication Critical patent/JP2001198825A/en
Pending legal-status Critical Current

Links

Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Abstract

PROBLEM TO BE SOLVED: To store a membrane separator easily with an apparatus being prevented from being clogged due to membrane by means of valve switching alone, in stopping the operation of the apparatus, provide long stable operation for the membrane separator, and recover and reuse the abrasive with high efficiency stably for a long period. SOLUTION: This recovery apparatus, treating grinding process drainage with the membrane separator 2 and a centrifugal separator 3 for recovery of abrasive, is provided with a circulating means of circulating membrane permeated water in the membrane separator 2 while the operation of the apparatus is stopping.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、半導体製造工程等
における化学的機械研磨(CMP:Chemical
Mechanical Polishing)工程から
排出される研磨工程排水から、研磨材粒子を効率的に回
収して再利用するための装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to chemical mechanical polishing (CMP) in a semiconductor manufacturing process or the like.
TECHNICAL FIELD The present invention relates to an apparatus for efficiently collecting and reusing abrasive particles from wastewater from a polishing step discharged from a mechanical polishing step.

【0002】[0002]

【従来の技術及び先行技術】半導体ウエハ及びその上に
形成された絶縁膜、メタル薄膜等の被膜の表面は高度な
平坦面であることが望まれる。従来、ウエハや、その上
に形成された被膜の平坦化には、研磨材のスラリを用い
て化学的機械研磨(CMP)する方法が採用されてい
る。この方法では、研磨パッド等の研磨部材と半導体ウ
エハとの間に研磨材スラリを介在させた状態で研磨を行
い、半導体ウエハあるいはシリコン酸化膜や金属薄膜等
の被膜表面を平坦化する。このCMPで用いられる研磨
材としては、分散性が良好で、平均粒子径が揃っている
シリカ微粒子(コロイダルシリカ)が一般的に使用され
ている。また、研磨速度の高い酸化セリウム(Ce
)や、硬度が高く安定なアルミナ(Al)等
も使用されている。酸化セリウムやアルミナ等の無機酸
化物は、平均粒子径が0.05〜0.5μm程度の粒子
が水中に分散したスラリとして使用されており、通常、
このスラリ中には、pH調整剤(KOH,NHOH,
有機酸,アミン類)や界面活性剤(分散剤)、酸化剤
(H,KIO,Fe(NO)等が別途添
加されて使用される。
2. Description of the Related Art It is desired that the surfaces of semiconductor wafers and films formed thereon, such as insulating films and metal thin films, be highly flat. 2. Description of the Related Art Conventionally, for planarizing a wafer and a film formed thereon, a method of performing chemical mechanical polishing (CMP) using a slurry of an abrasive has been adopted. In this method, polishing is performed with an abrasive slurry interposed between a polishing member such as a polishing pad and a semiconductor wafer to flatten the surface of a semiconductor wafer or a coating film such as a silicon oxide film or a metal thin film. As the abrasive used in the CMP, silica fine particles (colloidal silica) having good dispersibility and uniform average particle diameter are generally used. In addition, cerium oxide (Ce) having a high polishing rate
O 2), or the like high hardness stable alumina (Al 2 O 3) are also used. Inorganic oxides such as cerium oxide and alumina are used as a slurry in which particles having an average particle diameter of about 0.05 to 0.5 μm are dispersed in water.
In this slurry, a pH adjuster (KOH, NH 4 OH,
Organic acids, amines), a surfactant (dispersant), an oxidizing agent (H 2 O 2 , KIO 3 , Fe (NO 3 ) 3 ) and the like are separately added and used.

【0003】この研磨材スラリは、1枚のウエハ当りの
使用量が多く、しかも非常に高価であることから、ウエ
ハのCMP工程から排出される排水から研磨材を回収
し、回収した研磨材を用いて所定の組成の研磨材スラリ
を調整し、これを再利用することが望まれる。このよう
な回収再利用は廃液処理量の低減の面からも重要であ
る。
[0003] Since this abrasive slurry is used in a large amount per one wafer and is very expensive, the abrasive is recovered from wastewater discharged from a wafer CMP process, and the recovered abrasive is collected. It is desired to adjust the abrasive slurry having a predetermined composition by using the slurry and reuse the slurry. Such recovery and reuse is also important from the viewpoint of reducing the amount of waste liquid treatment.

【0004】しかし、CMP工程から排出される排水は
その使用により稀釈されて研磨材濃度が低下している上
に、被研磨物である半導体ウエハや被膜層を形成する薄
膜材料或いは研磨パッド等の研磨部材が削り取られた研
磨屑、研磨材としての無機酸化物粒子が破壊された微細
粒子や、研磨された薄膜材料片等と研磨粒子とが凝集す
ることによって生じる粒径の大きな研磨屑等の不純物が
混入したものである。このため、このような研磨工程排
水を無処理で研磨材として再利用すると、ウエハ表面に
キズを発生させたり、研磨屑の蓄積により研磨力が低下
したり、更には研磨材濃度の低下による研磨速度低下に
つながることから、この研磨工程排水はそのまま循環再
利用することはできない。従って、研磨工程排水の再利
用に当っては、不純物の除去、濃縮等の処理を行って研
磨材を回収し、所定の組成の研磨材スラリを再調整する
ことが必要となる。
However, the wastewater discharged from the CMP process is diluted by its use to reduce the abrasive concentration, and furthermore, a semiconductor wafer to be polished, a thin film material for forming a coating layer, a polishing pad, or the like. Polishing debris from which the polishing member has been scraped, fine particles in which inorganic oxide particles as abrasive have been destroyed, and polishing debris having a large particle diameter caused by agglomeration of the polished thin film material pieces and the polishing particles. It is a mixture of impurities. For this reason, if such polishing process wastewater is reused as an abrasive without treatment, scratches are generated on the wafer surface, polishing power is reduced due to accumulation of polishing debris, and polishing due to a decrease in abrasive concentration is further reduced. The polishing process wastewater cannot be circulated and reused as it is because it leads to a reduction in speed. Therefore, in reusing the wastewater from the polishing step, it is necessary to recover the abrasive by performing a process such as removal of impurities and concentration, and to readjust an abrasive slurry having a predetermined composition.

【0005】本出願人は、この研磨工程排水から研磨材
を回収して再利用するための技術として、酸化セリウム
やアルミナ等の研磨材粒子の比重が大きいことに着目
し、遠心分離機を用いてこれを濃縮し、遠心分離後の濃
縮スラリから塩類や有機物、微小な研磨屑などの不純物
を除去するために水洗浄を行って、研磨材を回収する装
置を先に提案した(特願平11−189347号等。以
下「先願」という。)。
As a technique for recovering and reusing the abrasive from the polishing process wastewater, the present applicant has focused on the fact that abrasive particles such as cerium oxide and alumina have a large specific gravity, and have used a centrifugal separator. We have previously proposed a device that concentrates the water and removes impurities such as salts, organic matter, and fine polishing debris from the concentrated slurry after centrifugation, and then recovers the polishing material (Japanese Patent Application No. Hei 10-26139). No. 11-189347, etc., hereinafter referred to as “first application”).

【0006】[0006]

【発明が解決しようとする課題】先願の装置によれば、
研磨工程排水から研磨材として容易に再利用可能な研磨
材粒子を効率的に回収することができるが、先願の装置
では、研磨工程排水に含まれるパッド屑等の粗大固形物
の除去をMF(精密濾過)膜等の膜分離装置で行ってい
るため、粗大固形物により膜が早期に目詰まりし、頻繁
な膜交換を必要とすることから、ランニングコストが高
騰し、長期安定運転に支障をきたすという不都合が生じ
ていた。この膜の目詰まりは、特に、装置の運転停止時
に不純物イオンの混入を避けて清浄度を保つために、配
管を含め回収装置全体を超純水で洗浄置換した後、次回
の運転再開まで保持している際に激しいことが明らかと
なった。これは、装置内に保有されている分散剤が超純
水により置換され、研磨材粒子の分散性が損なわれて粗
大粒子化すること、更に凝集体自体が残された分散剤の
粘性により固まり膜に付着することによるものと考えら
れる。また、膜の目詰まりは、膜分離装置内の液を抜き
取って保管した場合にも同様に激しかった。
According to the device of the prior application,
Abrasive particles that can be easily reused as abrasives can be efficiently recovered from the polishing process wastewater. However, the apparatus of the prior application uses MF to remove coarse solids such as pad debris contained in the polishing process wastewater. (Microfiltration) Since the separation is carried out by a membrane separation device such as a membrane, the membrane is clogged at an early stage due to coarse solids, and frequent replacement of the membrane is required. As a result, running costs rise and hinder long-term stable operation. Inconvenience was caused. This clogging of the membrane is maintained until the next operation restart, especially after cleaning and replacing the entire recovery system, including the piping, with ultrapure water in order to avoid contamination of impurity ions and maintain cleanliness when the operation of the system is stopped. It turned out to be intense while doing. This is because the dispersant held in the apparatus is replaced by ultrapure water, the dispersibility of the abrasive particles is impaired, the particles become coarse, and the agglomerates themselves are solidified due to the viscosity of the remaining dispersant. It is thought to be due to adhesion to the film. The clogging of the membrane was also severe when the liquid in the membrane separation device was withdrawn and stored.

【0007】このような問題を解決すべく、本出願人
は、装置の運転停止時に、分散剤を含んだ超純水又は研
磨工程排水を膜分離装置内に保持した状態で保管するこ
とを先の出願で提案した(特願平11−322924
号)。
In order to solve such a problem, the applicant of the present invention has proposed that when the operation of the apparatus is stopped, ultrapure water containing a dispersant or wastewater from a polishing process is stored in a state kept in a membrane separation apparatus. (Japanese Patent Application No. 11-322924)
issue).

【0008】本発明は、この発明を更に改良し、装置の
運転停止に当たり、弁の切り換えのみで膜分離装置を膜
の目詰まりを防止した条件下に簡単に保管することがで
き、膜分離装置の長期安定運転を可能とすると共に、装
置のランニングコストを低減して、長期間安定して研磨
材を効率良く回収再利用することができる研磨材の回収
装置を提供することを目的とする。
According to the present invention, the present invention is further improved, and when the operation of the apparatus is stopped, the membrane separation apparatus can be easily stored only by switching the valve under the condition in which clogging of the membrane is prevented. It is an object of the present invention to provide an abrasive recovery apparatus capable of performing a long-term stable operation, reducing the running cost of the apparatus, and efficiently recovering and reusing the abrasive stably for a long period of time.

【0009】[0009]

【課題を解決するための手段】本発明の研磨材の回収装
置は、研磨工程排水中の粗大固形物を除去する膜分離手
段と、研磨材を回収するための固液分離手段とを有する
研磨材の回収装置であって、前記膜分離手段の運転停止
時に膜透過水を該膜分離手段の導入側に循環する循環手
段を設けたことを特徴とする。
SUMMARY OF THE INVENTION An abrasive recovery apparatus according to the present invention is a polishing apparatus having a membrane separation means for removing coarse solids in a wastewater from a polishing step, and a solid-liquid separation means for recovering the abrasive. A material recovery apparatus, wherein a circulation means for circulating membrane permeated water to an introduction side of the membrane separation means when the operation of the membrane separation means is stopped is provided.

【0010】膜分離手段の膜透過水は、研磨工程排水を
膜分離して得られるものであり、膜分離により粗大固形
物が除去され、かつ、研磨材スラリ由来の分散剤を含む
スラリである。
[0010] The membrane permeated water of the membrane separation means is obtained by subjecting the wastewater from the polishing step to membrane separation, and is a slurry from which coarse solids are removed by membrane separation and which contains a dispersant derived from an abrasive slurry. .

【0011】本発明では、このような膜透過水を膜分離
手段の運転停止中に循環通水することにより、膜を分散
剤を含む条件下で保管し、これにより膜の目詰まりを防
止することができる。
In the present invention, such membrane permeated water is circulated and passed while the operation of the membrane separation means is stopped, so that the membrane is stored under conditions containing a dispersant, thereby preventing clogging of the membrane. be able to.

【0012】本発明において、固液分離手段としては遠
心分離手段又は膜分離手段が好適である。
In the present invention, the solid-liquid separation means is preferably a centrifugal separation means or a membrane separation means.

【0013】[0013]

【発明の実施の形態】以下に図面を参照して本発明の実
施の形態を詳細に説明する。
Embodiments of the present invention will be described below in detail with reference to the drawings.

【0014】図1は本発明の研磨材の回収装置の実施の
形態を示す系統図であり、図2(a),(b)はMF膜
分離装置の膜透過水の循環手段の実施の形態を示す系統
図である。
FIG. 1 is a system diagram showing an embodiment of an abrasive recovery apparatus according to the present invention. FIGS. 2A and 2B show an embodiment of a means for circulating permeated water of an MF membrane separation apparatus. FIG.

【0015】まず、図1に示す研磨材の回収装置によ
り、研磨工程排水を処理して研磨材を回収する手順につ
いて説明する。
First, the procedure for collecting the abrasive by treating the wastewater in the polishing step by the abrasive collecting apparatus shown in FIG. 1 will be described.

【0016】図1の研磨材の回収装置では、CMPの研
磨工程から排出された研磨材を含む研磨工程排水を、貯
留槽1を経て、まず、MF(精密濾過)膜分離装置2に
導入して全量を膜濾過することにより、研磨工程で発生
する研磨パット屑などの、研磨材粒子に比べて粒径の大
きな不純物を除去する。
In the apparatus for recovering abrasives shown in FIG. 1, polishing process wastewater containing abrasives discharged from the CMP polishing step is first introduced into a MF (microfiltration) membrane separation device 2 through a storage tank 1. By performing membrane filtration on the entire amount, impurities having a larger particle size than the abrasive particles, such as polishing pad debris generated in the polishing step, are removed.

【0017】この不純物の除去に用いる膜分離装置は、
MF膜分離装置に限らず、UF(限外濾過)膜分離装置
でも良く、用いるMF膜又はUF膜としては、このよう
な大粒径の不純物が除去できればよく、一般的には孔径
25〜30μm程度のものが好適である。MF膜材質と
しては、ポリプロピレン、ポリカーボネート、三酢化セ
ルロース、ポリアミド、ポリ塩化ビニル、ポリフッ化ビ
ニリデン等が用いられる。また、UF膜材質としては、
ポリサルフォン、セルロース、酢酸セルロース、ポリエ
チレンなどが例示される。特に、これらのいずれかの単
繊維をワインドしたワインドタイプの濾過エレメントを
有するMF膜やUF膜を用いるのが好ましい。
The membrane separation apparatus used for removing the impurities is as follows:
Not limited to the MF membrane separator, a UF (ultrafiltration) membrane separator may be used. The MF membrane or UF membrane to be used only needs to be able to remove such large-diameter impurities, and generally has a pore diameter of 25 to 30 μm. A degree is preferred. As the MF film material, polypropylene, polycarbonate, cellulose triacetate, polyamide, polyvinyl chloride, polyvinylidene fluoride and the like are used. Also, as the UF film material,
Examples thereof include polysulfone, cellulose, cellulose acetate, and polyethylene. In particular, it is preferable to use an MF membrane or a UF membrane having a wind-type filtration element obtained by winding any of these single fibers.

【0018】この膜濾過条件としては、基本的には全量
濾過方式とする。運転に際しては入口と出口の差圧が1
kgf/cm以上になったら逆洗をかけるか、又は膜
の交換を行うのが好ましい。
The membrane filtration conditions are basically a total filtration system. During operation, the differential pressure between the inlet and outlet is 1
It is preferable to perform backwashing or exchange the membrane when the weight becomes kgf / cm 2 or more.

【0019】MF膜分離装置2の透過液は次いで遠心分
離機3等の固液分離手段に導入されて濃縮される。この
固液分離手段としては、MF膜分離装置2で粗大固形物
が除去された研磨工程排水を濃縮できるものであれば良
く、遠心分離機3の他、適当な分画分子量又は孔径を選
定することにより、MF又はUF膜分離装置を用いるこ
ともできる。
The permeate from the MF membrane separation device 2 is then introduced into a solid-liquid separation means such as a centrifuge 3 and concentrated. The solid-liquid separation means may be any means capable of concentrating the wastewater from the polishing step from which coarse solids have been removed by the MF membrane separation device 2. In addition to the centrifugal separator 3, an appropriate molecular weight cutoff or pore size is selected. Thus, an MF or UF membrane separation device can be used.

【0020】図1の研磨材の回収装置では、固液分離手
段として遠心分離機3を用いて濃縮を行う。なお、この
遠心分離機3には、後段の洗浄槽4の洗浄処理液が循環
される。
In the apparatus for recovering abrasives shown in FIG. 1, concentration is performed using a centrifugal separator 3 as solid-liquid separating means. In addition, the washing processing liquid in the washing tank 4 at the subsequent stage is circulated through the centrifugal separator 3.

【0021】この遠心分離機3としては、遠心力を利用
した一般的な分離手段、例えば、分離板式デカンタ、サ
イクロン、回転円筒式等の各種の遠心分離手段を用いる
ことができる。この遠心分離機3による濃縮の程度には
特に制限はないが、通常の場合、濃縮液中のスラリ(S
S)濃度が5〜50重量%程度となるような濃縮条件と
するのが好ましい。
As the centrifugal separator 3, general centrifugal separators utilizing centrifugal force, for example, various types of centrifugal separators such as a separator type decanter, a cyclone, and a rotating cylindrical type can be used. The degree of concentration by the centrifugal separator 3 is not particularly limited, but usually, the slurry (S
S) Preferably, the concentration conditions are such that the concentration is about 5 to 50% by weight.

【0022】この遠心分離機3で分離した水(分離液)
は系外へ排出して廃水処理する。また、濃縮液は洗浄槽
4に送給し、この洗浄槽4で洗浄水と共に攪拌すること
により洗浄する。
Water (separated liquid) separated by the centrifuge 3
Is discharged outside the system for wastewater treatment. Further, the concentrated liquid is supplied to the washing tank 4 and washed by stirring with the washing water in the washing tank 4.

【0023】この研磨材の回収装置では、洗浄槽4に分
散剤水溶液(分散剤を洗浄水としての超純水に溶解した
もの)を添加し、分散剤水溶液で洗浄を行う。
In this abrasive recovery device, an aqueous solution of a dispersant (a solution in which the dispersant is dissolved in ultrapure water as washing water) is added to the washing tank 4 and washing is performed with the aqueous solution of the dispersant.

【0024】ここで用いられる分散剤としては、研磨材
の分散剤として一般的に使用されるもので良く、例え
ば、以下に示すような金属イオン類を含まない分散剤が
挙げられる。
The dispersant used here may be any one generally used as a dispersant for an abrasive, and examples thereof include the following dispersants that do not contain metal ions.

【0025】アクリル酸重合体及びそのアンモニウム
塩、メタクリル酸重合体及びそのアンモニウム塩、ポリ
ビニルアルコール等の水溶性有機高分子類 ラウリル硫酸アンモニウム、ポリオキシエチレンラウリ
ルエーテル硫酸アンモニウム等の水溶性陰イオン性界面
活性剤 ポリオキシエチレンラウリルエーテル、ポリエチレング
リコールモノステアレート等の水溶性非イオン性界面活
性剤 モノエタノールアミン、ジエタノールアミン等の水溶性
アミン類 この分散剤水溶液は、薬剤貯槽(図示せず)で超純水に
分散剤を添加して所定濃度に調整したものを添加すれば
良く、この分散剤水溶液中の分散剤の濃度には特に制限
はないが、通常の場合、10〜10000ppmの範囲
で洗浄温度や回収スラリに要求される分散剤濃度等に応
じて適宜決定される。
Water-soluble organic polymers such as acrylic acid polymers and their ammonium salts, methacrylic acid polymers and their ammonium salts, polyvinyl alcohol, etc. Water-soluble anionic surfactants such as ammonium lauryl sulfate and polyoxyethylene lauryl ether ammonium sulfate Water-soluble nonionic surfactants such as polyoxyethylene lauryl ether and polyethylene glycol monostearate Water-soluble amines such as monoethanolamine and diethanolamine This aqueous dispersant solution is converted into ultrapure water in a chemical storage tank (not shown). The concentration of the dispersant in the aqueous solution of the dispersant is not particularly limited, and the washing temperature or the recovery in the range of 10 to 10,000 ppm is usually used. Decide appropriately according to the dispersant concentration required for the slurry Is determined.

【0026】洗浄槽4で洗浄処理された研磨材含有液
(以下、「洗浄スラリ」と称す場合がある。)の一部は
遠心分離機3に循環され、遠心分離されることにより、
洗浄と濃縮が同時に行われる。
A part of the abrasive-containing liquid (hereinafter sometimes referred to as “washing slurry”) that has been washed in the washing tank 4 is circulated to the centrifugal separator 3 and centrifuged.
Washing and concentration are performed simultaneously.

【0027】このように洗浄槽4で分散剤水溶液により
希釈されて攪拌され、次いで、遠心分離機3に循環され
て濃縮されることにより、塩類や有機物、微小な研磨屑
などの不純物が除去される。そして、この洗浄に当り、
洗浄水として分散剤水溶液を用いるため、洗浄中におけ
る分散剤濃度の低下や研磨材粒子表面の分散剤の剥離の
問題は解消される。
As described above, the diluent is diluted with the aqueous solution of the dispersant in the washing tank 4 and stirred, and then circulated and concentrated in the centrifugal separator 3 to remove impurities such as salts, organic substances, and fine polishing debris. You. And in this washing,
Since the aqueous solution of the dispersant is used as the washing water, the problems of a decrease in the concentration of the dispersant during washing and peeling of the dispersant from the surface of the abrasive particles are eliminated.

【0028】即ち、研磨材は、その使用に当り、スラリ
中で所定の粒子径に凝集分散するように、その表面が分
散剤で被覆されている。しかし、回収工程で水洗浄を行
うと、この分散剤の濃度低下が生じ、水洗浄の時間、水
量、頻度等によっては、研磨材表面や近傍に存在する分
散剤が洗浄除去されてしまう場合が生じる。特に、研磨
材表面や、その近傍の分散剤が除去されてしまうと、研
磨材粒子が凝集粗大化してしまい、所定の粒子径に再分
散させるのが困難ないし不可能になることがある。従っ
て、このような不具合を生じないようにするためには、
水洗浄の時間、水量、頻度等の洗浄条件を厳密に管理す
ることが必要となる。
That is, when the abrasive is used, its surface is coated with a dispersant so that the abrasive is coagulated and dispersed to a predetermined particle size in the slurry. However, when the water washing is performed in the recovery step, the concentration of the dispersant decreases, and depending on the time, the amount of water, the frequency, etc. of the water washing, the dispersant present on or near the abrasive material may be washed away. Occurs. In particular, if the dispersant on or near the abrasive surface is removed, the abrasive particles are agglomerated and coarse, and it may be difficult or impossible to redisperse the particles to a predetermined particle diameter. Therefore, in order to avoid such a problem,
It is necessary to strictly control the cleaning conditions such as the time, the amount of water and the frequency of the water cleaning.

【0029】これに対して、分散剤を含む洗浄水であれ
ば、この問題が解消され、研磨工程排水から研磨材とし
て容易に再利用可能な研磨材粒子のスラリをより一層容
易かつ効率的に回収することが可能となる。
On the other hand, if the washing water contains a dispersant, this problem is solved, and the slurry of the abrasive particles which can be easily reused as the abrasive from the waste water in the polishing process can be more easily and efficiently. It becomes possible to collect.

【0030】この洗浄に用いる分散剤水溶液の量が少な
すぎると十分な洗浄効果が得られず、逆に過度に多いと
使用水量が増大して回収処理コストが増大するため、通
常の場合、遠心分離機2からの濃縮液に対して1〜10
0容量倍の分散剤水溶液を用いるのが好ましい。
If the amount of the aqueous solution of the dispersing agent used for this washing is too small, a sufficient washing effect cannot be obtained. Conversely, if the amount is too large, the amount of water used increases and the cost of the recovery treatment increases. 1 to 10 for the concentrate from the separator 2
It is preferable to use 0 times the volume of the dispersant aqueous solution.

【0031】洗浄槽4からの洗浄スラリを濃縮する過程
で生じる洗浄排水は、遠心分離機3からの分離液として
系外へ排出される。
The washing wastewater generated in the process of concentrating the washing slurry from the washing tank 4 is discharged out of the system as a separated liquid from the centrifuge 3.

【0032】このようにMF膜分離装置2での粗大固形
物の膜分離、遠心分離及び洗浄、濃縮を行うことによ
り、研磨材粒子よりも粒径の大きい不純物や塩類、有機
物等の溶解成分或いは微細な研磨屑等の不純物が除去さ
れた研磨粒子のスラリを得ることができるが、このスラ
リには、なお更に洗浄、濃縮工程での研磨材粒子の再凝
集で粗大化した粗大固形物が含有されている。
By performing the membrane separation, centrifugation, washing and concentration of the coarse solid in the MF membrane separation apparatus 2 as described above, dissolved components such as impurities, salts, organic substances, etc., having a larger particle size than the abrasive particles, or A slurry of abrasive particles from which impurities such as fine abrasive chips have been removed can be obtained, but this slurry further contains coarse solids that have been coarsened by reagglomeration of the abrasive particles in the washing and concentration steps. Have been.

【0033】図1の研磨材の回収装置では、この粗大固
形物を含むスラリを超音波照射手段5に送給し、超音波
を照射して凝集した粗大固形物の再分散を行う。
In the abrasive recovery apparatus shown in FIG. 1, the slurry containing the coarse solid is supplied to the ultrasonic irradiation means 5 and irradiated with ultrasonic waves to re-aggregate the aggregated coarse solid.

【0034】この超音波照射手段5としては特に制限は
なく、貯槽内に振動子を浸漬したもの、貯槽外に振動子
を取り付けたもの、或いはスラリの導入配管の外周に振
動子を取り付けたもの等を用いることができる。また、
照射する超音波の周波数は20〜100kHz、特に4
0〜60kHz程度であることが好ましく、照射時間は
凝集粒子の再分散効果が十分に得られる程度に適宜決定
される。
The ultrasonic irradiation means 5 is not particularly limited, and includes a vibrator immersed in a storage tank, a vibrator mounted outside the storage tank, or a vibrator mounted on the outer circumference of a slurry introduction pipe. Etc. can be used. Also,
The frequency of the ultrasonic wave to be irradiated is 20 to 100 kHz, especially 4
The irradiation time is preferably about 0 to 60 kHz, and the irradiation time is appropriately determined so that the effect of re-dispersing the aggregated particles can be sufficiently obtained.

【0035】このような超音波照射により凝集粒子は分
散化(再分散)し、また、以後の処理において研磨材粒
子の再凝集が防止される。
Agglomerated particles are dispersed (redispersed) by such ultrasonic irradiation, and reaggregation of the abrasive particles is prevented in the subsequent processing.

【0036】超音波照射手段5で凝集粒子の分散処理を
行った液は、次いで、膜分離装置でなお更に残留する粗
大固形物を膜分離除去する。
The liquid subjected to the dispersion treatment of the agglomerated particles by the ultrasonic wave irradiating means 5 is then subjected to membrane separation to remove the remaining coarse solid matter by a membrane separation device.

【0037】図1の研磨材の回収装置では、この膜分離
装置として2機のMF膜分離装置6,7を直列に設置し
て2段膜分離処理を行う。このように膜分離装置を多段
に設け、後段の膜分離装置程、膜孔径の小さいものを用
いるようにすることにより、膜の目詰まりをより一層効
果的に防止して効率的な処理を行うことが可能となる。
In the abrasive recovery apparatus shown in FIG. 1, two MF membrane separators 6 and 7 are installed in series as this membrane separator to perform a two-stage membrane separation process. As described above, the membrane separation devices are provided in multiple stages, and the one having a smaller membrane pore diameter is used in a later stage of the membrane separation device, whereby clogging of the membrane is more effectively prevented and efficient processing is performed. It becomes possible.

【0038】この場合、MF膜の孔径は1〜10μm程
度の範囲で変化させるのが好ましく、例えば、図1に示
す如く、MF膜分離装置6,7を2段に直列配置した場
合には、前段のMF膜分離装置6の孔径を5〜10μm
程度、後段のMF膜分離装置7の孔径を3〜5μm程度
とするのが好ましい。また、膜分離装置を3段に配置す
る場合には、更にMF膜分離装置7の後段に孔径1〜3
μm程度のMF膜分離装置を配置するのが好ましい。
In this case, the pore size of the MF membrane is preferably changed in the range of about 1 to 10 μm. For example, as shown in FIG. 1, when the MF membrane separation devices 6 and 7 are arranged in two stages, The pore size of the MF membrane separation device 6 in the former stage is 5 to 10 μm
It is preferable that the pore diameter of the MF membrane separation device 7 in the subsequent stage is about 3 to 5 μm. When the membrane separation devices are arranged in three stages, the MF membrane separation device 7 is further provided with a hole diameter of 1-3.
It is preferable to arrange an MF membrane separation device of about μm.

【0039】なお、MF膜の材質としては、前述のMF
膜分離装置2の膜材質として例示したものを用いること
ができる。
The material of the MF film is the same as the MF film described above.
What was illustrated as a membrane material of the membrane separation device 2 can be used.

【0040】MF膜分離装置6,7で順次残留粗大固形
物を除去した液は、調整槽8で超純水と必要に応じて水
酸化カリウム、アンモニア、塩酸、硫酸等のpH調整
剤、その他の薬剤を添加して新スラリと同等の研磨粒子
濃度、更には、新スラリと同等の液性状に調整して再生
スラリを得る。
The liquid from which the residual coarse solids have been sequentially removed by the MF membrane separators 6 and 7 is subjected to ultrapure water and, if necessary, a pH adjuster such as potassium hydroxide, ammonia, hydrochloric acid, sulfuric acid, etc. By adding the above chemical agent, the abrasive particles concentration is adjusted to the same level as the new slurry, and further, the liquid properties are adjusted to the same level as the new slurry to obtain a regenerated slurry.

【0041】なお、MF膜分離装置7と調整槽8との間
には、分級器を設け、なお残留する研磨屑などの微粒子
や大粒子を除去して粒径をより均一なものとしても良
い。この場合、粒度調整用の分級器としては、重力式、
機械式、水力式等の各種のものを用いることができる。
A classifier may be provided between the MF membrane separation device 7 and the adjusting tank 8 so as to remove fine particles and large particles such as remaining polishing dust to make the particle size more uniform. . In this case, as a classifier for particle size adjustment, gravity type,
Various types such as a mechanical type and a hydraulic type can be used.

【0042】次にこのような研磨材の回収装置の運転停
止時の操作について説明する。
Next, the operation when the operation of such an abrasive recovery apparatus is stopped will be described.

【0043】本発明の研磨材の回収装置では、図2
(a),(b)に示すような粗大固形物除去のための膜
分離装置2に膜透過水の循環手段が設けられている。
In the abrasive recovery apparatus of the present invention, FIG.
The means for circulating membrane permeated water is provided in the membrane separation device 2 for removing coarse solids as shown in (a) and (b).

【0044】図2(a)に示す循環手段は、MF膜分離
装置2の原水配管、透過水排出配管、濃縮水排出配管に
それぞれ設けられた弁V,V,Vと、弁Vの下
流側と弁Vの上流側を連絡する、ポンプPと弁V
有する循環配管とで構成される。
The circulation means shown in FIG. 2A includes valves V 1 , V 3 , V 4 provided in a raw water pipe, a permeated water discharge pipe, and a concentrated water discharge pipe of the MF membrane separation device 2, respectively, and a valve V. contact upstream of the first downstream the valve V 3, composed of a circulation pipe having a pump P and the valve V 2.

【0045】研磨工程排水の処理に際しては、ポンプP
停止、弁V閉、弁V,V,V 開で膜分離処理を
行うが、装置の運転停止に際しては、弁V,V,V
を閉とし、弁Vを開としてポンプPを起動し、膜分
離装置2内の膜透過水を循環配管で膜分離装置2の入口
側へ循環する。
Polishing process When treating wastewater, pump P
Stop, valve V2Closed, valve V1, V3, V 4Open for membrane separation
However, when the operation of the device is stopped, the valve V1, V3, V
4Is closed and the valve V2Is opened to start the pump P, and the
Of the membrane permeated water in the separation device 2 through a circulation pipe to the inlet of the membrane separation device 2
Circulates to the side.

【0046】これにより、膜分離装置2の膜は、粗大固
形物が除去され分散剤を含む膜透過水に接触した状態と
なり、膜の目詰まりが防止される。
As a result, the membrane of the membrane separation device 2 is brought into a state in which coarse solids are removed and comes into contact with the permeated water containing the dispersant, thereby preventing clogging of the membrane.

【0047】なお、このように循環配管で直接膜透過水
を循環する場合、ポンプPの入口配管に、水流を検知す
るフロースイッチや配管内の水の有無を検知する静電容
量スイッチなどの配管内の水の有無を検出する手段を設
け、ポンプPの保護(空引き防止)のために、水の無い
状態を検知した場合は、循環を行わないように制御する
ことが好ましい。
When the membrane permeated water is directly circulated in the circulation pipe as described above, a pipe such as a flow switch for detecting a water flow or a capacitance switch for detecting the presence or absence of water in the pipe is provided at the inlet pipe of the pump P. It is preferable to provide a means for detecting the presence or absence of water in the inside, and in order to protect the pump P (prevent emptying), control is performed so that circulation is not performed when a state without water is detected.

【0048】図2(b)に示す循環手段は、直列に配置
されたMF膜分離装置2A,2Bのうち膜分離装置2A
の原入配管、各膜分離装置2A,2Bの濃縮水排出配管
にそれぞれ設けられた弁V,V4A,V4Bと、膜分
離装置2Bの透過水排出配管に設けられた循環貯槽9
と、この循環貯槽9と弁Vの下流側とを連絡する、ポ
ンプPと弁Vを有する循環配管とで構成される。
The circulating means shown in FIG. 2 (b) is one of the MF membrane separation devices 2A and 2B which are arranged in series.
Valves V 1 , V 4A , V 4B respectively provided in the concentrated water discharge piping of each of the membrane separation devices 2A, 2B, and the circulation storage tank 9 provided in the permeated water discharge piping of the membrane separation device 2B.
When, communicating the downstream side of the circulation tank 9 and the valve V 1, composed of a circulation pipe having a pump P and the valve V 2.

【0049】研磨工程排水の処理に際しては、ポンプP
停止、弁V閉、弁V,V4A,V4B開で膜分離処
理を行い、循環貯槽9のオーバーフロー水を後工程へ送
給するが、装置の運転停止に際しては、弁V
4A,V4Bを閉とし、弁Vを開としてポンプPを
起動し、循環貯槽9内の膜透過水を循環配管で膜分離装
置2Aの入口側へ循環する。
Polishing process In treating wastewater, pump P
Stop, the valve V 2 is closed, the valve V 1, V 4A, performs membrane separation process in V 4B open, Kyusuru but feeding the overflow water of the circulation reservoir 9 to the subsequent process, when the operation stop of the apparatus, the valve V 1,
V 4A and V 4B are closed, valve V 2 is opened to start pump P, and the membrane permeated water in circulation storage tank 9 is circulated to the inlet side of membrane separation device 2A by circulation piping.

【0050】これにより、膜分離装置2A,2Bの膜
は、粗大固形物が除去され分散剤を含む膜透過水に接触
した状態となり、膜の目詰まりが防止される。
As a result, the membranes of the membrane separation devices 2A and 2B are brought into contact with the permeated water containing the dispersant after removing the coarse solids, thereby preventing the membranes from being clogged.

【0051】なお、このように循環貯槽を設け、循環貯
槽内の膜透過水を循環する場合、循環貯槽9にポンプP
の空引き防止のための水位計(レベルスイッチ)を設け
ることが好ましい。
When the circulation storage tank is provided and the membrane permeated water in the circulation storage tank is circulated as described above, the pump P
It is preferable to provide a water level meter (level switch) for preventing the air from being drawn.

【0052】このような膜透過水の循環は、研磨材回収
処理の停止中継続して行う方式でも、回収処理を停止し
てから一定時間(例えば1〜2時間)の間のみ行う方式
でもどちらでも良い。消費電力などを考慮した場合、後
者の方式が望ましい。
The circulation of the membrane permeated water may be performed continuously while the polishing material recovery process is stopped, or may be performed only for a fixed time (for example, 1 to 2 hours) after the recovery process is stopped. But it is good. In consideration of power consumption and the like, the latter method is desirable.

【0053】このように装置の運転停止中に膜透過水を
循環することができる本発明の研磨材の回収装置によれ
ば、少量の膜透過水を循環するだけで、膜の目詰まりを
防止することができ、長期間にわたって所定の透過水量
を安定して得ることができる。
As described above, according to the abrasive recovery apparatus of the present invention which can circulate the membrane permeated water while the operation of the apparatus is stopped, clogging of the membrane can be prevented only by circulating a small amount of the permeated water. And a predetermined amount of permeated water can be stably obtained over a long period of time.

【0054】特に、図2に示す如く、ポンプPと弁の切
り換えで膜透過水を循環する研磨材の回収装置であれ
ば、極めて簡単な操作で装置の運転停止、保管のための
処理を行える。
In particular, as shown in FIG. 2, if an abrasive recovery device circulates the membrane permeated water by switching the pump P and the valve, the operation for stopping and storing the device can be performed with extremely simple operation. .

【0055】図1,2に示す研磨材の回収装置は、本発
明の研磨材の回収装置の実施の形態の一例であって、本
発明はその要旨を超えない限り図示のものに何ら限定さ
れるものではない。
The apparatus for collecting abrasives shown in FIGS. 1 and 2 is an example of an embodiment of the apparatus for recovering abrasives of the present invention, and the present invention is not limited to the illustrated one as long as it does not exceed the gist. Not something.

【0056】例えば、粗大固形物除去のための膜分離装
置2は、遠心分離機3の前段に設けるものに限定され
ず、遠心分離機3の後段、その他の箇所であっても良
い。
For example, the membrane separation device 2 for removing coarse solids is not limited to the one provided before the centrifugal separator 3 but may be provided after the centrifugal separator 3 or at any other location.

【0057】また、図2(a),(b)に示すような膜
透過水の循環手段は、前段側の膜分離装置2に限らず、
後段側の膜分離装置6,7にも設けても良く、このよう
にすることにより、膜分離装置6,7についても膜の目
詰まりを有効に防止することが可能となる。また、固液
分離手段が膜分離手段である場合も同様に透過水循環を
しても良く、上記膜同様目詰まりを防止できる。
The means for circulating the permeated water as shown in FIGS. 2 (a) and 2 (b) is not limited to the membrane separation device 2 on the preceding stage.
The membrane separation devices 6 and 7 on the subsequent stage may be provided. By doing so, the membrane separation devices 6 and 7 can effectively prevent clogging of the membrane. Also, when the solid-liquid separation means is a membrane separation means, permeated water may be circulated in the same manner, and clogging can be prevented similarly to the above-mentioned membrane.

【0058】また、分散剤水溶液は、洗浄槽4への濃縮
液の導入配管に添加しても良く、洗浄槽4を省略して遠
心分離機3の入口側で分散剤水溶液を添加し、遠心分離
機3の濃縮液の一部を遠心分離機3の入口側に循環さ
せ、残部を超音波照射手段5に送給するようにしても良
い。この場合においても分散剤水溶液を添加しながら濃
縮スラリの一部を循環することにより、研磨材の洗浄を
遠心分離機3内での遠心分離による濃縮と同時に行うこ
とができ、しかも、洗浄槽を省略することができる。こ
の場合、濃縮スラリの循環は、遠心分離機3からの濃縮
液の排出配管から分岐する循環配管により、直接循環す
るようにしても良く、また、遠心分離機3と超音波照射
手段5との間に貯留槽を設け、この貯留槽からの濃縮液
を循環するようにして良い。
The aqueous solution of the dispersant may be added to the pipe for introducing the concentrated liquid into the washing tank 4. The aqueous solution of the dispersant is added at the inlet side of the centrifugal separator 3 without the washing tank 4, A part of the concentrated liquid of the separator 3 may be circulated to the inlet side of the centrifuge 3, and the remaining part may be sent to the ultrasonic irradiation means 5. Also in this case, by circulating a part of the concentrated slurry while adding the aqueous dispersant solution, the abrasive can be washed at the same time as the concentration by the centrifugal separation in the centrifugal separator 3. Can be omitted. In this case, the circulation of the concentrated slurry may be directly circulated by a circulation pipe branched from a pipe for discharging the concentrated liquid from the centrifugal separator 3. A storage tank may be provided between the storage tanks to circulate the concentrated liquid from the storage tank.

【0059】本発明においては、このような研磨材の回
収装置により、好ましくは、研磨材濃度が1〜30重量
%、研磨材粒子の粒子径範囲が0.1〜0.5μmで、
分散剤濃度が研磨材100重量部に対して0.01〜1
0重量部であるような再生スラリを得る。この再生スラ
リ中の研磨材濃度に特に制限はないが、再生スラリの取
り扱い性の面から1〜30重量%の範囲とするのが好ま
しい。また、分散剤濃度は、再生スラリ中の研磨材粒子
の分散性及び沈降防止性等の面から、上記範囲とするの
が好ましい。
In the present invention, preferably, the abrasive concentration is 1 to 30% by weight and the abrasive particles have a particle size range of 0.1 to 0.5 μm by such an abrasive recovery apparatus.
The dispersant concentration is 0.01 to 1 with respect to 100 parts by weight of the abrasive.
A regenerated slurry is obtained which is 0 parts by weight. The concentration of the abrasive in the regenerated slurry is not particularly limited, but is preferably in the range of 1 to 30% by weight from the viewpoint of handleability of the regenerated slurry. The dispersant concentration is preferably in the above range from the viewpoint of the dispersibility of the abrasive particles in the regenerated slurry and the anti-settling property.

【0060】[0060]

【発明の効果】以上詳述した通り、本発明の研磨材の回
収装置によれば、粗大固形物を除去するための膜分離手
段の膜の目詰まりを防止することができることから、膜
の交換頻度を低減することができ、ランニングコストを
大幅に低減して、長期に亘り安定して不純物の少ない研
磨材粒子を効率的に回収することができる。
As described in detail above, according to the apparatus for collecting abrasives of the present invention, it is possible to prevent clogging of the membrane of the membrane separation means for removing coarse solids, and therefore, it is necessary to replace the membrane. The frequency can be reduced, the running cost can be significantly reduced, and the abrasive particles with few impurities can be efficiently collected stably over a long period of time.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の研磨材の回収装置の実施の形態を示す
系統図である。
FIG. 1 is a system diagram showing an embodiment of an abrasive recovery apparatus of the present invention.

【図2】MF膜分離装置の膜透過水の循環手段の実施の
形態を示す系統図である。
FIG. 2 is a system diagram showing an embodiment of a means for circulating membrane permeated water of the MF membrane separation device.

【符号の説明】[Explanation of symbols]

1 貯留槽 2,2A,2B,6,7 MF膜分離装置 3 遠心分離機 4 洗浄槽 5 超音波照射手段 8 調整槽 9 循環貯槽 Reference Signs List 1 storage tank 2, 2A, 2B, 6, 7 MF membrane separator 3 centrifuge 4 washing tank 5 ultrasonic irradiation means 8 adjustment tank 9 circulation storage tank

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 3C047 FF08 GG14 GG17 4D006 GA07 JA56A JA70A KA02 KA53 KA63 KA72 KB14 KB20 KB30 KD30 PB08 PB20 PC01 4D037 AA13 AB02 BA28 CA02 CA03 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 3C047 FF08 GG14 GG17 4D006 GA07 JA56A JA70A KA02 KA53 KA63 KA72 KB14 KB20 KB30 KD30 PB08 PB20 PC01 4D037 AA13 AB02 BA28 CA02 CA03

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 研磨工程排水中の粗大固形物を除去する
膜分離手段と、研磨材を回収するための固液分離手段と
を有する研磨材の回収装置であって、 前記膜分離手段の運転停止時に膜透過水を該膜分離手段
の導入側に循環する循環手段を設けたことを特徴とする
研磨材の回収装置。
1. A polishing material recovery apparatus comprising: a membrane separation means for removing coarse solids in a polishing process wastewater; and a solid-liquid separation means for collecting an abrasive. A polishing means for circulating the membrane permeated water to the introduction side of the membrane separation means at the time of a stop;
【請求項2】 請求項1において、固液分離手段が遠心
分離手段又は膜分離手段であることを特徴とする研磨材
の回収装置。
2. The abrasive recovery device according to claim 1, wherein the solid-liquid separation means is a centrifugal separation means or a membrane separation means.
JP2000006759A 2000-01-14 2000-01-14 Recovery apparatus for abrasive Pending JP2001198825A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000006759A JP2001198825A (en) 2000-01-14 2000-01-14 Recovery apparatus for abrasive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000006759A JP2001198825A (en) 2000-01-14 2000-01-14 Recovery apparatus for abrasive

Publications (1)

Publication Number Publication Date
JP2001198825A true JP2001198825A (en) 2001-07-24

Family

ID=18535237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000006759A Pending JP2001198825A (en) 2000-01-14 2000-01-14 Recovery apparatus for abrasive

Country Status (1)

Country Link
JP (1) JP2001198825A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008078498A1 (en) * 2006-12-25 2008-07-03 Ngk Insulators, Ltd. Wastewater treatment system and method of wastewater treatment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008078498A1 (en) * 2006-12-25 2008-07-03 Ngk Insulators, Ltd. Wastewater treatment system and method of wastewater treatment
US7922915B2 (en) 2006-12-25 2011-04-12 Ngk Insulators, Ltd. Wastewater treatment system and method of wastewater treatment
JP5563765B2 (en) * 2006-12-25 2014-07-30 日本碍子株式会社 Waste water treatment system and waste water treatment method

Similar Documents

Publication Publication Date Title
JP3341601B2 (en) Method and apparatus for collecting and reusing abrasives
US6802983B2 (en) Preparation of high performance silica slurry using a centrifuge
US6656359B1 (en) Method and apparatus for reuse of abrasive fluid used in the manufacture of semiconductors
JP2606156B2 (en) Method for collecting abrasive particles
US9592471B2 (en) Recycling method and device for recycling waste water containing slurry from a semi-conductor treatment process, in particular from a chemico-mechanical polishing process
US6722958B2 (en) Apparatus and process for recovering abrasive
WO2008020507A1 (en) Method of recovering abrasive from abrasive slurry waste liquid and apparatus therefor
WO2012114395A1 (en) Abrasive recovery method and abrasive recovery device
JP5163078B2 (en) Polishing apparatus and method
JP2008034827A (en) Method and apparatus for recycling chemical-mechanical abrasive
JPH11121408A (en) Device for recovering abrasive slurry
JP2001009723A (en) Abrasive recovering device
JP2001225070A (en) Apparatus for recovering abrasive material
JP2000288935A (en) Method and device for recovering non-colloidal abrasive material
JP2001198826A (en) Recovery apparatus for abrasive
JP4457444B2 (en) Abrasive recovery method
JP2001198825A (en) Recovery apparatus for abrasive
JP4161389B2 (en) Polishing wastewater treatment method and apparatus
JP2001198823A (en) Recovery device for abrasive
JP2001138236A (en) Abrasive material recovering apparatus
JP2001009721A (en) Abrasive recovery system
JP2001009722A (en) Abrasive recovery system
JPH1133362A (en) Recovery method and apparatus of polishing agent
JP2000126768A (en) Method nd apparatus for treating cmp waste solution
JP2001138235A (en) Abrasive material recovering apparatus