JP2001196599A5 - - Google Patents
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- JP2001196599A5 JP2001196599A5 JP2000327179A JP2000327179A JP2001196599A5 JP 2001196599 A5 JP2001196599 A5 JP 2001196599A5 JP 2000327179 A JP2000327179 A JP 2000327179A JP 2000327179 A JP2000327179 A JP 2000327179A JP 2001196599 A5 JP2001196599 A5 JP 2001196599A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000327179A JP4776767B2 (ja) | 1999-10-26 | 2000-10-26 | 半導体装置の作製方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11-304719 | 1999-10-26 | ||
JP30471999 | 1999-10-26 | ||
JP1999304719 | 1999-10-26 | ||
JP2000327179A JP4776767B2 (ja) | 1999-10-26 | 2000-10-26 | 半導体装置の作製方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001196599A JP2001196599A (ja) | 2001-07-19 |
JP2001196599A5 true JP2001196599A5 (enrdf_load_stackoverflow) | 2007-12-06 |
JP4776767B2 JP4776767B2 (ja) | 2011-09-21 |
Family
ID=26564023
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000327179A Expired - Fee Related JP4776767B2 (ja) | 1999-10-26 | 2000-10-26 | 半導体装置の作製方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4776767B2 (enrdf_load_stackoverflow) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW552645B (en) | 2001-08-03 | 2003-09-11 | Semiconductor Energy Lab | Laser irradiating device, laser irradiating method and manufacturing method of semiconductor device |
US6933527B2 (en) | 2001-12-28 | 2005-08-23 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and semiconductor device production system |
JP4011344B2 (ja) | 2001-12-28 | 2007-11-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
EP1326273B1 (en) * | 2001-12-28 | 2012-01-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US6841797B2 (en) | 2002-01-17 | 2005-01-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device formed over a surface with a drepession portion and a projection portion |
CN100350617C (zh) | 2002-03-05 | 2007-11-21 | 株式会社半导体能源研究所 | 半导体元件和使用半导体元件的半导体装置 |
US6847050B2 (en) | 2002-03-15 | 2005-01-25 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element and semiconductor device comprising the same |
JP4631250B2 (ja) * | 2003-04-22 | 2011-02-16 | セイコーエプソン株式会社 | 半導体装置の製造方法及び半導体装置、並びにこれを備えた電気光学装置及び電子機器 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3150840B2 (ja) * | 1994-03-11 | 2001-03-26 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
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2000
- 2000-10-26 JP JP2000327179A patent/JP4776767B2/ja not_active Expired - Fee Related