JP2001196500A5 - - Google Patents
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- Publication number
- JP2001196500A5 JP2001196500A5 JP2000002594A JP2000002594A JP2001196500A5 JP 2001196500 A5 JP2001196500 A5 JP 2001196500A5 JP 2000002594 A JP2000002594 A JP 2000002594A JP 2000002594 A JP2000002594 A JP 2000002594A JP 2001196500 A5 JP2001196500 A5 JP 2001196500A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000002594A JP4013432B2 (ja) | 2000-01-11 | 2000-01-11 | 半導体パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000002594A JP4013432B2 (ja) | 2000-01-11 | 2000-01-11 | 半導体パッケージ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001196500A JP2001196500A (ja) | 2001-07-19 |
| JP2001196500A5 true JP2001196500A5 (de) | 2006-12-21 |
| JP4013432B2 JP4013432B2 (ja) | 2007-11-28 |
Family
ID=18531684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000002594A Expired - Fee Related JP4013432B2 (ja) | 2000-01-11 | 2000-01-11 | 半導体パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4013432B2 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7504710B2 (en) | 2004-06-28 | 2009-03-17 | Mitsubishi Electric Corporation | Multilayer dielectric substrate and semiconductor package |
| KR100650732B1 (ko) | 2004-12-28 | 2006-11-27 | 주식회사 하이닉스반도체 | 스택 칩 패키지 |
| CN101971327B (zh) * | 2008-03-17 | 2012-07-18 | 三菱电机株式会社 | 多层介质基板及半导体封装 |
| JP5377096B2 (ja) | 2008-09-08 | 2013-12-25 | 株式会社東芝 | 高周波パッケージ装置およびその製造方法 |
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2000
- 2000-01-11 JP JP2000002594A patent/JP4013432B2/ja not_active Expired - Fee Related