JP2001196285A - Resist applicator - Google Patents
Resist applicatorInfo
- Publication number
- JP2001196285A JP2001196285A JP2000001049A JP2000001049A JP2001196285A JP 2001196285 A JP2001196285 A JP 2001196285A JP 2000001049 A JP2000001049 A JP 2000001049A JP 2000001049 A JP2000001049 A JP 2000001049A JP 2001196285 A JP2001196285 A JP 2001196285A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- ridge
- resist
- polyimide
- resist coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はレジスト類塗布機に
関し、特に、レジスト、ポリイミドあるいはＰＭＧＩな
どのレジスト類を基板に均一に塗布するための小型のレ
ジスト類塗布機に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resist coater, and more particularly to a small resist coater for uniformly coating a resist such as resist, polyimide or PMGI on a substrate.
【０００２】[0002]
【従来の技術】図３に従来のレジスト類塗布機の斜視図
を、図４に斜視図中Ａ−Ａ’における断面図を示す。2. Description of the Related Art FIG. 3 is a perspective view of a conventional resist coating machine, and FIG. 4 is a sectional view taken along line AA 'in FIG.
【０００３】両図において５は筐体であり、筐体５中に
は電源（図示せず）によって回転駆動されるモータ１が
配設される。４は基板固定台であり、モータ１の回転軸
２と係合する軸状の係合部４ａを備える。基板固定台４
はさらにディスク状の基板載置部４ｂを備え、当該載置
部に基板３が固定される。[0005] In both figures, reference numeral 5 denotes a housing, in which a motor 1 rotated and driven by a power supply (not shown) is provided. Reference numeral 4 denotes a substrate fixing base, which includes a shaft-shaped engaging portion 4a that engages with the rotating shaft 2 of the motor 1. Board fixing stand 4
Further includes a disk-shaped substrate mounting portion 4b, on which the substrate 3 is fixed.
【０００４】モータ１は一方向に回転駆動され、図３で
は時計回り方向（ＣＷ）に回転して基板固定台４を同方
向に回転させる。基板固定台４の上部には、基板載置部
４ｂ上の基板３にレジスト類を滴下して塗布するための
レジスト滴下手段（図示せず）が設けられる。The motor 1 is driven to rotate in one direction, and rotates clockwise (CW) in FIG. 3 to rotate the substrate fixing table 4 in the same direction. A resist dropping means (not shown) for dropping and applying resists to the substrate 3 on the substrate mounting portion 4b is provided on the upper portion of the substrate fixing base 4.
【０００５】次に、上記構成の従来のレジスト類塗布機
を用いて、リッジを持った基板に例えばポリイミドを塗
布してリッジ構造を平坦化し、リッジの頭に形成した電
極を外部に引き出すプロセスを行った場合の動作と問題
点について考察する。Next, using a conventional resist coating machine having the above-described structure, a process of applying a polyimide, for example, to a substrate having a ridge to flatten the ridge structure and drawing out an electrode formed at the head of the ridge to the outside. Consider the operation and the problems when it is performed.
【０００６】図５（Ａ）〜図５（Ｃ）はレジスト塗布か
ら電極形成までの工程を説明する動作説明図であり、回
転方向と直交する方向に示している。FIGS. 5 (A) to 5 (C) are operation explanatory views for explaining steps from resist coating to electrode formation, and are shown in a direction orthogonal to the rotation direction.
【０００７】使用する基板３には、図５（Ａ）のよう
に、幅Ｗ、高さＨのリッジ６が形成されている。なお、
この例においては幅Ｗは１．５μｍ程度、高さＨは４μ
ｍ程度とするが、以下の議論は、幅Ｗ、高さＨの値に関
らず成立する。As shown in FIG. 5A, a ridge 6 having a width W and a height H is formed on a substrate 3 to be used. In addition,
In this example, the width W is about 1.5 μm, and the height H is 4 μm.
m, but the following discussion holds regardless of the values of the width W and the height H.
【０００８】図３および図４に示したように基板３を基
板載置部４ｂ上に載置する。この状態で、レジスト滴下
手段によってポリイミド７を滴下した後、基板固定台４
を時計回り方向（ＣＷ）に回転させ、図５（Ａ）の通り
に基板３の全面に塗布する。この時、回転方向と慣性の
関係で、リッジ６の図中左側にポリイミド７が堰き止め
られて溜まる。従って、リッジ６の右側にはポリイミド
７が充分には供給されないので、ここにディップ８が生
じてしまう。この形状に形成されたポリイミド７をべー
キングにより固化する。As shown in FIGS. 3 and 4, the substrate 3 is placed on the substrate placing portion 4b. In this state, after the polyimide 7 is dropped by the resist dropping means, the substrate fixing table 4
Is rotated in the clockwise direction (CW), and the entire surface of the substrate 3 is applied as shown in FIG. At this time, due to the relationship between the rotational direction and the inertia, the polyimide 7 is blocked and accumulated on the left side of the ridge 6 in the drawing. Therefore, the polyimide 7 is not sufficiently supplied to the right side of the ridge 6, so that the dip 8 occurs here. The polyimide 7 formed in this shape is solidified by baking.
【０００９】次に、図５（Ｂ）に示すようにエッチバッ
クを行ってリッジ６の頭出しを行なう。すなわち、基板
３の上方から酸素ガスによるリアクティブイオンエッチ
ング（Ｏ2−ＲＩＥ）を行ってポリイミド７の上部を除
去する。この結果、リッジ６の右側には段差９が生じ
る。Next, as shown in FIG. 5B, the ridge 6 is caught by performing etch back. That is, reactive ion etching (O 2 -RIE) using oxygen gas is performed from above the substrate 3 to remove the upper portion of the polyimide 7. As a result, a step 9 is formed on the right side of the ridge 6.
【００１０】続いて、ポリイミド７とリッジ６の上部に
電極を形成すると、図５（Ｃ）に示すように電極１０ａ
もディップ８にしたがって湾曲した断面形状となり、ま
た、段差９によって電極１０ｂと電極１０ａが不連続と
なって電極の断線が起こってしまう。Subsequently, when electrodes are formed on the polyimide 7 and the ridge 6, the electrodes 10a are formed as shown in FIG.
Also, the electrode 10b and the electrode 10a become discontinuous due to the step 9, and the electrode is disconnected.
【００１１】[0011]
【発明が解決しようとする課題】従来のレジスト類塗布
機では、上述した通り電極の断線が起こるという課題が
あった。The conventional resist coating machine has a problem that the electrodes are disconnected as described above.
【００１２】このようにリッジ６の回転方向に対し両側
において塗布された厚みが異なるのはポリイミドの場合
のみでなく、厚みの相異は通常のレジストやＰＭＧＩ
（Polyglycidal Methacrylate Imede）など粘性のある
液体を塗布した場合には必ず生じてしまう。また本出願
人は、従来のレジスト類塗布機のように同じ方向に回転
させた場合には、レジスト塗布とベーキングを何度繰り
返しても厚みの相異を解決することができないことを実
験的に確認した。As described above, the difference in the thickness applied on both sides with respect to the rotation direction of the ridge 6 is not only in the case of the polyimide, but the difference in the thickness is caused by the ordinary resist or PMGI.
When a viscous liquid such as (Polyglycidal Methacrylate Imede) is applied, it always occurs. In addition, the present applicant has experimentally demonstrated that, if the resist is rotated in the same direction as in a conventional resist coating machine, the difference in thickness cannot be solved even if resist coating and baking are repeated many times. confirmed.
【００１３】また従来のレジスト類塗布機では、上述の
ようなエッチバックを行うことなくリッジ６の頭部に微
細なパターンを形成する場合にも、正確なパターン形成
を行えないという課題があった。Further, the conventional resist coating machine has a problem that even when a fine pattern is formed on the head of the ridge 6 without performing the above-described etchback, an accurate pattern cannot be formed. .
【００１４】そこで本発明は、リッジ両側に形成される
レジスト類の厚みの相異を解決し、リッジ頭部から電極
を引き出す際の断線を防ぐことができ、またはリッジ頭
部へ微細なパターンを形成することのできるレジスト類
塗布機を提供することを目的とする。Therefore, the present invention solves the difference in the thickness of the resists formed on both sides of the ridge and can prevent disconnection when the electrode is pulled out from the ridge head, or can form a fine pattern on the ridge head. It is an object of the present invention to provide a resist coating machine that can be formed.
【００１５】[0015]
【課題を解決するための手段】上記の目的を達成するた
めに本発明は、基板を固定する基板固定手段と、駆動電
源から電力を供給されて前記基板固定手段を回転させる
回転手段と、前記回転駆動にしたがって回転する前記基
板固定手段に固定された基板にレジスト類を塗布する塗
布手段と、前記回転手段に供給する電力の極性を切り替
えて、前記回転手段の回転方向を時計回り方向と反時計
回り方向に切り替える回転切り替え手段とを備えたこと
を特徴とするレジスト類塗布機を提供する。In order to achieve the above object, the present invention provides a substrate fixing means for fixing a substrate, a rotating means for supplying electric power from a driving power supply to rotate the substrate fixing means, The polarity of electric power supplied to the rotating means and the coating means for coating resists on the substrate fixed to the substrate fixing means which rotates according to the rotation drive are switched so that the rotating direction of the rotating means is opposite to the clockwise direction. A resist coating machine comprising: a rotation switching unit that switches clockwise.
【００１６】上記構成の本発明によれば、基板固定手段
は時計回りと反時計回りの両方向に回転可能である。従
って、時計回りに回転させてレジスト類を一旦塗布し、
べーキングにより固化させた後、今度は時計回りに回転
させてレジスト類を塗布してべーキングすると、リッジ
両側で対称となるようにレジスト類を塗布することがで
きる。According to the present invention having the above structure, the substrate fixing means can rotate in both clockwise and counterclockwise directions. Therefore, apply the resists once by rotating clockwise,
After solidifying by baking, the resist is applied by rotating clockwise and baking is performed, so that the resist can be applied so as to be symmetrical on both sides of the ridge.
【００１７】[0017]
【発明の実施の形態】図１は本発明に係る一実施形態の
レジスト類塗布機の構成を示す構成図である。図３中と
同一構成要素には同一符号を付し、その説明を省略す
る。FIG. 1 is a configuration diagram showing the configuration of a resist coating machine according to an embodiment of the present invention. The same components as those in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted.
【００１８】図１において、１２は本発明の特徴である
極性切替スイッチであり、電源スイッチＳと直流電源Ｅ
の直列回路とモータ１の間に接続される。極性切替スイ
ッチ１２には、例えば２回路３接点のコンタクト・スイ
ッチを用いることができる。極性切替スイッチ１２の回
路形式はこれに限定されない。In FIG. 1, reference numeral 12 denotes a polarity switch which is a feature of the present invention.
Is connected between the series circuit and the motor 1. As the polarity switch 12, for example, a contact switch having two circuits and three contacts can be used. The circuit type of the polarity switch 12 is not limited to this.
【００１９】電源スイッチＳがオンされているときに極
性切替スイッチ１２を手動操作することで、直流電源Ｅ
からモータ１に印加する電源電圧の極性を反転させて、
モータ１を、すなわち基板３を時計回り方向（ＣＷ）の
みならず反時計回り方向（ＣＣＷ）に回転駆動すること
が可能である。基板固定台４の上部には、レジスト滴下
手段（図示せず）が設けられる。By manually operating the polarity switch 12 when the power switch S is turned on, the DC power supply E
From the power supply voltage applied to the motor 1
It is possible to rotationally drive the motor 1, that is, the substrate 3 not only in the clockwise direction (CW) but also in the counterclockwise direction (CCW). A resist dropping means (not shown) is provided above the substrate fixing table 4.
【００２０】以下、本実施形態に係るレジスト類塗布機
によるレジスト塗布から電極形成までの工程と、当該工
程により得られる効果について、図２（Ａ）〜図２
（Ｄ）の動作説明図（レジスト塗布から電極形成までの
工程）を参照して説明する。図２（Ａ）〜図２（Ｄ）は
回転方向と直交する方向に示している。Hereinafter, the steps from resist coating to electrode formation by the resist coating machine according to the present embodiment and the effects obtained by the steps will be described with reference to FIGS.
The operation will be described with reference to the operation explanatory view of FIG. FIGS. 2A to 2D show directions orthogonal to the rotation direction.
【００２１】まず、従来例と同様に基板固定台４の上に
基板３を載置し、固定する。レジスト類の一例として基
板３上にポリイミド７を滴下した後、電源スイッチＳを
オンさせて時計回り方向（ＣＷ）に基板固定台４を回転
させて基板３にポリイミド７を塗布した後、べーキング
により固化する。この時、図２（Ａ）に示したように、
従来例と同様にポリイミド７は基板３のリッジ６によっ
てその図中左側に堰き止められ、ここに多く溜まる。一
方、リッジ６の右側にはディップ８が形成される。First, the substrate 3 is placed on the substrate fixing table 4 and fixed as in the conventional example. After the polyimide 7 is dropped on the substrate 3 as an example of resists, the power switch S is turned on, and the substrate fixing base 4 is rotated in the clockwise direction (CW) to apply the polyimide 7 to the substrate 3, followed by baking. To solidify. At this time, as shown in FIG.
As in the conventional example, the polyimide 7 is blocked by the ridge 6 of the substrate 3 on the left side in the figure, and a large amount of the polyimide 7 accumulates here. On the other hand, a dip 8 is formed on the right side of the ridge 6.
【００２２】この工程までは従来例と同様である。The steps up to this step are the same as in the conventional example.
【００２３】続いて、図２（Ａ）の形状とされたポリイ
ミド７の上にポリイミド１１を滴下した後、極性切替ス
イッチ１２を手動操作し、反時計回り方向（ＣＣＷ）に
基板固定台４を回転させてポリイミド７上にポリイミド
１１を塗布した後、べーキングにより固化する。このと
き、回転方向が反時計回り方向（ＣＣＷ）であるため、
最初の工程で形成されたディップ８部分にポリイミド１
１が多く溜まるので、これによってディップが解消さ
れ、リッジ６の両側におけるポリイミド形状はほぼ対称
となる。Subsequently, after the polyimide 11 is dropped on the polyimide 7 having the shape shown in FIG. 2A, the polarity change switch 12 is manually operated, and the substrate fixing base 4 is moved in the counterclockwise direction (CCW). The polyimide 11 is applied on the polyimide 7 by rotating, and then solidified by baking. At this time, since the rotation direction is the counterclockwise direction (CCW),
Polyimide 1 is applied to the dip 8 formed in the first step.
Since many 1s accumulate, the dip is eliminated, and the polyimide shapes on both sides of the ridge 6 are substantially symmetric.
【００２４】ポリイミドが対称となった状態で、続いて
図２（Ｃ）に示すように基板３の上方から酸素ガスによ
るリアクティブイオンエッチング（Ｏ2−ＲＩＥ）を行
ってポリイミド７と１１の上部を除去する。この結果、
リッジ両側でポリイミドが対称な形状となるように、リ
ッジ６が頭出しされる。このとき、リッジ側部に段差は
生じていない。With the polyimide symmetrical, reactive ion etching (O 2 -RIE) using oxygen gas is performed from above the substrate 3 as shown in FIG. Is removed. As a result,
The ridge 6 is caught so that the polyimide has a symmetrical shape on both sides of the ridge. At this time, there is no step on the side of the ridge.
【００２５】これに続いて、ポリイミド７，１１とリッ
ジ６の上部に電極を形成すると、図２（Ｄ）に示すよう
に断線することなく連続した電極１０を形成することが
できる。Subsequently, when electrodes are formed on the polyimides 7 and 11 and the ridge 6, the continuous electrodes 10 can be formed without disconnection as shown in FIG. 2D.
【００２６】なお、上述した例では最初のレジスト塗布
時に時計回りに回転させ、次のレジスト塗布時に反時計
回りに回転させていたが、これとは逆に、最初のレジス
ト塗布時に反時計回りに回転させ、次のレジスト塗布時
に時計回りに回転させても良い。このように両方向に回
転させ、各回転時にレジスト類を塗布することで、ポリ
イミド以外のレジストやＰＭＧＩなど、粘性のある液体
であればリッジの左右においてほぼ対称となるように塗
布することができる。In the above-described example, the resist is rotated clockwise at the time of the first resist coating, and is rotated counterclockwise at the time of the next resist coating. Conversely, it is rotated counterclockwise at the first resist coating. It may be rotated clockwise in the next resist application. By rotating in both directions in this way and applying the resists at each rotation, a viscous liquid such as a resist other than polyimide or PMGI can be applied so as to be substantially symmetric on the left and right sides of the ridge.
【００２７】また、上述した例では時計回りと反時計回
りのレジスト類の塗布手順を一回だけ行う場合を説明し
たが、上記塗布手順を複数回繰返すことにより、より均
一な塗布を可能とすることができる。In the above-described example, the case where the clockwise and counterclockwise resist coating procedures are performed only once has been described. However, by repeating the above coating procedure a plurality of times, more uniform coating is possible. be able to.
【００２８】[0028]
【発明の効果】以上説明したように本発明に係るレジス
ト類塗布機によれば、基板固定手段を時計回りと反時計
回りの両方向に回転可能とすることでリッジ両側で対称
となるようにレジスト類を塗布することができるので、
リッジの頭部付近において微細なパターンを形成するこ
とができ、また、エッチバックによってリッジ頭部を露
出させても断線のない電極を形成できるなどの効果があ
る。As described above, according to the resist coating machine of the present invention, the substrate fixing means can be rotated in both clockwise and counterclockwise directions so that the resist is symmetrical on both sides of the ridge. Kind can be applied,
There is an effect that a fine pattern can be formed near the head of the ridge, and an electrode without disconnection can be formed even when the head of the ridge is exposed by etch-back.
【図１】本発明に係る一実施形態のレジスト類塗布機の
構成を示す構成図である。FIG. 1 is a configuration diagram showing a configuration of a resist coating machine according to an embodiment of the present invention.
【図２】本発明に係る一実施形態のレジスト類塗布機に
よるレジスト塗布から電極形成までの工程を説明する動
作説明図である。FIG. 2 is an operation explanatory diagram illustrating steps from resist coating to electrode formation by a resist coating machine according to one embodiment of the present invention.
【図３】従来のレジスト類塗布機の一例の斜視図であ
る。FIG. 3 is a perspective view of an example of a conventional resist coating machine.
【図４】従来のレジスト類塗布機の一例の断面図であ
る。FIG. 4 is a sectional view of an example of a conventional resist coating machine.
【図５】従来のレジスト類塗布機によるレジスト塗布か
ら電極形成までの工程を説明する動作説明図である。FIG. 5 is an operation explanatory view illustrating steps from resist coating to electrode formation by a conventional resist coating machine.
１ モータ ２ 回転軸 ３ 基板 ４ 基板固定台 ５ 筐体 ６ リッジ ７，１１ ポリイミド ８ ディップ ９ 段差 １０ 電極 １２ 極性切替スイッチ DESCRIPTION OF SYMBOLS 1 Motor 2 Rotation axis 3 Substrate 4 Substrate fixing stand 5 Housing 6 Ridge 7, 11 Polyimide 8 Dip 9 Step 10 Electrode 12 Polarity change switch
Claims (1)
させる回転手段と、 前記回転駆動にしたがって回転する前記基板固定手段に
固定された基板にレジスト類を塗布する塗布手段と、 前記回転手段に供給する電力の極性を切り替えて、前記
回転手段の回転方向を時計回り方向と反時計回り方向に
切り替える回転切り替え手段とを備えたことを特徴とす
るレジスト類塗布機。1. A substrate fixing means for fixing a substrate, a rotating means supplied with electric power from a driving power supply to rotate the substrate fixing means, and a substrate fixed to the substrate fixing means which rotates according to the rotation drive. Coating means for applying resists, and rotation switching means for switching the polarity of electric power supplied to the rotating means to switch the rotating direction of the rotating means between clockwise and counterclockwise. Resist coating machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000001049A JP2001196285A (en) | 2000-01-06 | 2000-01-06 | Resist applicator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000001049A JP2001196285A (en) | 2000-01-06 | 2000-01-06 | Resist applicator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001196285A true JP2001196285A (en) | 2001-07-19 |
Family
ID=18530312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000001049A Pending JP2001196285A (en) | 2000-01-06 | 2000-01-06 | Resist applicator |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015531994A (en) * | 2012-07-10 | 2015-11-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Uniform masking for wafer dicing using laser and plasma etching |
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2000
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015531994A (en) * | 2012-07-10 | 2015-11-05 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | Uniform masking for wafer dicing using laser and plasma etching |
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