JP2001194417A - Substrate with electrode, inspecting jig using the same, inspection apparatus and adapter apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate with electrodes, which can be prevented from deforming. SOLUTION: This substrate 100 with electrodes has an anisotropic conductive elastic body sheet 20, set between a circuit substrate 10 and a flexible substrate 30. Elastic force of the anisotropic conductive elastic body sheet 20 can reduce deformation of the substrate 100 with the electrodes, which is caused by a stress resulting from the differences in elastic moduli, thermal expansion coefficients or the like between the flexible substrate 30 and the circuit substrate 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate having electrodes and an inspection jig, an inspection device and an adapter device using the substrate.

[0002]

2. Description of the Related Art Anisotropically conductive elastic sheets are particularly fine multi-pieces such as inspection jigs for ICs and printed circuit boards, mounting IC sockets and printed circuit board connectors, and IC card connectors in the periphery thereof. Used to achieve point electrical connections.

An anisotropic conductive elastic sheet used in such technical fields has conductivity only in the thickness direction or shows conductivity only in the thickness direction when pressed. It has a large number of pressurized conductive parts. As the anisotropic conductive elastic sheet, those of various structures,
For example, Japanese Patent Publication No. 56-48951,
No. 93393, JP-A-53-147772,
JP-A-54-146873, JP-A-7-1057
No. 41, U.S. Pat. No. 4,292,261 and the like. The outline of the conventional anisotropic conductive elastic sheet will be described below.

As shown in FIG. 10, when an anisotropic conductive elastic sheet 2000 is viewed from the surface, for example, an insulating sheet 2100 made of silicone rubber and having a thickness of about 1 mm is formed.
Many conductive portions 2200 are formed in an island shape. FIG. 11 is a cross-sectional view of the anisotropic conductive elastic sheet 2000 taken along the line AA. In FIG. 11, conductive portion 2200 is formed by collecting a plurality of particle arrays in which conductive ferromagnetic particles 2210 (for example, nickel particles) are continuously connected in the thickness direction of anisotropic conductive elastic sheet 2000. It is a thing. The anisotropic conductive elastic sheet 2000 has conductivity in the thickness direction but does not have conductivity in the plane direction, and is therefore called an anisotropic conductive elastic sheet.

The anisotropic conductive elastic sheet can be produced, for example, by the following method. Disperse the conductive ferromagnetic particles in the thermosetting silicone rubber liquid to make a molding material,
The molding material is put into the molding space of the mold. By applying a magnetic field to the molding space, the conductive ferromagnetic particles are magnetically oriented. When the silicone rubber liquid is cured by heating in this state, the anisotropic conductive elastic sheet is completed.

The main applications of the anisotropic conductive elastic sheet are as described above. The details of the use of the anisotropic conductive elastic sheet will be described with reference to an inspection jig used for inspecting the electrical characteristics of an inspection object such as a semiconductor device.
FIG. 9 is a sectional view of the inspection jig. The inspection jig 1000 includes a circuit board 1100 and an anisotropic conductive elastic sheet 1200 placed on the circuit board 1100.

The circuit board 1100 has a structure in which three rigid layers are stacked, and an upper electrode 1110 is formed on the upper surface and a lower electrode 1120 is formed on the lower surface. Lower electrode 1120
Is electrically connected to an electrical characteristic inspection device (not shown).
A wiring layer 1130 is formed in the circuit board 1100. The upper electrode 1110 and the lower electrode 1120 are connected to the wiring layer 1
130 are electrically connected.

The inspection jig 1000 has a guide plate 1300 attached to the surface of the circuit board 1100 on which the upper electrode 1110 is formed. An anisotropic conductive elastic sheet 1200 is provided in a region surrounded by the guide plate 1300.

The anisotropic conductive elastic sheet 1200 includes an insulating sheet 1210 and a conductive portion 1220 formed locally on the insulating sheet 1210 and serving as an electrical contact. The conductive portion 1220 is in contact with the upper surface electrode 1110.

Next, a method of using the inspection jig 1000 will be described. The semiconductor device 2000 to be inspected is guided by the guide plate 1300, and the anisotropic conductive elastic sheet 12 is guided.
Put on 00. Then, by pressing the semiconductor substrate 2200 of the semiconductor device 2000 by the pressing mechanism 3000, the semiconductor device 20 is securely contacted with the bump electrode 2100 of the semiconductor device 2000 and the conductive portion 1220.
The electrical characteristics of 00 are examined.

The role of the anisotropic conductive elastic sheet 1200 in the inspection jig 1000 will be described. Bump electrode 2
When the semiconductor device 2000 is in direct contact with the upper surface electrode 1110, the contact becomes unstable due to variations in the height of the bump electrode 2100, warpage of the semiconductor substrate 2200, warpage of the circuit board 1100, and the like. This leads to reduced reliability. Therefore, the anisotropic conductive elastic sheet 12
00, the variation and the like are absorbed by the elasticity of the conductive portion 1220, and the electrical connection between the bump electrode 2100 and the upper surface electrode 1110 is stabilized.

[0012]

Since the circuit board 1100 has a structure in which rigid layers are stacked, warpage is likely to occur. This warpage is one of the causes of an unstable electrical connection between the bump electrode 2100 and the upper surface electrode 1110. As described above, the anisotropic conductive elastic sheet 1200 absorbs the influence of the warpage. However, if the warpage is large, this effect may not be fully absorbed.

In addition, the distance between the bump electrodes 2100 has been reduced with the miniaturization of the semiconductor device 2000. This is because the conductive portion 1220 of the anisotropic conductive elastic sheet 1200
This means miniaturization of the distance. By the way, the conductive part 12
As the distance between the two decreases, the thickness of the anisotropic conductive elastic sheet 1200 decreases accordingly. Therefore, when the distance between the conductive portions 1220 is reduced, the thickness of the anisotropic conductive elastic sheet 1200 must be reduced. When the thickness of the anisotropic conductive elastic sheet 1200 is reduced, the ability to absorb the above-mentioned variation and the like is reduced. As a result, variations and the like cannot be completely absorbed, and the bump electrode 2100 and the conductive portion 1
In some cases, the electrical characteristics may be inspected in a state where the conductive portion 220 is not in contact with the conductive portion 220, or the durability of the conductive portion 1220 may decrease.

Further, the limit value of the miniaturization of the distance between the conductive portions 1220 is larger than the limit value of the miniaturization of the distance between the bump electrodes 2100 for the reason of manufacturing the anisotropic conductive elastic sheet 1200. Therefore, depending on the degree of miniaturization of the distance between the bump electrodes 2100, the anisotropic conductive elastic sheet 12
00 may not be used.

Since the anisotropic conductive elastic sheet 1200 is produced by the above-described method, uncured silicone rubber may partially exist in the anisotropic conductive elastic sheet 1200. is there. When such an anisotropic conductive elastic sheet 1200 is used for the inspection jig 1000, when the semiconductor device 2000 is pressed by the pressing mechanism 3000, the uncured silicone rubber in the anisotropic conductive elastic sheet 1200 is deformed. It may seep out to the surface of the one conductive elastic sheet 1200. When the exuded silicone rubber adheres to the bump electrode 2100, after the inspection, the semiconductor device 200
When 0 is mounted on a mounting board, the yield of mounting may decrease, or the mounting reliability may decrease.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a substrate having electrodes, an inspection jig and an inspection apparatus using the same, which can prevent deformation of the substrate having electrodes. And an adapter device.

Another object of the present invention is to provide a substrate having an electrode, and an inspection jig, an inspection apparatus and an adapter device using the substrate, which can improve the durability of the substrate having the electrode.

Still another object of the present invention is to provide a substrate having electrodes having a finer pattern of terminal electrodes and an inspection jig, an inspection apparatus and an adapter apparatus using the substrate.

Still another object of the present invention is to provide a substrate having electrodes and an inspection jig using the same, which can prevent the elastic material constituting the anisotropic conductive elastic sheet from leaking out of the circuit board. An inspection device and an adapter device are provided.

[0020]

(1) A substrate having electrodes according to the present invention includes a flexible substrate, an anisotropic conductive elastic sheet, and a circuit board. , An insulating sheet, a conductive portion locally formed on the insulating sheet and serving as an electrical contact, the flexible board has terminal electrodes, the circuit board has connector electrodes, The conductive elastic sheet is located between the circuit board and the flexible board, and the connector electrode and the terminal electrode are electrically connected via a conductive portion.

From the above configuration, the substrate having the electrode according to the present invention has the following functions and effects. The present invention includes an anisotropic conductive elastic sheet between a flexible substrate and a circuit board. Due to the elastic force of the anisotropic conductive elastic sheet, it is possible to reduce the deformation of the substrate having electrodes due to the stress caused by the difference between the elastic coefficient, thermal expansion coefficient, etc. of the flexible substrate and those of the circuit board. Become. For example, the stress generated when a substrate having electrodes is manufactured by the build-up method can be absorbed by the elastic force of the anisotropic conductive elastic sheet.

Further, according to the present invention, the connector electrode and the terminal electrode are electrically connected by the conductive portion of the anisotropic conductive elastic sheet. Since the conductive portion has elasticity, it is possible to prevent the occurrence of electrical connection failure between the connector electrode and the terminal electrode caused by the stress. That is, when the electrical connection between the connector electrode and the terminal electrode is made by a wiring member having no elasticity, the wiring member may be disconnected due to the stress.

Further, according to the present invention, the terminal electrode is formed on the flexible substrate. Therefore, a terminal electrode having a finer pattern can be formed as compared with the case where the conductive portion of the anisotropic conductive elastic sheet is used as a terminal electrode. It is not easy to make the distance between the conductive parts of the anisotropic conductive elastic sheet small for the reason of its production, and it is easier to make the distance between the terminal electrodes of the flexible substrate fine.

The flexible substrate in the present invention means a substrate which can be flexibly moved in the thickness direction of a substrate having electrodes. Materials satisfying such properties include polyimide, polyester, and PET.
The reason why the substrate positioned on the anisotropic conductive elastic sheet was a flexible substrate is that when this substrate is a rigid substrate having no flexibility, when a certain terminal electrode comes into contact with the electrode of another element and is pressed, This is because the other non-contact terminal electrodes also follow this, and eventually move to the non-contact state.

The circuit board is a board on which circuits can be formed, such as a rigid board and a board having a flexible property. When the circuit board has a flexible property, the electrodes on both sides of the circuit board can be flexibly moved in the thickness direction of the board having the electrodes.

Next, preferred embodiments of the present invention will be described below. In the present invention, preferably, a positioning hole for an electrode of an element electrically connected to the terminal electrode is formed in the flexible substrate, and the terminal electrode is located in the hole. According to this configuration, the electrode of the element whose hole is electrically connected to the terminal electrode (for example, the electrode of the inspection object)
Performs the positioning function. For this reason, the positioning accuracy is improved as compared with the case where there is no hole. In particular, when the electrode electrically connected to the terminal electrode is spherical (for example, solder ball) or columnar, the positioning function of the hole portion works effectively. As an example of the structure in which the terminal electrode is located in the hole, a concave electrode formed by forming a copper foil pattern at the hole on the back surface of the flexible sheet in which the hole is formed and applying gold plating is used. is there.

In the present invention, preferably, the terminal electrode has a projection. This protrusion contacts the electrode of the element electrically connected to the terminal electrode. According to this configuration, in particular,
When the electrode of the element is a flat plate (for example, an aluminum pad) or when the vertical cross section of the electrode of the element is a trapezoid (for example, Au)
In a mesa-type bump, the reliability of connection between the terminal electrode and the electrode of the element can be improved. As a terminal electrode having a projection, for example, there is a small-diameter projection electrode in which a metal film having excellent contact properties such as Au, Pd, Rh or the like is formed on the surface of a core metal having high hardness such as Ni.

In the present invention, preferably, a circuit is formed on a flexible substrate. According to this configuration, since the circuit is formed on the circuit board and the flexible board, the degree of integration of the board having the electrodes can be improved.

In the present invention, preferably, the flexible substrate is used for improving the degree of freedom of forming a wiring layer in a substrate having electrodes.

In the present invention, preferably, a flexible substrate, an anisotropically conductive elastic sheet, and a circuit board are separately prepared in advance, these are laminated, and the laminate is subjected to, for example, thermocompression bonding to produce a substrate having electrodes. I do. According to this, since the substrate having the electrode according to the present invention can be manufactured by the conventional multilayer substrate forming apparatus, the substrate having the electrode is manufactured without using any special means in terms of equipment and process. be able to.

Preferably, in the present invention, another anisotropic conductive elastic sheet is further attached to the substrate having the electrodes, and the other anisotropic conductive elastic sheet is located on the flexible substrate, and the other anisotropic conductive elastic sheet is disposed on the flexible substrate. The conductive portion of the conductive elastic sheet is electrically connected to the terminal electrode. According to this configuration,
In addition to the anisotropically conductive elastic sheet between the circuit board and the flexible substrate, the sheet is provided with another anisotropically conductive elastic sheet. It can be further improved. This is particularly effective when there is a large variation in electrode height such as a solder ball electrode. Further, according to this configuration, for example, variations in the height of the electrodes of the inspection object are absorbed by the anisotropic conductive elastic sheet between the circuit board and the flexible board and other anisotropic conductive elastic sheets. Therefore, it is possible to reduce the fatigue generated in the conductive portion of these anisotropic conductive elastic sheets. Therefore, the durability of these anisotropic conductive elastic sheets can be improved.

Preferably, in the present invention, in the case where the present invention has a structure provided with the above another anisotropic conductive elastic sheet, the terminal electrodes of the flexible substrate are made of metal. A terminal electrode is located between the conductive part of the anisotropic conductive elastic sheet between the circuit board and the flexible substrate and the conductive part of another anisotropic conductive elastic sheet. When the terminal electrode has elasticity or flexibility, the contact between the terminal electrode and the conductive portion is not stable. According to this configuration, since the metal terminal electrode is interposed, the contact state can be stabilized. The term "metal terminal electrode" used herein refers to, for example, an electrode obtained by plating a pattern made of copper or nickel with gold, palladium, rhodium, or the like.

The present invention is directed to an inspection jig for inspecting electrical characteristics of an object to be inspected, which includes a substrate having the above-described electrode according to the present invention.

According to the present invention, there is provided an inspection apparatus for inspecting electrical characteristics of an inspection object by electrically connecting a contact electrode portion to an electrode of the inspection object. Is an inspection device including a contact electrode portion in a contact electrode portion.

According to the present invention, there is provided an adapter device used for electrical connection between a first element and a second element, the adapter device including a substrate having the above-described electrode according to the present invention. Here, the first and second elements are an electronic circuit device,
The operational effects of the inspection jig, the inspection device, and the adapter device according to the present invention, which mean an electric circuit device, a circuit board, and the like, will be described using an inspection jig as an example. When inspecting the electrical characteristics of the object to be inspected, the object to be inspected is placed on an inspection jig, and the electrodes of the object to be inspected are brought into contact with the terminal electrodes of the substrate having the electrodes. Due to variations in the height of the electrodes of the inspection object, the contact between the electrodes of the inspection object and the terminal electrodes of the substrate having the electrodes may not be stable. According to the present invention, since the anisotropic conductive elastic sheet is located between the flexible substrate and the circuit board, the electrode of the object to be inspected and the substrate having the electrodes are formed by the elastic force of the anisotropic conductive elastic sheet. The contact with the terminal electrode can be stabilized. Here, the inspection object means a semiconductor device, a circuit board, and the like.

In the present invention, since the flexible substrate is provided on the anisotropic conductive elastic sheet, the uncured material among the elastic materials constituting the anisotropic conductive elastic sheet can be inspected by the flexible substrate. It is possible to prevent the flexible substrate from seeping out of the substrate having the electrodes due to pressurization or heating at that time. Therefore, according to the present invention, it is possible to prevent the elastic material constituting the anisotropic conductive elastic sheet from adhering to the electrodes of the inspection object. It does not reduce the reliability of the connection.

Further, since the present invention includes the anisotropic conductive elastic sheet, the inspection object can be inspected without preparing a new anisotropic conductive elastic sheet.

(2) The substrate having the electrode according to the present invention includes a flexible substrate, an anisotropic conductive elastic sheet,
The flexible substrate and the anisotropic conductive elastic sheet are laminated, and the anisotropic conductive elastic sheet is an insulating sheet, and a conductive portion locally formed on the insulating sheet and serving as an electrical contact. And the flexible substrate has a terminal electrode, and the terminal electrode and the conductive portion are electrically connected.

From the above configuration, it can be said that the substrate having the electrode according to the present invention is the same as the substrate having the electrode according to the present invention described in (1).

[0040]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] {Description of Structure} FIG. 1 is a sectional view of a substrate having an electrode according to a first embodiment of the present invention, and FIG. FIG. 3 is an exploded view of a substrate having the above. The substrate 100 having electrodes includes a circuit board 10, an anisotropic conductive elastic sheet 20 located on the circuit board 10, and a flexible substrate 30 located on the anisotropic conductive elastic sheet 20.

The circuit board 10 has a structure in which three rigid layers are laminated. The circuit board 10 is not limited to a three-layer structure, but may have another multi-layer structure or a single-layer structure. An example of the rigid layer is an epoxy substrate containing a glass cloth. An upper surface electrode 12 is formed on the uppermost rigid layer, and a lower surface electrode 14 is formed on the lowermost rigid layer in a predetermined pattern. Upper electrode 12
The lower electrode 14 is formed, for example, by etching a copper foil attached to a rigid layer. The upper electrode 12 is an example of a connector electrode. A wiring layer 16 is formed in the circuit board 10. The upper electrode 12 and the lower electrode 14 are electrically connected via a wiring layer 16.
The wiring layer 16 is formed of, for example, a plating layer.

The circuit board 10 can be produced by placing a prepreg on both sides of a core substrate, sandwiching this structure with an epoxy substrate, and processing by a vacuum press or a build-up method.

The anisotropic conductive elastic sheet 20 is the same as that described in the background art, and includes an insulating sheet 24 having elasticity, an insulating sheet 24 formed locally on the insulating sheet 24 in a predetermined pattern, and an electric sheet. And a conductive portion 22 serving as a target contact. The conductive portion 22 contacts the upper electrode 12 of the circuit board 10.

The flexible substrate 30 includes a substrate portion 32,
An upper electrode 34 is formed on the upper surface of the substrate 32 in a predetermined pattern, and a lower electrode 36 is formed on the lower surface of the substrate 32 in a predetermined pattern.

Although not shown, a through hole is formed in the substrate portion 32. A plating layer is embedded in the through hole. The upper electrode 34 and the lower electrode 36 are electrically connected by this plating layer.

The substrate 32 is flexible, and its material is, for example, polyimide. The upper electrode 34 is an example of a terminal electrode. The lower electrode 36 contacts the conductive part 22 of the anisotropic conductive elastic sheet 20. The upper electrode 34 and the lower electrode 36 are metal electrodes. That is, the upper electrode 34 and the lower electrode 36 are, for example, electrodes formed by plating a copper foil pattern formed on the substrate 32 with gold.

The substrate 100 having the electrodes described above
Can be manufactured by, for example, interposing an anisotropic conductive elastic sheet 20 coated with an elastic adhesive on both sides between a circuit board 10 and a flexible board 30 and hot-pressing the laminate. it can.

<< Explanation of Effect >> The first embodiment of the present invention shown in FIG.
The main effects of the substrate 100 having the electrodes according to the embodiment will be described.

The substrate 100 having electrodes according to the first embodiment has an anisotropic conductive elastic sheet 20 between a flexible substrate 30 and a circuit board 10. Therefore, the elastic force of the anisotropic conductive elastic sheet 20 causes the deformation of the substrate 100 having the electrodes caused by the stress caused by the difference between the elastic coefficient and the thermal expansion coefficient of the flexible substrate 30 and those of the circuit board 10. It is possible to reduce the size.

Further, according to the substrate 100 having electrodes according to the first embodiment, the upper surface electrode 12 of the circuit board 10 and the lower surface electrode 36 of the flexible substrate 30 are formed by the conductive portions 22 of the anisotropic conductive elastic sheet 20. And are electrically connected. Since the conductive portion 22 has elasticity, it is possible to prevent the occurrence of poor electrical connection between the upper electrode 12 and the lower electrode 36 due to the stress. That is, the conductive portion 22
If the resin does not have elasticity, the above-mentioned stress may deform the conductive portion and cause disconnection.

Further, according to the substrate 100 having the electrodes according to the first embodiment, the upper electrode 34 serving as the terminal electrode is formed on the flexible substrate 30. Therefore, a terminal electrode having a finer pattern can be formed as compared with the case where the conductive portion 22 of the anisotropic conductive elastic sheet 20 is used as a terminal electrode.

[Second Embodiment] FIG. 3 shows a second embodiment of the present invention.
FIG. 3 is a cross-sectional view of the inspection jig according to the embodiment. The inspection jig 2 is a jig for inspecting electrical characteristics of a semiconductor device or the like. The inspection jig 2 includes a substrate 200 having electrodes.
And a guide plate 300 attached to a surface of the substrate 200 having electrodes on which the upper electrode 34 is formed;
Is provided. A region surrounded by the guide plate 300 is a region where a semiconductor device or the like to be inspected is placed. The structure of the substrate 200 having electrodes is the same as the structure of the substrate 100 having electrodes according to the first embodiment. Therefore, the description of the reference numerals indicating the components of the substrate 200 having the electrodes is the same as the reference numerals indicating the components of the substrate 100 having the electrodes.

Next, a method of using the inspection jig 2 will be described. The semiconductor device 400 to be inspected is connected to the guide plate 30.
Guided at 0 and placed on the flexible substrate 30. Then, the semiconductor substrate 420 of the semiconductor device 400 is pressed by the pressing mechanism 500, and the bump electrode 410 of the semiconductor device 400 and the upper surface electrode 34 of the flexible substrate 30 are pressed.
The electrical characteristics of the semiconductor device 400 are examined after the contact with the semiconductor device 400 is ensured. At this time, the elasticity of the conductive portion 22 of the anisotropic conductive elastic sheet 20 absorbs variations in the height of the bump electrode 410, and the bump electrode 410 and the upper electrode 3
4 stabilizes the contact.

Next, main effects of the inspection jig 2 according to the second embodiment of the present invention will be described.

In the substrate 200 having electrodes provided on the inspection jig 2 according to the second embodiment of the present invention, the anisotropic conductive elastic sheet 20 is positioned between the flexible substrate 30 and the circuit substrate 10. Therefore, the contact between the bump electrode 410 and the upper surface electrode 34 of the flexible substrate 30 can be stabilized by the elastic force of the anisotropic conductive elastic sheet 20.

In the substrate 200 having the electrodes of the inspection jig 2 according to the second embodiment of the present invention, the flexible substrate 30 is located on the anisotropic conductive elastic sheet 20. When the semiconductor substrate 420 is pressed by the pressing mechanism 500, the upper electrode 34 in contact with the bump electrode 410 among the upper electrodes 34 of the flexible substrate 30 moves flexibly in the thickness direction of the substrate 200 having the electrode. This enables the bump electrode 410 that is not in contact with the upper electrode 34 to reliably contact the upper electrode 34 even if the height of the bump electrode 410 varies.

In the substrate 200 having the electrodes of the inspection jig 2 according to the second embodiment of the present invention, since the flexible substrate 30 is provided on the anisotropic conductive elastic sheet 20, It is possible to prevent the uncured material among the elastic materials forming the elastic sheet 20 from seeping out of the substrate 200 having the electrodes from the flexible substrate 30 side by pressurizing or heating at the time of inspection. Therefore, it is possible to prevent the uncured elastic material constituting the anisotropic conductive elastic sheet 20 from adhering to the bump electrodes 410, so that the yield of mounting the semiconductor device after inspection is reduced, or It does not reduce the reliability of the connection.

Further, since the substrate 200 having the electrodes of the inspection jig 2 according to the second embodiment of the present invention includes the anisotropic conductive elastic sheet 20, it is newly added to the anisotropic conductive elastic body. The semiconductor device 400 can be inspected without preparing a sheet.

Since the structure of the substrate 200 having the electrodes of the inspection jig 2 according to the second embodiment of the present invention is the same as the structure of the substrate 100 having the electrodes, the substrate 200 having the electrodes is the same as the substrate having the electrodes. It has the same effect as 100.

[Third Embodiment] FIG. 4 shows a third embodiment of the present invention.
FIG. 3 is a cross-sectional view of the inspection jig according to the embodiment. The inspection jig 4 is a jig for inspecting electrical characteristics of a semiconductor device or the like, similarly to the inspection jig 2 according to the second embodiment of the present invention. In the components of the inspection jig 4 shown in FIG. 4, the same components as those of the inspection jig 2 shown in FIG.

The difference between the components of the inspection jig 4 shown in FIG. 4 and the components of the inspection jig 2 shown in FIG. 3 is the structure of the flexible substrate. That is, the flexible substrate 40 of the substrate 200 having the electrodes of the inspection jig 4 shown in FIG.
6, a flexible substrate portion 42 formed locally,
A lower surface electrode 44 formed on the back surface of the substrate part 42.

The detailed structure of the flexible substrate 40 will be described with reference to FIG. FIG. 5 is a partially enlarged view of the flexible substrate 40 shown in FIG. Flexible substrate 4
The hole 46 is formed in the position 0 corresponding to the bump electrode 410. The hole 46 penetrates through the substrate 42 in the thickness direction of the substrate 42. The lower electrode 44 is formed on the back surface of the substrate portion 42, is located at the bottom of the hole 46, and is formed so as to cover at least the opening of the hole 46. The upper surface electrode is not formed on the flexible substrate 40. The lower electrode 44 becomes a terminal electrode. The hole 46 functions to position the bump electrode 410, and the bump electrode 410 contacts the lower electrode 44 via the hole 46.

Next, the specific effects of the inspection jig 4 according to the third embodiment of the present invention will be described. The substrate 200 having the electrodes of the inspection jig 4 according to the third embodiment of the present invention
In FIG. 5, since the flexible substrate 40 has the holes 46 for positioning the bump electrodes 410 as shown in FIG. 5, the positioning accuracy of the bump electrodes 410 is improved.

Other functions and effects are the same as those of the inspection jig 2 according to the second embodiment of the present invention.

[Fourth Embodiment] FIG. 6 shows a fourth embodiment of the present invention.
FIG. 4 is a partially enlarged view of the inspection jig according to the embodiment, and shows the vicinity of a flexible substrate 50. The basic structure of the inspection jig shown in FIG. 6 is the same as the basic structure of the inspection jig 2 shown in FIG. The difference between the components of the inspection jig shown in FIG. 6 and the components of the inspection jig 2 shown in FIG. 3 is the structure of the flexible substrate.

That is, the flexible substrate 50 of the inspection jig shown in FIG. 6 includes a flexible substrate 52, a lower electrode 54 formed on the back surface of the substrate 52, and a bump electrode formed on the surface of the substrate 52. And a top electrode 56 having a structure. In this embodiment, the upper surface electrode 56 is an electrode having a projection. A through hole is formed in the substrate portion 52, and a through layer is filled with a wiring layer 58 made of a plating layer. The upper electrode 56 and the lower electrode 54 of the flexible substrate 50 are electrically connected by a wiring layer 58. Note that a pad electrode 430 is formed on the semiconductor device to be inspected.

Next, the specific effects of the inspection jig according to the fourth embodiment of the present invention will be described. As shown in FIG.
The upper surface electrode 56 of the flexible substrate 50 is a bump electrode. Since the bump electrode has a protruding shape, the reliability of contact with the pad electrode 430 is higher than that of a film-shaped electrode.

Other functions and effects are the same as those of the inspection jig 2 according to the second embodiment of the present invention.

Note that a combination of the third embodiment and the fourth embodiment of the present invention is a modification.
That is, the lower surface electrode 44 of the flexible substrate 40 shown in FIG.
6, the height of the protrusion is smaller than the depth of the hole 46, and the protrusion is located at the bottom of the hole 46.

[Fifth Embodiment] FIG. 7 shows a fifth embodiment of the present invention.
FIG. 3 is a cross-sectional view of the inspection jig according to the embodiment. The difference from the inspection jig 2 shown in FIG. 3 is that an anisotropic conductive elastic sheet 600 is further arranged on the flexible substrate 30 in a region surrounded by the guide plate 300.

The anisotropic conductive elastic sheet 600 includes an insulating sheet 640 having elasticity, and a conductive portion 620 formed locally on the insulating sheet 640 in a predetermined pattern and serving as an electrical contact. You. The conductive portion 620 is located at a position corresponding to the upper surface electrode 34 of the flexible substrate 30 and is in contact with the upper surface electrode 34. The anisotropic conductive elastic sheet 600 is detachably attached to the guide plate 300. The structures of the substrate 200 having electrodes and the guide plate 300 are the same as those of the inspection jig 2 shown in FIG.

Next, a method of using the inspection jig 6 will be described. The semiconductor device 400 to be inspected is connected to the guide plate 30.
0 and is placed on the anisotropic conductive elastic sheet 600. Then, by pressing the semiconductor substrate 420 of the semiconductor device 400 by the pressing mechanism 500, the semiconductor device 4
The electrical characteristics of the semiconductor device 400 are examined in a state where the contact between the bump electrode 410 of FIG.

Next, the specific effects of the inspection jig 6 according to the fifth embodiment of the present invention will be described. Since the inspection jig 6 according to the fifth embodiment of the present invention includes the anisotropic conductive elastic sheet 600 in addition to the anisotropic conductive elastic sheet 20 as shown in FIG. The ability to absorb the height variation of the electrode 410 and the like can be further improved. Further, according to this configuration, the variation in height of the bump electrodes 410 is absorbed by the anisotropic conductive elastic sheets 20 and 600, so that the fatigue generated in the conductive portions 22 and 620 can be reduced. Therefore, the durability of the anisotropic conductive elastic sheets 20 and 600 can be improved.

In the inspection jig 6 according to the fifth embodiment of the present invention, the conductive portion 620 of the anisotropic conductive elastic sheet 600 and the conductive portion 2 of the anisotropic conductive elastic sheet 20
2, the upper electrode 34 and the lower electrode 36 of the flexible substrate 30 are interposed. The upper electrode 34 and the lower electrode 36 are plate-shaped metal electrodes. Conductive parts 22, 620
Has elasticity, so that the upper surface electrode 34 and the lower surface electrode 36
The connection state between the conductive portion 22 and the conductive portion 620 can be stabilized by interposing.

Other functions and effects are the same as those of the inspection jig 2 according to the second embodiment of the present invention.

[Sixth Embodiment] FIG. 8 shows a sixth embodiment of the present invention.
FIG. 7 is a cross-sectional view of a substrate 700 having electrodes according to the embodiment. The substrate 700 having electrodes is different from the substrate 100 having electrodes shown in FIG. 1 in that the circuit board 10 is not provided. That is, the substrate 700 having the electrodes is composed of the anisotropic conductive elastic sheet 720 and the anisotropic conductive elastic sheet 720.
An upper flexible substrate 740.

The anisotropic conductive elastic sheet 720 has the same structure as the anisotropic conductive elastic sheet 20 shown in FIG. 1, and has an insulating sheet 724 having elasticity and an insulating sheet 724.
And a conductive portion 722 locally formed in a predetermined pattern and serving as an electrical contact.

The flexible substrate 740 has the same structure as the flexible substrate 30 shown in FIG. 1, and includes a flexible substrate 742, an upper electrode 744 formed on the upper surface of the substrate 742 in a predetermined pattern, Lower surface electrode 746 formed in a predetermined pattern on the lower surface of 742
And is composed of Substrate part 742, upper surface electrode 74
4. The material of the lower electrode 746 is the same as the material of the substrate portion 32, the upper electrode 34, and the lower electrode 36 of the flexible substrate 30 shown in FIG.

The substrate 700 having the electrodes is, for example, as shown in FIG.
Can be used as components of the substrate 100 having the electrodes shown in FIG. That is, the circuit board 1 having the electrodes is positioned on the surface of the circuit board 10 shown in FIG.
A substrate 700 having electrodes is placed on a circuit board 10
The substrate 700 having electrodes is thermocompression-bonded to form the substrate 100 having electrodes.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a substrate having an electrode according to a first embodiment of the present invention.

FIG. 2 is an exploded view of a substrate having electrodes according to the first embodiment of the present invention.

FIG. 3 is a sectional view of an inspection jig according to a second embodiment of the present invention.

FIG. 4 is a sectional view of an inspection jig according to a third embodiment of the present invention.

5 is a partially enlarged view of the flexible substrate shown in FIG.

FIG. 6 is a partially enlarged view of an inspection jig according to a fourth embodiment of the present invention.

FIG. 7 is a sectional view of an inspection jig according to a fifth embodiment of the present invention.

FIG. 8 is a sectional view of a substrate having electrodes according to a sixth embodiment of the present invention.

FIG. 9 is a sectional view of an inspection jig used for an apparatus for inspecting electrical characteristics of a semiconductor device or the like.

FIG. 10 is a perspective view of an example of an anisotropic conductive elastic sheet.

FIG. 11 is a cross-sectional view of the anisotropic conductive elastic sheet shown in FIG.
It is sectional drawing along the A line.

[Explanation of symbols]

 2, 4, 6 Inspection jig 10 Circuit board 12 Upper electrode 14 Lower electrode 16 Wiring layer 20 Anisotropically conductive elastic sheet 22 Conductive part 24 Insulating sheet 30 Flexible substrate 32 Substrate part 34 Upper surface electrode 36 Lower electrode 40 Flexible substrate 42 substrate portion 44 lower surface electrode 46 hole portion 50 flexible substrate 52 substrate portion 54 lower surface electrode 56 upper surface electrode 58 wiring layer 100 substrate having electrodes 200 substrate having electrodes 300 guide plate 400 semiconductor device 410 bump electrode 420 semiconductor substrate 430 pad electrode 500 Pressing mechanism 600 Anisotropically conductive elastic sheet 620 Conductive section 640 Insulating sheet 700 Substrate having electrodes 720 Anisotropically conductive elastic sheet 722 Conducting section 724 Insulating sheet 740 Flexible board 742 Board section 744 Upper electrode 746 Below Surface electrode

Claims (10)

[Claims] 1. A flexible substrate, an anisotropic conductive elastic sheet, and a circuit board, wherein the anisotropic conductive elastic sheet is locally formed on the insulating sheet and the insulating sheet. And a conductive portion serving as an electrical contact, wherein the flexible substrate has terminal electrodes, the circuit board has connector electrodes, and the anisotropic conductive elastic sheet has the circuit board and the flexible board. A substrate having an electrode, located between the substrate and the substrate, wherein the connector electrode and the terminal electrode are electrically connected via the conductive portion. 2. A flexible substrate and an anisotropic conductive elastic sheet, wherein the flexible substrate and the anisotropic conductive elastic sheet are laminated, and wherein the anisotropic conductive elastic sheet has an insulating property. A sheet, and a conductive portion locally formed on the insulating sheet and serving as an electrical contact. The flexible substrate has a terminal electrode, and the terminal electrode and the conductive portion are electrically connected to each other. A connected substrate having electrodes. 3. The flexible substrate according to claim 1, further comprising a positioning hole formed in the flexible substrate for an electrode of an element electrically connected to the terminal electrode, wherein the terminal electrode is formed in the hole. A substrate with electrodes located thereon. 4. The substrate according to claim 1, wherein the terminal electrode has a projection. 5. The substrate according to claim 1, wherein the circuit substrate has a flexible property and has electrodes. 6. The substrate according to claim 1, further comprising another anisotropic conductive elastic sheet attached to the substrate having the electrodes, wherein the other anisotropic conductive elastic sheet is the flexible substrate. A substrate having an electrode, wherein the conductive portion of the another anisotropic conductive elastic sheet is electrically connected to the terminal electrode. 7. The substrate according to claim 1, wherein the terminal electrode is made of metal. 8. An inspection jig for inspecting electrical characteristics of an object to be inspected, the inspection jig including any one of the substrates having the electrodes according to claim 1. 9. An inspection device for inspecting an electrical characteristic of the object to be inspected by electrically connecting a contact electrode portion to an electrode of the object to be inspected, wherein the contact electrode portion is defined in claim 1 to 7. An inspection device including any one of the substrates having such an electrode. 10. An adapter device used for electrical connection between a first element and a second element, the adapter device including any one of the substrates having the electrodes according to claim 1.