JP2001186594A - Insulation ring for condenser microphone and its fixing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an insulation ring for a condenser microphone and its fixing method, where a case of the condenser microphone can be insulated electrically from an integrated base ring and a diaphragm. SOLUTION: A gate of a FET is connected electrically to a pattern and a base ring of printed circuit board, the source and the drain of the FET are electrically connected to patterns formed on both sides of the printed circuit board, a spacer, a diaphragm, base ring, FET and printed circuit board or the like are stacked sequentially, the stacked components are placed to the inside of the condenser microphone with the case to which a sound wave flowing entrance is made, an insulating material is surrounded on the outer circumferential edge of the base ring, and the case is insulated electrically from the integrated base ring and the diaphragm. Thus, according to this ring, one can electrically insulate the case from the integrated base ring and the diaphragm and also simplify a work fixing the insulation ring to the outer circumferential edge of the diaphragm and the integrated base ring.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating ring for a condenser microphone, and more particularly to an insulating ring provided inside a condenser microphone for converting a change in capacitance due to sound waves into an electric signal. The present invention relates to a capacitor microphone insulating ring capable of facilitating a manufacturing operation of the capacitor microphone by improving a structure of the insulating ring of the capacitor microphone which is electrically insulated from the diaphragm and a method of fixing the same.

[0002]

2. Description of the Related Art A conventional condenser microphone is shown in FIG.
2, a printed circuit board 101 on which a predetermined pattern is formed, an FET 102 for converting a change in potential due to a change in capacitance into an electric signal, a base ring 103 for connecting the FET 102 and the diaphragm 104, A diaphragm 10 that vibrates due to the incoming sound wave
4, a spacer 105 that insulates the case 106 from the diaphragm 104, and a case 106 in which a sound wave inlet 107 is further perforated.

The diaphragm 104 and the base ring 103
Is electrically connected to the gate of the FET 102 through a predetermined pattern on the upper surface of the printed circuit board 101,
6 is electrically connected to the source of the FET 102 via a predetermined pattern on the bottom surface of the printed circuit board 101. Of course,
The diaphragm 104 and the base ring 103 are electrically insulated from each other.

For this reason, conventionally, as shown in FIGS. 1 and 2, an insulating film 108, 1
After forming 18 in the case, the remaining components are provided. In this case, it is difficult not only to form the insulating films 108 and 118 accurately in the case, but also to form the insulating films 108 and 1.
Since it takes a long time to form the capacitor 18, the manufacturing time of the condenser microphone is disadvantageously increased.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to not only more efficiently insulate the case from the integrated base ring and diaphragm, but also to provide an integrated base ring and diaphragm. An object of the present invention is to provide an insulating ring for a condenser microphone and a method for fixing the insulating ring, which can simplify the work of fixing the insulating ring to the outer peripheral edge.

[0006]

In order to achieve the above object, an insulating ring of a condenser microphone according to the present invention has a structure in which a gate of an FET is electrically connected to a pattern and a base ring of a printed circuit board, and a gate of the FET. The source and the drain are electrically connected to the patterns formed on both sides of the printed circuit board, respectively, the spacer, the diaphragm, the base ring, the FET, the printed circuit board, etc. are sequentially laminated, and the sound wave inlet is provided. It is provided inside a condenser microphone having a perforated case and is made of an insulating material surrounding the outer peripheral edge of the base ring, so that the case is electrically insulated from the integrated base ring and diaphragm. It is characterized by.

The upper and lower thicknesses of the insulating ring are 75% to 85% of the thickness of the integrated base ring and the guiding plate.
%, And the insulating ring made of a material that contracts at a predetermined temperature is preferably fixed to the central part of the integrated base ring and the diaphragm.

The fixing method of the insulating ring of the condenser microphone is such that when the insulating ring is fixed to the integrated base ring and diaphragm, the case and the base ring, and the case and the diaphragm are insulated from each other so that a predetermined inner diameter is provided. The integrated base ring and the diaphragm are placed inside the insulating ring having a shape, and heat is applied at a predetermined temperature, so that the insulating ring shrinks and the integrated base ring and the outer peripheral edge of the diaphragm It is characterized by being fixed to.

The insulating ring, which is made of a material that contracts at a predetermined temperature, has a thickness of 7 mm between the integrated base ring and the diaphragm among the outer peripheral surfaces of the integrated base ring and the diaphragm.
It is preferable to fix only at the central portion corresponding to 5% to 85%. Here, the insulating ring is used at a temperature of 70 ° C. to 9 ° C.
A material that contracts by heat at 0 ° C. can be used.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the accompanying drawings. In the present invention, as shown in FIG. 3 and FIG. 4, a sound wave inlet 51 is perforated at the center of the upper surface of the case 50, and the lower surface thereof is completely open at first. That is, the case 50 has the spacer 40 inside.
And the printed circuit board 10 having the diaphragm 30, the base ring 20, and the FET 13 are sequentially laminated. In other words, the uppermost end of the case 50 is provided with a donut-shaped spacer 40 made of an insulating material, and then provided with the integrated diaphragm 30, base ring 20, and insulating ring 60.

Here, the diaphragm 30 and the base ring 20
Are electrically connected to each other, and an insulating ring 60 made of an insulating material is fixed to outer peripheral edges of the integrated diaphragm 30 and base ring 20. In particular, the insulating ring 60 is made of a material that contracts by heat at a predetermined temperature (70 ° C. to 90 ° C.)
The diaphragm 30 and the base ring 2 having a diameter larger than that of the base ring 20 and being integrated inside the insulating ring 60.
0 is placed on the insulating ring 6 by applying heat.
0 is fixed to the central part of the outer peripheral surface of the diaphragm 30 and the base ring 20 integrated while contracting.

In this case, the integral vibration plate 30 and the insulating ring 60 fixed to the outer peripheral surface of the base ring 20
As shown in FIG. 4, the diaphragm 3 in which the case 50 is integrated
The thickness of the integrated base ring 20 and the outer peripheral surface of the diaphragm 30 so that the base ring 20 is accurately connected to the pattern of the printed circuit board 10 while insulating the base ring 20 from the base ring 20. It is fixed to a central part corresponding to 75% to 85% of the height.

Then, the lower end of the case 50 is provided on the printed circuit board 10 having the FET 13, and the lower end of the case 50 is bent inward.
0, the base ring 20, and the printed circuit board 10 are fixed.

FIG. 5 is a plan view showing the printed circuit board 10, and a pattern (Pg) having a predetermined width is provided around the printed circuit board 10.
Is formed to connect not only to the base ring 20 provided on the upper part but also to the gate of the FET 13.
Through hole 1 for inserting source and drain of FET13
1, 12 are perforated.

FIG. 6 is a front view showing the printed circuit board 10, in which a pattern (Pd) electrically connected to the through hole 11 is formed at the center, and the through hole 12 and A pattern (Ps) electrically connected to the case 50 is formed.

Next, the operation of the present invention configured as described above will be described. When the diaphragm 30 vibrates due to sound waves flowing through the sound wave inlet 51 of the case 50, the distance between the diaphragm 30 and the case 50 changes, and the diaphragm 3
The capacitance between 0 and case 50 changes.

Thus, since the potential of the base ring 20 is input to the gate of the FET 13 in response to the sound wave,
The current flowing from the source of the ET 13 to the drain is amplified corresponding to the sound wave. Thereby, the microphone can convert the sound wave flowing through the sound wave inlet 51 into an electric signal and amplify it. As described above, the present invention has been described in detail only with respect to the specific examples described. However, it is apparent to those skilled in the art that various modifications and modifications are possible within the scope of the technical idea of the present invention. Such variations and modifications naturally fall within the scope of the appended claims.

[0018]

Therefore, according to the present invention, not only can the case be more electrically insulated from the integrated base ring and diaphragm, but also the outer peripheral edge of the integrated base ring and diaphragm. This has the effect of simplifying the work of fixing the insulating ring.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing one embodiment of a conventional condenser microphone.

FIG. 2 is a sectional view showing another embodiment of the conventional condenser microphone.

FIG. 3 is an exploded perspective view showing a condenser microphone according to the present invention.

FIG. 4 is a sectional view showing a condenser microphone according to the present invention.

FIG. 5 is a plan view of a printed circuit board used for the condenser microphone according to the present invention.

FIG. 6 is a front view of a printed circuit board used for the condenser microphone according to the present invention.

FIG. 7 is a side view showing a main part of the condenser microphone according to the present invention.

[Explanation of symbols]

 Reference Signs List 10 printed circuit board 11, 12 through hole 13 FET 20 base ring 30 diaphragm 40 spacer 50 case 51 sound wave inlet 60 insulating ring Pg, Ps, Pd pattern

Claims (8)

[Claims] A gate of the FET is electrically connected to a pattern and a base ring of the printed circuit board; a source and a drain of the FET are electrically connected to patterns formed on both sides of the printed circuit board; , A diaphragm, a base ring, an FET, a printed circuit board, and the like are sequentially stacked, and the case has a case in which a sound wave inlet is perforated. Made of an insulating material surrounding the outer periphery of the ring,
An insulating ring for a condenser microphone, wherein the case is electrically insulated from the integrated base ring and diaphragm. 2. The thickness of the insulating ring in the vertical direction is 75% to 8% of the thickness of the integrated base ring and the diaphragm.
2. The insulating ring for a condenser microphone according to claim 1, wherein the amount is 5%. 3. The insulating ring according to claim 1, wherein the insulating ring is fixed to a central portion of the integrated base ring and the diaphragm. 4. The insulating ring according to claim 1, wherein the insulating ring is made of a material that contracts at a predetermined temperature. 5. A gate of the FET is electrically connected to a pattern and a base ring of the printed circuit board, and a source and a drain of the FET are electrically connected to patterns formed on both sides of the printed circuit board, respectively. , A diaphragm, a base ring, an FET, a printed circuit board, and the like, are sequentially laminated, and the case has a case in which a sound wave inlet is perforated. In a method of fixing an insulating ring of a condenser microphone in which a case and a base ring of a microphone and a case and a diaphragm are insulated from each other, the integrated base ring and the diaphragm are mounted inside an insulating ring having a predetermined inner diameter. The insulation ring shrinks by applying heat at a predetermined temperature. , The method of fixing the insulating ring of the condenser microphone, characterized in that integrated base ring and has to be fixed to the outer peripheral edge of the diaphragm. 6. The insulating ring is provided only at a central portion corresponding to 75% to 85% of the thickness of the integrated base ring and the diaphragm among the outer peripheral edges of the integrated base ring and the diaphragm. 6. The method for fixing an insulating ring of a condenser microphone according to claim 5, wherein the fixing ring is fixed. 7. The method according to claim 5, wherein the insulating ring is made of a material that contracts at a predetermined temperature. 8. The insulating ring according to claim 5, wherein the insulating ring is made of a material that contracts when heated to 70 ° C. to 90 ° C.
Or the method of fixing the insulating ring of the condenser microphone according to 7.