JP2001177309A5 - - Google Patents

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Publication number
JP2001177309A5
JP2001177309A5 JP1999361343A JP36134399A JP2001177309A5 JP 2001177309 A5 JP2001177309 A5 JP 2001177309A5 JP 1999361343 A JP1999361343 A JP 1999361343A JP 36134399 A JP36134399 A JP 36134399A JP 2001177309 A5 JP2001177309 A5 JP 2001177309A5
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JP
Japan
Prior art keywords
alloy
magnetic
resin case
yoke
case
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Pending
Application number
JP1999361343A
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Japanese (ja)
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JP2001177309A (en
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Publication date
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Priority to JP36134399A priority Critical patent/JP2001177309A/en
Priority claimed from JP36134399A external-priority patent/JP2001177309A/en
Publication of JP2001177309A publication Critical patent/JP2001177309A/en
Publication of JP2001177309A5 publication Critical patent/JP2001177309A5/ja
Pending legal-status Critical Current

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Description

【0012】
【発明の実施の形態】
以下本発明に係る非可逆回路素子及びその製造方法について、一実施例をもとに説明する。図1は、本発明に係るアイソレータの全体構成示す分解斜視図、図2は樹脂ケースと一体構造の下ヨークの斜視図、図3及び図4は図2のA−A’、B―B’断面図であり、図5はフープ状の下ヨークの斜視図である。図1に示すように本発明に係るアイソレータは、外部端子を備えた樹脂ケース7と下ケース12とを一体化し、前記樹脂ケースの凹部に、磁性体に3本の中心導体を相互に絶縁して重ねた組立体20、コンデンサ8,9,10、抵抗素子11を所定の部位にクリームはんだを塗布して搭載し、更に永久磁石を配置した上ケースと下ケースを嵌合させた構造としている。組立体20を配置する凹部は、前記組立体20の厚みよりも深く形成されている。前記樹脂ケースと一体構造の下ケース12を構成する金属材料は、SPCC,42アロイ,Fe−Co合金から選ばれる少なくとも1種であって、これらの金属材料は、100〜300μm程度に冷間圧延又は熱間圧延されている。さらに、その表面に銀、銅、金、アルミニウムのうち少なくとも一つを含む金属または合金で電気抵抗率が5.5μΩcm以下、好ましくは3.0μΩcm更に好ましくは1.8μΩcm以下である導電性の高い金属皮膜を形成している。このときの皮膜厚さは0.5〜25μm、好ましくは0.5〜10μm、更に好ましくは1〜8μmとする。前記組立体20、コンデンサ8,9,10、抵抗素子11は、下ヨークに実装するが、前記金属皮膜によって、信号伝送効率を高め、外部との相互干渉を抑制して損失を低減しているので、従来のアイソレータのように前記導体板を用いて樹脂ケースを構成しなくても電気的特性が劣化することがない。前記金属材料としては、42アロイを用いれば耐酸化性に優れるので好ましい。また、上下ヨークは磁気回路の一部として用いられるので、磁気特性に優れた、SPCCやFe−Co合金を使用するのが望ましく、前記Fe−Co合金の組成としては、具体的には質量%でそれぞれ、Co:49、V:2、C:≦0.015、Si:≦0.10、Mn:≦0.15、残部Fe及び不可避不純物からなる合金である。この合金の板材は100μm程度の極薄板の製造が可能であり、通常最大透磁率は15000で飽和磁束密度は2.25テスラの特性を保持することが出来るものである。ここで、Coは周波数帯と磁気特性との相関から40〜60%で選定するが50%前後が望ましく、Vは冷間加工性を改善するために添加するが、反面磁気特性に影響を与えるので5%以下とし、加工性確保のために2%が望ましい。このFe−Co合金をヨークに用いればヨークの厚さを薄くしても磁気回路における磁束漏れが必要十分に抑制されるので、更にアイソレータを薄型化、小型化することが出来る。
0012
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the irreversible circuit element and the method for manufacturing the irreversible circuit element according to the present invention will be described with reference to an embodiment. FIG. 1 is an exploded perspective view showing the overall configuration of the isolator according to the present invention, FIG. 2 is a perspective view of a lower yoke having an integral structure with a resin case, and FIGS. It is a cross-sectional view, and FIG. 5 is a perspective view of a hoop-shaped lower yoke. As shown in FIG. 1, in the isolator according to the present invention, a resin case 7 provided with an external terminal and a lower case 12 are integrated, and three central conductors are mutually insulated by a magnetic material in a recess of the resin case. The assembled assembly 20, the capacitors 8, 9, 10 and the resistance element 11 are mounted on a predetermined portion by applying cream solder, and the upper case and the lower case in which the permanent magnets are arranged are fitted to each other. .. The recess for arranging the assembly 20 is formed deeper than the thickness of the assembly 20. The metal material constituting the lower case 12 having an integral structure with the resin case is at least one selected from SPCC, 42 alloy, and Fe—Co alloy, and these metal materials are cold-rolled to about 100 to 300 μm. Or it is hot rolled. Further, a metal or alloy containing at least one of silver, copper, gold, and aluminum on its surface has a high electrical resistivity of 5.5 μΩcm or less, preferably 3.0 μΩcm, and more preferably 1.8 μΩcm or less. It forms a metal film. The film thickness at this time is 0.5 to 25 μm, preferably 0.5 to 10 μm, and more preferably 1 to 8 μm. The assembly 20, the capacitors 8, 9, 10 and the resistance element 11 are mounted on the lower yoke, and the metal film enhances the signal transmission efficiency, suppresses mutual interference with the outside, and reduces the loss. Therefore, unlike the conventional isolator, the electrical characteristics do not deteriorate even if the resin case is not formed by using the conductor plate. It is preferable to use 42 alloy as the metal material because it has excellent oxidation resistance. Further, since the upper and lower yokes are used as a part of the magnetic circuit, it is desirable to use SPCC or Fe-Co alloy having excellent magnetic characteristics, and the composition of the Fe-Co alloy is specifically mass%. Co: 49, V: 2, C: ≤0.015, Si: ≤0.10, Mn: ≤0.15, the balance Fe and unavoidable impurities, respectively. The plate material of this alloy can be produced as an ultrathin plate having a thickness of about 100 μm, and usually has a maximum magnetic permeability of 15,000 and a saturation magnetic flux density of 2.25 Tesla. Here, Co is selected from 40 to 60% from the correlation between the frequency band and the magnetic characteristics, but about 50% is desirable, and V is added to improve cold workability, but on the other hand, it affects the magnetic characteristics. Therefore, it should be 5% or less, and 2% is desirable to ensure workability. If this Fe—Co alloy is used for the yoke, magnetic flux leakage in the magnetic circuit is suppressed necessaryly and sufficiently even if the thickness of the yoke is reduced, so that the isolator can be further made thinner and smaller.

JP36134399A 1999-12-20 1999-12-20 Irreversible circuit element and manufacturing method therefor Pending JP2001177309A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36134399A JP2001177309A (en) 1999-12-20 1999-12-20 Irreversible circuit element and manufacturing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36134399A JP2001177309A (en) 1999-12-20 1999-12-20 Irreversible circuit element and manufacturing method therefor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2003117109A Division JP3871269B2 (en) 2003-04-22 2003-04-22 Non-reciprocal circuit element

Publications (2)

Publication Number Publication Date
JP2001177309A JP2001177309A (en) 2001-06-29
JP2001177309A5 true JP2001177309A5 (en) 2006-12-28

Family

ID=18473197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36134399A Pending JP2001177309A (en) 1999-12-20 1999-12-20 Irreversible circuit element and manufacturing method therefor

Country Status (1)

Country Link
JP (1) JP2001177309A (en)

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