JP2001177082A - Cover glass for solid state image sensor and solid state image sensor using it - Google Patents
Cover glass for solid state image sensor and solid state image sensor using itInfo
- Publication number
- JP2001177082A JP2001177082A JP36217299A JP36217299A JP2001177082A JP 2001177082 A JP2001177082 A JP 2001177082A JP 36217299 A JP36217299 A JP 36217299A JP 36217299 A JP36217299 A JP 36217299A JP 2001177082 A JP2001177082 A JP 2001177082A
- Authority
- JP
- Japan
- Prior art keywords
- state image
- glass
- face
- glass substrate
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B29/00—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins
- C03B29/02—Reheating glass products for softening or fusing their surfaces; Fire-polishing; Fusing of margins in a discontinuous way
- C03B29/025—Glass sheets
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Glass Compositions (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＣＣＤ（電荷結合
素子）やＣＭＯＳ（相補的金属酸化物半導体素子）など
の固体撮像素子のカバーガラスに用いられる固体撮像管
用カバーガラス及びそれを用いた固体撮像管に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover glass for a solid-state image pickup tube used for a cover glass of a solid-state image pickup device such as a CCD (charge-coupled device) and a CMOS (complementary metal oxide semiconductor device), and a solid state using the same. It relates to an imaging tube.
【０００２】[0002]
【従来の技術】デジタルスチルカメラやカメラ一体型Ｖ
ＴＲなどに用いられるＣＣＤやＣＭＯＳなどの固体撮像
素子のカバーガラスには、その組立中に発生するガラス
の破片、特にカバーガラスの端部のカケに起因する微小
ガラス破片がカバーガラスの表面又は裏面に付着するこ
とのないよう対策が要求される。2. Description of the Related Art Digital still cameras and camera-integrated V
In a cover glass of a solid-state imaging device such as a CCD or a CMOS used for a TR, etc., a piece of glass generated during the assembling, particularly a small piece of glass caused by chipping at an edge of the cover glass, has a front surface or a back surface of the cover glass. Countermeasures are required so that they do not adhere to the surface.
【０００３】このため、従来は切断加工されたガラス板
の端面に研磨加工を施している。この端面の研磨加工と
しては、通常多く用いられるＣ面加工よりもカケが発生
し難いＲ加工研磨が行われている。更に、端面のマイク
ロクラックの除去やガラス板に付着している微小ガラス
粉などの不要物を除去するため、研磨面に酸によるガラ
ス板の化学研磨、いわゆるフッ酸によるケミカルエッチ
ング処理を行っている。[0003] For this reason, conventionally, an end face of a cut glass plate is polished. As the polishing of the end face, R processing polishing, in which chipping is less likely to occur than in the C surface processing that is generally used, is performed. Furthermore, in order to remove microcracks on the end face and to remove unnecessary substances such as fine glass powder adhering to the glass plate, the polished surface is subjected to chemical polishing of the glass plate with an acid, so-called chemical etching treatment with hydrofluoric acid. .
【０００４】[0004]
【発明が解決しようとする課題】しかし、ガラス板の端
面からの発塵は、研磨加工とケミカルエッチング処理に
より減少するものの、完全に除去できず、１％以下の割
合ではあるが不良品（大きさが数μｍ程度のガラス粉が
カバーガラスの表面又は裏面に付着）が発生する。ま
た、研磨することによりガラス板の強度が低下し、取り
扱いに注意が要求され、搬送中にケースなど硬いものに
接触すると微細なカケが発生する場合がある。However, although the dust generated from the end face of the glass plate is reduced by the polishing and the chemical etching, it cannot be completely removed. Glass powder having a thickness of about several μm adheres to the front or back surface of the cover glass). In addition, the polishing reduces the strength of the glass plate, requires careful handling, and may cause fine chips when contacting a hard object such as a case during transportation.
【０００５】ケミカルエッチング処理により、ガラス板
表面に潜在する微小傷（いわゆる潜傷）がエッチングさ
れて浮き出て目に見えるようになってくるため、不良率
の増加をもたらす。そして、ケミカルエッチング処理で
は、フッ酸などの処理液の後処理が必要となるため、処
理費用などが発生しコストアップになる。[0005] By the chemical etching treatment, latent micro flaws (so-called latent flaws) on the surface of the glass plate are etched and emerge and become visible, thereby increasing the defect rate. In the chemical etching treatment, post-treatment of a treatment liquid such as hydrofluoric acid is required, so that a treatment cost and the like are generated and the cost is increased.
【０００６】本発明は、従来の技術が有するこのような
問題点に鑑みてなされたものであり、その目的とすると
ころは、ガラス板の切断後に端面からの発塵や端面にお
けるカケを抑制し、ガラス板の端面から発塵やカケが発
生しない固体撮像管用カバーガラス及びそれを用いた固
体撮像管を提供しようとするものである。The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to suppress generation of dust from the end face and chipping on the end face after cutting the glass plate. Another object of the present invention is to provide a cover glass for a solid-state image pickup tube in which dust and chips are not generated from the end surface of the glass plate, and a solid-state image pickup tube using the same.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決すべく請
求項１に係る発明は、所定の寸法に切断したガラス基板
を用いる固体撮像管用カバーガラスにおいて、前記ガラ
ス基板の端面を溶融処理したものである。According to a first aspect of the present invention, there is provided a cover glass for a solid-state image pickup tube using a glass substrate cut to a predetermined size, wherein an end surface of the glass substrate is melt-processed. It is.
【０００８】請求項２に係る発明は、請求項１記載の固
体撮像管用カバーガラスにおいて、前記端面の溶融処理
は、炭酸ガスレーザで行うものである。According to a second aspect of the present invention, in the cover glass for a solid-state image pickup tube according to the first aspect, the melting process of the end face is performed by a carbon dioxide gas laser.
【０００９】請求項３に係る発明は、請求項１又は２記
載の固体撮像管用カバーガラスにおいて、前記ガラス基
板は、その組成がＳｉＯ2：５０〜７４ｗｔ％、Ａｌ2Ｏ
3：１〜１５ｗｔ％、Ｒ2Ｏ（Ｎａ2Ｏ＋Ｋ2Ｏ＋Ｌｉ
2Ｏ）：６〜２４ｗｔ％、ＲＯ（ＣａＯ＋ＭｇＯ＋Ｓｒ
Ｏ＋ＢａＯ）：６〜２７ｗｔ％であってフロート製法で
成型されたものである。According to a third aspect of the present invention, in the cover glass for a solid-state image pickup tube according to the first or second aspect, the glass substrate has a composition of 50 to 74 wt% of SiO 2 and Al 2 O.
3 : 1 to 15 wt%, R 2 O (Na 2 O + K 2 O + Li
2 O): 6 to 24 wt%, RO (CaO + MgO + Sr)
O + BaO): 6 to 27 wt%, which is formed by a float process.
【００１０】請求項４に係る発明は、カバーガラスとし
て請求項１、２又は３記載の固体撮像管用カバーガラス
を用いた固体撮像管である。According to a fourth aspect of the present invention, there is provided a solid-state image pickup tube using the cover glass for a solid-state image pickup tube according to the first, second or third aspect as a cover glass.
【００１１】[0011]
【発明の実施の形態】以下に本発明の実施の形態を添付
図面に基づいて説明する。ここで、図１は本発明に係る
固体撮像管の断面図、図２は炭酸ガスレーザによる溶融
方法の説明図、図３はカバーガラス端面の溶融加工状態
の説明図、図４は炭酸ガスレーザによる他の溶融方法の
説明図である。Embodiments of the present invention will be described below with reference to the accompanying drawings. Here, FIG. 1 is a sectional view of the solid-state image pickup tube according to the present invention, FIG. 2 is an explanatory view of a melting method using a carbon dioxide gas laser, FIG. 3 is an explanatory view of a melt processing state of an end face of a cover glass, and FIG. FIG. 4 is an explanatory view of a melting method of FIG.
【００１２】図１に示すように、本発明に係る固体撮像
管１は、ＣＣＤやＣＭＯＳなどの固体撮像素子２と、固
体撮像素子２の開口窓を覆うように固着したカバーガラ
ス３からなる。As shown in FIG. 1, a solid-state image pickup tube 1 according to the present invention comprises a solid-state image pickup device 2 such as a CCD or CMOS, and a cover glass 3 fixed so as to cover an opening window of the solid-state image pickup device 2.
【００１３】そして、本発明に係るカバーガラス３を製
造するために、図２に示すように、所望な寸法に切断さ
れたガラス基板５を、先ず加工台６の所定位置に載置
し、次いでガラス基板５の端面５ａをレーザ発振器（炭
酸ガスレーザ）７により溶融加工する。Then, in order to manufacture the cover glass 3 according to the present invention, as shown in FIG. 2, a glass substrate 5 cut into a desired size is first placed on a processing table 6 at a predetermined position, The end face 5 a of the glass substrate 5 is melt-processed by a laser oscillator (carbon dioxide laser) 7.
【００１４】ガラス基板５の厚みは、０．３ｍｍ〜１．
２ｍｍである。また、ガラス基板５は、その組成がＳｉ
Ｏ2：５０〜７４ｗｔ％、Ａｌ2Ｏ3：１〜１５ｗｔ％、
Ｒ2Ｏ（Ｎａ2Ｏ＋Ｋ2Ｏ＋Ｌｉ2Ｏ）：６〜２４ｗｔ％、
ＲＯ（ＣａＯ＋ＭｇＯ＋ＳｒＯ＋ＢａＯ）：６〜２７ｗ
ｔ％であって、フロート製法で成型されるソーダライム
ガラスを経済性の観点から用いるのが好ましい。下記に
述べる熱応力の発生の問題を少なくする観点からは、ガ
ラスは低膨張係数のもの、例えば低アルカリガラスや無
アルカリガラスを用いるのが好ましい。The thickness of the glass substrate 5 ranges from 0.3 mm to 1.
2 mm. The glass substrate 5 has a composition of Si
O 2 : 50 to 74 wt%, Al 2 O 3 : 1 to 15 wt%,
R 2 O (Na 2 O + K 2 O + Li 2 O): 6 to 24 wt%,
RO (CaO + MgO + SrO + BaO): 6 to 27 w
It is preferable to use soda lime glass which is t% and is formed by a float process from the viewpoint of economy. From the viewpoint of reducing the problem of generation of thermal stress described below, it is preferable to use glass having a low expansion coefficient, for example, low alkali glass or non-alkali glass.
【００１５】加工台６の内部には、ヒータなどの加熱装
置（不図示）が設けられ、必要に応じてガラス基板５を
予備加熱できるようになっている。レーザ発振器７の出
力が大きい場合には、レーザ光Ｌａにより生じる熱応力
によって、ガラス基板５が常温で熱割れを発生する場合
があるため、ガラス基板５を適当な温度になるよう予備
加熱しておく必要があるからである。A heating device (not shown) such as a heater is provided inside the processing table 6 so that the glass substrate 5 can be preheated as required. When the output of the laser oscillator 7 is large, the glass substrate 5 may be thermally cracked at room temperature due to thermal stress generated by the laser beam La. Therefore, the glass substrate 5 is preheated to an appropriate temperature. It is necessary to keep it.
【００１６】そして、加工台６に載置されたガラス基板
５の端面５ａにレーザ光Ｌａがレーザ発振器７より照射
される。ここで、ガラス基板５の端面５ａに対するレー
ザ光Ｌａの照射方法としては、図２（ａ）に示すよう
に、ガラス基板５に対して上下方向から２台のレーザ発
振器７より照射することもできるし、図２（ｂ）に示す
ように、端面５ａに対して垂直方向から１台のレーザ発
振器７より照射することもできる。Then, a laser beam La is emitted from a laser oscillator 7 to the end face 5 a of the glass substrate 5 placed on the processing table 6. Here, as a method of irradiating the end face 5a of the glass substrate 5 with the laser light La, as shown in FIG. 2A, the glass substrate 5 can be irradiated from two laser oscillators 7 from above and below. Then, as shown in FIG. 2B, irradiation can be performed from one laser oscillator 7 in a direction perpendicular to the end face 5a.
【００１７】レーザ発振器７は、ガラス基板５の端面５
ａにレーザ光Ｌａを照射しながら適切な送り速度で端面
５ａに平行（矢印方向）に移動し、端面５ａを溶融す
る。同様にして、ガラス基板５の全ての端面５ａ（ガラ
ス基板５が矩形であれば、４つの端面５ａ）を溶融す
る。The laser oscillator 7 is provided on the end face 5 of the glass substrate 5.
While irradiating the laser beam La to the laser beam a, the laser beam moves parallel to the end face 5a (in the direction of the arrow) at an appropriate feed speed to melt the end face 5a. Similarly, all the end faces 5a of the glass substrate 5 (four end faces 5a if the glass substrate 5 is rectangular) are melted.
【００１８】すると、ガラス基板５の端面５ａは、レー
ザ光Ｌａが照射されることにより全て溶融状態（いわゆ
る火造り面）になって、端面５ａは表面張力によりＲ形
状となり、固体撮像管用のカバーガラス３が製造され
る。本発明の溶融処理方法としては、レーザ光照射の他
に、ガスバーナ、ハロゲンランプなどを用いる処理も可
能である。Then, the end face 5a of the glass substrate 5 is entirely in a molten state (a so-called fire surface) by being irradiated with the laser beam La, and the end face 5a becomes an R shape due to surface tension. Glass 3 is manufactured. As the melting treatment method of the present invention, a treatment using a gas burner, a halogen lamp, or the like is also possible in addition to laser beam irradiation.
【００１９】次に、ガラス基板５の厚みが１ｍｍの場合
について、加工条件の具体例を２例示す。第１例の加工
条件としては、炭酸ガスレーザ光Ｌａのスポット径が２
ｍｍ、出力が５ｗ、送り速度が２ｍｍ／秒、ガラス基板
５の予熱温度が常温である。第２例の加工条件として
は、炭酸ガスレーザ光Ｌａのスポット径が２ｍｍ、出力
が２０ｗ、送り速度が１０ｍｍ／秒、ガラス基板５の予
熱温度が３００℃である。Next, two specific examples of processing conditions are shown for the case where the thickness of the glass substrate 5 is 1 mm. As the processing conditions of the first example, the spot diameter of the carbon dioxide laser beam La is 2
mm, the output is 5 watts, the feed rate is 2 mm / sec, and the preheating temperature of the glass substrate 5 is normal temperature. As the processing conditions of the second example, the spot diameter of the carbon dioxide laser beam La is 2 mm, the output is 20 w, the feed speed is 10 mm / sec, and the preheating temperature of the glass substrate 5 is 300 ° C.
【００２０】レーザ発振器（炭酸ガスレーザ）７の出力
が低い場合には、送り速度を低速にすることにより、端
面５ａの溶融が可能になる。また、送り速度の設定の仕
方によっては、予備加熱を行うことなく端面５ａの溶融
Ｒ加工が可能である。When the output of the laser oscillator (carbon dioxide laser) 7 is low, the end face 5a can be melted by reducing the feed rate. Further, depending on how to set the feed speed, it is possible to perform the melting R processing on the end face 5a without performing the preheating.
【００２１】図３にガラス基板５の端面５ａにレーザ光
Ｌａを照射して製造されたカバーガラス３の端面３ａの
溶融加工状態を示す。望ましいカバーガラス３の端面３
ａの加工寸法としては、カバーガラス３の厚みをｔｍ
ｍ、端面３ａにおける断面形状の曲率半径をＲｍｍとす
ると、厚みｔと曲率半径Ｒとの関係は、コーナのカケな
どを防ぐために次式となる。FIG. 3 shows a state in which the end face 3a of the cover glass 3 manufactured by irradiating the end face 5a of the glass substrate 5 with the laser beam La is melt-processed. Desirable end surface 3 of cover glass 3
As the processing dimension of a, the thickness of the cover glass 3 is tm.
Assuming that m and the radius of curvature of the cross-sectional shape at the end face 3a are Rmm, the relationship between the thickness t and the radius of curvature R is as follows in order to prevent chipping at corners.
【００２２】（１／５）ｔ≦Ｒ≦（１／２）ｔ(1/5) t ≦ R ≦ (1/2) t
【００２３】図３（ａ）は、Ｒ＝（１／５）ｔの場合を
示し、端面３ａの断面形状が、曲率半径Ｒ＝（１／５）
ｔである２つの曲面と幅が（３／５）ｔの平面からなる
Ｃ面加工の状態になっている。図３（ｂ）は、Ｒ＝（１
／２）ｔの場合を示し、端面３ａの断面形状が、曲率半
径Ｒ＝（１／２）ｔである１つの曲面からなるＲ面加工
の状態になっている。FIG. 3A shows the case where R = (1/5) t, and the cross-sectional shape of the end face 3a has a curvature radius R = (1/5) t.
It is in a state of C-plane processing consisting of two curved surfaces t and a plane having a width of (3/5) t. FIG. 3B shows that R = (1
/ 2) t, and the cross-sectional shape of the end face 3a is in an R-surface processing state with one curved surface having a radius of curvature R = (1/2) t.
【００２４】また、カバーガラス３の端面３ａの平均粗
さとしては、平均粗さをＲａとすると、Ｒａ＜１０ｎｍ
であることが望ましい。これは、ガラス基板５の端面５
ａを溶融することにより、容易に達成することができ
る。The average roughness of the end face 3a of the cover glass 3 is Ra <10 nm, where Ra is the average roughness.
It is desirable that This is the end face 5 of the glass substrate 5
This can be easily achieved by melting a.
【００２５】また、固体撮像管１のパッケージがアルミ
ナ製から樹脂製になってきていることから、カバーガラ
ス３に窓ガラス組成のソーダライムガラスを用いると、
樹脂とソーダライムガラスは熱膨張係数の大きさが近い
ので、熱膨張的な相性がよい。Further, since the package of the solid-state image pickup tube 1 is changed from alumina to resin, if soda lime glass having a window glass composition is used for the cover glass 3,
Since resin and soda lime glass have similar thermal expansion coefficients, they have good thermal expansion compatibility.
【００２６】上記した発明の実施の形態では、所望な寸
法に切断したガラス基板５を、加工台６の所定位置に載
置し、所定の送り速度でレーザ発振器７を移動させてガ
ラス基板５の端面５ａを溶融加工する方法について説明
した。In the embodiment of the invention described above, the glass substrate 5 cut to a desired size is placed at a predetermined position on the processing table 6, and the laser oscillator 7 is moved at a predetermined feed speed to thereby reduce the size of the glass substrate 5. The method of melting the end face 5a has been described.
【００２７】次に、図４に示すように、４台のレーザ発
振器７ａ，７ｂ，７ｃ，７ｄを固定し、ガラス基板５を
搬送コンベア８により一定速度で搬送しながらレーザ光
Ｌａを端面５ａに照射して溶融する方法について説明す
る。Next, as shown in FIG. 4, four laser oscillators 7a, 7b, 7c and 7d are fixed, and the laser beam La is applied to the end face 5a while the glass substrate 5 is transported at a constant speed by the transport conveyor 8. The method of irradiating and melting will be described.
【００２８】搬送コンベア８に所定の姿勢（例えば、ガ
ラス基板５が矩形であれば、４つのうちの１つの端面５
ａを搬送方向に向くようにする）でガラス基板５を載置
し、ガラス基板５を所定速度にて矢印Ａ方向に搬送す
る。なお、搬送コンベア８には、ガラス基板５を予備加
熱する加熱装置を備え、加工条件に応じてガラス基板５
をレーザ光Ｌａ照射前に加熱することができる。If the glass substrate 5 is rectangular, one of the four end faces 5
The glass substrate 5 is placed in the direction of arrow A so that the glass substrate 5 is transported at a predetermined speed. The conveyor 8 is provided with a heating device for preheating the glass substrate 5, and the glass substrate 5 is heated in accordance with processing conditions.
Can be heated before irradiation with the laser beam La.
【００２９】そして、搬送コンベア８を挟んで、左右に
対向してレーザ発振器７ａ，７ｂを配置した工程にガラ
ス基板５が搬送されると、ガラス基板５は搬送コンベア
８により搬送されながら左右の端面５ａにレーザ光Ｌａ
が照射される。すると、２つの端面５ａは溶融されてＲ
形状に形成される。When the glass substrate 5 is conveyed to the step of arranging the laser oscillators 7a and 7b facing left and right with the conveyance conveyor 8 interposed therebetween, the glass substrate 5 is conveyed by the conveyance conveyor 8 while the left and right end faces are being conveyed. Laser light La on 5a
Is irradiated. Then, the two end faces 5a are melted and R
It is formed into a shape.
【００３０】次いで、左右の端面５ａがＲ形状に形成さ
れたガラス基板５が、次工程に搬送されると、回転装置
９によりガラス基板５が９０°だけ矢印Ｂ方向に回転さ
れ、溶融された２つの端面５ａが前後方向を向く。Next, when the glass substrate 5 having the right and left end surfaces 5a formed in an R shape is transported to the next step, the glass substrate 5 is rotated by 90 ° in the direction of arrow B by the rotating device 9 and melted. The two end faces 5a face the front-back direction.
【００３１】更に、左右に対向してレーザ発振器７ｃ，
７ｄを配置した工程にガラス基板５が搬送されると、前
回と同様にガラス基板５は搬送コンベア８により搬送さ
れながら左右の端面５ａにレーザ光Ｌａが照射される。
すると、残りの２つの端面５ａも溶融されてＲ形状に形
成され、４つの端面５ａが溶融加工された固体撮像管用
のカバーガラス３が製造される。Further, the laser oscillators 7c,
When the glass substrate 5 is conveyed to the step where 7d is arranged, the glass substrate 5 is irradiated with the laser beam La on the left and right end surfaces 5a while being conveyed by the conveyor 8 as in the previous case.
Then, the remaining two end surfaces 5a are also melted and formed into an R shape, and the cover glass 3 for a solid-state image pickup tube in which the four end surfaces 5a are melt-processed is manufactured.
【００３２】このような方法によれば、ガラス基板５の
端面５ａの溶融によるＲ形状加工を能率よく実施して、
固体撮像管用のカバーガラス３を製造することができ
る。According to such a method, the R shape processing by melting the end face 5a of the glass substrate 5 is efficiently performed,
A cover glass 3 for a solid-state image pickup tube can be manufactured.
【００３３】[0033]
【発明の効果】以上説明したように請求項１に係る発明
によれば、端面を溶融加工するので端面をガラス研磨し
た場合に発生する微小クラックが発生しない。また、溶
融加工により端面の表面が平滑な面となり、端面からの
ガラス粉の発生がなくなる。更に、熱的な強度が改善さ
れ、後工程である封着工程での破損が減少する。As described above, according to the first aspect of the present invention, since the end face is melt-processed, there is no occurrence of minute cracks generated when the end face is polished with glass. In addition, the surface of the end face becomes smooth by the melt processing, and the generation of glass powder from the end face is eliminated. Further, the thermal strength is improved, and damage in the subsequent sealing step is reduced.
【００３４】請求項２に係る発明によれば、従来におい
ては必要とされる研磨加工とエッチング処理が、ガラス
基板の端面に対するレーザ加工のみでよくなるため、加
工工程が少なくなる。また、炭酸ガスレーザによる加工
は、研磨装置、エッチング装置に比べ設備費用が安価に
できる。According to the second aspect of the present invention, the polishing and etching processes conventionally required can be performed only by laser processing on the end face of the glass substrate, so that the number of processing steps is reduced. In addition, processing using a carbon dioxide laser can reduce equipment costs as compared with a polishing apparatus and an etching apparatus.
【００３５】請求項３に係る発明によれば、α線放出対
策が不要なＣＭＯＳの固体撮像素子に適用して、安価な
固体撮像管を製造することができる。According to the third aspect of the present invention, an inexpensive solid-state image pickup tube can be manufactured by applying the present invention to a CMOS solid-state image pickup device which does not require measures against α-ray emission.
【００３６】請求項４に係る発明によれば、固体撮像管
の製造中又は固体撮像管の使用中において、カバーガラ
スの端面からガラス粉が発生しないため、カバーガラス
の表面又は裏面などにガラス粉が付着することがないの
で、固体撮像管としての品質向上が図れる。According to the present invention, no glass powder is generated from the end surface of the cover glass during the manufacture of the solid-state image pickup tube or during use of the solid-state image pickup tube. Is not attached, so that the quality of the solid-state image pickup tube can be improved.
【図１】本発明に係る固体撮像管の断面図FIG. 1 is a cross-sectional view of a solid-state imaging tube according to the present invention.
【図２】炭酸ガスレーザによる溶融方法の説明図FIG. 2 is an explanatory view of a melting method using a carbon dioxide laser.
【図３】カバーガラス端面の溶融加工状態の説明図FIG. 3 is an explanatory view of a state in which a cover glass end face is melt-processed.
【図４】炭酸ガスレーザによる他の溶融方法の説明図FIG. 4 is an explanatory view of another melting method using a carbon dioxide laser.
１…固体撮像管、２…固体撮像素子、３…カバーガラ
ス、３ａ…端面、５…ガラス基板、５ａ…端面、６…加
工台、７，７ａ，７ｂ，７ｃ，７ｄ…レーザ発振器（炭
酸ガスレーザ）、８…搬送コンベア、９…回転装置、Ｌ
ａ…レーザ光。DESCRIPTION OF SYMBOLS 1 ... Solid-state image pick-up tube, 2 ... Solid-state image sensor, 3 ... Cover glass, 3a ... End face, 5 ... Glass substrate, 5a ... End face, 6 ... Processing table, 7, 7a, 7b, 7c, 7d ... Laser oscillator (CO2 gas laser ), 8: Conveyor, 9: Rotating device, L
a laser light.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 地引 聡 大阪府大阪市中央区道修町３丁目５番11号 日本板硝子株式会社内 (72)発明者 服部 明彦 大阪府大阪市中央区道修町３丁目５番11号 日本板硝子株式会社内 Ｆターム(参考） 4E068 AE00 AH01 DA09 DB13 4G015 BA05 BB01 4G062 AA04 BB01 DA06 DA07 DB03 DB04 DC01 DD01 DE01 DF01 EA01 EA02 EA03 EA04 EA10 EB01 EB02 EB03 EB04 EC01 EC02 EC03 EC04 ED01 ED02 ED03 ED04 EE01 EE02 EE03 EE04 EF01 EF02 EF03 EF04 EG01 EG02 EG03 EG04 FA01 FA10 FB01 FC01 FD01 FE01 FF01 FG01 FH01 FJ01 FK01 FL01 GA01 GA10 GB01 GC01 GD01 GE01 HH01 HH03 HH05 HH07 HH09 HH11 HH13 HH15 HH17 HH20 JJ01 JJ03 JJ05 JJ07 JJ10 KK01 KK03 KK05 KK07 KK10 MM02 MM04 4M118 AA10 AB01 BA08 BA14 HA02 HA19 HA25 HA40 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Satoshi Jihiki 3-5-11 Doshomachi, Chuo-ku, Osaka-shi, Osaka Inside Nippon Sheet Glass Co., Ltd. (72) Inventor Akihiko Hattori 3-chome, Doshucho, Chuo-ku, Osaka-shi, Osaka No. 5-11 F-term in Nippon Sheet Glass Co., Ltd. (reference) 4E068 AE00 AH01 DA09 DB13 4G015 BA05 BB01 4G062 AA04 BB01 DA06 DA07 DB03 DB04 DC01 DD01 DE01 DF01 EA01 EA02 EA03 EA04 EA10 EB01 EB02 EB03 EB04 EC03 ED04 EC03 EE01 EE02 EE03 EE04 EF01 EF02 EF03 EF04 EG01 EG02 EG03 EG04 FA01 FA10 FB01 FC01 FD01 FE01 FF01 FG01 FH01 FJ01 FK01 FL01 GA01 GA10 GB01 GC01 GD01 GE01 HH01 HH03 HH05 HHH HH HH HH HH HH HH HH HH MM02 MM04 4M118 AA10 AB01 BA08 BA14 HA02 HA19 HA25 HA40
Claims (4)
る固体撮像管用カバーガラスにおいて、前記ガラス基板
の端面を溶融処理したことを特徴とする固体撮像管用カ
バーガラス。1. A cover glass for a solid-state image pickup tube using a glass substrate cut to a predetermined size, wherein an end surface of the glass substrate is melted.
で行う請求項１記載の固体撮像管用カバーガラス。2. The cover glass for a solid-state image pickup tube according to claim 1, wherein the melting process of the end face is performed by a carbon dioxide gas laser.
Ｏ2：５０〜７４ｗｔ％、Ａｌ2Ｏ3：１〜１５ｗｔ％、
Ｒ2Ｏ（Ｎａ2Ｏ＋Ｋ2Ｏ＋Ｌｉ2Ｏ）：６〜２４ｗｔ％、
ＲＯ（ＣａＯ＋ＭｇＯ＋ＳｒＯ＋ＢａＯ）：６〜２７ｗ
ｔ％であってフロート製法で成型された請求項１又は２
記載の固体撮像管用カバーガラス。3. The glass substrate has a composition of Si
O 2 : 50 to 74 wt%, Al 2 O 3 : 1 to 15 wt%,
R 2 O (Na 2 O + K 2 O + Li 2 O): 6 to 24 wt%,
RO (CaO + MgO + SrO + BaO): 6 to 27 w
3. The method according to claim 1, wherein the molding is performed by a float process.
A cover glass for a solid-state imaging tube according to the above.
カバーガラスを用いたことを特徴とする固体撮像管。4. A solid-state image pickup tube comprising the solid-state image pickup tube cover glass according to claim 1, 2 or 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36217299A JP2001177082A (en) | 1999-12-21 | 1999-12-21 | Cover glass for solid state image sensor and solid state image sensor using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP36217299A JP2001177082A (en) | 1999-12-21 | 1999-12-21 | Cover glass for solid state image sensor and solid state image sensor using it |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001177082A true JP2001177082A (en) | 2001-06-29 |
Family
ID=18476152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP36217299A Pending JP2001177082A (en) | 1999-12-21 | 1999-12-21 | Cover glass for solid state image sensor and solid state image sensor using it |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001177082A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002012436A (en) * | 2000-06-23 | 2002-01-15 | Nippon Sheet Glass Co Ltd | Method of treating glass plate end and plate glass treated thereby |
| WO2007051512A1 (en) * | 2005-11-03 | 2007-05-10 | Schott Ag | Method for producing cover glass for radiation-sensitive sensors and device for carrying out said method |
| JP2011164508A (en) * | 2010-02-15 | 2011-08-25 | Sony Corp | Method for manufacturing electric solid-state device, and electric solid-state device |
| JP2011233641A (en) * | 2010-04-26 | 2011-11-17 | Disco Abrasive Syst Ltd | Laser processing method for plate-like object |
| CN106997929A (en) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | A kind of plesiochronous package system of double-sided laser and method for packing |
| US10195825B2 (en) | 2014-10-30 | 2019-02-05 | Corning Incorporated | Methods for strengthening the edge of laminated glass articles and laminated glass articles formed therefrom |
| US10513455B2 (en) | 2014-10-30 | 2019-12-24 | Corning Incorporated | Method and apparatus for sealing the edge of a glass article |
-
1999
- 1999-12-21 JP JP36217299A patent/JP2001177082A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002012436A (en) * | 2000-06-23 | 2002-01-15 | Nippon Sheet Glass Co Ltd | Method of treating glass plate end and plate glass treated thereby |
| WO2007051512A1 (en) * | 2005-11-03 | 2007-05-10 | Schott Ag | Method for producing cover glass for radiation-sensitive sensors and device for carrying out said method |
| JP2011164508A (en) * | 2010-02-15 | 2011-08-25 | Sony Corp | Method for manufacturing electric solid-state device, and electric solid-state device |
| JP2011233641A (en) * | 2010-04-26 | 2011-11-17 | Disco Abrasive Syst Ltd | Laser processing method for plate-like object |
| US10195825B2 (en) | 2014-10-30 | 2019-02-05 | Corning Incorporated | Methods for strengthening the edge of laminated glass articles and laminated glass articles formed therefrom |
| US10513455B2 (en) | 2014-10-30 | 2019-12-24 | Corning Incorporated | Method and apparatus for sealing the edge of a glass article |
| CN106997929A (en) * | 2016-01-22 | 2017-08-01 | 上海微电子装备有限公司 | A kind of plesiochronous package system of double-sided laser and method for packing |
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