JP2001176762A - Method and apparatus for ventilating semiconductor manufacturing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce load and energy consumption of air conditioning and air carrier power in a clean room by minimizing usage of circulating air in the clean room, at ventilation of a semiconductor manufacturing apparatus. SOLUTION: In an air-circulating system, air delivered from the outlet side of an air-supply/exhaust fan 56 is distributed to each of branch air-supply pipings 62, 64, 66, 68 and 70 from a main air-supply piping 58, and supplied through each of air-supply ports into casings 26, 28, 30, 46 and 54 of each of apparatuses to be ventilated 10-20. The air supplied into each of the casings 26, 28, 30, 46 and 54 temporally remains there and then is delivered through each of exhaust ports to respective branch exhaust pipings 82, 84, 86, 88 and 90, and gathered to a main exhaust piping 60, to be sucked by an inlet (air- sucking) side of the air-supply/exhaust fan 56. In this way, the semiconductor manufacturing apparatuses 10-20 are ventilated by the air-circulating system that basically uses no air in the clean room.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a technique for ventilating semiconductor manufacturing equipment installed in a clean room.

[0002]

2. Description of the Related Art Generally, an apparatus for manufacturing a semiconductor device is installed in a clean room in which air that is clean and whose temperature and humidity are controlled is circulated.

[0003] Among them, the process equipment and peripheral equipment that handle special gases such as raw material gas are provided with a casing such as a housing or an enclosure to prevent the leaked gas from diffusing into the clean room even if a gas leak occurs. ing. In this type of conventional semiconductor manufacturing equipment, a casing is provided with an outside air intake (opening), an exhaust port for exhausting the inside of the casing is provided, and air from a clean room is introduced into the casing from the outside air intake. By exhausting the air in the casing from the exhaust port to an exhaust duct suitable for the characteristics of the gas, the inside of the casing is constantly ventilated. According to such a casing structure and ventilation system, even if a gas leaks in the equipment, the leaked gas does not diffuse out of the casing and is exhausted together with the clean room air drawn into the casing. It is designed to be discharged to a duct.

[0004] Further, semiconductor manufacturing equipment that generates heat also has a casing structure similar to the above, in which air in the clean room is taken in from the outside air intake of the casing, while the air in the casing is heated from the exhaust port of the casing. By exhausting air to the exhaust duct, the inside of the casing is constantly ventilated. In this case, the heat generated in the device is exhausted to the heat exhaust duct by an air cooling method using air in a clean room as a refrigerant.

[0005]

As described above, in conventional semiconductor manufacturing equipment, ventilation is performed using clean room air whose temperature and humidity are controlled and clean. The clean room air used for this ventilation is expensive clean air generated at a great cost,
This is always thrown out to the exhaust duct due to gas leakage and exhaust heat of the equipment. In particular, in ventilation for gas leakage countermeasures, a large amount of air in a clean room is constantly exhausted or consumed at a ventilation amount that provides a sufficient ventilation capacity in the event of gas leakage. For this reason, air-conditioning equipment in a clean room must supply or replenish a large amount of air-conditioning (clean and temperature and humidity controlled) air by using a large amount of air conveyance power to maintain the differential pressure in the clean room. Must
The burden was heavy.

The present invention has been made in view of the above problems, and minimizes the use of circulating air in a clean room when ventilating semiconductor manufacturing equipment, and reduces the load or energy consumption of air conditioning and air transfer power in the clean room. It is an object of the present invention to provide a ventilation method and a ventilation facility for semiconductor manufacturing equipment, which reduce the amount of gas.

Further, the present invention reduces the load on a special exhaust facility for gas leakage in accordance with the characteristics of the gas handled in the semiconductor manufacturing equipment, and reduces the running cost of the semiconductor manufacturing equipment. The purpose is to provide.

[0008]

In order to achieve the above object, a ventilation method according to the present invention is a method for ventilating semiconductor manufacturing equipment installed in a clean room, the method comprising: The casing of the device is substantially sealed with respect to the first air supplied to the clean room, and the second air for ventilation is circulated and supplied into the casing by an air circulation system cut off from the first air. And how to do it.

The ventilating apparatus according to the present invention is a ventilating facility for semiconductor manufacturing equipment for ventilating semiconductor manufacturing equipment installed in a clean room, wherein a casing of the semiconductor manufacturing equipment is supplied to the clean room. An air circulation system having a fan which is substantially sealed from air and has a supply port and an exhaust port, and has a fan for circulating the second air cut off from the first air,
The outlet side of the fan is connected to an air supply port of the casing via a first pipe, and the inlet side of the fan is connected to a second side.
And connected to the exhaust port of the casing through the piping described above.

[0010] According to the present invention, the second air for ventilation is to be ventilated by the air circulating system cut off from the circulating air (first air) in the clean room. To be circulated. The air circulation system is provided with a fan, and the second air sent or blown from the outlet side of the fan is supplied into the casing of the semiconductor manufacturing equipment through the first pipe,
After temporarily staying in the casing, the air is sucked from the exhaust port to the inlet side of the fan through the second pipe, and is blown again from the outlet side of the fan. Thus, the semiconductor manufacturing equipment is ventilated in the air circulation system cut off from the air in the clean room.

In the ventilating method of the present invention, in order to effectively exhaust the heat generated in the equipment to be ventilated, preferably, the second air discharged from the casing is temperature-controlled to a predetermined temperature, and the temperature is controlled. The supplied second air may be supplied into the casing. In order to realize this temperature control function, the ventilating equipment of the present invention may preferably be configured such that the first or second pipe is provided with a heat exchanger for controlling the temperature of the second air to a predetermined temperature. .

Further, in the ventilation method of the present invention, preferably, the casing or the second air in the air circulation system is normally maintained, and the casing of the device to be ventilated is always kept clean. The discharged second air may be normalized, and the normalized second air may be supplied into the casing. In order to realize this cleaning function, the ventilation equipment of the present invention preferably has the first
Alternatively, the second pipe may be provided with an air cleaning filter.

Further, in the present invention, the pressure of the second air may be maintained at a constant value or a constant range in the air circulation system so that the ventilation volume or the pressure in the casing is always kept constant. For this purpose, in the ventilation method of the present invention, preferably, the second air is discharged from the air circulation system when the pressure of the second air in the air circulation system is equal to or higher than the first set pressure. May be. In order to realize this pressure maintaining function, in the ventilation facility of the present invention, preferably, a third pipe having one end connected to the first or second pipe and the other end connected to the first exhaust duct; This third
And a relief valve that is provided in the first pipe and is opened when the pressure in the first or second pipe is equal to or higher than the first set pressure.

In the ventilating method according to the present invention, preferably, the step of detecting the pressure of the second air in the air circulation system, and the detected pressure value of the second air becomes equal to or less than the second set pressure. Replenishing the air circulation system with the second air during the operation. Here, the air supply step may include a step of introducing the first air into the air circulation system until the detected pressure of the second air becomes higher than the second set pressure.

In order to realize the above-mentioned pressure maintaining function, in the ventilating equipment of the present invention, preferably, the first or second ventilating equipment is used.
Pressure detecting means for detecting the pressure of the second air in the pipe of the second type, and the second pressure detected by the pressure detecting means.
And air supply means for supplying the second air to the air circulation system when the pressure of the air is equal to or lower than the second set pressure. Preferably, the air supply means includes a fourth pipe having one end connected to the first or second pipe and the other end open to the first air in the clean room;
The first on-off valve provided in the fourth pipe and the first on-off valve are opened until the pressure of the second air detected by the pressure detecting means becomes higher than the second set pressure. First
And a valve control means.

In the present invention, in the steady state, the second air is circulated without or assuming the gas leak of the ventilated equipment, so that no special exhaust equipment for gas leak is burdened. . If a gas leak occurs in the ventilated equipment, necessary safety measures are taken at that time.

For this safety measure against gas leakage, in the ventilation method of the present invention, preferably, a step of detecting leakage of a predetermined gas handled in the device to be ventilated based on the second air discharged from the casing. And discharging the second air discharged from the casing from the air circulation system to a predetermined external exhaust system when the gas leakage is detected. Here, the air discharging step may include a step of diluting the second air discharged from the casing with an inert gas.

In the ventilating equipment of the present invention, in order to realize the above-mentioned safety measure function for gas leakage, preferably, a gas detector provided in the second pipe for detecting a predetermined gas leakage in the ventilated equipment. Means, a fifth pipe having one end connected to the second pipe via the direction switching valve and the other end connected to the second exhaust duct, and a casing in response to a gas leak detection signal from the gas detection means. The second air from the fifth
And a second valve control means for switching and controlling the direction switching valve so as to send the pipe to the pipe. More preferably, an emergency exhaust fan provided in the fifth pipe and a fan control means for operating the emergency exhaust fan in response to a gas leak detection signal from the gas detection means may be provided. More preferably, an inert gas supply source for supplying an inert gas, a sixth pipe having one end connected to the inert gas supply source and the other end connected to a fifth pipe, and the sixth pipe And a third valve control means for opening the third on-off valve in response to a gas leak detection signal from the gas detection means.

In the present invention, the term "semiconductor manufacturing equipment" means any equipment or apparatus installed in a clean room for manufacturing semiconductor devices, and includes a predetermined process for manufacturing semiconductor devices on a substrate to be processed. And various peripheral devices related to the process.

[0020]

Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 shows a basic configuration of a ventilation facility for semiconductor manufacturing equipment according to an embodiment of the present invention. As an example, the semiconductor manufacturing equipment to be ventilated in this embodiment is the process equipment 10, gas box 12, pump 14, abatement equipment 16, chiller equipment 18, and RF power supply 20,
These devices to be ventilated are installed in the same or adjacent clean room, and constitute one semiconductor manufacturing system centering on the process apparatus 10.

The processing apparatus 10 is a processing apparatus using a special material gas, for example, a single-wafer type plasma etching apparatus. The processing apparatus 10 accommodates one substrate to be processed, for example, a semiconductor wafer (not shown), and performs plasma etching processing. Vacuum chamber 22 and a machine room 24 for accommodating various mechanical elements or driving units related to the plasma etching process.

In this embodiment, a substantially closed structure, that is, almost no outside air (clean room air) enters,
Alternatively, the vacuum chamber 22 is housed in a casing 26 having a structure that can be inserted only a little, and the casing panel of the machine room 24 has a casing 2 of a substantially substantially similar structure.
8. The casings 16 and 28 have air supply ports 16a and 28a and exhaust ports 16b and 28b.
Are provided one by one.

The gas box 12 is a box containing a pressure regulator, a flow regulator and the like for controlling the flow of the raw material gas used in the plasma etching process and the flow of the exhaust gas obtained as a result of the process. A source gas from a source gas supply source (not shown) enters the gas box 12 through a pipe 32, and is supplied from the gas box into the vacuum chamber 22 of the plasma etching apparatus 10 through a pipe 34. Further, the exhaust gas from the vacuum chamber 22 is sent to the gas box 12 through the pipe 36 via the machine room 24, and is sucked into the vacuum pump 14 from the gas box 12 through the pipe 38.

The gas box 12 is constructed as a casing 30 having a substantially closed structure. The casing 30 is provided with one supply port 30a and one exhaust port 30b.

The vacuum pump 14 is composed of, for example, a dry pump, and functions to reduce the pressure inside the vacuum chamber 22 and exhaust gases such as unreacted raw material gas and reaction by-product gas from the chamber 22. The exhaust gas discharged from the outlet side of the vacuum pump 14 passes through a pipe 40 and
Sent to The abatement device 16 extracts and removes harmful substances from the exhaust gas sent from the vacuum pump 14.
The gas discharged from the abatement device 16 is sent to an exhaust duct according to the characteristics of the gas. For example, if the exhaust gas is flammable, it is sent to an exhaust duct 44 for collecting flammable exhaust gas via a pipe 42 as shown.

In this embodiment, the main bodies of the vacuum pump 14 and the abatement apparatus 16 are housed together in a casing 46 having a substantially closed structure. This casing 4
6 also has one supply port 46a and one exhaust port 46b.

The chiller device 18 supplies a refrigerant for cooling the substrate to be processed around a susceptor (not shown) provided in the vacuum chamber 22 of the plasma etching device 10 through a pipe 4.
Supply via 8,50. The RF power supply 20 supplies high frequency power for plasma generation to, for example, the susceptor in the vacuum chamber 22 via the electric cable 52.

In this embodiment, the main bodies of the chiller device 18 and the RF power supply 20 are housed together in a casing 54 having a substantially sealed structure. This casing 54 is also provided with one supply port 54a and one exhaust port 54b.

The casings 26, 28, 30, 46, 54 of the ventilated devices 10 to 20 do not always need to be kept in a sealed state.
A glass window, a meter, and the like may be attached.

In the ventilation equipment of this embodiment, the casings 26, 28, 30, 46, 54 of the respective devices 10 to 20 are provided.
Inside, air for ventilation is circulated and supplied from an air circulation system or system cut off from air in the clean room. This air circulation system includes an electric air supply / exhaust fan 56 for both air supply and exhaust, and the fan 56 is provided with casings 26, 28, 30 of the ventilated devices 10 to 20 through piping capable of withstanding a positive pressure. , 46, 54.

More specifically, main air supply pipes 58 are provided on the outlet (blower) side and inlet (intake) side of the air supply / exhaust fan 56, respectively.
And the main exhaust pipe 60 are connected. Main air supply piping 5
8, casings 26, 2 of each of the devices to be ventilated 10-20.
8, 30, 46, 54 air supply ports 26a, 28a, 30
a, 46a and 54a are branch air supply pipes 62 and 6 respectively.
4, 66, 68 and 70 are connected in parallel.
Air supply dampers 72, 74, 76, 78, and 80 are attached to these branch air supply pipes 62, 64, 66, 68, and 70, respectively.

On the other hand, the main exhaust pipe 60 is provided with casings 26, 28, 30, 46, 54 of the respective ventilated devices 10 to 20.
Exhaust ports 26b, 28b, 30b, 46b, and 54b are connected in parallel via branch exhaust pipes 82, 84, 86, 88, and 90, respectively. These branch exhaust pipes 8
2,84,86,88,90 have exhaust dampers 92,9
4, 96, 98 and 100 are attached respectively.

In this air circulation system, the supply / exhaust fan 56 is constantly operated at a constant rotation speed. The air delivered from the outlet side of the supply / exhaust fan 56 is distributed from the main supply pipe 58 to the branch supply pipes 62, 64, 66, 68, 70, and the casings 26, 28 of the ventilated devices 10 to 20. ,
The air is supplied into each of 30, 46, and 54 from each air supply port. The air supply pressure to each of the casings 26, 28, 30, 46, 54 can be adjusted by each air supply damper 72, 74, 76, 78, 80.

Each casing 26, 28, 30, 46, 5
The air supplied into the inside 4 temporarily stays there, and then flows from each exhaust port to each branch exhaust pipe 82, 84, 86, 88,
The exhaust gas is collected by the main exhaust pipe 60 and is sucked into the inlet (intake) side of the supply / exhaust fan 56. Casing 2
The exhaust pressure from 6, 28, 30, 46, 54 can be adjusted by each exhaust damper 92, 94, 96, 98, 100.

In the clean room, clean air whose temperature and humidity are controlled is sent downflow from the ceiling of the room through a dust filter, and the sent air is supplied to the casings 26 and 2 of the devices 10 to 20 to be ventilated.
It flows downward without being substantially taken into the 8, 30, 46, 54 and is circulated out of the grating on the room floor.

As described above, according to the ventilation system of the present invention,
Basically, semiconductor manufacturing equipments 10 to 20 are ventilated by an air circulation system that does not use air in a clean room. Therefore, the use of circulating air in the clean room can be minimized, and the load and energy consumption of air conditioning or air conveyance power in the clean room can be significantly reduced.

Next, an application system according to an embodiment of the present invention in which various functions are added to the above basic configuration will be described with reference to FIGS.

FIG. 2 is a block diagram showing a functional configuration of the application system, and FIG. 3 is a schematic perspective view showing an external configuration of the application system. FIG. 4 shows an external configuration of a control system according to the embodiment. In FIGS. 2 to 4, parts having substantially the same configuration or function as those in FIG. 1 are denoted by the same reference numerals.

In FIG. 2, a cooling radiator 102 is provided in the main air supply pipe 58. The cooling radiator 102 is a water-cooled heat exchanger, and has a cooling water supply unit 104.
The temperature of the air passing through the main air supply pipe 58 is controlled to a predetermined temperature by cooling water supplied at a constant temperature, for example, 20 ° C., supplied through the pipes 106 and 108 from the air. Thus, the air supply pipe 5
8, 62 to 70, air at a predetermined temperature is
Is supplied into each of the casings 26, 28, 30, 46, 54. And each casing 26, 28, 30, 4
The air whose temperature has risen by absorbing the heat generated from each of the devices 10 to 20 in the cooling radiator 1 and the cooling radiator 1 is collected through the exhaust pipes 82 to 90 and 60.
In 02, the temperature is returned to the predetermined temperature again.

Thus, in this air circulation system,
Without using the air in the clean room, the heat generated in each of the devices 10 to 20 is absorbed in each of the casings 26, 28, 30, 30, 46 and 54 via the circulating air in the system,
The heat is exhausted by the cooling radiator 102.

Further, a main air supply pipe 60 is connected between the supply / exhaust fan 56 and the cooling radiator 102 via a pipe 110 to a general exhaust duct 112, and the pipe 110 is provided with a relief valve 114. Main air supply piping 6
When the pressure in 0 is equal to or higher than a predetermined (first) set pressure, the relief valve 114 is opened to discharge the air in the main air supply pipe 60 to the general exhaust duct 112 side. With such an air releasing or reducing function, even if clean room air enters the air circulation system in any of the casings 26, 28, 30, 46, 54, for example, the ventilation circulating air supplied to the respective devices 10 to 20 is supplied. The pressure can be maintained at a set value.

The pressure of the circulating air in the air circulation system can be selected to an arbitrary value in principle. However, when airtightness is lost in any of the casings, even if air in the clean room may enter the casing, the circulating air on the system side does not go out of the casing. Usually, it is preferable to set the pressure to a negative pressure.

The pressure in the main air supply pipe 60 between the air supply / exhaust fan 56 and the cooling radiator 102 is predetermined (second).
When the pressure is equal to or higher than the set pressure, the pressure switch 116 outputs a predetermined signal. On the other hand, one end of a pipe 118 is connected to the main exhaust pipe 60, and this pipe 11
The other end of 8 is opened or opened in the clean room to form an air intake port 120. This piping 118
Is provided with an air intake valve 122 composed of, for example, an air operated valve.
In response to a signal from 16, the valve 122 opens and clean room air is drawn into the air circulation system through line 118. When the pressure in the main air supply pipe 60 becomes higher than the set pressure, the pressure switch 116
Is stopped, and the valve 122 is closed.

In this way, in this air circulation system, when the circulating air, especially the supply air, becomes insufficient due to aging or damper adjustment, the required amount of air in the clean room is immediately taken in and replenished. I am trying to do it.

An air-cleaning filter, for example, a dust filter 12 is connected to the main exhaust pipe 60 just before the inlet side of the supply / exhaust fan 56.
4 are provided. Dust generated in the piping and the casings 26, 28, 30, 46, and 54 in the air circulation system is sent to the dust filter 124 together with the exhaust gas, and is removed there. In this way, each part or circulating air in this air circulation system is always kept clean,
Further, the inside of each of the casings 26, 28, 30, 46, 54 is always kept clean.

The air purifying filter 14 is preferably a low pressure drop type filter that minimizes the pressure difference between the delivery side and the suction side of the supply / exhaust fan 56 as much as possible. It is also possible to use or use a filter for removing a chemical substance from the circulated air collected and exhausted.

On the upstream side of the air purifying filter 14, the main exhaust pipe 60 is connected to an emergency exhaust duct 130 via an exhaust switching valve (three-way valve) 126 composed of, for example, an air operated valve and a pipe 128. I have. Piping 12
8 is provided with an electric fan 132 for emergency exhaust. Under the control of a signal unit (sequencer) 134 described later, the emergency exhaust fan 132 is stopped when the system is normal, and operates when a gas leak occurs in any of the ventilated devices 10 to 20. Has become.

A gas supply source 136 of, for example, nitrogen (N 2) gas as an inert gas for dilution is connected to a pipe 128 downstream of the electric fan 132 via a pipe 138. Are a pressure regulator 140 and a dilution gas supply valve 14 in order from the upstream side to the downstream side.
2 and a flow meter 144 are provided. The dilution gas supply valve 142 is formed of, for example, an air operated valve, and is closed under the control of the signal unit 134 when the system is normal and opened when a gas leak occurs in any of the ventilated devices 10 to 20. It has become.

A gas detector 148 is connected to the main exhaust pipe 60 via a gas sampling port 146 on the upstream side of the exhaust switching valve 126. This gas detector 14
Reference numeral 8 includes one or a plurality of gas sensors for sensing one or a plurality of types of gas handled by the ventilated devices 10 to 20, respectively. When the circulating air exhausted or collected from the ventilated devices 10 to 20 through the branch exhaust pipes 82 to 90 contains a leaked gas, the corresponding gas sensor detects this and the gas detector 148 detects the leaked gas. A gas leak detection signal is output.

The signal unit 134 includes a gas detector 148
When the gas leak detection signal is received, the outlet of the exhaust switching valve 126 is switched to the pipe 128, the emergency exhaust fan 132 is started as described above, and the dilution gas supply valve 142 is switched to the open state. Thereby, the casings 26, 28, 3 of the ventilated devices 10 to 20 are provided.
All the air collected from the tubes 0, 46, and 54 is sent to an emergency exhaust duct 130 through a pipe 128, and is diluted with a predetermined flow rate of an inert gas (N2 gas) in the middle of the pipe 128, and then the emergency exhaust duct 130 is discharged. To be sent to The exhaust duct 130 may be provided with a required abatement device (not shown).

When the emergency exhaust system for gas leakage operates as described above, around the main air supply / exhaust fan 56,
Since the air from the main exhaust pipe 60 is cut off by the exhaust switching valve 126, the air from the clean room is taken in through the pipe 118 by the action of the pressure switch 116 and the air intake valve 122, and the taken air is supplied to the supply / exhaust fan. 56, the casings 26, 28, 30,
46 and 54 are supplied. The signal unit 134
An alarm means may be provided in the case of a gas leak so that a predetermined abnormality alarm is issued to notify the worker in the event of gas leakage.

Thus, in this air circulation system,
Under normal conditions, ventilation air is circulated without or assuming gas leakage from the devices to be ventilated 10 to 20. Then, when a gas leak occurs in any of the ventilated devices 10 to 20, the emergency exhaust system as described above is operated at that time, and the ventilation air including the leaked gas is promptly and immediately discharged to the emergency exhaust duct 130. In addition to safe discharge, take in clean room air as an emergency measure to
To maintain ventilation. Therefore,
In normal times, there is no need to operate exhaust or abatement equipment for gas leaks, nor does it require a large amount of air transfer power to be used for air conditioning equipment in clean rooms, minimizing the burden and energy consumption of these external related equipment. It is possible to

The backup power supply 152 shown in FIG. 2 is electrically connected to each part of the semiconductor manufacturing system and the air circulation system that uses power in this embodiment, and is used when the utility power is stopped due to a power failure of a commercial power supply or the like. Supply the required power to each part, and continue the operation of the system.

In the illustrated embodiment, the components of the control system in the air circulation system are collectively combined into one casing 150.
And is disposed on the process apparatus 10. Preferably, the casing 150 also has a substantially closed structure. The unit in the casing 150 can be added to one of the devices to be ventilated. In this case, an air supply port and an air exhaust port may be provided in the casing 150, and the air supply port and the air exhaust port may be connected to the main air supply pipe 58 and the main air exhaust pipe 60 via pipes, respectively.

In FIG. 3, the air supply dampers 72 to 80 and 92 to 100 are provided for easy illustration of the entire system.
And the piping 106, 108, 138, etc. are omitted.

The above embodiment is merely an example, and various modifications and changes can be made within the scope of the technical concept of the present invention. For example, the type, individual or system configuration of the equipment to be ventilated is not limited to the above embodiment, and various variations are possible. The casing structure of the equipment to be ventilated is not limited to the casing structure as shown in the figure, but may have any shape, material,
Configurations are possible.

In the air circulation system of the present invention, the type, the mounting position, the number, etc. of the fans, especially the supply / exhaust fans, can be arbitrarily selected. Is also possible.

In the above embodiment, a plurality of ventilated devices 10 to 2 are connected to the air supply / exhaust fan 56 or the main air supply pipe 58.
0 are connected in parallel via branch air supply pipes 62 to 70. According to such a parallel ventilation system, each device to be ventilated 1
Ventilation for 0 to 20 can be performed individually, and characteristics of air supply and / or exhaust (flow rate, pressure, etc.) can be individually controlled for each of the devices to be ventilated 10 to 20. However, for the purpose of simplifying the piping structure and the like, it is also possible to connect a plurality of ventilated devices 10 to 20 to the air supply / exhaust fan 56 in series and select the series ventilation system. Alternatively, it is also possible to combine a parallel ventilation system and a series ventilation system.

[0060]

As described above, according to the method and apparatus for ventilating semiconductor manufacturing equipment of the present invention, the use of circulating air in a clean room is minimized, and the load or energy consumption of air conditioning and air transfer power in the clean room is reduced. The amount can be reduced. In addition, the burden on the exhaust equipment for gas leakage of the semiconductor manufacturing equipment can be reduced, and the running cost can be reduced.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a basic configuration of a ventilation facility for semiconductor manufacturing equipment according to an embodiment of the present invention.

FIG. 2 is a block diagram illustrating a configuration example of an application system according to the embodiment.

FIG. 3 is a perspective view schematically illustrating an external configuration of an application system according to the embodiment.

FIG. 4 is a perspective view illustrating an external configuration of a control system according to the embodiment.

[Explanation of symbols]

 10-20 Semiconductor manufacturing equipment (ventilated equipment) 26, 28, 30, 46, 54 Casing 56 Supply / exhaust fan 58 Main air supply pipe 60 Main exhaust pipe 62-70 Branch air supply pipe 82-90 Branch exhaust pipe 102 Cooling radiator 110, 118, 128, 138 Piping 112 General exhaust duct 114 Relief valve 116 Pressure switch 122 Air intake valve 124 Air cleaning filter 126 Exhaust switching valve 130 Emergency exhaust duct 132 Emergency exhaust duct 134 Signal unit 136 Inert gas supply source for dilution 142 Gas supply valve for dilution 148 Gas detector

Claims (17)

[Claims] 1. A method for ventilating semiconductor manufacturing equipment installed in a clean room, the method comprising: providing a casing of the semiconductor manufacturing equipment with respect to a first air supplied into the clean room. A ventilation method for circulating and supplying second air for ventilation into the casing by an air circulation system cut off from the first air. 2. The second casing discharged from the casing.
The ventilation method according to claim 1, wherein the temperature of the air is controlled to a predetermined temperature, and the temperature-controlled second air is supplied into the casing. 3. The second container discharged from the casing.
3. The ventilation method according to claim 1, wherein the air is purified, and the purified second air is supplied into the casing. 4. 4. The method according to claim 1, wherein the second air in the air circulation system is reduced when the pressure of the second air in the air circulation system is equal to or higher than a first set pressure. Ventilation method according to any of the above. 5. A step of detecting a pressure of the second air in the air circulation system, and detecting a pressure of the second air when the detected pressure value of the second air is equal to or lower than a second set pressure. Replenishing the second air.
4. The ventilation method according to any one of 4. 6. The air replenishing step includes a step of introducing the first air into the air circulation system until a detected pressure value of the second air becomes higher than the second set pressure. Ventilation method described in. 7. The second container discharged from the casing.
Detecting the leakage of a predetermined gas handled in the semiconductor manufacturing equipment based on the air, and the second air discharged from the casing when the leakage of the gas is detected from the air circulation system Discharging the air to a predetermined external exhaust system. 8. The ventilation method according to claim 7, wherein the air discharging step includes a step of diluting the second air discharged from the casing with an inert gas. 9. A ventilating facility for semiconductor manufacturing equipment for ventilating semiconductor manufacturing equipment installed in a clean room, wherein a casing of the semiconductor manufacturing equipment is substantially sealed from first air supplied into the clean room. And an air circulation system having a fan for circulating the second air cut off from the first air is formed in a structure having an air supply port and an exhaust port. Ventilation equipment connected to an air supply port of the casing via a pipe of the above, and an exhaust port of the casing connected to an inlet side of the fan via a second pipe. 10. The second pipe is connected to the first or second pipe.
The ventilation equipment according to claim 9, further comprising a heat exchanger for adjusting the temperature of the air to a predetermined temperature. 11. The ventilation system according to claim 9, wherein the first or second pipe is provided with an air purifying filter. 12. A third pipe having one end connected to the first or second pipe and the other end connected to a first exhaust duct, and the third pipe is provided on the third pipe. The ventilation system according to claim 9, further comprising a relief valve that opens when the pressure in the second pipe is equal to or higher than a first set pressure. 13. A pressure detecting means for detecting a pressure in said first or second pipe, and said air circulation when a pressure detected by said pressure detecting means is lower than a second set pressure. The ventilation equipment according to any one of claims 9 to 12, further comprising an air supply means for supplying the second air to a system. 14. The air replenishing means has one end provided with the first air supply means.
A fourth pipe connected to a second pipe and having the other end opened to the first air in the clean room; a first on-off valve provided in the fourth pipe; The ventilating equipment according to claim 13, further comprising: first valve control means for opening the first on-off valve until the pressure detected by the first on-off valve becomes higher than the second set pressure. 15. A gas detecting means provided on the second pipe for detecting a predetermined gas leak in the semiconductor manufacturing equipment, and one end is connected to the second pipe via a direction switching valve. A fifth pipe having the other end connected to the second exhaust duct, and the second air from the casing in response to a gas leak detection signal from the gas detection means.
The second switching control of the direction switching valve so as to send to the pipe of the second direction.
The ventilation equipment according to any one of claims 9 to 14, further comprising: a valve control unit. 16. An emergency exhaust fan provided in the fifth pipe, and fan control means for operating the emergency exhaust fan in response to a gas leak detection signal from the gas detection means. Item 16. A ventilation system according to Item 15. 17. An inert gas supply source for supplying an inert gas; a sixth pipe having one end connected to the inert gas supply source and the other end connected to the fifth pipe; 16. A third opening / closing valve provided in a pipe of the above, and third valve control means for opening the third opening / closing valve in response to a gas leak detection signal from the gas detection means. 1
7. The ventilation system according to 6.