JP2001175695A - System and method for designing printed wiring board, and recording method for program of the method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a design system for a solid pattern to a printed wiring board which is easily corrected and reduces electric noise. SOLUTION: This system comprises a storage means 120 which inputs and outputs design data of a wiring pattern, an input/output part 130, a display means 110, and a computer 100 which includes an operation input means 101, a specifying and recording means 102 for a space value between a solid pattern formation area and a component mount pad, a net name recording means 103 for the solid pattern, and a solid pattern calculating means 104 generating the solid pattern at necessary intervals from the wiring pattern while avoiding the formation inhibition area of the solid pattern in the area of the component mount pad and its peripheral area and operates under the control of a program recorded on a recording medium.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board design system and a design method thereof, and more particularly, to a computer-aided design system (hereinafter referred to as a CAD system) for designing a printed wiring board. The present invention relates to a printed wiring board design system and a design method for automatically creating solid pattern data such as copper foil in an area having no pad data or wiring pattern data.

[0002]

2. Description of the Related Art A solid pattern of a conductive material such as a copper foil (hereinafter referred to as a solid pattern) is usually provided in an empty area where a wiring pattern and a component mounting pad of a printed wiring board are not formed in order to prevent noise. As a method for creating this solid pattern, as disclosed in Japanese Patent Application Laid-Open No. 8-235240, after designing a wiring pattern and component mounting pads, these negative patterns are created, and the data portion of the negative pattern is created. In general, a method of forming a desired clearance into solid pattern creation data is used.

FIG. 18 is a plan view for explaining the above-described conventional method for forming a solid pattern on a printed wiring board. First, as shown in FIG.
0, the image data of the component through hole 201, the wiring pattern 202, and the component via hole are inverted by the CAD system, and the negative data is automatically generated as shown in FIG.

[0004] Next, as shown in FIG. 18 (c), after generating data linking FIGS. 18 (a) and 18 (b) by a CAD system, the negative data and each specific pattern data are set to a predetermined interval value. The copper foil part 204 is shaped by narrowing the negative data by a predetermined amount so as to be as follows. This shaped copper foil portion (see copper foil portion 204a after clearance design) becomes a solid pattern. Next, ground connection through holes 205 are formed at predetermined intervals in the copper foil portion 204 based on the pad connection position data. The through hole 205 for ground connection is confirmed to be free from the component mounting pad 200, the component through hole 201, the wiring pattern 202, and the via hole 203 on each inner layer and on the front and back surfaces. Is provided.

[0005]

However, the above-mentioned conventional solid pattern forming method has the following problems. That is, the first problem is that, in the conventional technique, after generating the negative data, the negative data is shaped to create a solid pattern so as to satisfy the interval value with the specific pattern. A solid pattern is also generated. As a result, when the solid pattern is manually corrected, much time is required for correction because there is no data in the basic lattice area.

Further, in the above-mentioned prior art, since the printing deviation of the solder resist of the component mounting pad or the like is not considered, the solid pattern provided around the component mounting pad is exposed without being completely covered with the resist. There are cases.
When the solid pattern is exposed, when mounting components on the printed wiring board, the wiring pattern and component mounting pads adjacent to the solid pattern are short-circuited by soldering, so the design man-hours such as changing the solid pattern area are further reduced. There was an increasing problem.

The second problem is that if the wiring pattern adjacent to the solid pattern to be created has a net name different from that of the solid pattern, even a solid pattern smaller than the through-hole diameter which does not appear on the grid can be used. In order to produce the printed wiring board, the terminal ends at that portion, which causes noise on the printed wiring board.

An object of the present invention is to provide a system and a method for designing a solid pattern of a printed wiring board which solves the above-mentioned problems of the prior art.

[0009]

According to the first aspect of the present invention, there is provided a printed wiring board design system comprising: a storage means for inputting / outputting design data of a wiring pattern of a printed wiring board; and an input / output unit for inputting an operation command. And display means, an input screen for receiving an operation command from the operator is displayed on the display means,
Operation input means for storing data received from an operator, and interval value data between the wiring patterns specified by the operator, which is necessary between the conductor solid pattern forming area and the component mounting pad specified by the operator; Interval value designation recording means for recording a proper interval value, net name recording means for recording the net name of the solid pattern specified and created by an operator, and the solid area of the component mounting pad area and the surrounding area. A solid pattern calculation means for creating a pattern creation prohibited area, avoiding the prohibited area, and creating the solid pattern from the wiring pattern at required intervals determined by design criteria, and controlling a program written on a recording medium. And a computer that operates on the computer.

In the printed wiring board design system having the first configuration, the solid pattern calculating means can perform an area dividing process of the solid pattern forming area specified by an operator. The calculation means avoids the forbidden area, and sets a solid line as a line connecting grid points of a basic grid defined by design reference data, with a boundary of the solid pattern area created from the wiring pattern at a required interval defined by a design standard. The pattern area can be calculated.

Further, the solid pattern calculation means of the printed wiring board design system of the first configuration has a means for storing a minimum generation size of the solid pattern, and has a size larger than the minimum generation size. Means for calculating one solid pattern area, and the first solid pattern area
There is a means for enlarging to a solid pattern area including the first solid pattern area.

A second configuration of the present invention is a method of designing a printed wiring board by a computer, which comprises inputting a wiring pattern data, a first step of reading design reference data, and designation of an operator. A second step of receiving and recording data representing a solid pattern creation area and a net name of the solid pattern, and calculating the solid pattern creation prohibition area data for each component mounting pad data and component mounting hole of the wiring pattern data. A third step of connecting the solid pattern area outside the solid pattern creation prohibited area and the wiring pattern to the solid pattern area, and connecting the solid pattern area boundary line to a grid point of a basic lattice defined by design reference data. And a fourth step of calculating the solid pattern area.

[0013] In the second configuration of the present invention, the second step includes a step of performing an area dividing process on an area in which the designated area can be processed at one time with a previously recorded dimension. In the first step or the second step, the component mounting pad data and a required interval between the component mounting hole and the solid pattern are recorded, and the third step includes the component mounting pad data and the component mounting. The method is characterized in that a step of creating the solid pattern creation prohibited area data representing an area of a size obtained by adding the required interval to the size of the pad for each hole data is provided.

In the above-mentioned second configuration of the present invention, the first step or the second step records a minimum generation size of a solid pattern, and the fourth step includes a step of recording the minimum generation size. A step of calculating a first solid pattern area having the above dimensions, and a step of expanding the first solid pattern area to a solid pattern area including the first solid pattern area. I have.

Further, in the above-mentioned second configuration of the present invention, the third step includes, for each of the component mounting pad and the component mounting hole data and the wiring pattern, the size of the wiring pattern with the solid pattern. Calculating the solid pattern creation prohibition region including a region having a size obtained by adding a necessary interval and having a vertex of the region being a lattice point;
Calculating a shape of a region (referred to as a grid region) having vertices at lattice points in a region included in the solid pattern creation region, and converting the grid region into the solid pattern creation prohibited region. The method includes a step of calculating a hollow figure of a hollow shape and a step of setting the hollow figure as a solid pattern area.

In the method for designing a solid pattern of a printed wiring board according to the present invention, a shift margin parameter for a positional shift of a resist printed with respect to a wiring pattern at the time of manufacturing a substrate is recorded in advance, and the solid pattern calculation means calculates a shift margin parameter value. A solid pattern separated from other wiring patterns at the above intervals is calculated, a shape for reducing the solid pattern on a design grid included in the solid pattern is calculated, and the shape is recorded as solid pattern data. This is because the boundary of the solid pattern is placed on the grid to reduce the area where the solid pattern area protrudes from the grid to reduce the area.

The solid pattern calculation means reads the minimum size of the solid pattern calculated by the above processing, which is previously recorded in the CAD system, and first creates a solid pattern having the minimum size or more. As the minimum size, the minimum size that can store the design via hole is recorded. Next, a region is enlarged around the solid pattern to form a final solid pattern. The reason for this is that at least one place in the solid pattern can be connected to a solid pattern on another layer surface by providing a via hole to avoid isolation of the solid pattern.

According to a third aspect of the present invention, there is provided a recording medium in which a computer has recorded a program for a method of designing a solid pattern of a printed wiring board, wherein:
A first process of reading design reference data, a second process of receiving and recording data representing a solid pattern creation area and a net name of the solid pattern when the computer inputs designation from an operator, A third process of calculating solid pattern creation prohibited area data for each of the component mounting pad data and component mounting holes of the wiring pattern data, and setting the solid pattern creation prohibited area and the solid pattern area existing outside the wiring pattern to The fourth is to calculate a solid pattern area in which the boundary of the solid pattern area is a line connecting grid points of the basic grid defined by the design reference data.
And a program for causing the computer to execute the above processes.

In the third configuration of the present invention, the second process of the program includes a process of dividing the designated region into a region which can be processed at one time with a dimension recorded in advance. Further, the first processing or the second processing of the program records component mounting pad data and a necessary interval between a component mounting hole and the solid pattern, and the third processing includes component mounting pad data and The method is characterized by having a process of creating the solid pattern creation inhibition area data representing an area of a size obtained by adding the required interval to the pad size for each component mounting hole data.

In the third configuration, the first processing or the second processing of the program records a minimum generation size of a solid pattern, and the fourth processing determines that the minimum generation size is equal to or larger than the minimum generation size. Calculating a first solid pattern area having the following dimensions; and expanding the first solid pattern area to a solid pattern area including the first solid pattern area. The third process includes, for each of the component mounting pad and component mounting hole data and the wiring pattern, a region having a size obtained by adding a necessary interval to a solid pattern to the size, and a vertex of the region is a lattice point. The fourth processing includes calculating a solid pattern creation prohibited area, wherein the fourth processing is an area that is included in the solid pattern creation area and has a vertex at a lattice point (referred to as a gridded area). A process of calculating the shape of the shape, a process of calculating a hollow figure of a shape obtained by hollowing out the gridded area in the solid pattern creation prohibition area, and a processing of setting the hollow figure as a solid pattern area. I have.

[0021]

Next, embodiments of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a schematic diagram showing the configuration of a printed wiring board design system according to a first embodiment of the present invention. FIG.
As shown in the figure, the printed wiring board design system of the present invention comprises a storage unit 12 for inputting / outputting design data of a wiring pattern of a printed wiring board by using a magnetic storage medium reader or the like.
0 and an input / output unit 130 for inputting an operation command from a keyboard, a mouse, or communication means. The communication means can output the data of the wiring pattern and the solid pattern of the printed wiring board as a design result from the communication line. Further, the display means 110 such as a CRT display device or a liquid crystal display device, and an input screen for receiving an operation command from the operator are displayed on the display means 110, and the operation input means 101 for storing data received from the operator and the operator. The interval value designation recording means 10 stores the interval value data between the wiring patterns designated by the operator and records the necessary interval value between the solid pattern creation area and the component mounting pad designated by the operator.
2, a net name recording means 103 for recording the net name of the solid pattern designated and created by the operator, and an area dividing process for the solid pattern creation area designated by the operator, and the component mounting pad area and its surroundings And a solid pattern calculation means 104 for creating a solid pattern creation prohibited area of the area, avoiding the prohibited area, and creating a solid pattern from the wiring pattern at a required interval determined by a design standard. And a computer 100 that operates under control.

Next, a first method of designing a solid pattern of a printed wiring board according to a second embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 2 is a flow chart for explaining a first method of designing a solid pattern of a printed wiring board according to a second embodiment of the present invention.

According to the present invention, a solid pattern for shielding is created in the empty area on the substrate after the completion of the wiring pattern design in the following procedure. First, the operation input unit 101 receives the wiring pattern design data and the design reference data (design grid data) from the storage unit 120 such as a magnetic disk storage medium reading device, or the Internet communication line which is a part of the input / output unit 130. An interval value and a required interval value between wiring patterns for each layer surface are read (STEP 0).

Next, the operation input means 101 displays an image such as a wiring pattern of the wiring board on the display means 110. Then, the solid pattern creation area and the net name of the solid pattern creation area are received from the operator by operating a keyboard, a mouse, or the like, which is a part of the input / output unit 130, and are recorded in the net name recording means 103 (STEP).
1).

Next, the operation input means 101 receives designation of an interval value from the component mounting pad to the solid pattern from the keyboard input of the operator, and records it in the interval value designation recording means 102.

Next, the operation input means 101 receives from the operator the value of the resist printing deviation for each layer surface, and adds the value to the gap value between the wiring patterns registered for each layer surface in the design reference data. do. The result is defined as the minimum required spacing value from the component mounting pad to the solid pattern,
It is recorded in the interval value designation recording means 102. The reason for this is to avoid the possibility that a solid pattern may be exposed due to a shift during printing of a resist escape created from a component mounting pad during board manufacturing. Here, for the inner layer surface, since the resist is not printed, it is not necessary to consider the printing deviation of the resist. Therefore, the value of the resist printing deviation is not specified for the inner layer surface. Records only the interval value registered in the design reference data in the interval value designation recording means 102 (STEP 2).

Next, the operation input means 101 is connected to the display means 1.
10 displays an input screen and a menu of the minimum generation size of the solid pattern, and allows the operator to select the menu with a mouse or to input a numerical value of the minimum size from a keyboard (STEP 3).

Next, the operation input means 101 receives a command for designating a solid pattern creation area (referred to as a rectangular area a) by a mouse operation from the operator, and records it in the creation area designation data of the operation input means 101 ( (STEP 4).

Next, the solid pattern calculation means 104 first compares the rectangular area a with an area which can be processed at one time by the computer (referred to as a processable area) determined by the memory capacity of the computer. If the rectangular area a exceeds the size of a rectangle that can be processed, a process of dividing the rectangular area a into rectangles of a size that can be processed (referred to as area division processing) is performed (STEP 5). Next, the solid pattern calculation unit 104 records the size of the component mounting pad and the component mounting hole existing in the divided region in the interval value designation recording unit 102 so that a solid pattern is not created. A solid pattern creation prohibited area is created in consideration of the printing shift of the resist corresponding to the value (STEP 6).

Next, the solid pattern calculation means 104 determines, for each of the rectangles c, a region surrounded by the minimum lattice specified by the design reference data as a basic lattice region (hereinafter referred to as a rectangle c). In addition, it is checked whether or not the rectangle c overlaps the solid pattern creation prohibition area, and the second rectangle c adjacent to the rectangle c is checked, and the rectangle c contacts the solid pattern existing in the second rectangle c. The process of checking whether or not it has been performed is performed as follows. That is, the solid pattern calculation unit 104 checks, for each rectangle c in the divided area, whether or not the rectangle c is a solid pattern creation prohibited area. If the rectangle c is not the solid pattern creation prohibited area, then the solid pattern calculation means 1
04 checks whether there is a wiring pattern in the rectangle c and the second rectangle c adjacent thereto. Therefore, if there is no wiring pattern between the rectangle c and the second rectangle c, the rectangle c
A solid pattern generation possible flag (hereinafter simply referred to as a solid possibility flag, which means that a solid pattern can be set to the rectangle c) is set in the data.

When the rectangle c is not in the solid pattern creation prohibited area, and there is a wiring pattern in the rectangle c, if there is only a wiring pattern with the same net name as the solid pattern creation area, the A solid pattern overlapping the wiring pattern may be created. Therefore, the net name of the wiring pattern is checked. That is, even when the net name of the wiring pattern is the same as the net name of the solid pattern creation area, the solid possible flag is set in the rectangular c data (STEP 7).

Next, the solid pattern calculating means 104 checks the interval between the rectangle c and the wiring pattern in more detail, and performs a process of resetting the solid possible flag in the rectangle c data (STE).
P8). Next, in STEP 9, the solid pattern calculation means 104 searches for a rectangle c from the upper left grid to the lower right grid of the rectangularly divided area a as the processing of the first stage, and the solid c is calculated. An area having a size larger than the minimum size (size in which a via hole can be set) is extracted from the area composed of the rectangle c in which the flag is set. ).

Next, as a second processing step, if a solid possible flag is set in a rectangular area c adjacent to the created solid pattern area (a set of copper foil rectangles d), the rectangular area c is also solid. A process of expanding the solid pattern area by adding the pattern area to the pattern area is performed.

Thus, since the solid pattern is not isolated from other solid pattern areas, a solid pattern having one or more wide portions that can be connected to the solid pattern on the other layer surface via holes can be formed.

When the processing of all the rectangles c in the divided area is completed, the solid pattern calculating means 104
However, the same solid rectangle number is assigned to each solid rectangle d of one solid pattern in order to distinguish solid patterns connected in each layer plane as one solid pattern. Also, solid rectangle d
Each time, a net name recorded in the net name recording means 103 is assigned, and it is calculated whether or not each side of the solid rectangle d is a contour of a solid pattern (STEP 10).

Next, in STEP11 to STEP12, in order to make it difficult for the edge of the solid pattern to be peeled off from the base material of the printed wiring board, a process of adding a triangular solid pattern of a chamfering process in which the corner of the contour is obtuse is performed. In addition, in order to secure an area for performing additional processing of a triangular solid pattern,
A process of removing a solid pattern in units of rectangle c from the solid pattern is performed.

When the solid pattern in the lattice area has been removed, the processing from STEP 11 to STEP 12 is repeated. In STEP 13, the contour of the created solid pattern is calculated. STEP6 to STEP13 above
Are performed for each divided area. When the processing for all the divided areas is completed, the process returns to STEP 1 and the operation input means
1 waits for the next command from the operator.

Next, the first method of designing a solid pattern will be described in more detail with reference to FIGS.

As shown in FIG. 2, in STEP 0,
The data of the wiring pattern is read, and the interval value of the design grid and the distance between the wiring patterns of different net names are input and recorded as design reference data.

In STEP 1, the operation input means 101
Receives the net name of the solid pattern creation area from the operator from the keyboard and records it in the net name recording means 103.

In STEP 2, the operation input means 101
Receives the allowable distance from the wiring pattern of the component mounting pad to the solid pattern by a keyboard operation of the operator, and records the distance in the interval value designation recording means 102. Here, even when the designation input of the prohibited area is not received from the operator, the distance between the wiring patterns of different net names recorded in the design reference data is recorded in the interval value designation recording means 102 as a default value. deep.

As shown in FIG. 3, the operation input means 101 provides the operator with a command from the boundary of the rectangular solid pattern generation prohibition area 2 created around the component mounting pad 1 to the component mounting pad 1. Input distance 3 from the keyboard,
This is stored in the interval value designation recording means 102 for generating the solid pattern generation prohibited area.

Next, the operation input means 101 receives, from the operator, the value of the resist printing deviation for each layer surface, and adds the value to the gap value between the wiring patterns registered for each layer surface in the design reference data. do. The result is defined as the minimum required spacing value from the component mounting pad to the solid pattern,
It is recorded in the interval value designation recording means 102.

This is for calculating a prohibited area from the component mounting pad to the range of the designated distance in STEP 6 later.

In STEP 3, the operation input means 101
Receives the area of the minimum occurrence size of the solid pattern as a rectangular area b specified by the number of grids in the XY directions from the keyboard or mouse operation of the operator.

Here, the reason why the rectangular area b having the minimum size is designated is that a solid pattern is conventionally created if the condition of the wiring pattern of a different net name is satisfied.
This is to solve the problem of creating an extremely fine solid pattern by giving a lower limit to the size of the solid pattern to be created.

Referring to FIG. 4, a method of inputting a rectangular area b having a minimum solid pattern generation size will be described. First, the operation input unit 101 displays the wiring pattern of the printed wiring board on the window of the display unit 110, displays an auxiliary window on the display unit 110 in addition to the window, and displays the XY coordinate plane and grid points on the auxiliary window. 5 is displayed. Then, when the operator designates a rectangular area b (indicated by reference numeral 6) having the minimum occurrence size by dragging the mouse from one grid point to another, the operation input unit 101 stores the specified area.

In STEP 4, the operation input means 101
Displays the wiring pattern of the printed wiring board on the screen of the display means 110. Then, the operator designates a rectangular area a in which a solid pattern is to be created by a drag operation of a mouse, and designates the rectangular area a as a solid pattern creating area.
01 reads. Here, a rectangular area a (indicated by reference numeral 7)
Is shown in FIG.

Next, the solid pattern calculation means 104 divides the rectangular area a into a rectangular grid c (indicated by reference numeral 8) having one grid vertically and horizontally. Here, if the number of rectangles c exceeds an area that can be processed by the computer at one time (this is a default value recorded in a program), which depends on the memory size of the computer, etc., The solid pattern calculation means 104 divides the area.

Next, in STEP 5, when the solid pattern calculation means 104 determines that the rectangular area a specified in STEP 4 exceeds the number of areas that can be handled in one solid pattern creation process as shown in FIG. , Rectangular area a (reference numeral 7)
To an area A (reference numeral 1) such as a strip area shown in FIG.
0), area B (reference numeral 11), and area C (reference numeral 12). This is divided into regions that can be processed at one time, that is, divided into a plurality of creation processing regions, and each divided region has a portion that overlaps at its boundary, and the width of the overlapping portion is the rectangular region set in STEP 3. Division processing is performed on a creation processing area in which twice the larger dimension of the dimension b or the rectangle c, whichever is larger, is overlapped.

The reason for the overlapping with this width is that when the solid pattern of the rectangular area b having the minimum size exists at the end of the creation processing area, the rectangular area b having the minimum size is also added to the creation processing area adjacent at that end. As can be seen, overlapping areas are provided so that the smallest rectangular area can be shared. Also, the reason why the overlap is made twice as large as the minimum-size rectangular area is that even if the position of the minimum-size rectangular area is shifted from the end of the creation processing area by about the width thereof, the minimum size of the creation processing area on both sides is still small. This is for sharing and confirming the rectangular area of. Note that reference numeral 9 in FIG. 6 indicates an existing prohibited area.

Next, in STEP 6, the solid pattern calculation means 104 specifies the pad size and the mounting hole of the component in the specified area by adding an interval value to each of the size of the component pad and the mounting hole diameter. A solid pattern creation prohibited area having a size corresponding to the value recorded in the recording means is created.

In STEP 7, a loop in which the solid pattern calculation means 104 processes the left rectangle c to the right rectangle c in order from the upper left rectangle c of the creation processing area, and a next rectangle c from the upper rectangle c to the lower rectangle c The rectangle c solid possible flag setting process of each rectangle c is performed in a double loop shown in FIG. A process for confirming whether or not the wiring pattern is in contact is performed. Regarding the rectangle c that does not overlap the prohibited area, if there is no wiring pattern in another rectangle c adjacent to the rectangle c, or if there is a wiring pattern, it is the same as the net name recorded in the net name recording means. If the wiring pattern is the net name, a solid flag is recorded in the data storing the rectangle c. Reference numeral 18 in FIG.
Indicates a solid flag setting area, and reference numeral 17 indicates a wiring pattern having the same net name. Reference numeral 16 indicates a wiring pattern.

The net name of the rectangle c is the net name recording means 10
If it is different from the net name recorded in 3 or a rectangle c
, Overlaps the prohibited area, a copper foil impossible flag is recorded in the data storing the rectangle c. Solid pattern calculation means 1
Step 04 repeats the same processing for all rectangles c in the creation processing area.

In STEP 8, the solid pattern calculating means 10
4 processes the rectangle c in the order shown in FIG. 7, and performs a solid flag reset process on the data storing the rectangle in the following procedure. Here, a more detailed interference check process between the rectangle c and the wiring pattern in the adjacent rectangle c is performed on the rectangle c for which the solid possible flag could not be set in STEP7. That is, a rectangle c and its adjacent rectangle c
The distance to the wiring pattern existing therein is calculated, and if the distance is smaller than the minimum gap value, a check process is performed to determine that there is interference.

That is, for each rectangle c, an interference check process with the wiring pattern in the rectangle c adjacent thereto is performed.
At this time, when the net name of the solid pattern to be created is recorded in the net name recording means 103, even if a wiring pattern having the same net name as the net name interferes, it is not an error. If it interferes with a wiring pattern with a different net name, it is an error.

If no net name is recorded in the net name recording means 103, interference check processing is performed on all wiring patterns in the rectangle c adjacent to the rectangle c. If there is interference, it is determined that an error has occurred. If an error occurs in the interference check processing, the process proceeds to the check processing for the next rectangle c.
If no error has occurred, a solid flag is set for the rectangle c, and the process proceeds to the next rectangle c.

In STEP 9, the solid pattern calculation means 104 sets the rectangular area b having the minimum generation size set in STEP 3 in the area where the solid possible flag is set in the area in the creation processing area as follows. A search is made for an area that can be included in more than one place, and that area is set as a solid pattern installation area.

This process is performed in the following two stages. In the first stage, a solid pattern area including the rectangular area b of the minimum size is secured. The reason why one or more areas of the rectangular area b or more having the minimum occurrence size are secured in the solid pattern in this way is that a via hole is formed in that area later and the solid pattern can be connected to the solid pattern on another layer surface. It is. In the next stage, the minimum size rectangular area b
From the above-described region, the region is expanded to a region including a copper foil region connected to the region.

In the first stage, the solid pattern calculation means 104 selects the rectangles c in the creation processing area in the order shown in FIG. 7, and based on the rectangles c, as shown in FIG. (Indicated by reference numeral 8) is the rectangular area b
A process is performed to check whether or not a solid flag is set for all rectangles c (indicated by reference numeral 6). As an example,
In FIG. 9, when the size of the rectangular area b (symbol 6) is 3 × 3 times the size of the rectangle c (symbol 8), all the grids (3 × 3 = 9) with the rectangle c at the upper left can be solid. If there are flags,
All rectangles c in the rectangular area b with the rectangle c at the upper left
To set the copper foil confirmation flag. The rectangle c with this flag set is called a solid rectangle d. Note that reference numeral 19 in FIG.
Indicates an area where a solid flag is set.

Thus, in the first stage, the rectangular area a
For all the rectangles c, the solid possible flag in the range of the rectangular area b is checked.

Next, in the second stage, the solid pattern calculation means 104 again converts the rectangle c in the creation processing area of the rectangular area a from the left column to the right column in the order of FIG. Is scanned from top to bottom to select a rectangle c, and the following processing is performed on each rectangle c to grow the solid pattern secured in the first stage. That is, in this processing, the rectangle c on which the solid possible flag is set is
As shown in FIG. 10 (a) to FIG. 10 (d), when the solid rectangle d is in contact with the upper, lower, left and right sides, the copper foil determination flag is set in the rectangle c.

After performing this processing for all the rectangles c in the rectangular area a, the solid pattern calculation means 104 again sets a new solid rectangle flag for any of the rectangles c in the processing. This process (second stage process) is repeated for all the rectangles c in the rectangular area a.

In the second-stage processing for all the rectangles c in the rectangular area, if the increase of the solid rectangle d has stopped, the process proceeds to the next processing. That is, the solid enable flag of the rectangle c is deleted, and the process proceeds to the next STEP 10.

In STEP 10, the solid pattern calculation means 104 determines whether the rectangular c
From the left column to the right column in the order of FIG. 7, and scan each column from top to bottom to select a rectangle c. For each rectangle c, the rectangle c is a solid rectangle d. Is
A solid rectangle number is assigned.

This number assignment process is to give the same solid rectangle number to the solid rectangles d connected to each other.

A method of assigning a solid rectangle number to the solid rectangle d will be described with reference to FIG.

FIG. 11A shows a case where the following conditions are newly assigned. (1) The rectangle c is a solid rectangle d. (2) For the rectangle c, the solid rectangle number has not been determined. (3) The grid on the upper and left sides of the rectangle c is not a solid rectangle d. In this case, a new solid rectangle number is calculated, and the solid rectangle number is recorded in the data of the solid rectangle d.

FIG. 11B shows a case where an existing solid rectangle number under the following conditions is assigned. (1) The rectangle c is a solid rectangle d. (2) For the rectangle c, the solid rectangle number has not been determined. (3) Either one of the upper and left sides of the rectangle c is a solid rectangle d and has a solid rectangle number, or both the upper and left sides are a solid rectangle d and have the same solid rectangle number. In this case, the existing solid rectangle number is recorded in the data of the solid rectangle d.

FIG. 11C shows a case where two types of solid rectangles d are connected under the following conditions. (1) The rectangle c is a solid rectangle d. (2) For the rectangle c, the solid rectangle number has not been determined. (3) Both the upper and left grids of the rectangle c are solid rectangles d, and have different solid rectangle numbers. In this case,
The solid rectangle number is unified to the smaller solid rectangle number, the solid rectangle number is recorded in the solid rectangle d, and the existing solid rectangle d in which the larger solid rectangle number is recorded is updated to the smaller solid rectangle number. Record.

Next, the solid pattern calculation means 104 selects the rectangles c in the rectangular area a in the order shown in FIG. 7, and if the rectangle c is a solid rectangle d, the upper, lower, left and right sides of the solid rectangle d A check process is performed to determine whether or not the side is required as the outline of. That is, when the following condition is satisfied, the data that stores the side is recorded as the side required as the contour of the solid pattern. In this condition, after all, it is determined whether the side of the solid rectangle d is not shared with the adjacent solid rectangle d, and if it is not shared, it is determined that the side is a contour. FIG. 12 is a diagram illustrating a procedure for creating a contour by connecting the valid sides determined here.

First, it is an essential condition that the rectangle c to be processed is a solid rectangle d. Only in this case, processing is performed under the following conditions to determine whether or not the side is a side required as a contour. (1) The rectangle c above the rectangle c to be processed is not a solid rectangle d. In this case, the data that stores the upper side is recorded as a side that is necessary as a contour. (2) The rectangle c below the rectangle c to be processed is not a solid rectangle d. In this case, the lower side is set as a necessary side as a contour. (3) The rectangle c to the left of the rectangle c to be processed is not a solid rectangle d. In this case, the left side is a necessary side as a contour. (4) The rectangle c to the right of the rectangle c to be processed is not a solid rectangle d. In this case, the right side is set as a necessary side as a contour.

In STEP 11, the solid pattern calculation means 104 adds a triangular solid pattern portion to the rectangle c. The addition of the triangular solid pattern portion is determined by the relationship with the solid rectangle d existing adjacent to the rectangle c at the top, bottom, left, and right sides.

Hereinafter, a criterion for judging whether or not to add a triangular solid pattern portion will be described with reference to FIGS.

First, under each of the following conditions showing the relationship shown in FIG. 12, it is impossible to add a triangular solid pattern portion to the rectangle c. (1) The deletion history flag (described below) is not set on the rectangle c. (2) A case where there is no solid rectangle d (reference numeral 20) adjacent to the upper, lower, left, and right sides of the rectangle c (reference numeral 8) (FIG. 12A). (3) A case where there is a solid rectangle d only at one position adjacent to the rectangle c at the top, bottom, left and right (FIG. 12B). (4) Solid rectangles d at three locations adjacent to the rectangle c at the top, bottom, left and right
Exists (FIG. 12C). (5) Solid rectangles d at four locations adjacent to the rectangle c vertically and horizontally
Exists (FIG. 12D). (6) Two solid rectangles d adjacent to the rectangle c at the top, bottom, left and right
Exists, and there is a solid rectangle d on opposing sides such as up and down and left and right (FIG. 12 (e)).

Further, the rectangle c does not have the relationship shown in FIG. 12 and the following conditions indicating the relationships shown in FIGS. 13A to 13D indicate that the rectangle c has a triangular solid pattern. A part (indicated by a painted triangle 21) is added, and two sides of the added triangle are deleted from the contour data (FIG. 13).
(E) to FIG. 13 (h)). (1) A deletion history flag is set for rectangle c (see rectangle c (denoted by reference numeral 8a) where a deletion history exists). (2) Solid rectangle d in two places adjacent to rectangle c at the top, bottom, left and right
Exists, and the two places are a combination of upper and left, upper and right, lower and left, and lower and right.

Next, in STEP 12, if there is a solid rectangle d that satisfies any of the following conditions, the solid pattern calculation means 104 deletes the solid rectangle d and adds a deletion history flag to the data of the rectangle c representing the solid rectangle d. (This is called a chamfering process).

The solid rectangle d is deleted under each of the following conditions showing the relationship shown in FIG. FIG. 14 shows that the set of solid rectangles d is the solid rectangle d in the area indicated by the dotted line.
, And a solid rectangle d indicated by oblique lines, the solid rectangle d indicated by oblique lines is deleted. (1) Solid rectangle d having three effective sides (FIG. 14
(A)). (2) Solid rectangle d having four effective sides (FIG. 14
(B)). (3) A solid rectangle d having two consecutive effective sides (corners) (FIG. 14C). (4) A case where the corner is formed by three solid rectangles d each having one effective side (FIG. 14D). (5) A case where the corner is formed of four solid rectangles d having one effective side (FIG. 14E). (6) A case where the corner is formed by two solid rectangles d each having one effective side (FIG. 14F).

If these conditions are met, first, a deletion flag is set for the rectangle c, and the processing is continued. When all the rectangles c in the creation processing area have been completely processed, the solid rectangle with the flag raised is set. Delete d. If one or more solid rectangles d have been deleted in STEP 12, the process returns to STEP 11 again to continue the processing. STEP12
If the solid rectangle d is not deleted in
Proceed to P13.

In STEP 13, the solid pattern calculation means 104 selects rectangles c in the creation processing area in the order shown in FIG. 7, and the rectangle c is a solid rectangle d for which the contour extraction end flag (described below) has not yet been set. Extract some cases.

The subsequent processing will be described with reference to FIG.
The solid rectangle d is defined as a rectangle to be processed first (a rectangle to be processed is referred to as a current rectangle 22).
Is a start point, and that point is defined as a starting point (referred to as a current point 23) for searching for the first contour.

Next, as described below, solid rectangles d having the same solid rectangle number are sequentially set as the current rectangle, and the processing of the current rectangle unit is continued to extract the contour line of the solid pattern. That is, a solid rectangle d (reference numeral 2)
0) are sequentially set as the current rectangle, and the contour extraction work is performed. At that time, the start point is fixed, but the current point is shifted for each process, and a chain of effective sides of the current rectangle starting from the current point is added to the contour line.
The solid pattern calculating means 104 sequentially stores the start point and end point coordinates of the effective side.

Next, the current point is moved to the end point of the chain of effective sides, and is set as the end of the extracted contour line. The effective side of the current rectangle is stored by the solid pattern calculation means 104 as a contour in the order of upper right and lower left, and the current point is set to the end of the contour of the current rectangle. When the solid pattern calculating means 104 stores the effective side of the solid rectangle d which is the current rectangle, the outline flag is recorded in the data storing the effective side. Then, when the outline flags are set for all the valid sides of the current rectangle, the outline extraction end flag is set in the data describing the solid rectangle d which is the current rectangle.

Then, the solid pattern calculation means 104
It is divided into the following cases (1) to (4), a rectangle c and a side are selected in the order of the side list described in the rule, and it is confirmed whether or not the following conditions are satisfied. The confirmation condition is to confirm whether or not the rectangle c has the same solid rectangle number as the current rectangle and the condition that the contour extraction end flag is not set. If this condition is not satisfied, the confirmation is continued for the next side of the list of sides described in the rules (1) to (4). When an effective edge satisfying the condition is found, the rectangle c is set as the next current rectangle, and the process proceeds to the next process. (1) When the contour at the end of the contour is the left side of the current rectangle: the upper side of the lower left rectangle c of the current rectangle, the left side of the lower rectangle c, the hypotenuse of the left rectangle c, the hypotenuse of the lower left rectangle c, the lower side The hypotenuse of the rectangle c. (2) When the contour of the end is the lower side of the current rectangle: the left side of the lower right rectangle c of the current rectangle, the lower side of the right rectangle c,
The hypotenuse of the lower rectangle c, the hypotenuse of the lower right rectangle c, and the hypotenuse of the right rectangle c. (3) When the contour of the end is the right side of the current rectangle: the lower side of the upper right rectangle c of the current rectangle, the right side of the upper rectangle c,
The hypotenuse of the right rectangle c, the hypotenuse of the upper right rectangle c, and the hypotenuse of the upper rectangle c. (4) When the contour of the end is the upper side of the current rectangle: the right side of the upper left rectangle c of the current rectangle, the upper side of the left rectangle c,
The hypotenuse of the upper rectangle c, the hypotenuse of the upper left rectangle c, and the hypotenuse of the left rectangle c.

For example, in the case of FIG. 15, when the effective side of the current rectangle 22 is the upper side (shown by the effective side (upper) 24) and the left side (shown by the effective side (left) 25), the upper side of the current rectangle is From the start point of the right coordinate → the left coordinate of the upper side →
The valid sides are connected in the order of the coordinates below the left side, and the current point is updated to the end of the chain of the valid sides, that is, the coordinates below the left side (see the next current point 26). Then, an outline flag is recorded on the upper side and the left side which are the effective sides of the current rectangle, and an outline extraction end flag is set on the solid rectangle d which is the current rectangle.

Next, the next current rectangle is searched for as follows. That is, the lower end of the left side (see the effective side (left) 25)
Is the end of the outline, and the outline of the end is the left side of the current rectangle, and thus is the case of the above (1). Therefore, it is checked whether the lower left rectangle c at the beginning of the list of sides described in the rule (1) and its upper side satisfy the above condition. In the case of this example, the upper side of the lower left rectangle c of the current rectangle is the effective side, and the contour extraction flag is not set, which satisfies the search condition. Therefore, the current rectangle is updated to the lower left rectangle c (solid rectangle d), and the process proceeds to the next contour data creation processing.

When the current point coincides with the coordinates of the start point, the outer loop of the solid rectangle number group is determined. The solid pattern calculation means 104 checks whether or not the contour extraction end flag has been set for all the solid rectangles d having the solid rectangle number. The contour extraction process is completed.

If there is still a solid rectangle d for which the contour extraction flag is not set, it means that a cavity where no copper foil exists and a contour line of the cavity exist inside the solid pattern. It has a chain of internal contours (called internal loops) surrounding the cavity. In this case, the contour data of the inner loop is further extracted. If there is a chain of line segments in the same direction in the chain of outline lines stored by the solid pattern calculation means 104, the line group is regarded as one line segment, and only the start point and the end point are recorded.

When the contour extraction processing is completed, solid pattern data represented by one solid rectangle number described by the contour data is created. The above processing is 1
The process is continued until solid pattern data of all solid rectangle numbers in one creation processing area is created. When the data of all the solid patterns is completed, the process returns to STEP 5 to process the next creation processing area. When all the creation processing areas have been processed, the process returns to STEP1.

Next, a second method of designing a printed wiring board according to a third embodiment of the present invention will be described in detail with reference to the drawings. This embodiment uses the printed wiring board design system shown in FIG. 1 as in the first method.

In the present embodiment, it is possible to directly calculate the final solid pattern area by omitting the procedure in which the first method divides the solid pattern area by the grid and then recombines it. it can.

FIG. 16 is a flowchart for explaining a second method of designing a printed wiring board according to the third embodiment of the present invention. As in the case of the first method, first, the operation input unit 101 is connected to the storage unit 120 such as a magnetic disk storage medium reader or the input / output unit 130.
The wiring pattern design data and the design reference data (design grid spacing values, required spacing values between wiring patterns for each layer surface) are read from the Internet communication line or the like, which is part of the above (STEP 0).

Next, the operation input means 101 displays an image such as a wiring pattern of the wiring board on the display means 110. Then, the solid pattern creation area and the net name of the solid pattern creation area are received from the operator by operating a keyboard, a mouse, or the like, which is a part of the input / output unit 130, and are recorded in the net name recording means 103 (STEP).
1).

Next, the operation input means 101 receives designation of an interval value from the component mounting pad to the solid pattern from the keyboard input of the operator, and records it in the interval value designation recording means 102.

Next, the operation input means 101 receives from the operator the value of the resist printing deviation for each layer surface, and adds the value to the gap value between the wiring patterns registered for each layer surface in the design reference data. do. The result is defined as the minimum required spacing value from the component mounting pad to the solid pattern,
It is recorded in the interval value designation recording means 102.

The reason for this is to avoid the possibility that a solid pattern may be exposed due to a shift at the time of printing of a resist escape created from a component mounting pad at the time of manufacturing a substrate.

Here, for the inner layer surface, it is not necessary to consider the printing deviation of the resist because the resist is not printed. Therefore, the value of the resist printing deviation is not specified for the inner layer surface. The input unit 101 records only the interval value registered in the design reference data in the interval value designation recording unit 102 (STEP 2).

Next, the operation input means 101 is the display means 1
10 displays an input screen and a menu of the minimum generation size of the solid pattern, and allows the operator to select the menu with a mouse or to input a numerical value of the minimum size from a keyboard (STEP 3).

Next, the operation input means 101 receives a command for designating a solid pattern creation area (referred to as a rectangular area a) by a mouse operation from the operator, and records it in the creation area designation data of the operation input means 101 ( (STEP 4).

Next, in STEP 21, the solid pattern calculation means 104 extracts the wiring pattern of the component mounting pad and the component mounting hole existing in the area where the specified solid pattern is created. Then, as shown in FIG. 17A, the boundaries formed in the eight directions of the vertical and horizontal directions and the diagonal 45 degrees direction are set to the dimensions of the extracted wiring pattern by the values recorded in the interval value designation recording means 102. A rectangular area is calculated, and an octagonal solid pattern generation prohibition area 15 (clearance octagon) which is an octagon including the area and whose vertices are present at the positions of lattice points in the XY directions is calculated and stored. (The hollowed-out figure 13 in FIG. 17A is generated in STEP 24.) Further, with respect to the wiring pattern, an octagonal area surrounding the necessary gap between the wiring patterns is calculated, and an octagon including the area is calculated. An octagon having a vertex at the position of a lattice point in the X and Y directions is calculated and stored as a solid pattern generation prohibited area (similarly, a kind of clearance octagon). In FIG. 17A, reference numeral 14 denotes a component land.

As for the outline 27 of the printed wiring board, FIG.
As shown in (1), a clearance octagon 15a that surrounds each of the outer contour lines 27 with a required minimum gap from the wiring pattern is calculated. The clearance octagon 15a has a side that is oblique to the side of the horizontal line and the side of the vertical line.
It is an octagon that is composed of a hypotenuse of 5 degrees and whose apex exists at the position of a lattice point in the XY directions. The inside of the clearance octagon 15a is a solid pattern creation prohibited area where the creation of a solid pattern is prohibited. Note that reference numeral 13a in FIG. 17B indicates a hollow figure.

Next, in STEP 22, the solid pattern calculation means 104 stores the vertices or sides of the clearance octagon that are not included in the other clearance octagon as effective vertices and effective sides, respectively. Then, the distance from the effective vertex or effective side of each clearance octagon to the effective vertex or effective side of the clearance octagon adjacent in the vertical or horizontal direction is calculated, and the distance between them is less than the rectangular area b of the minimum size. In the case of, the effective vertices adjacent within the distance are stored. For the effective side, the effective vertices whose effective sides are adjacent to the effective vertices or the effective side of the other party within the rectangular area b are defined as the effective vertices. The grid points existing above are extracted and stored. And with the octagon surrounding those memorized points,
Calculate the clearance octagon (small width prohibited octagon) consisting of vertical and horizontal lines and oblique 45-degree lines. As a result, the effective vertices or effective sides of any of the clearance octagons can be separated from each other by a distance equal to or greater than the length of one side of the rectangular area b. In other words, this small-width prohibited octagon makes it possible to delete a narrow area where the solid pattern width is equal to or smaller than the minimum size.

Next, in STEP 23, the solid pattern calculation means 104 divides the area designated in STEP 4 in the same manner as in STEP 5 of the first embodiment. At that time, STE
At P23, strip area data is created by dividing a strip area in the vertical direction having a width several times as large as the design grid width into strip areas whose vertical boundaries are placed on the design grid points (FIG. 17).
(C)). In addition, the strip regions are connected to each other in the STEP 1 of the first method.
As shown in FIG. 5, a width for overlapping the areas is provided.

The strip area is calculated as follows. That is, the solid pattern calculation means 104 sets the upper boundary line and the lower boundary line of each strip region obtained by dividing the region specified in STEP 4 by a vertical line into the design grid point by the uppermost boundary line in the region specified in STEP 4. Is calculated by connecting a horizontal line, a 45-degree line obliquely, and a vertical line. Similarly, a lower boundary line is calculated at the lowermost boundary line in the region, and a strip region surrounded by both is calculated. This strip area is called a grid area. This grid area is an area included in the solid pattern creation area,
Its vertex is at a grid point.

Next, STEP 24 performs the following calculation for each strip area. That is, the solid pattern calculating means 10
4 calculates the outline of the figure data in which each strip area calculated above is cut out with a clearance octagon, and sets the area surrounded by the outline as hollow figure data (FIG. 1).
7 (a) (indicated by reference numeral 13).

Next, in STEP 25, the outline of the hollow figure data is calculated for each strip region by a known outline calculation method. The solid pattern data is created with the net name recorded in the net name recording means 1103 in the area surrounded by the outline of the hollow figure data. Next, when there is an unprocessed strip area, the process returns to STEP 24.
When all the strip areas have been processed, the process returns to STEP1.

[0109]

As described above, the present invention has the following effects. (1) In the first method of designing a solid pattern of a printed wiring board according to the present invention, one or more regions in which a via hole can be formed are formed in the solid pattern, and the via hole can be connected to a solid pattern on another layer surface. Since the solid pattern is created, there is an effect that a solid pattern that is not isolated can be formed. Furthermore, by placing the contour data of the solid pattern on the grid, the man-hour required by a designer to make a solid pattern for an empty area on a substrate and then modifying the solid pattern is greatly reduced. Has an effect. (2) In the second method for designing a solid pattern of a printed wiring board according to the present invention, a clearance octagon including a region of a component mounting pad and a component mounting hole and connecting grid points is calculated, and further, the clearance is calculated. When the gap between the vertices or sides of the octagons is small, calculate the clearance octagon (small ban octagon) that closes the gap and calculate the solid pattern area by removing that area from the solid pattern creation area. Therefore, in the first method, the procedure of dividing the solid pattern area by the grid and recombining the divided areas is omitted, and the final solid pattern area can be calculated directly.

[Brief description of the drawings]

FIG. 1 is a schematic configuration diagram of a printed wiring board design system according to a first embodiment of the present invention.

FIG. 2 is a flowchart illustrating a first method of designing a printed wiring board according to a second embodiment of the present invention.

FIG. 3 is a diagram illustrating a method of inputting a distance from a boundary line of a solid pattern generation prohibition region to a component mounting pad from a keyboard in STEP2 of FIG. 2;

FIG. 4 is an auxiliary window screen of a display unit for explaining a method of inputting a rectangular area having a minimum solid pattern generation size in STEP 3 of FIG. 2;

FIG. 5 is a window screen of auxiliary means for explaining a method of specifying a rectangular area in which a solid pattern is generated in STEP 4 of FIG. 2;

FIG. 6 is a diagram illustrating a method for dividing a rectangular area in STEP5 of FIG. 2;

FIG. 7 is a view for explaining a solid possible flag setting processing order of a rectangle c in STEP7 of FIG. 2;

8 is a diagram illustrating a method of setting a solid possible flag of rectangle c in STEP7 of FIG. 2;

FIG. 9 is a diagram illustrating a method of extracting a solid pattern generation determined region and a region enlarging method in STEP 9 of FIG. 2;

FIG. 10 is a diagram illustrating a method of extracting a solid pattern generation determined region and a region enlarging method in STEP 9 of FIG. 2;

11 is a diagram illustrating a method of assigning a number to a solid pattern generation determined rectangle in STEP 10 of FIG. 2;

FIG. 12 is a schematic diagram showing criteria for judging whether or not to add a triangular solid pattern portion in the first method of designing a printed wiring board according to the present invention.

FIG. 13 is a schematic diagram for explaining a criterion for determining whether or not to add a triangular solid pattern portion in the first method of designing a printed wiring board according to the present invention.

FIG. 14 is a schematic diagram illustrating conditions for deleting a solid rectangle d in the first method of designing a printed wiring board according to the present invention.

FIG. 15 is a diagram for explaining a method of extracting a contour line of a solid pattern in STEP 13 of FIG. 2;

FIG. 16 is a flowchart illustrating a second method of designing a printed wiring board according to the third embodiment of the present invention.

FIG. 17 is a diagram illustrating a clearance octagon, division of a rectangular area, and a hollow octagon in STEPS 21 to 24 in FIG. 16;

FIG. 18 is a plan view for explaining a conventional method for producing a solid pattern on a printed wiring board.

[Explanation of symbols]

 1,200 Component mounting pad 2,15,15a Solid pattern generation prohibited area 3 Distance 5 Grid point 6 Rectangular area b 7 Rectangular area a 8 Rectangular c 8a Rectangular c 9 with deletion history 9 Existing prohibited area 10 Area A 11 area B 12 Area C 13, 13a Hollow figure 14 Parts land 15a Clearance octagon 16, 202 Wiring pattern 17 Wiring pattern with the same net name 18 Solid flag setting area 19 Solid flag set area 20 Solid rectangle d 21 Filling Triangle 22 Current rectangle 23 Current point 24 Effective side (top) 25 Effective side (left) 26 Next current point 27 Outline contour 100 Computer 101 Operation input means 102 Interval value designation recording means 103 Net name recording means 104 Solid pattern calculation means 110 display means 120憶 means 130 output section 201 parts through hole 203 the via hole 204 the copper foil portion 204a clearance design after the copper foil 205 through hole for ground connection

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hideo Shinzaki 5-7-1 Shiba, Minato-ku, Tokyo Inside NEC Corporation (72) Inventor Hideo Kikuchi 5-7-1 Shiba, Minato-ku, Tokyo NEC Corporation F term (reference) 5B046 AA08 BA04 HA04 HA07

Claims (14)

[Claims] A storage means for inputting / outputting design data of a wiring pattern of a printed wiring board; an input / output unit for inputting an operation command; a display means; and an input screen for receiving an operation command from an operator. And operation input means for storing data received from an operator, storing interval value data between the wiring patterns specified by the operator, and forming a conductor solid pattern forming area and a component mounting pad specified by the operator. Interval value designation recording means for recording an interval value required during the operation, net name recording means for recording a net name of the solid pattern specified and created by an operator, and an area of the component mounting pad and its surroundings Creating a solid pattern forbidden area, avoiding the prohibited area, and creating the solid pattern from the wiring pattern at a required interval defined by a design standard. And a computer which operates under the control of a program written on a recording medium, the computer comprising: 2. The printed wiring board design system according to claim 1, further comprising: said solid pattern calculating means for performing an area dividing process of said solid pattern forming area specified by an operator. Design system. 3. The design system according to claim 1, wherein
A line connecting the grid points of the basic grid defined by the design reference data, wherein the solid pattern calculation means avoids the prohibited area and creates a boundary line of the solid pattern area created from the wiring pattern at a required interval defined by a design standard. A printed circuit board design system, which is a solid pattern calculation means for calculating a solid pattern area. 4. The printed wiring board design system according to claim 1, wherein said solid pattern calculating means has means for storing a minimum occurrence size of the solid pattern, and said first solid pattern calculation means has a dimension equal to or greater than said minimum occurrence size. A means for calculating the solid pattern area of the above, and a means for expanding the first solid pattern area to a solid pattern area including the first solid pattern area. . 5. A method for designing a printed wiring board by a computer, comprising: a first step of reading wiring pattern data, design reference data; A second step of receiving and representing the data to be represented and the net name of the solid pattern, and a third step of calculating the solid pattern creation prohibited area data for each component mounting pad data and each component mounting hole of the wiring pattern data; The solid pattern area existing outside the solid pattern creation prohibited area and the wiring pattern is defined as a solid pattern area which is a line connecting grid points of a basic lattice defined by design reference data with a boundary of the solid pattern area. And a fourth step of calculating. A method of designing a printed wiring board, comprising: 6. The printed wiring according to claim 5, wherein the second step includes a step of performing an area dividing process on an area in which the designated area can be processed at one time with a previously recorded dimension. Board design method. 7. The component mounting pad data and a necessary interval between the component mounting hole and the solid pattern are recorded in the first step or the second step, and the component mounting pad data is recorded in the third step. A step of creating, for each of the pad data and the component mounting hole data, the solid pattern creation prohibited area data representing an area having a size obtained by adding the required interval to the size of the pad. 5. The method for designing a printed wiring board according to 5. 8. The method according to claim 1, wherein the first step or the second step includes:
Recording a minimum generation size of the solid pattern, the fourth step of calculating a first solid pattern area having a dimension equal to or greater than the minimum generation size; and setting the first solid pattern area to the first solid pattern area. 6. The method for designing a printed wiring board according to claim 5, further comprising the step of enlarging to a solid pattern area including the solid pattern area. 9. The third step includes, for each of the component mounting pad and the component mounting hole data and the wiring pattern, an area having a size obtained by adding a necessary interval to the solid pattern to the size thereof. Having a step of calculating the solid pattern creation prohibited area in which the vertices of the area are grid points,
The fourth step is a step of calculating a shape of a region (referred to as a grid region) having vertices at lattice points in a region included in the solid pattern forming region, and forming the solid pattern in the solid pattern forming region. 6. The method according to claim 5, further comprising a step of calculating a hollow figure having a shape hollowed out in the prohibited area, and a step of setting the hollow figure as a solid pattern area.
The printed wiring board design method described. 10. A recording medium in which a computer records a program of a method for designing a printed wiring board, wherein the computer performs a first process of reading data of a wiring pattern and design reference data; A second process of receiving and recording data representing a solid pattern creation area and a net name of the solid pattern by inputting; solid pattern creation prohibited area data for each of the component mounting pad data and component mounting holes of the wiring pattern data; And connecting the solid pattern creation prohibition region and the solid pattern region existing outside the wiring pattern to the grid points of the basic lattice defined by the design reference data with the boundary line of the solid pattern region. And a fourth process for calculating a solid pattern area as a line. A computer-readable recording medium, characterized by recording the following. 11. The second processing of the program,
11. The computer-readable recording medium according to claim 10, further comprising a process of performing an area division process on an area in which the designated area can be processed at one time with a previously recorded dimension. 12. The first process or the second process of the program records component mounting pad data and a necessary interval between a component mounting hole and the solid pattern, and the third process includes a component mounting pad For each data and component mounting hole data, a process of creating the solid pattern creation prohibited area data representing an area of a size obtained by adding the required interval to the size of the pad.
A computer-readable recording medium according to claim 10. 13. The program according to claim 1, wherein the first processing or the second processing of the program records a minimum generation size of the solid pattern, and the fourth processing executes a first solid processing having a dimension equal to or larger than the minimum generation size. A process of calculating a pattern area;
11. The computer-readable recording medium according to claim 10, further comprising a process of enlarging the first solid pattern area to a solid pattern area including the first solid pattern area. 14. The program according to claim 3, wherein the third processing is
For each of the component mounting pad and component mounting hole data and the wiring pattern, the area of the size obtained by adding the required interval to the solid pattern is included, and the solid pattern creation prohibited area where the apex of the area is a grid point is calculated. The fourth processing includes calculating a shape of a region (referred to as a grid region) having vertices at grid points in a region included in the solid pattern creation region; 2. The method according to claim 1, further comprising: processing of calculating a hollow figure having a shape obtained by hollowing an area in the solid pattern creation prohibited area; and processing of setting the hollow figure as a solid pattern area.
0. A computer-readable recording medium according to item 0.