JP2001158061A5 - - Google Patents
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- JP2001158061A5 JP2001158061A5 JP1999345916A JP34591699A JP2001158061A5 JP 2001158061 A5 JP2001158061 A5 JP 2001158061A5 JP 1999345916 A JP1999345916 A JP 1999345916A JP 34591699 A JP34591699 A JP 34591699A JP 2001158061 A5 JP2001158061 A5 JP 2001158061A5
- Authority
- JP
- Japan
- Prior art keywords
- dianhydride
- metal foil
- bis
- dicarboxyphenyl
- polyimide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011888 foil Substances 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 229920001721 Polyimide Polymers 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 7
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 3
- 125000006159 dianhydride group Chemical group 0.000 description 3
- VDFVNEFVBPFDSB-UHFFFAOYSA-N 1,3-dioxane Chemical compound C1COCOC1 VDFVNEFVBPFDSB-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N DMA Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N O-Cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N P-Cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N n-methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral Effects 0.000 description 2
- -1 ptyrrolactam Chemical compound 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- CYSGHNMQYZDMIA-UHFFFAOYSA-N 1,3-Dimethyl-2-imidazolidinone Chemical compound CN1CCN(C)C1=O CYSGHNMQYZDMIA-UHFFFAOYSA-N 0.000 description 1
- ZWXPDGCFMMFNRW-UHFFFAOYSA-N 1-methylazepan-2-one Chemical compound CN1CCCCCC1=O ZWXPDGCFMMFNRW-UHFFFAOYSA-N 0.000 description 1
- DZLUPKIRNOCKJB-UHFFFAOYSA-N 2-methoxy-N,N-dimethylacetamide Chemical compound COCC(=O)N(C)C DZLUPKIRNOCKJB-UHFFFAOYSA-N 0.000 description 1
- GWHLJVMSZRKEAQ-UHFFFAOYSA-N 3-(2,3-dicarboxyphenyl)phthalic acid Chemical compound OC(=O)C1=CC=CC(C=2C(=C(C(O)=O)C=CC=2)C(O)=O)=C1C(O)=O GWHLJVMSZRKEAQ-UHFFFAOYSA-N 0.000 description 1
- LFBALUPVVFCEPA-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C(C(O)=O)=C1 LFBALUPVVFCEPA-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- RDOXTESZEPMUJZ-UHFFFAOYSA-N Anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N Diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- GBASTSRAHRGUAB-UHFFFAOYSA-N Ethylenetetracarboxylic dianhydride Chemical compound O=C1OC(=O)C2=C1C(=O)OC2=O GBASTSRAHRGUAB-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K Iron(III) chloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- RLSSMJSEOOYNOY-UHFFFAOYSA-N M-Cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 1
- HHVIBTZHLRERCL-UHFFFAOYSA-N Methylsulfonylmethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 1
- YTVNOVQHSGMMOV-UHFFFAOYSA-N Naphthalenetetracarboxylic dianhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=C2C(=O)OC(=O)C1=C32 YTVNOVQHSGMMOV-UHFFFAOYSA-N 0.000 description 1
- CLYVDMAATCIVBF-UHFFFAOYSA-N Pigment Red 224 Chemical compound C=12C3=CC=C(C(OC4=O)=O)C2=C4C=CC=1C1=CC=C2C(=O)OC(=O)C4=CC=C3C1=C42 CLYVDMAATCIVBF-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N Triethylene glycol dimethyl ether Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 1
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 1
- OBKARQMATMRWQZ-UHFFFAOYSA-N naphthalene-1,2,5,6-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 OBKARQMATMRWQZ-UHFFFAOYSA-N 0.000 description 1
- DOBFTMLCEYUAQC-UHFFFAOYSA-N naphthalene-2,3,6,7-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C=C2C=C(C(O)=O)C(C(=O)O)=CC2=C1 DOBFTMLCEYUAQC-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 description 1
Description
テトラカルボン酸二無水物としては、例えば、エチレンテトラカルボン酸二無水物、ブタンテトラカルボン酸二無水物、シクロペンタンカルボン酸二無水物、ピロメリット酸二無水物、2,2’,3,3’−ベンゾフェノンテトラカルボン酸二無水物、3,3’,4,4’−ベンゾフェノンテトラカルボン酸二無水物、2,2’,3,3’−ビフェニルテトラカルボン酸二無水物、3,3’,4,4’−ビフェニルテトラカルボン酸二無水物、2,2−ビス(3,4−ジカルボキシフェニル)プロパン二無水物、ビス(3,4−ジカルボキシフェニル)エーテル二無水物、ビス(2,3−ジカルボキシフェニル)エーテル二無水物、ビス(3,4−ジカルボキシフェニルスルホン)二無水物、ビス(2,3−ジカルボキシフェニル)スルホン二無水物、1,1−ビス(2,3−ジカルボキシフェニル)メタン二無水物、ビス(3,4−ジカルボキシフェニル)メタン二無水物、4,4’−(p−フェニレンジオキシ)ジフタル酸二無水物、4,4’−(m−フェニレンジオキシ)ジフタル酸二無水物、2,3,6,7−ナフタレンテトラカルボン酸二無水物、1,4,5,8−ナフタレンテトラカルボン酸二無水物、1,2,5,6,−ナフタレンテトラカルボン酸二無水物、1,2,3,4−ベンゼンテトラカルボン酸二無水物、3,4,9,10−ペリレンテトラカルボン酸二無水物、2,3,6,7−アントラセンテトラカルボン酸二無水物、1,2,7,8−フェナントレンテトラカルボン酸二無水物等が挙げられる。 Examples of the tetracarboxylic dianhydride include ethylene tetracarboxylic dianhydride, butanetetracarboxylic dianhydride, cyclopentanecarboxylic dianhydride, pyromellitic dianhydride, 2,2 ′, 3,3 '-Benzophenonetetracarboxylic dianhydride, 3,3', 4,4'-benzophenonetetracarboxylic dianhydride, 2,2 ', 3,3'-biphenyltetracarboxylic dianhydride, 3,3' , 4,4'-biphenyltetracarboxylic dianhydride, 2,2-bis (3,4-dicarboxyphenyl) propane dianhydride, bis (3,4-dicarboxyphenyl) ether dianhydride, bis ( 2,3-dicarboxyphenyl) ether dianhydride, bis (3,4-dicarboxyphenyl sulfone) dianhydride, bis (2,3-dicarboxyphenyl) sulfone dianhydride, 1,1-bis (2,3-dicarboxyphenyl) methane dianhydride, bis (3,4-dicarboxyphenyl) methane dianhydride, 4,4 ′-(p-phenylenedioxy) diphthalic dianhydride 4,4 ′-(m-phenylenedioxy) diphthalic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 1,4,5,8-naphthalenetetracarboxylic dianhydride 1,2,5,6-naphthalenetetracarboxylic dianhydride, 1,2,3,4-benzenetetracarboxylic dianhydride, 3,4,9,10-perylenetetracarboxylic dianhydride, 2,3,6,7-anthracene tetracarboxylic dianhydride, 1,2,7,8-phenanthrene tetracarboxylic dianhydride, and the like may include et is Ru.
上記ポリイミド溶液、又はその前駆体であるポリアミド酸溶液の濃度は、通常、塗布性等を考慮して、5〜25重量%程度のものが用いられる。有機溶媒としては、N−メチル−2−ピロリドン、N,N−ジメチルアセトアミド、N,N−ジメチルホルムアミド、1,3−ジメチル−2−イミダゾリジノン、N,N−ジメチルメトキシアセトアミド、ジメチルスルホキシド、ピリジン、ジメチルスルホン、ヘキサメチルスルホルアミド、テトラメチル尿素、N−メチルカプロラクタム、プチロラクタム、テトラヒドロフラン、m−ジオキサン、p−ジオキサン、1,2−ジメトキシエタン、ビス(2−メトキシエチル)エーテル、1,2−ビス(2−メトキシエトキシ)エタン、ビス2−(2−メトキシエトキシ)エチルエーテル、1,3−ジオキサン、1,4−ジオキサン、o−クレゾール、m−クレゾール、p−クレゾール、クレゾール酸,p−クロロフェノール、アニソール等を含む溶剤が挙げられる。好ましくは、N−メチル−2−ピロリドン、N,N−ジメチルアセトアミド、N,N−ジメチルホルムアミドが挙げられる。 The concentration of the polyimide solution or the polyamic acid solution as a precursor thereof is usually about 5 to 25% by weight in consideration of coatability and the like. Examples of the organic solvent include N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, 1,3-dimethyl-2-imidazolidinone, N, N-dimethylmethoxyacetamide, dimethylsulfoxide, Pyridine, dimethyl sulfone, hexamethylsulfonamide, tetramethylurea, N-methylcaprolactam, ptyrrolactam, tetrahydrofuran, m-dioxane, p-dioxane, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, 1, 2-bis (2-methoxyethoxy) ethane, bis 2- (2-methoxyethoxy) ethyl ether, 1,3-dioxane, 1,4-dioxane, o-cresol, m-cresol, p-cresol, cresylic acid, p-chlorophenol, anisole, etc. Solvent-free is Ru and the like. Preferably, N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide are exemplified.
本発明では、塗工工程における金属箔の走行速度に対するコートロールの周速度の比が115〜200%に制御する。該速度比が115%未満では均一な塗工ができなくなり、ポリイミド層の厚みばらつきが発生する。また、200%を超えても塗工ムラ、ポリイミド層の厚みムラが発生する。通常、塗工工程における金属箔の走行速度は0.5〜5m/分程度、また、コートロールの周速度は0.6〜10m/分程度である。 In the present invention, the ratio of the peripheral speed of the coat roll to the running speed of the metal foil in the coating step is controlled to be 115 to 200%. If the speed ratio is less than 115%, uniform coating cannot be performed, and the thickness variation of the polyimide layer occurs. Also, uneven coating, uneven thickness of the polyimide layer to generate 200% super forte. Usually, the traveling speed of the metal foil in the coating step is about 0.5 to 5 m / min, and the peripheral speed of the coat roll is about 0.6 to 10 m / min.
(1)金属箔の弛み(mm)
〔図3〕は金属箔の弛みの測定方法の概要を示す模式図である。〔図3〕に示す如く、幅が684mmである金属箔5を繰り出し軸9から、前ガイドロール10と後ガイドロール11の上を通過させる。この時、2本のガイドロール10及び11間を走行する金属箔5を水平に保つ。金属箔5がガイドロール10及び11に接触する点間の距離は1000mmとする。後ガイドロール11を通過した金属箔に5kgの重り12を負荷させ、繰り出し軸9にロックし、重り12が地面に接触しないようにする。金属箔5がガイドロール10及び11に接触する箇所の中央位置(一方の接触点から500mmの位置)の部分から金属箔の端面を基準とし、レーザー変位計(キーエンス(株)製、形式:LB−1000)13を用いて全幅についてその変位を測定する。
(2)均一塗布性
FMCL試料を縦横100mmの正方形に切り取り、塩化第二鉄水溶液(40重量%)を用いて金属箔層に化学エッチング処理を施し、ポリイミド層のみとする。ポリイミド層を透過光で観察して、直径10μm以上の穴の有無を観察する。
(3)ポリイミド層の厚みムラ(μm)
前項と同様にしてポリイミド層のみを得る。接触式膜厚計(Heidenhain(株)製、形式:200068G)を用いて、横方向に任意に10点厚みを測定し、その最大値と最低値の差を厚みムラとする。
(1) Looseness of metal foil (mm)
FIG. 3 is a schematic diagram showing an outline of a method for measuring the slack of a metal foil. As shown in FIG. 3, a metal foil 5 having a width of 684 mm is passed from a payout shaft 9 over a front guide roll 10 and a rear guide roll 11 . At this time, the metal foil 5 traveling between the two guide rolls 10 and 11 is kept horizontal. The distance between the points where the metal foil 5 contacts the guide rolls 10 and 11 is 1000 mm. A metal foil which has passed through the rear guide roll 11 to load the weight 12 of 5 kg, to lock the unwinding shaft 9, the weight 12 does not contact the ground. A laser displacement meter (manufactured by KEYENCE CORPORATION, type: LB) from the center position of the place where the metal foil 5 comes into contact with the guide rolls 10 and 11 (500 mm from one contact point) with reference to the end face of the metal foil. The displacement is measured for the entire width using (−1000) 13.
(2) Uniform applicability An FMCL sample is cut into a square of 100 mm in length and width, and a metal foil layer is subjected to a chemical etching treatment using an aqueous ferric chloride solution (40% by weight) to obtain only a polyimide layer. The polyimide layer is observed with transmitted light, and the presence or absence of a hole having a diameter of 10 μm or more is observed.
(3) Thickness unevenness of polyimide layer (μm)
Only the polyimide layer is obtained in the same manner as in the previous section. Using a contact-type film thickness meter (Heidenhain Co., Ltd., model: 200068G), the thickness at 10 points is arbitrarily measured in the horizontal direction, and the difference between the maximum value and the minimum value is defined as the thickness unevenness.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34591699A JP4311836B2 (en) | 1999-12-06 | 1999-12-06 | Method for producing polyimide metal foil laminate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP34591699A JP4311836B2 (en) | 1999-12-06 | 1999-12-06 | Method for producing polyimide metal foil laminate |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2001158061A JP2001158061A (en) | 2001-06-12 |
JP2001158061A5 true JP2001158061A5 (en) | 2006-09-28 |
JP4311836B2 JP4311836B2 (en) | 2009-08-12 |
Family
ID=18379877
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP34591699A Expired - Fee Related JP4311836B2 (en) | 1999-12-06 | 1999-12-06 | Method for producing polyimide metal foil laminate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4311836B2 (en) |
-
1999
- 1999-12-06 JP JP34591699A patent/JP4311836B2/en not_active Expired - Fee Related
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