JP2001131411A - Resin composition, molded product and electronic part for surface mounting using these - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polyimide resin composition having an excellent heat resistance which may serve as an electronic part for surface mounting and an electronic part using this. SOLUTION: A resin composition contains a high-melting crystalline polyimide and a polyester having a lower melting point than this or an amorphous polyester. Here, at least at the melt state, the high-melting crystalline polyimide is compatibilized with the polyester, and when they are cooled down, the high- melting crystalline polyimide crystallizes prior to the polyester and therefore generates heat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin composition obtained by blending a specific relationship between polyimide and polyester. More specifically, the present invention relates to a polyimide-based resin composition having excellent heat resistance that can be used for a surface-mounted electronic component, and an electronic component using the same.

[0002]

2. Description of the Related Art In the field of electronic components, with the recent trend toward miniaturization and high performance of electric appliances and to improve productivity, as a method of mounting various electronic components on a substrate, the mounting density of components is high and the efficiency is high. Good surface mount technology (SMT) is spreading.

In response to the surface mounting method using this surface mounting technology, as electronic components have become smaller and thinner, resin materials have also been required to have improved mechanical strength and fluidity during molding. It became so.

Furthermore, in the surface mounting method, the electronic component material such as a connector is heated from the upper and lower parts by a soldering method by heating in a reflow furnace, so that the temperature is more severe than in the conventional mounting method. You will be exposed to the conditions.

As a result, resin materials for electronic parts are required to have further improved heat resistance. For example, polyamide resins such as nylon 6 resin and nylon 66 resin, and semi-aromatic polyesters such as polyethylene terephthalate and polybutylene terephthalate are required. Conventional materials such as resin have insufficient heat resistance.

Therefore, application of polyphenylene sulfide resin, aromatic polyamide resin and the like as a resin material for the electronic component for surface mounting has been studied. These resins are excellent in heat resistance, but have the above-mentioned mechanical properties and fluidity. Due to such disadvantages, there are great restrictions on industrial use.

On the other hand, attempts have been made to improve heat resistance by using a plurality of resin blends. However, general blended resins are incompatible and have an inhomogeneous structure, resulting in extremely poor mechanical properties, and subtle changes in molding conditions leading to variations in physical properties, making them unsuitable for production. There is a point. On the other hand, for example, alloys of polyesters have been actually studied as a practical method for solving problems such as dispersion of physical properties such as incompatibility. However, in the case of polyester alloys, copolymerization occurs due to transesterification, or the crystallization rate is reduced, and the crystallinity is reduced, so that sufficient heat resistance and strength as a molding resin cannot be exhibited. Was. Also,
Polymer Juornal Vol. 30, pp780-789 contains Polybutylene
succinate and Poly (vinylidene chloride- vinyl chlori
It has been reported that, in a compatible blend using a combination of the crystalline polymers of (de), the polymer crystals of each component precipitate almost without lowering the melting point and take a dense structure in which they are engaged. Then, improvement in thermophysical properties and mechanical properties can be expected. However, this is a structure generated by crystallization by annealing from a low temperature, and is not realized by the mold molding technique. In addition, PE
Combinations of EK and polyetherimide are known, but have the drawback of having very high viscosity and low crystallinity. Blends of polyester and polyetherimide are also known, but also have the problem that crystallinity is significantly impaired. In addition to these, as a compatible blend of a crystalline polymer, a blend of a polymer that forms hydrogen bonds with polyvinylphenol (for example,
Polyvinyl phenol and polyhydroxybutyrate, nylon, PVA, etc.), a blend of polyvinyl phenol and a polar polymer (for example, PVDF polymer), a blend of PVDF and polybutylene adipate, a blend of PVA and chitin, etc. are known, In common, these have a problem that the melting point of the compatible blend is reduced because crystallization is suppressed.

[0008] It is an important requirement that a blended resin that can be produced industrially is compatible. However, few crystalline resin blends that can be used for heat resistance have compatibility and are compatible with each other. Even in such cases, there has not been found any one which has sufficient crystallinity and can be used as a molding resin.

As described above, at present, there is almost no resin material that can be used as a base material for a surface-mountable electronic component having excellent moldability, mechanical properties, flow properties, and heat resistance. It has been demanded.

[0010]

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition having excellent heat resistance and excellent moldability by blending a high crystalline resin having a high melting point with a resin having a low melting point. To provide. A further object of the present invention is to
A resin composition obtained by blending a crystalline semi-aromatic polyimide and a semi-aromatic polyester, and a mixture of the blended resin composition and a fibrous filler, having excellent mechanical properties, flow properties, and heat resistance. It is to provide a resin composition. A further object of the present invention is to provide a surface-mountable electronic component using the resin composition, and to provide another molded article obtained by molding the resin composition.

[0011]

That is, the present invention is as follows. 1. A compatible resin composition comprising a high-melting crystalline polyimide and a lower-melting or amorphous polyester, wherein the high-melting crystalline polyimide crystallizes preferentially to the polyester during cooling. A resin composition characterized by being observed. 2. A molded article using the above resin composition. 3. A surface-mountable electronic component using the above resin composition.

Here, preferential crystallization during cooling is performed by using a differential scanning calorimeter, and the crystallization exothermic peak of the high melting crystalline polyimide is observed at a high temperature independently or independently of the crystallization peak of the polyester. It can be determined from things. Also, this crystallization peak was measured by a differential scanning calorimeter (Perk
Using inElmar DSC-7), the exothermic peak of the exothermic peak observed when melted at a temperature higher than the melting point (of the high melting point crystalline polyimide) by 10 ° C. or more for 2 minutes and then cooled at a rate of 20 ° C./min. Refers to peak temperature.

The components constituting the resin composition used in the present invention must satisfy the following requirements. That is, the first component is a polyimide that crystallizes and has a melting point. When the second component has a melting point, the melting point of the first component is higher than the melting point. The first component and the second component must be compatible at least in a molten state to form a uniform state. When the cooling crystallization temperature of the resin composition is measured, at least an exothermic peak due to crystallization of the first component is observed,
This is a higher temperature than that of the second component.

Here, being crystalline is determined by having a clear endothermic peak accompanying melting in a calorimetric measurement with a differential scanning calorimeter. In addition, the compatibility of the resin, the clouding phenomenon due to the difference in the refractive index during melting is not observed,
When the molten state is observed under a microscope, it can be confirmed by forming a single-phase and uniform melt. In order to form such a compatible state, a compatibilizer may be used, or the resins may be simply blended.

As a method for blending the resins, any mixing method can be used. Without limitation,
The resins may be blended with each other by using a ruder, or a method of dissolving the resins in a solution and mixing them may be used. It is also possible to adopt a method in which one resin is uniformly dissolved or melted, the other resin monomer is added, and the other monomer is polymerized.

The high melting point crystalline polyimide used in the present invention is preferably one which has a high crystallization speed and a high degree of crystallization. Until now, there has been no known example in which such a highly crystalline polymer is compatible with other polymers even in a molten state. Find that it can satisfy
The present invention has been completed.

The polyimide used in the present invention corresponds to the first component in the resin composition, and has the following formula (1)

[0018]

Embedded image

A pyromellitic imide structure represented by the formula (n:
It is a crystalline, semi-aliphatic polyimide having, as a main component, (an integer of 7 or more and 16 or less). Specifically, heptane diamine, octane diamine, nonane diamine, decane diamine, undecane diamine, dodecane diamine, tridecane diamine, tetradecane diamine, pentadecane diamine, hexadecane diamine as the main diamine component, and pyromellitic acid as the main tetracarboxylic acid component Polyimide. Here, "semi-aliphatic" means that all or a part of the diamine component and / or a part of the tetracarboxylic acid component are aliphatic.

The polyimide may contain a plurality of copolymer components. The copolymer components may be contained as a diamine component or as a tetracarboxylic acid component, or may be mixed as both. It is also possible. Although not limited to this, in addition to the main diamine component, for example, as a diamine component to be copolymerized, ethylene diamine, propylene diamine, butane diamine, pentane diamine, hexane diamine, heptane diamine, octane diamine, nonane diamine, decane diamine, Undecanediamine, dodecanediamine,
Alkylenediamines such as tetramethylhexanediamine, 1,12- (4,9-dioxa) dodecanediamine, 1,8- (3,6-dioxa) octanediamine,
Examples thereof include aliphatic diaminoethers such as Jeffamine, and diamines containing alicyclic hydrocarbons such as cyclohexanediamine and isophoronediamine.

As the tetracarboxylic acid component to be copolymerized, a tetracarboxylic acid component such as an aromatic tetracarboxylic acid and an aliphatic tetracarboxylic acid can be used.
For example, benzophenonetetracarboxylic acid, biphenyltetracarboxylic acid, bis (dicarboxyphenyl) propane, 4,4 '-[2,2,2-trifluoromethyl)
Ethylidene] bis (1,2-benzenedicarboxylic acid),
Bis (dicarboxyphenyl) sulfone, bis (dicarboxyphenyl) ether, thiophenetetracarboxylic acid, naphthalenetetracarboxylic acid, 1,2,3,4-butanetetracarboxylic acid, cyclopentanetetracarboxylic acid, 5 (2,5 -Dioxotetrahydrofuryl) tetracarboxylic acid component derived from 3-methyl-3-cyclohexene-1,2-dicarboxylic acid and the like.

Although the copolymerization ratio is not particularly specified, it is preferable to use it in a ratio of less than 50 mol% with respect to the main diamine component and / or tetracarboxylic acid component. However, when the melting point of the obtained polyimide is lower than 250 ° C., the resin composition cannot be used for surface mounting applications. Therefore, it is preferable to carry out copolymerization with a component containing more main imide components.

The polyimide used in the present invention is melt polymerization,
Although any one produced by any method such as solution polymerization, solid phase polymerization, and interfacial polymerization can be used, for example, as a general method, (1) tetracarboxylic dianhydride and diamine in a solvent A method of chemically ring-closing a polyamic acid produced by reacting with acetic anhydride and pyridine,
(2) a method of thermally dehydrating and cyclizing the polyamic acid,
(3) A method of heating and dehydrating and polymerizing a tetracarboxylic dianhydride and a diisocyanate, and (4) a method of reacting a dicarboxylic or tetraester of a tetracarboxylic acid with a diamine to remove alcohol by cyclization.

The high-melting crystalline polyimide of the present invention may have its terminal blocked. Examples of the terminal blocking agent include phthalic acid derivatives, monoamine derivatives, alcohols and the like. Can be used accordingly.

The polyester used in the present invention includes:
As long as the melting point is lower or amorphous than the high melting point crystalline polyimide, either a wholly aromatic or semi-aromatic polyester can be used, but the following formula (2) is preferred.

[0026]

Embedded image

The semi-aromatic polyester represented by the following formula, and more preferably, a semi-aromatic polyester in which the main component of the structural unit is ethylene terephthalate is preferred in terms of heat resistance and cost of the resin composition according to the present invention. Is particularly preferred. The polyester may be a single polyester or a mixture of a plurality of polyesters. In the present specification, “semi-aromatic” means that an aliphatic diol is contained as a diol component.

The polyester used in the present invention is, for example, one composed of the following acid component and diol component. However, it is not limited to this.

That is, as an acid component, aromatic dicarboxylic acids such as isophthalic acid, naphthalenedicarboxylic acid, diphenoxyethanecarboxylic acid, diphenyletherdicarboxylic acid, diphenylsulfonedicarboxylic acid, etc .; and hexahydroterephthalic acid, hexahydroisophthalic acid, etc. Such as aliphatic cyclic dicarboxylic acids, adipic acid,
Examples include aliphatic dicarboxylic acids such as sebacic acid and azelaic acid, and difunctional carboxylic acids such as oxy acids such as p-β-hydroxyethoxybenzoic acid and ε-oxybenzoic acid. Examples of the diol component include trimethylene glycol, tetramethylene glycol, hexamethylene glycol, decamethylene glycol, neopentyl glycol, diethylene glycol, 1,1
-Cyclohexanedimethanol, 1,4-cyclohexanedimethanol, 2,2-bis (4'-β-hydroxyphenyl) propane, bis (4'-β-hydroxyethoxyphenyl) sulfonic acid, bisphenol A,
4-dihydroxybenzene and the like.

The resin composition according to the present invention can be produced by blending a polyimide and a polyester.

In order to enhance the heat resistance of the resin composition according to the present invention, it is necessary that the resin composition is uniform in a mixed state.
Polyester: polyimide 95: 5 to 0.0 by weight
It is preferably in the range of 1: 99.99. Since the plastic effect of the polyester improves the crystallinity of the polyimide component, the addition of a small amount is effective for improving the heat resistance.However, when the proportion of the polyester is too large, the effect of diluting the polyimide exceeds the plastic effect. Works to reduce heat resistance. The limit of the heat resistance also depends on the combination of polyester and polyimide. However, when the polyester is excessive and the polyimide crystals have no bonding point, it is difficult to exceed the heat resistance of polyester. Therefore, it is not preferable to add the polyester in an amount exceeding 95% by weight, and it is preferable not to add the polyester in an amount exceeding 70% by weight in order to obtain sufficient solder heat resistance.

In the present invention, a polyimide having a high melting point and high crystallinity is used, and the high melting point crystal forms a network to impart high heat resistance in order to improve the flow start temperature of the resin composition according to the present invention. You can do it. Therefore, in order to enhance heat resistance, it is essential that a high melting point polyimide crystal is formed and grows at a high temperature faster than a low melting point polyester. Therefore, in this blend resin, the crystallization temperature of the polyimide upon cooling is higher than that of the polyester used in the blend, and must be preferentially crystallized. Therefore, the resin composition of the present invention always generates heat due to crystallization of polyimide upon cooling, and gives a strong X-ray diffraction image based on the crystal of polyimide. Here, the heat generation and the temperature based on the crystallization during cooling are defined as a difference scanning calorimeter, where the polyimide is melted at a temperature 30 ° C. or more higher than the melting point of polyimide for 2 minutes and then cooled at a rate of 20 ° C./min. And the exothermic peak and peak temperature. Since the crystallization temperature of the polyimide is higher than that of the polyester, the crystallization of the polyimide occurs before the crystallization of the polyester. It is possible to make it.

In particular, semi-aromatic polyesters such as polyethylene terephthalate are compatible with the polyimide in a molten state, and have a previously unknown phase behavior in which the polyimide is rapidly crystallized preferentially upon cooling. Due to this phase behavior, when the resin composition according to the present invention is molded by a method such as injection molding, unlike the inhomogeneous structure containing coarse phase separation domains generally found in incompatible polymer blends, it is extremely small. A highly homogeneous polymer alloy in which fine crystals are uniformly dispersed can be obtained. This effect is exactly the same or even more pronounced when fillers and additives such as glass are added, and even in a composition using a semi-aromatic polyester substantially in a larger amount than polyimide, the melting point of the semi-aromatic polyester is reduced. Can be produced.

The molecular weight of the high melting point crystalline polyimide and polyester used in the present invention is not particularly limited.
The solution viscosity is preferably ηsp / C in the range of 0.3 to 15, and the solution viscosity of the resin composition obtained by blending these is preferably 0.3 to 3.0. For example, the solution composition has a resin viscosity of 10 ml in a solvent capable of dissolving a polymer, such as a mixed solvent in which tetrachloroethane and phenol are mixed at a volume ratio of 6: 4.
This is a value measured at 35 ° C. by dissolving 0 mg. If the resin composition is less than this range, sufficient mechanical strength cannot be obtained, and if it exceeds this range, the fluidity is significantly reduced and molding is difficult.

In the present invention, any method can be used for mixing to obtain the resin composition from the polymer components, fillers, additives, etc., for example, a method of mixing using a ruder, or a method in a melting pot. A method of melt-kneading or a method of dissolving or dispersing in a solvent or the like and mixing can be employed.

Various fibrous materials can be used as the fibrous filler to be used by mixing and adding to the composition of the present invention, irrespective of organic or inorganic materials.

As such a fibrous filler, glass fiber, metal fiber, aramid fiber, ceramic fiber,
Examples thereof include potassium titanate whiskers, carbon fibers, and asbestos. Particularly, it is preferable to use glass fiber because it is economically excellent and has excellent heat resistance.

The fibrous filler can be used in an appropriate amount for imparting heat resistance and strength. However, if the amount is too small, sufficient strength cannot be obtained, and if the amount is too large, moldability is reduced. 1% to 70% by weight based on the total composition
% Can be used.

The organic component of the present invention and the fibrous filler can be mixed by any method. For example, a method of mixing using a ruder, a method of melt-kneading in a melting pot, a method of dissolving or dissolving in a solvent or the like. Dispersion and mixing can be used.

The heat distortion temperature of the resin composition according to the present invention preferably exceeds 200 ° C. If the temperature is lower than this, it is difficult to use it suitably for heat-resistant applications. For example, an electronic component that considers solder reflow or the like can be particularly suitably used as long as its heat deformation temperature exceeds 250 ° C.

The resin composition according to the present invention can contain various additives which are not fibrous, if necessary. Talc, which is preferably used as an additive,
Various fillers such as calcium carbonate, mica, clay, titanium oxide, aluminum oxide, glass flakes, metal flakes, metal powders, and heat stabilizers or oxidation stabilizers represented by phosphates and phosphites, Examples include light stabilizers, ultraviolet absorbers, lubricants, pigments, flame retardants, flame retardant aids, plasticizers, and crystal nucleating agents.

The resin composition according to the present invention can be suitably used as various molded articles by utilizing its moldability. For example, it can be formed into a surface-mountable electronic component, a heat-resistant container, or the like, and used particularly preferably. Here, the electronic component for surface mounting refers to an electronic component that is soldered on a substrate by a surface mounting method. The surface mounting method is a method for mounting electronic components on a wiring board.
Printed on the printed circuit board compared to conventional insertion mounting, where the lead of the electronic component is passed through the through hole of the board and directly soldered (flow soldering or wave soldering) to the surface opposite to the surface on which the electronic component is mounted In this method, an electronic component is placed on the solder thus obtained, and the substrate is passed through a heating furnace called a reflow furnace to melt the solder and fix the electronic component. This surface mounting method can produce various advantages such as increasing mounting density, enabling mounting on both front and back surfaces, and reducing costs by improving efficiency.
With the trend toward higher functionality and lower prices, soldering is becoming the mainstream, and its application field is camera integrated V
TR, calculator, camera, clock, LCD TV, electronic game,
It has spread to consumer electronic devices such as personal computers and PC cards, industrial electronic devices such as minicomputers, office computers, workstations, peripheral devices, terminal devices, measuring devices, etc., and further to aerospace devices.

As a method of heating a substrate in a reflow furnace in surface mounting, a heat conduction method in which the substrate is placed on a heat-resistant belt moving on a heater and heated, and the boiling point is about 220 ° C.
VPS system utilizing latent heat during coagulation of fluorine-based liquid,
Hot air convection heat transfer method that passes the substrate through the place where hot air is forced to circulate, Far infrared method that heats the substrate from above or from both upper and lower surfaces with far infrared, and also uses heating with hot air and heating with far infrared There are various methods, such as a far-infrared ray method and a hot air convection heat transfer method, for reasons such as running costs. In these heating methods, unlike the conventional insertion mounting method, the components to be mounted are also heated to a temperature not lower than the solder melting temperature, which is a very severe condition for the resin material used for the electronic components.

Specific examples of these surface-mountable electronic components include various connectors, switches, relays, coil bobbins, volumes, sockets, plug boards, terminal blocks,
Sensors, resistors, transformers, main bodies such as ICs (integrated circuits), or mainly housings (cases, bodies, covers), frames, electrical insulators, slides (sliders), bases, wafers, lencams, spools, cards, and yokes And the like are typical examples. The present invention is directed to a resin electronic component mounted on a substrate by such a surface mounting method. Among them, connectors are called wire-to-wire (relay) connectors,
Any of wire-to-board connectors, board-to-board connectors, etc., may be used.
t Cable) / FPC (Flexible Pri)
connectors, SIMM sockets, ROM sockets, interface connectors, board-in connectors, jumper wire connectors, etc., in the form of straight type, right angle type, multi-harness type, and injection lever. Type, clip mounting type, bottom entry type, strain relief, etc., and the connection form may be any of stack connection, horizontal connection, and vertical connection.

The resin composition according to the present invention can be used as a heat-resistant container (molded article) by utilizing its excellent heat resistance. Examples of what is referred to as a heat-resistant container include, for example, various types of trays, food heating trays, towels, containers for heating and transporting towels, baskets, various tableware, ashtrays, and other heat-resistant containers. Although not limited thereto, it can be used for applications requiring heat resistance to hot water washing, steam sterilization, and the like.

The above-mentioned surface-mountable parts and containers can be obtained very easily from the resin composition according to the present invention by a molding method used for general thermoplastic resins, for example, injection molding. Examples will be described below.

[Measurement Method of Crystallization Temperature] The heat generated by crystallization during cooling was measured by using a differential scanning calorimeter (DSC-7) manufactured by Perkin Elmer and melted at a temperature higher than the melting point of polyimide by 30 ° C. or more for 2 minutes. Thereafter, it is determined based on the peak temperature of the exothermic peak observed when cooling at a rate of 20 ° C./min.

[0048]

EXAMPLES 2 mol of dodecanediamine was dissolved in a mixed solvent of 3 L of NMP and 500 ml of toluene, and 2 mol of pyromellitic anhydride was added thereto under a nitrogen stream, and the mixture was gradually heated from room temperature. At a temperature of 140 ° C. to 165 ° C., azeotropy between toluene and water generated by the reaction starts, and the reaction is completed in about 3 hours. The powdery polypyromellitimide (ηsp / C =
1.3) was obtained.

30 parts by weight of this polyimide and 70 parts by weight of polyethylene terephthalate were melt-mixed at 320 ° C. to obtain a blend resin. The crystallization temperature of the resin upon cooling was 266 ° C. The crystallization temperature is the temperature of the exothermic peak observed at the highest temperature when melted at 350 ° C for 2 minutes and cooled at 20 ° C / min using a PerkinElmer DSC measurement device (DSC-7). .

60 parts by weight of the crushed chip of the blended resin and 40 parts by weight of glass fiber (Glass Ron chopped strand made by Asahi Fiber Glass) are mixed and molded by an injection molding machine at a cylinder temperature of 280 to 320 ° C. and a mold temperature of 40 ° C. Then, a plate-shaped molded body of 120 mm × 12 mm × 3 mm was obtained.

The heat distortion temperature (18.5 kgf load) of this molded product measured according to JIS C2241 was 26.
4 ° C.

[0052]

According to the present invention, a polyimide resin composition which is inexpensive, has improved moldability, and is excellent in heat resistance without impairing the heat resistance as a surface mount electronic component, and a surface mount electronic component made of this resin composition. Obtainable.

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 4F071 AA45 AA46 AA56 AA60 AB03 AB12 AB20 AB28 AB30 AD01 AF45 AH12 BB05 BC07 4J002 CF04X CL063 CM04W DA016 DC006 DE186 DJ026 DL006 DM006 FA043 FA046 FA066 FD013 FD016 GQ00 PA12 PC146 QB15 QB25 QB26 QB31 QB58 RA35 SA06 SA11 SB01 SB02 TA14 TA22 TA33 TB01 TB02 UA031 UA041 UA042 UA122 UA132 UA262 UA622 UA761 UA762 UA781 UB011 UB022 UB122 UB131 UB152 UB282 Z08A07 Z08A08 ZB08A08B08A08A08B08A09B08A08B08A09A08

Claims (12)

[Claims] 1. A resin composition comprising a high-melting crystalline polyimide and a lower-melting or amorphous polyester, wherein the high-melting crystalline polyimide and the polyester are compatible at least in a molten state. A resin composition characterized in that, upon cooling, heat is generated due to crystallization of the high melting point crystalline polyimide in preference to the polyester. 2. The resin composition according to claim 1, wherein the crystalline polyimide having a high melting point is a crystalline semi-aromatic polyimide, and is obtained by blending it with a polyester. 3. The high melting crystalline polyimide according to the following formula (1): The resin composition according to claim 2, which is a polyimide containing a semi-aliphatic pyromellitic imide represented by the following formula (n is an integer from 7 to 16) as a main component. 4. The polyester according to the following formula (2): (Where Ar is an aromatic group which may have a substituent, and R is an aliphatic group which may have a substituent). The resin composition according to claim 1. 5. The blend ratio of the high melting point crystalline polyimide and the semi-aromatic polyester in a weight ratio of 99.99:
The resin composition according to claim 4, wherein the ratio is in the range of 0.01 to 5:95. 6. The semi-aromatic polyester according to claim 4, wherein the main component is polyethylene terephthalate.
Or the resin composition according to 5. 7. The resin composition according to claim 1, wherein a fibrous filler is mixed and added. 8. The resin composition according to claim 7, wherein the fibrous filler is contained in a range from 70% by weight to 1% by weight based on the whole resin composition. 9. The resin composition according to claim 7, wherein the fibrous filler is a glass fiber. 10. The resin composition according to claim 1, wherein the heat distortion temperature of the resin composition is 200 ° C. or higher. 11. A molded article using the resin composition according to any one of claims 1 to 10. 12. A surface-mountable electronic component using the resin composition according to claim 1. Description: