JP2001125055A - Manufacturing method for liquid crystal display element - Google Patents

Manufacturing method for liquid crystal display element

Info

Publication number
JP2001125055A
JP2001125055A JP30846599A JP30846599A JP2001125055A JP 2001125055 A JP2001125055 A JP 2001125055A JP 30846599 A JP30846599 A JP 30846599A JP 30846599 A JP30846599 A JP 30846599A JP 2001125055 A JP2001125055 A JP 2001125055A
Authority
JP
Japan
Prior art keywords
substrate
dummy substrate
dummy
mother
cell formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30846599A
Other languages
Japanese (ja)
Other versions
JP4338109B2 (en
Inventor
Masahide Shigemura
政秀 重村
Masahide Taniguchi
政秀 谷口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Display Corp
Original Assignee
Kyocera Display Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Display Corp filed Critical Kyocera Display Corp
Priority to JP30846599A priority Critical patent/JP4338109B2/en
Publication of JP2001125055A publication Critical patent/JP2001125055A/en
Application granted granted Critical
Publication of JP4338109B2 publication Critical patent/JP4338109B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To prevent generation of cracks on a surface hardened layer, to dispense with problems related to seal releasing and to efficiently lead terminal parts in the case a plastic substrate on which the surface hardened layer is formed is used for a transparent electrode substrate. SOLUTION: A first dummy substrate part 32 with a specified width is set between neighboring cell-forming regions 31 on a first mother substrate 30 side. A display part 31a and a terminal part 31b are formed on each of the cell-forming regions 31. Only a display part 41a is formed on each of cell- forming regions 41 on a second mother substrate 40 side and a second dummy substrate part 42 is set between respective neighboring cell-forming regions 41. Then, both of the mother substrates 30, 40 are pressed to stick together via a peripheral sealant 51 and a spacer sealant 52. Both of edges 32a, 32b of the first dummy substrate part 32, and an edge 42a of the second dummy substrate part 42 are fully cut respectively. The other edge 42b of the second dummy substrate part 42 is half cut and subsequently bending stress is applied to the cut groove part from the first dummy substrate part 32 side so as to divide the second dummy substrate part 42.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は液晶表示素子の製造
方法に関し、さらに詳しく言えば、透明電極基板として
表面硬化層を有するプラスチック基板を用いた表示素子
用セルの切断技術に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid crystal display device, and more particularly to a technique for cutting a cell for a display device using a plastic substrate having a hardened surface layer as a transparent electrode substrate.

【0002】[0002]

【従来の技術】液晶表示素子は、一方の面に透明電極が
形成された基板の一対をそれらの間に周辺シール材を介
在させて、その透明電極形成面同士を対向させて圧着し
た後、その基板間のセルギャップ内に液晶などの表示活
性物質を注入することにより構成される。
2. Description of the Related Art In a liquid crystal display device, a pair of substrates having a transparent electrode formed on one surface is pressure-bonded with a peripheral sealing material interposed therebetween, with the transparent electrode forming surfaces facing each other. It is constituted by injecting a display active substance such as a liquid crystal into a cell gap between the substrates.

【0003】ところで、液晶表示素子を実際に製造する
にあたっては、生産性を考慮していわゆるマザー基板
(マルチ基板)にて複数の表示素子用セルを一度に形成
した後、マザー基板をその表示素子用セルの列もしくは
行に沿って分割してスティック基板とし、各表示素子用
セル内に表示活性物質を注入した後、さらにそのスティ
ック基板から個々の液晶表示素子を切り出すようにして
いる。
When actually manufacturing a liquid crystal display element, a plurality of display element cells are formed at a time on a so-called mother substrate (multi-substrate) in consideration of productivity, and then the mother substrate is mounted on the display element. Each of the display cells is divided along a column or a row into a stick substrate. After a display active substance is injected into each display element cell, individual liquid crystal display elements are cut out from the stick substrate.

【0004】スティック基板から個々の液晶表示素子を
切り出す際に、いわゆる端子部出しが行なわれるが、ガ
ラス基板の場合、この端子部出しには次の2通りの方法
が知られている。第1の方法は、図3に示されているよ
うに、一方のマザー基板1側には、一つのセル形成領域
につき表示部1aおよび端子部1bを形成し、他方のマ
ザー基板2側には、一つのセル形成領域につき表示部2
aのみを形成し、両基板1,2を周辺シール材3を介し
て圧着する。そして、Aの部分を切断して個々の液晶表
示素子を切り出した後、Bの部分から端子部1bと対向
している他方の基板の基板部分(ダミー部分)2bを切
り落とす。
When individual liquid crystal display elements are cut out from the stick substrate, so-called terminal portions are provided. In the case of a glass substrate, the following two methods are known for the terminal portions. In the first method, as shown in FIG. 3, a display section 1a and a terminal section 1b are formed for one cell formation area on one mother substrate 1 side, and a display section 1a and a terminal section 1b are formed on the other mother substrate 2 side. Display unit 2 per cell formation area
a is formed, and both substrates 1 and 2 are pressure-bonded via the peripheral sealing material 3. Then, after cutting the portion A to cut out individual liquid crystal display elements, the substrate portion (dummy portion) 2b of the other substrate facing the terminal portion 1b is cut off from the portion B.

【0005】第2の方法は、図4に示されているよう
に、一方のマザー基板1に、表示部1aおよび端子部1
bを有する第1セル形成領域11と、表示部1aのみを
有する第2セル形成領域12とを交互に配置する。同様
に、他方のマザー基板2についても、表示部2aおよび
端子部2bを有する第1セル形成領域21と、表示部2
aのみを有する第2セル形成領域22とを交互に配置す
る。
In a second method, as shown in FIG. 4, a display section 1a and a terminal section 1 are provided on one mother substrate 1.
The first cell formation regions 11 having the “b” and the second cell formation regions 12 having only the display unit 1 a are alternately arranged. Similarly, for the other mother substrate 2, the first cell forming region 21 having the display unit 2 a and the terminal unit 2 b and the display unit 2
The second cell formation regions 22 having only a are alternately arranged.

【0006】そして、第1セル形成領域11と第2セル
形成領域22とが、また、第2セル形成領域12と第1
セル形成領域21とがそれぞれ対向するようにして、両
マザー基板1,2を周辺シール材3を介して圧着する。
この第2の方法によれば、端子部1bと端子部2bとが
対向するため、Cの部分とDの部分の2箇所を切断する
ことにより、液晶表示素子の切り出しと同時に端子部出
しを行なうことができる。また、捨て基板部が生じない
ため生産性もよい。
Then, the first cell formation region 11 and the second cell formation region 22 are connected to each other, and the second cell formation region 12 and the first cell formation region
The two mother substrates 1 and 2 are pressure-bonded via the peripheral sealing material 3 such that the cell formation regions 21 face each other.
According to the second method, since the terminal portion 1b and the terminal portion 2b face each other, by cutting two portions of the portion C and the portion D, the terminal portion is simultaneously cut out of the liquid crystal display element. be able to. In addition, productivity is good because no discarded substrate portion occurs.

【0007】[0007]

【発明が解決しようとする課題】基板がガラス基板の場
合には、同ガラス基板を切断テーブルに固定し、超硬ホ
イールカッターなどでケガキ線を引くことにより、比較
的簡単に切断もしくは分断することができるが、プラス
チック基板はガラス基板に比べて柔軟性があり、かつ、
簡単には割れにくいという性質上、上記した第1および
第2の方法のいずれでも端子部出しを行なうことは困難
である。
When the substrate is a glass substrate, the glass substrate is fixed on a cutting table and cut or cut relatively easily by drawing a marking line with a carbide wheel cutter or the like. However, plastic substrates are more flexible than glass substrates, and
Due to the property that it is not easily broken easily, it is difficult to make the terminal portion by any of the first and second methods.

【0008】すなわち、液晶表示素子用のプラスチック
基板には、例えば熱可塑性のポリエチレンテレフタレー
ト、ポリエーテルスルホン、ポリカーボネートや、熱硬
化性のアクリル系、エポキシ系樹脂などが用いられる
が、プラスチック基板には、耐薬品性向上のため、例え
ばアクリル系のハードコート層と、酸素などの透過を防
止するための有機もしくは無機材料による酸素バリアコ
ート層とからなる表面硬化層が形成されており、その上
に例えばITO(Indium Tin Oxide)
からなる透明電極が形成される。この種の表面硬化層は
プラスチック基板よりも硬く割れやすい。
That is, for example, thermoplastic polyethylene terephthalate, polyether sulfone, polycarbonate, thermosetting acrylic or epoxy resin is used for a plastic substrate for a liquid crystal display element. For the purpose of improving chemical resistance, for example, an acrylic hard coat layer and a surface hardened layer composed of an oxygen barrier coat layer made of an organic or inorganic material for preventing permeation of oxygen and the like are formed, and for example, ITO (Indium Tin Oxide)
Is formed. This type of hardened layer is harder and easier to crack than a plastic substrate.

【0009】このようなプラスチック基板について、図
3で説明した第1の方法で端子部出しを行なう場合、A
の部分はカッターなどで完全に切断(フルカット)でき
るが、残されたダミー部分2bについては、対向する端
子部1bとの間には6μm程度のギャップしかないた
め、端子部1bを傷つけることなく、その基板部分2b
をフルカットすることはきわめて困難である。
In the case where such a plastic substrate is provided with a terminal portion by the first method described with reference to FIG.
Can be completely cut (full cut) with a cutter or the like, but the remaining dummy portion 2b has only a gap of about 6 μm between the opposing terminal portion 1b, so that the terminal portion 1b is not damaged. , Its substrate part 2b
It is extremely difficult to fully cut

【0010】したがって、従来ではBの部分に所定深さ
の切り込み溝(いわゆるハーフカット)を入れ、手作業
でダミー部分2bを引き裂くようにしているため、生産
性の低下は否めない。そればかりでなく、手作業による
ため、ダミー部分2bをつかむ際に誤って端子部1bに
接触して傷をつけたり、また、外観的な切断不良が発生
しやすい。
[0010] Therefore, conventionally, a cut groove (so-called half cut) having a predetermined depth is formed in the portion B, and the dummy portion 2b is torn by hand, so that a reduction in productivity cannot be denied. In addition, since it is a manual operation, when the dummy portion 2b is grasped, the terminal portion 1b is erroneously contacted with the terminal portion 1b to be scratched, and a cutting failure in appearance is likely to occur.

【0011】また、図4で説明した第2の方法で端子部
出しを行なう場合には、C,Dの各部分にハーフカット
を入れた後、その部分に曲げ応力を加えて分断すること
になるが、端子部1b,2bの分断面に多大な応力が集
中するため、表面硬化層のハードコート層や酸素バリア
コート層にクラックが発生したり、周辺シール材3が剥
離することがかなりの頻度で発生していた。
In the case where the terminal portion is formed by the second method described with reference to FIG. 4, a half cut is made in each of the C and D portions, and then a bending stress is applied to the portions to divide the portions. However, since a large amount of stress concentrates on the cross section of the terminal portions 1b and 2b, cracks occur in the hard coat layer and the oxygen barrier coat layer of the hardened surface layer, and the peripheral seal material 3 peels off considerably. Occurred frequently.

【0012】[0012]

【課題を解決するための手段】本発明は、このような課
題を解決するためになされたもので、その目的は、透明
電極基板としてプラスチック基板を用いる場合におい
て、その表面硬化層などにクラックを発生させることな
く、また、端子部を傷つけることなく、端子部出しがで
きるようにした液晶表示素子の製造方法を提供すること
にある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and has as its object the purpose of using a plastic substrate as a transparent electrode substrate to form cracks in the surface hardened layer and the like. It is an object of the present invention to provide a method of manufacturing a liquid crystal display element in which a terminal portion can be provided without causing the generation and without damaging the terminal portion.

【0013】上記目的を達成するため、本発明は、表面
硬化層が形成されたプラスチック基板からなる第1およ
び第2マザー基板の各々に、所定の配列をもって複数の
セル形成領域をそれぞれ割り当てるにあたって、第1マ
ザー基板側については隣接する各セル形成領域の間に所
定幅の第1ダミー基板部を設定して、その各セル形成領
域に表示部および端子部を形成するとともに、第2マザ
ー基板側の各セル形成領域には第1マザー基板側の表示
部と対応する位置に表示部のみを形成して、隣接する各
セル形成領域の間を第2ダミー基板部とした上で、いず
れか一方のマザー基板側の各表示部の周りに周辺シール
材を塗布するとともに、第1ダミー基板部と第2ダミー
基板部との間にスペーサシール材を塗布して、両マザー
基板を周辺シール材およびスペーサシール材を介して圧
着して同時に複数の表示素子用セルを形成し、第1ダミ
ー基板部の両端および第2ダミー基板部の上記端子部と
対向しない側の一端についてはそれぞれ完全に切断(フ
ルカット)し、第2ダミー基板部の上記端子部と対向す
る側の他端については所定深さの切り込み溝(ハーフカ
ット)を入れた後、第1ダミー基板部側からその切り込
み溝の部分に折り曲げ応力を加えて第2ダミー基板部を
分断することを特徴としている。
In order to achieve the above object, the present invention provides a method of allocating a plurality of cell forming regions in a predetermined arrangement to each of a first mother substrate and a second mother substrate each formed of a plastic substrate having a hardened surface layer. On the first mother substrate side, a first dummy substrate portion having a predetermined width is set between adjacent cell forming regions, and a display portion and a terminal portion are formed in each of the cell forming regions. In each cell formation region, only a display portion is formed at a position corresponding to the display portion on the first mother substrate side, and a space between each adjacent cell formation region is used as a second dummy substrate portion. A peripheral sealing material is applied around the respective display portions on the mother substrate side, and a spacer sealing material is applied between the first dummy substrate portion and the second dummy substrate portion to seal both mother substrates. And a plurality of display element cells are simultaneously formed by pressure bonding via a spacer sealing material, and both ends of the first dummy substrate portion and one end of the second dummy substrate portion on the side not facing the terminal portion are completely cut off, respectively. (Full cut), a notch groove (half cut) having a predetermined depth is formed at the other end of the second dummy substrate portion facing the terminal portion, and then the notch groove is formed from the first dummy substrate portion side. The second dummy substrate portion is divided by applying a bending stress to the portion.

【0014】この場合、第1ダミー基板部の幅は3〜1
0mm、特には5〜7mmの範囲内であることが好まし
い。3mm未満であると、幅が狭すぎて第2ダミー基板
部の分断作業が行ないにくくなる。一方、第1ダミー基
板部の幅が10mmを超えると、第2ダミー基板部の分
断時に同第2ダミー基板部の跳ね返りが顕著になり、こ
れによって端子部が傷つけられるおそれが生ずる。
In this case, the width of the first dummy substrate portion is 3 to 1
It is preferably within a range of 0 mm, particularly 5 to 7 mm. If it is less than 3 mm, the width is too narrow, and it becomes difficult to divide the second dummy substrate portion. On the other hand, if the width of the first dummy substrate portion exceeds 10 mm, the rebound of the second dummy substrate portion becomes remarkable when the second dummy substrate portion is divided, which may cause damage to the terminal portion.

【0015】また、本発明においては、上記切り込み溝
部分の切り残し量は基板厚さの3〜40%、特には5〜
20%であることが好ましい。切り残し量を3%未満と
することは精度上困難であるし、他方において、切り残
し量が40%を超えると、分断時のストレスが大きくな
り、プラスチック基板の表面硬化層にクラックが発生し
たり、周辺シール材に剥離が発生するおそれがあるため
好ましいとは言えない。
Further, in the present invention, the uncut amount of the cut groove portion is 3 to 40% of the substrate thickness, particularly 5 to 40%.
Preferably it is 20%. It is difficult to reduce the uncut portion to less than 3% in terms of accuracy. On the other hand, if the uncut portion exceeds 40%, stress at the time of cutting increases, and cracks occur in the surface hardened layer of the plastic substrate. It is not preferable because there is a possibility that the peripheral sealing material may peel off.

【0016】本発明によれば、第1ダミー基板部の両端
および第2ダミー基板部の両端の計4箇所を分断なり切
断することにより端子部出しが行なわれるが、その内の
3箇所(第1ダミー基板部の両端2箇所と、第2ダミー
基板部の一端側1箇所)はフルカットで切断できる。
According to the present invention, the terminal portion is obtained by dividing and cutting a total of four positions at both ends of the first dummy substrate portion and both ends of the second dummy substrate portion. Two places at both ends of one dummy substrate part and one place at one end side of the second dummy substrate part) can be cut by full cutting.

【0017】残りの1箇所(第2ダミー基板部の他端側
1箇所)はハーフカットによる分断となるが、本発明の
場合、第1ダミー基板部側から第2ダミー基板部に分断
力を加えることができるため、その分断作業が効率よく
行なえる。また、自動分断機による分断作業の自動化も
可能となる。
The remaining one portion (one portion on the other end side of the second dummy substrate portion) is cut by half cutting. In the case of the present invention, a separating force is applied from the first dummy substrate portion side to the second dummy substrate portion. Since it can be added, the dividing operation can be performed efficiently. Further, it is possible to automate the dividing operation by the automatic dividing machine.

【0018】[0018]

【発明の実施の形態】次に、本発明を図面を参照しなが
らより具体的に説明する。
Next, the present invention will be described more specifically with reference to the drawings.

【0019】図1は、一対の第1および第2マザー基板
30,40をこれから端子部出しをしようとする状態に
組み合わせた状態の要部断面図である。各マザー基板3
0,40ともに、例えばポリカーボネイトなどのプラス
チック基板からなり、図示されていないが、その各面に
は耐薬品性向上のため、例えばアクリル系のハードコー
ト層と、酸素などの透過を防止するための有機もしくは
無機材料による酸素バリアコート層とからなる表面硬化
層が形成されている。液晶表示素子用のプラスチック基
板には、通常、その基板厚さが0.1〜0.4mm程度
のものが選択される。
FIG. 1 is a cross-sectional view of an essential part in a state where a pair of first and second mother substrates 30 and 40 are combined in a state in which a terminal portion is to be extended. Each mother board 3
Both 0 and 40 are made of, for example, a plastic substrate such as polycarbonate. Although not shown, each surface thereof is provided with, for example, an acrylic hard coat layer for improving chemical resistance, and for preventing permeation of oxygen and the like. A surface hardened layer composed of an oxygen barrier coat layer made of an organic or inorganic material is formed. As the plastic substrate for a liquid crystal display device, a substrate having a substrate thickness of about 0.1 to 0.4 mm is usually selected.

【0020】各マザー基板30,40には、それぞれ所
定の配列をもって複数のセル形成領域31,41が割り
当てられるが、この実施例によると、第1マザー基板3
0側については、隣接するセル形成領域31,31の間
に、所定幅の第1ダミー基板部32が設定され、その各
セル形成領域31に表示部31aおよび端子部31bが
形成されている。
A plurality of cell forming regions 31 and 41 are allocated to each of the mother substrates 30 and 40 in a predetermined arrangement. According to this embodiment, the first mother substrate 3
On the 0 side, a first dummy substrate portion 32 having a predetermined width is set between adjacent cell formation regions 31, 31, and a display portion 31 a and a terminal portion 31 b are formed in each cell formation region 31.

【0021】詳しくは図示されていないが、表示部31
aにはITOよりなる透明電極が所定のパターンで形成
されており、また、端子部31bにはその透明電極に連
なる引出電極が形成されている。本発明において、第1
ダミー基板部32の幅は、3〜10mm、特には5〜7
mmの範囲内であることが好ましい。
Although not shown in detail, the display unit 31
A transparent electrode made of ITO is formed in a predetermined pattern at a, and an extraction electrode connected to the transparent electrode is formed at the terminal portion 31b. In the present invention, the first
The width of the dummy substrate portion 32 is 3 to 10 mm, particularly 5 to 7 mm.
mm.

【0022】これに対して、第2マザー基板40の各セ
ル形成領域41には、第1マザー基板30側の表示部3
1aと対応する位置に表示部41aのみが形成され、隣
接するセル形成領域41,41の間は第2ダミー基板部
42とされている。
On the other hand, each of the cell forming regions 41 of the second mother substrate 40 has a display portion 3 on the first mother substrate 30 side.
Only the display section 41a is formed at a position corresponding to 1a, and a second dummy substrate section 42 is formed between adjacent cell formation areas 41, 41.

【0023】マザー基板30,40は、そのいずれか一
方の基板の各表示部(31aもしくは41a)の周りに
塗布された周辺シール材51を介して圧着されるが、こ
の場合、第1ダミー基板部32と第2ダミー基板部42
との間にも、スペーサシール材52が設けられている。
周辺シール材51およびスペーサシール材52は、通常
よく用いられている例えばエポキシ樹脂系の接着材であ
ってよい。
The mother substrates 30 and 40 are pressure-bonded via a peripheral sealing material 51 applied around each display portion (31a or 41a) of one of the substrates. In this case, the first dummy substrate Part 32 and second dummy substrate part 42
A spacer sealing material 52 is also provided between them.
The peripheral sealing material 51 and the spacer sealing material 52 may be, for example, an epoxy resin-based adhesive that is commonly used.

【0024】端子部出しを行なうには、第1マザー基板
30側においては、その第1ダミー基板部32の両端3
2a,32bを完全に切断(フルカット)する。第2マ
ザー基板40側は、その第2ダミー基板部42の一方の
端部42aをフルカットする。なお、この端部42a
は、第1ダミー基板部32の一方の端部32aと位置的
に重なっており、端子部31bと対向しない側の端部で
ある。
In order to carry out the terminal section, on the first mother board 30 side, both ends 3 of the first dummy board section 32 are provided.
2a and 32b are completely cut (full cut). On the second mother substrate 40 side, one end 42a of the second dummy substrate portion 42 is fully cut. Note that this end portion 42a
Is an end on the side not overlapping with the terminal 31b, which overlaps with one end 32a of the first dummy substrate part 32 in position.

【0025】第2ダミー基板部42の他方の端部、すな
わち端子部31bと対向している側の端部42bについ
ては、例えば超硬ホイールカッターなどで切り込み溝
(ハーフカット)を入れる。その切り込み溝部分の切り
残し量は、基板厚さの3〜40%、特には5〜20%で
あることが好ましい。
The other end of the second dummy substrate 42, that is, the end 42b facing the terminal 31b, is provided with a cut groove (half cut) by, for example, a carbide wheel cutter. The uncut amount of the cut groove portion is preferably 3 to 40%, particularly preferably 5 to 20% of the substrate thickness.

【0026】そして、図2に示されているように、第2
マザー基板40側を下にして分断機のテーブル61上に
載置し、押さえバー62にてしっかり固定した後、分断
バー63を第1ダミー基板部32の上から押し当てて、
端部42bに形成されている切り込み溝部分に折り曲げ
応力を加えて、第2ダミー基板部42を第2マザー基板
40から切り離す。これにより、プラスチック基板に形
成されている表面硬化層などにクラックを発生させるこ
となく、ダミー部分を分断することができる。
Then, as shown in FIG.
After being placed on the table 61 of the cutting machine with the mother board 40 side down, and firmly fixed with the holding bar 62, the cutting bar 63 is pressed from above the first dummy board unit 32,
A bending stress is applied to the cut groove portion formed at the end portion 42 b to separate the second dummy substrate portion 42 from the second mother substrate 40. Thus, the dummy portion can be divided without causing cracks in the hardened surface layer or the like formed on the plastic substrate.

【0027】なお、第1ダミー基板部32の幅を2〜1
5mmの範囲内で適宜変えて、実際に分断を行なったと
ころ、3mm未満の場合には、その幅が狭すぎて分断作
業がスムーズにできなかった。一方、第1ダミー基板部
32の幅が10mmを超えると、切り込み溝の深さが適
正でも、分断時に第2ダミー基板部42の端部42bが
跳ね返って端子部31bに傷が付くおそれがある。した
がって、第1ダミー基板部32の幅は3〜10mmが適
正である。
The width of the first dummy substrate portion 32 is set to 2 to 1
Actually, the cutting was carried out by appropriately changing the distance within a range of 5 mm. When the cutting was less than 3 mm, the width was too narrow and the cutting operation could not be performed smoothly. On the other hand, if the width of the first dummy substrate portion 32 exceeds 10 mm, even if the depth of the cut groove is appropriate, the end portion 42b of the second dummy substrate portion 42 may rebound at the time of division and the terminal portion 31b may be damaged. . Therefore, it is appropriate that the width of the first dummy substrate portion 32 is 3 to 10 mm.

【0028】また、第1ダミー基板部32の幅を5mm
に設定し、切り込み溝の切り残し量を基板厚さの1〜6
0%の範囲内で適宜変えて、実際に分断を行なったとこ
ろ、3%未満では、切り残し量がバラツキ管理ができな
い。これに対して、切り残し量が40%を超えると、分
断時のストレスが大きく、表面硬化層にクラックが発生
したり、シール剥離が散見された。したがつて、切り残
し量の適正な範囲は3〜40%ということになる。
The width of the first dummy substrate portion 32 is 5 mm.
And the uncut amount of the cut groove is set to 1 to 6 of the substrate thickness.
The actual cutting was performed by appropriately changing it within the range of 0%. When the cutting was less than 3%, the uncut amount could not be managed. On the other hand, when the uncut amount exceeds 40%, the stress at the time of cutting is large, cracks are generated in the hardened surface layer, and seal peeling is scattered. Therefore, the appropriate range of the uncut amount is 3 to 40%.

【0029】[0029]

【発明の効果】以上説明したように、本発明によれば、
ハードコート層や酸素バリアコート層などの表面硬化層
を有するプラスチック基板を透明電極基板として用いる
場合において、表面硬化層にクラックを生じさせること
なく、また、シール剥離の問題もなく、端子部出しを効
率よく行なうことができる。
As described above, according to the present invention,
When a plastic substrate having a hardened layer such as a hard coat layer or an oxygen barrier coat layer is used as a transparent electrode substrate, without causing cracks in the hardened surface layer, and without any problem of peeling of the seal, the terminal portion can be exposed. It can be performed efficiently.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明により端子部出しが行なわれるマザー基
板の要部断面図。
FIG. 1 is a cross-sectional view of a main part of a mother board on which a terminal portion is provided according to the present invention.

【図2】本発明による分断状態を示した模式的側面図。FIG. 2 is a schematic side view showing a divided state according to the present invention.

【図3】従来の端子部出しの第1の方法を説明するため
の模式的断面図。
FIG. 3 is a schematic cross-sectional view for explaining a first conventional method of providing a terminal portion.

【図4】従来の端子部出しの第2の方法を説明するため
の模式的断面図。
FIG. 4 is a schematic cross-sectional view for explaining a second conventional method for providing a terminal portion.

【符号の説明】[Explanation of symbols]

30,40 マザー基板 31,41 セル形成領域 31a,41a 表示部 31b 端子部 32 第1ダミー基板部 42 第2ダミー基板部 51 周辺シール材 52 スペーサシール材 30, 40 Mother substrate 31, 41 Cell formation region 31a, 41a Display unit 31b Terminal unit 32 First dummy substrate unit 42 Second dummy substrate unit 51 Peripheral seal material 52 Spacer seal material

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2H088 FA06 FA07 FA10 FA27 FA29 HA01 HA04 MA20 2H089 LA09 LA10 LA11 LA13 NA12 NA17 NA39 NA41 QA12 QA16 TA01 TA05 2H090 JA07 JA08 JB03 JC07 JC13 LA02 LA03  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2H088 FA06 FA07 FA10 FA27 FA29 HA01 HA04 MA20 2H089 LA09 LA10 LA11 LA13 NA12 NA17 NA39 NA41 QA12 QA16 TA01 TA05 2H090 JA07 JA08 JB03 JC07 JC13 LA02 LA03

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 表面硬化層が形成されたプラスチック基
板からなる第1および第2マザー基板の各々に、所定の
配列をもって複数のセル形成領域をそれぞれ割り当てる
にあたって、第1マザー基板側については隣接する各セ
ル形成領域の間に所定幅の第1ダミー基板部を設定し
て、その各セル形成領域に表示部および端子部を形成す
るとともに、第2マザー基板側の各セル形成領域には第
1マザー基板側の表示部と対応する位置に表示部のみを
形成して、隣接する各セル形成領域の間を第2ダミー基
板部とした上で、いずれか一方のマザー基板側の各表示
部の周りに周辺シール材を塗布するとともに、第1ダミ
ー基板部と第2ダミー基板部との間にスペーサシール材
を塗布して、両マザー基板を周辺シール材およびスペー
サシール材を介して圧着して同時に複数の表示素子用セ
ルを形成し、第1ダミー基板部の両端および第2ダミー
基板部の上記端子部と対向しない側の一端についてはそ
れぞれ完全に切断し、第2ダミー基板部の上記端子部と
対向する側の他端については所定深さの切り込み溝を入
れた後、第1ダミー基板部側からその切り込み溝の部分
に折り曲げ応力を加えて第2ダミー基板部を分断するこ
とを特徴とする液晶表示素子の製造方法。
When allocating a plurality of cell formation regions with a predetermined arrangement to each of a first and a second mother substrate formed of a plastic substrate having a surface hardened layer, the first mother substrate is adjacent to the first mother substrate. A first dummy substrate portion having a predetermined width is set between each cell formation region, a display portion and a terminal portion are formed in each cell formation region, and a first dummy substrate portion is formed in each cell formation region on the second mother substrate side. Only the display portion is formed at a position corresponding to the display portion on the mother substrate side, and a space between each adjacent cell formation region is used as a second dummy substrate portion. A peripheral sealing material is applied to the periphery, and a spacer sealing material is applied between the first dummy substrate portion and the second dummy substrate portion, and both mother substrates are pressed through the peripheral sealing material and the spacer sealing material. And simultaneously forming a plurality of display element cells, and completely cutting both ends of the first dummy substrate portion and one end of the second dummy substrate portion which is not opposed to the terminal portion. At the other end on the side facing the terminal portion, a notch groove of a predetermined depth is formed, and then a bending stress is applied to the notch groove portion from the first dummy substrate portion side to divide the second dummy substrate portion. A method for manufacturing a liquid crystal display device, comprising:
【請求項2】 上記第1ダミー基板部の幅が3〜10m
mの範囲内である請求項1に記載の液晶表示素子の製造
方法。
2. The method according to claim 1, wherein the first dummy substrate has a width of 3 to 10 m.
2. The method for manufacturing a liquid crystal display device according to claim 1, wherein m is within a range of m.
【請求項3】 上記切り込み溝部分の切り残し量が基板
厚さの3〜40%である請求項1または2に記載の液晶
表示素子の製造方法。
3. The method for manufacturing a liquid crystal display element according to claim 1, wherein an uncut amount of the cut groove portion is 3 to 40% of a substrate thickness.
JP30846599A 1999-10-29 1999-10-29 Manufacturing method of liquid crystal display element Expired - Fee Related JP4338109B2 (en)

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Application Number Priority Date Filing Date Title
JP30846599A JP4338109B2 (en) 1999-10-29 1999-10-29 Manufacturing method of liquid crystal display element

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Application Number Priority Date Filing Date Title
JP30846599A JP4338109B2 (en) 1999-10-29 1999-10-29 Manufacturing method of liquid crystal display element

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Publication Number Publication Date
JP2001125055A true JP2001125055A (en) 2001-05-11
JP4338109B2 JP4338109B2 (en) 2009-10-07

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ID=17981359

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Country Link
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004145337A (en) * 2002-10-22 2004-05-20 Lg Philips Lcd Co Ltd Cutting apparatus for liquid crystal display panel
JP2010128407A (en) * 2008-12-01 2010-06-10 Seiko Epson Corp Method of dividing substrate, and device for dividing substrate
KR100963496B1 (en) 2009-06-12 2010-06-17 주식회사 토비스 Method for cutting liquid crystal panel and method for manufacturing liquid crystal panel using the same
KR100966082B1 (en) * 2009-06-16 2010-06-28 주식회사 토비스 Method for cutting liquid crystal panel

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004145337A (en) * 2002-10-22 2004-05-20 Lg Philips Lcd Co Ltd Cutting apparatus for liquid crystal display panel
JP4578086B2 (en) * 2002-10-22 2010-11-10 エルジー ディスプレイ カンパニー リミテッド Liquid crystal display panel cutting device
JP2010128407A (en) * 2008-12-01 2010-06-10 Seiko Epson Corp Method of dividing substrate, and device for dividing substrate
KR100963496B1 (en) 2009-06-12 2010-06-17 주식회사 토비스 Method for cutting liquid crystal panel and method for manufacturing liquid crystal panel using the same
WO2010143878A3 (en) * 2009-06-12 2011-03-03 주식회사 토비스 Method for cutting liquid crystal panel and method for manufacturing liquid crystal panel using same
US8905807B2 (en) 2009-06-12 2014-12-09 Tovis Co., Ltd. Method for cutting liquid crystal panel and method for manufacturing liquid crystal panel using the same
KR100966082B1 (en) * 2009-06-16 2010-06-28 주식회사 토비스 Method for cutting liquid crystal panel
WO2010147331A3 (en) * 2009-06-16 2011-03-03 주식회사 토비스 Method for cutting liquid crystal panel

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