JP2001110706A - Lighting system, aligner, exposing method and manufacturing method of microdevice - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain change in illumination characteristic on a surface to be illuminated under a plurality of illumination conditions without complexing unnecessarily equipment itself. SOLUTION: In this lighting system, a light distribution changing means which forms one out of first light distribution and second light distribution different from the first light distribution on a specified position, on the basis of an illumination light from a light source means, a light introducing system for introducing an illumination light from the light distribution changing means to an object to be illuminated, and an adjustment means which is arranged in an optical path between the light source means and the object and adjusts illumination characteristic at the object, are arranged. The adjustment means is provided with a first light distribution correcting part having specified first optical characteristic for correcting first illumination characteristic which is formed on the object by the first light distribution, and a second light distribution correcting part having specified second optical characteristic for correcting second illumination characteristic which is formed on the object by the second light distribution.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an illuminating device, particularly an illuminating device requiring high illuminance uniformity, an exposing device equipped with the illuminating device, and an exposing method and a micro device manufacturing method using the illuminating device. And various other methods. In particular, the microdevice referred to in the present invention includes a semiconductor element having a semiconductor integrated circuit and the like, a high-definition flat panel display, an imaging element such as a CCD, a magnetic head for a personal computer hard disk, a diffractive optical element, and the like.

[0002]

2. Description of the Related Art In this type of apparatus, strict illuminance uniformity is required on a surface to be illuminated. As a method for improving the uniformity of illuminance on the surface to be illuminated, an illumination optical path optically conjugate with the surface to be illuminated is used. Japanese Patent Application Laid-Open No. Hei 7-130600 proposed to dispose a filter having a predetermined optical characteristic at the position of.

[0003]

In recent years, in the manufacture of a micro device represented by a semiconductor element having a semiconductor integrated circuit, an illumination optical system is required for each type of pattern exposed (transferred) to a photosensitive substrate. Optimization of the illumination conditions of the illumination light has been performed. The optimization of the illumination condition is performed, for example, by changing the size and shape of the secondary light source formed at the pupil position of the illumination optical system.

However, as described above, as the size and shape of the secondary light source of the illumination optical system are changed, illumination such as illumination distribution on a mask (reticle) on which a predetermined pattern is formed or on a photosensitive substrate. There is a problem that the characteristics change. As a method for solving this problem, Japanese Patent Application Laid-Open
Japanese Patent Application Laid-Open No. 189427 proposes a device configuration in which various adjustment mechanisms move in conjunction with changing the size and shape of a secondary light source of an illumination optical system using a variable aperture stop. However, this method has a problem that the apparatus itself is complicated.

The present invention has been made in view of the above problems, and does not change the illumination characteristics on an irradiated surface under a plurality of illumination conditions without complicating the apparatus itself more than necessary. An object of the present invention is to provide an illumination device, an exposure device equipped with the illumination device, and various methods such as an exposure method and a microdevice manufacturing method using the illumination device.

[0006]

In order to achieve the above object, an illuminating device according to the present invention comprises a light source means for supplying illumination light and a first light distribution based on the illumination light from the light source means. A light distribution varying means for forming one of a second light distribution different from the first light distribution at a predetermined position, a light guide system for guiding illumination light from the light distribution variable means to an object to be illuminated, Adjusting means arranged in an optical path between the light source means and the illuminated object to adjust the illumination characteristics of the illuminated object,
The adjustment unit includes a first light distribution correction unit having a predetermined first optical characteristic for correcting a first illumination characteristic formed on the illumination object by the first light distribution, and a second light distribution correction unit.
A second optical characteristic having a predetermined second optical characteristic for correcting a second illumination characteristic formed on the illumination object by the light distribution of
And a light distribution correction unit.

In this case, it is preferable that the first light distribution correction section and the second light distribution correction section are formed in different areas along a predetermined plane crossing the optical path of the illumination light. Alternatively, the first light distribution correction unit and the second light distribution correction unit
The light distribution correcting section is formed along a predetermined surface crossing the optical path of the illumination light, and the second light distribution correcting section is formed in a part of the first light distribution correcting section. You may do it.

[0008] The first light distribution correction unit may include a first transmission region including a plurality of transmission elements having a predetermined first transmittance distribution, and a first transmission region different from the first transmittance distribution. A second transmissive region including at least a second transmissive element having a second transmissivity distribution, wherein the second light distribution correction unit includes a plurality of transmissive elements having a predetermined third transmissivity distribution It is desirable to include at least a third transmission region and a fourth transmission region including a plurality of transmission elements having a predetermined fourth transmittance distribution different from the third transmittance distribution. Alternatively, the first light distribution correction unit includes a first light distribution correction unit including a plurality of transmission elements having a predetermined first transmittance distribution.
And the second light distribution correction unit has a second transmission region including a plurality of transmission elements having a predetermined second transmittance distribution different from the first transmittance distribution. You may do it.

Further, the light distribution changing means includes an optical integrator for forming a secondary light source at the predetermined position or a position optically conjugate with the predetermined position based on the illumination light; It is more preferable to include changing means for changing the light distribution at a position optically conjugate with the predetermined position. In particular, the changing means preferably has a variable aperture stop for changing the shape or size of the secondary light source formed by the optical integrator.

An exposure apparatus according to the present invention includes, for example, the illumination apparatus described above for illuminating a mask having a predetermined pattern formed thereon, and a projection system for projecting an image of the mask onto a photosensitive substrate. It is desirable to have. Further, the exposure method according to the present invention is characterized in that the first position at the position where the mask on which the predetermined pattern is formed or the position where the photosensitive substrate at which the pattern of the mask is to be exposed is set is set.
A first measurement step of obtaining the first illumination characteristic under the first illumination condition; and a first step of providing a predetermined first light distribution for correcting the first illumination characteristic based on a result of the first measurement step. And a second illumination characteristic at a position where the mask is to be set or at a position where the photosensitive substrate is to be set.
A second measurement step for obtaining under a lighting condition of the second, a second correction step of providing a predetermined second light distribution for correcting a second illumination characteristic based on the result of the second measurement step, After each correction step, an exposure step of illuminating the mask and exposing an image of a pattern of the mask to a photosensitive substrate is provided.

In this case, the first correction step includes forming a first light distribution correction section for providing the first light distribution in the illumination light path, and the first light distribution correction section includes a predetermined light distribution correction section. A first transmission region including a plurality of transmission elements having a first transmittance distribution, and a second transmission region different from the first transmittance distribution.
A second transmission region including a plurality of transmission elements having a transmittance distribution of
Forming a second light distribution correction unit for providing the light distribution in the illumination light path, wherein the second light distribution correction unit includes a plurality of transmission elements having a predetermined third transmittance distribution. It is preferable to include at least a third transmission region and a fourth transmission region including a plurality of transmission elements having a predetermined fourth transmittance distribution different from the third transmittance distribution.

Alternatively, the first correcting step includes forming a first light distribution correcting section for providing the first light distribution in an illumination light path, wherein the first light distribution correcting section includes a predetermined light distribution correcting section. A first light-transmitting region including a plurality of light-transmitting elements having a first light-transmittance distribution; Forming, wherein the second light distribution correction unit has a second transmission region including a plurality of transmission elements having a predetermined second transmittance distribution different from the first transmittance distribution. You may do it.

Further, a method for exposing a micro device according to the present invention is a method for manufacturing a micro device using the above-described exposure method.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a first embodiment according to the present invention will be described with reference to FIGS. FIG. 1 is a view schematically showing a configuration of an exposure apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the emission point at the center of the ultra-high pressure mercury lamp 11 is located on the first focal point of the elliptical mirror 12, and the light beam from the ultra-high pressure mercury lamp 11 is reflected and condensed by the elliptical mirror 12. Is reflected by the cold mirror 13.

Here, from the ultrahigh pressure mercury lamp 11, for example, a wavelength of 436 nm (g line) or 365 nm
Light such as (i-line) is supplied. Well, cold mirror 1
The light beam reflected by 3 is once collected on the second focal point of the elliptical mirror 12, converted into a substantially parallel light beam by the collimating optical system 14, and guided to the optical integrator 17.

Here, these ultra-high pressure mercury lamps 11
The circular mirror 12 and the collimating optical system 14
The light source unit 1 that supplies illumination light is configured. Note that this
The light source unit 1 has a wavelength of 248 nm (KrF) or a wavelength of 248 nm (KrF).
Excimere that supplies 193 nm (ArF) laser light
Laser light source, F that supplies laser light with a wavelength of 157 nm _Two
Light sources such as laser light sources, and light supplied from these light sources
Beam shaping optics to shape the bundle and occur at the illuminated surface
Has optical delay optical system etc. to reduce speckles etc.
It is also possible to adopt a configuration in which

An interference filter 1 that transmits only a light beam in a desired wavelength range in the parallel light beam from the light source unit 1 is described.
5, and a light intensity distribution adjustment filter (illuminance correction or illuminance adjustment filter) 16 as an adjustment unit (or correction unit), which will be described in detail later. FIG.
2 shows that the light intensity distribution adjusting filter 16 is arranged at a position slightly distant from the optical integrator 17, but in practice, the light intensity distribution adjusting filter 16 is located at a position (near the optical integrator 17). (A position slightly distant from the incident surface of the optical integrator 17).

Now, the optical integrator 17
As shown in FIG. 2, is composed of an aggregate of lens elements (a so-called fly-eye lens) in which a plurality of lens elements 17a are bundled. Then, the parallel light beam from the collimation lens 14 is
Is formed on the exit side of the optical integrator 17 in the number of condensing points (light source images) equal to the number of the small lenses constituting the optical integrator 17. A light source) is formed. As shown in FIGS. 3A to 3C, a group of light beams from the secondary light source is desired by a variable aperture stop apparatus AS1 having, for example, three kinds of aperture stops (30 to 32) that are interchangeable. After being limited to a light beam having a size or a desired shape, the light beam is condensed on a field stop 19 by a condensing optical system 18. The variable aperture stop AS1 includes, for example, three types of aperture stops (30 to 32) shown in FIG. 3 formed along the circumferential direction of a circular substrate such as a turret plate, and rotates the circular substrate. Accordingly, one of the three types of aperture stops (30 to 32) is configured to be set in the illumination optical path. Note that the optical integrator 17 and the variable aperture stop AS1 (change means) constitute a light distribution changing means.

The secondary light source is located at the front focal position of the condenser optical system 18, and the field stop 19 is located at the rear focal position of the condenser optical system 18. Therefore, when the light flux from each light source image of the secondary light source passes through the condenser optical system 18, it illuminates the opening of the field stop 19 in a superimposed manner.
After that, each light beam that illuminates the opening of the field stop 19 in a superimposed manner passes through the relay optical system (20, 22), and is then superimposed on a mask (reticle) 23 on which a predetermined pattern such as a circuit pattern is formed. Illuminate uniformly.

Here, the relay optical system (20, 22)
The relay optical system (20, 22) includes a front group 20 and a rear group 22, and a mirror 21 for bending the optical path is arranged between two lens groups of the relay optical system (20, 22). When the mask is uniformly illuminated by the above illumination device, the pattern image of the mask 23 is projected and exposed by the projection optical system 24 onto a photosensitive substrate 25 such as a wafer on which a resist is applied.

Here, the mask 23 is a mask stage M
S, and the photosensitive substrate 25 is held on the substrate stage WS. Then, the substrate stage W
At one end of S, an illuminance sensor IS that measures the illuminance, which is one of the illumination characteristics, in a two-dimensional matrix along the imaging surface of the projection optical system 24 (the exposed surface of the photosensitive substrate).
Is provided. The projection optical system 24 has an aperture stop AS2 arranged at the pupil position, a first lens group 24A, and a second lens group 24B with the aperture stop AS2 interposed therebetween.

The entrance surface of the optical integrator 17 and the field stop 19 are optically connected to the mask surface (the object surface of the projection optical system) or the surface to be exposed on the photosensitive substrate 25 (the imaging surface of the projection optical system). It is conjugate. Also, the exit surface of the optical integrator 17 or the aperture stop (30 to 3)
2) is at the position of the pupil of the illumination optical system, and these are the pupil of the projection optical system 24 or the aperture stop AS2 arranged at that position.
And optically conjugate.

Next, a light intensity distribution adjustment filter (illuminance correction or illuminance adjustment filter) as adjustment means (or correction means) when the three types of aperture stops (30 to 32) shown in FIG. 3 are used. ) 16 will be described. Here, in FIG. 3, (A) is an aperture stop (large σ stop) 30 having a large circular aperture,
(B) shows an aperture stop (small σ stop) 31 having a small circular opening, and (C) shows an aperture stop (ring stop) 32 having an annular opening. The diameter of the circular aperture of the aperture stop 30 shown in FIG.
The diameter of the circular aperture of the aperture stop 31 shown in FIG. 3B is D31, the outer diameter of the annular opening of the aperture stop 32 shown in FIG. 3C is D32, and the aperture shown in FIG. When the inner diameter of the orifice opening of the diaphragm 32 is d32, D30 and D32 are equal,
It is assumed that D31 and d32 are equal. [Step 1] In step 1, the position where the photosensitive substrate 25 is to be set under the first illumination condition (the projection optical system 2
(The position of the imaging plane No. 4). Therefore, in order to set the first illumination condition, the variable aperture stop device AS
According to 1, an aperture stop (small σ stop) 31 having a small circular aperture among the three types of aperture stops (30 to 32) is set in the illumination optical path. At this time, the exposure mask 23 is removed from the max stage MS or the
In S, a parallel flat plate having the same thickness as the exposure mask 23 is arranged.

Next, one end of the substrate stage WS is provided.
The first illuminating condition (small
Illumination conditions by setting aperture stop 31 having a circular aperture)
Illuminance along the image plane of the projection optical system 24 under the
First illuminance distribution at this time, measured in the form of an original matrix
I₃₁Find (x, y). Where x and y are the projection optical system 2
4 is a position in the image plane. [Step 2] Next, in step 2, the first illumination condition
Illuminance distribution I obtained under the condition ₃₁(x, y) result
Light intensity distribution adjustment based on (measurement result of step 1)
What is the first transmittance distribution TA (x,
y) is calculated using Equation 1 below.
You.

[0025]

## EQU1 ## where TA (x, y) = CA / I ₃₁ (x, y) where CA is a constant and the maximum value of I ₃₁ (x, y) is 1
It is desirable to select such a value that the transmittance becomes 100%. Needless to say, if it is less than this, the light quantity is unnecessarily lost, and if it is more than that, it is impossible to manufacture the light intensity distribution adjusting filter 16.

FIG. 5 shows an illuminance distribution I (x, y) on the surface 25 to be exposed under a certain illumination condition (exposure condition) and the illuminance distribution I (x, y) which can be corrected. The relationship with the transmittance distribution T (x, y) in the filter 16 is shown. Now, assume that the first illuminance distribution I ₃₁ (x, y) on the exposed surface 25 under the first illumination condition (first exposure condition) is a distribution shown in FIG. In this case, if the first transmittance distribution TA (x, y) shown in FIG. 5B having the opposite characteristic to the distribution shown in FIG. It can be understood that the non-uniformity of the first illuminance distribution I ₃₁ (x, y) shown in FIG. [Step 3] As described above, after the first transmittance distribution TA (x, y) under the first illumination condition is obtained, in step 3, the light intensity distribution adjusting filter 16 Where the first transmittance distribution TA (x, y) should be formed.

FIG. 4A shows a state in which the optical integrator 17 is viewed from the aperture stop 31 side when the aperture stop 31 for setting the first illumination condition is arranged in the illumination optical path. . In FIG. 4A, in the optical integrator 17, a symbol “A” is attached to a lens element that is not limited by the aperture stop 31. In other words, exposure (illumination) is also performed depending on the arrangement of the aperture stop 31. "A" for the lens element through which the contributing light flux passes
The symbol is attached.

Therefore, the position of the aperture stop 31 in the central region of the optical integrator 17 depends on the arrangement of the aperture stop 31.
The luminous flux passing through each of the lens elements A is superimposed on an image-forming area (exposure area) finally formed on the image-forming surface (photosensitive substrate 25) of the projection optical system 24. It is understood that a light intensity distribution that corrects the non-uniformity of the first illuminance distribution I ₃₁ (x, y) should be given to the light flux passing through the element A.

Therefore, as shown in FIG. 4 (C), each of the light transmitting portions (first transmitting elements) of the light intensity distribution adjusting filter 16 corresponding to the 32 lens elements A is obtained in step 2 described above. The first illuminance distribution I ₃₁ (x, y) can be corrected by giving the first transmittance distribution TA (x, y). The light intensity distribution adjusting filter 16
The 32 light transmitting portions (first transmitting elements) constitute a first light distribution correction unit.

Next, at step 4, the illuminance distribution is measured under the second illumination condition, and at step 5, the transmittance to be corrected under the second illumination condition is calculated. 6
The configuration of the light intensity distribution adjusting filter 16 that corrects the illuminance distribution under the second illumination condition will be described. [Step 4] In step 4, the position where the photosensitive substrate 25 is to be set under the second illumination condition (the projection optical system 2
(The position of the imaging plane No. 4). Therefore, in order to set the second illumination condition, the variable aperture stop device AS
According to 1, an aperture stop (ring stop) 32 having an annular aperture among the three types of aperture stops (30 to 32) is set in the illumination optical path. At this time, the exposure mask 23 is removed from the max stage MS or the
A parallel flat plate having the same thickness as that of the exposure mask 23 is disposed at the first position.

Next, one end of the substrate stage WS is provided.
The second illumination condition (ring
Illumination conditions by setting the aperture stop 32 having a band aperture)
The illuminance along the image plane of the projection optical system 24 is two-dimensional
The second illuminance distribution I at this time is measured in a matrix.
₃₂Find (x, y). Where x and y are the projection optical system 24
In the image plane. [Step 5] Next, in step 5, the second illumination condition
Illuminance distribution I obtained under the condition ₃₂(x, y) result
Light intensity distribution adjustment based on (measurement result in step 4)
What kind of second transmittance distribution TB (x,
y) is calculated using Equation 2 below.
You.

[0032]

## EQU2 ## where TB (x, y) = CB / I ₃₂ (x, y) where CB is a constant, and the maximum value of I ₃₂ (x, y) is 1
It is desirable to select such a value that the transmittance becomes 100%. FIG. 5 shows an illuminance distribution I (x, y) on the surface 25 to be exposed under a certain illumination condition (exposure condition) and a filter 16 capable of correcting the illuminance distribution I (x, y).
5 shows the relationship with the transmittance distribution T (x, y).

Now, the second illuminance distribution I ₃₂ (x, y) on the surface 25 to be exposed under the second illumination condition (second exposure condition) is the same as the distribution shown in FIG. I do. In this case, FIG.
If the second transmittance distribution TB (x, y) shown in FIG. 5B having the opposite characteristic to the distribution shown in FIG. 5A is given to the filter 16, the second illuminance shown in FIG. It is understood that the non-uniformity of the distribution I ₃₂ (x, y) can be corrected. [Step 6] As described above, after the second transmittance distribution TB (x, y) under the second illumination condition is determined, in step 5, the light intensity distribution adjusting filter 16 Where the second transmittance distribution TB (x, y) should be formed.

FIG. 4B shows a state when the optical integrator 17 is viewed from the aperture stop 32 side when the aperture stop 32 for setting the second illumination condition is arranged in the illumination optical path. . In FIG. 4B, in the optical integrator 17, a lens element that is not restricted by the aperture stop 32 is denoted by “B”. In other words, exposure (illumination) is also performed depending on the arrangement of the aperture stop 32. "B" for the lens element through which the contributing light flux passes
The symbol is attached.

Accordingly, the position 84 located in the peripheral area of the optical integrator 17 depends on the arrangement of the aperture stop 32.
The luminous flux passing through each of the lens elements B is superimposed on an image forming area (exposure area) finally formed on the image forming plane (photosensitive substrate 25) of the projection optical system 24, so that 84 lenses are used. It is understood that a light intensity distribution that corrects the non-uniformity of the second illuminance distribution I ₃₂ (x, y) may be given to the light flux passing through the element B.

Therefore, as shown in FIG. 4 (C), each of the light transmitting portions (second transmitting elements) of the light intensity distribution adjusting filter 16 corresponding to the 84 lens elements B is obtained in step 5 described above. By giving the second transmittance distribution TB (x, y), the second illuminance distribution I ₃₂ (x, y) can be corrected. The light intensity distribution adjusting filter 16
The 84 light transmitting portions (second transmitting elements) constitute a second light distribution correction unit.

As described above, steps 3 and 6
Finally, as shown in FIG. 4C, the filter 16 for adjusting the light intensity distribution adjusts the first transmittance distribution TA.
A central region (first light distribution correction unit) including a plurality of transmission portions having (x, y) and a peripheral region (first region) including a plurality of transmission portions having a second transmittance distribution TB (x, y). 2 light distribution correction unit)
By setting the aperture stop 31 having a small circular aperture or the aperture stop 32 having a ring-shaped aperture in the illumination optical path, the illuminance uniformity is extremely high on the photosensitive substrate 25. Can be obtained. Moreover,
Since the opening of the large σ stop 30 is the combination of the opening of the small σ stop 31 and the opening of the annular stop 32, FIG.
If the light intensity distribution adjusting filter 16 shown in (C) is set at the position shown in FIG. 1, the illuminance uniformity is extremely high on the photosensitive substrate 25 even when the large σ stop 30 is selected without any particular operation. Sex can be sufficiently obtained.

The manufacturing procedure of the light intensity distribution adjusting filter 16 according to the present invention is not limited to the order of the above steps, and it goes without saying that the order of the above steps can be changed. For example, the illuminance distribution I (x, y) under a plurality of illumination conditions is measured in advance, and the transmittance distribution T (x, y) of the filter 16 to be corrected for each illumination condition based on each measurement result. y), and finally,
The transmittance distribution T (x, y) of the filter 16 to be corrected for each illumination condition may be formed in each region of the filter 16.

By the way, in the light intensity distribution adjusting filter 16 described above, the sum of the opening of the small σ stop 31 and the opening of the annular stop 32 is set for the sake of simplicity.
An example in which the aperture is equal to the aperture of the large σ stop 30 has been described.
FIGS. 6 and 7 show an example in which the sum of the aperture of the diaphragm 31 and the aperture of the annular diaphragm 32 is not equal to the aperture of the large σ diaphragm 30.
This will be described with reference to FIG.

That is, in the following, 3 shown in FIG.
Instead of a kind of aperture stop (30-32), 3
A description will be given of a manufacturing method and a configuration of another light intensity distribution adjusting filter 160 in the case of using various kinds of aperture stops (130 to 132). The configuration of the exposure apparatus in this case is exactly the same as that of FIG.

In FIG. 6, (A) is an aperture stop (large σ stop) 130 having a large circular aperture, (B) is an aperture stop (small σ stop) 131 having a small circular aperture, (C)
Shows the state of an aperture stop (ring stop) 132 having a ring-shaped opening. The diameter of the circular aperture of the aperture stop 130 shown in FIG.
The diameter of the circular aperture of the aperture stop 131 shown in FIG.
1. When the outer diameter of the annular opening of the aperture stop 132 shown in FIG. 6C is D132 and the inner diameter of the annular opening of the aperture stop 132 shown in FIG. Are equal, and the relationship d132 <D131 <D132 holds.

In this example, three types of aperture stops (130
To 132), in order to make the illuminance uniform on the surface to be exposed (the surface of the photosensitive substrate 25), for example,
The transmittance distribution of the filter 16 can be determined by the following procedure. In order to facilitate understanding, the filter 160 of the present embodiment will be described using a procedure different from the above-described procedure for manufacturing the filter 16 shown in FIG. [Step 1] In step 1, the illuminance distribution at the position where the photosensitive substrate 25 is to be set (the position of the imaging plane of the projection optical system 24) is measured for each of the three illumination conditions (three types of aperture settings). I do. That is, the variable aperture stop AS1 shown in FIG.
, One of the three types of aperture stops (130 to 132) is sequentially set in the illumination optical path, and each time the stop is sequentially set, the illuminance along the imaging plane of the projection optical system 24 is formed into a two-dimensional matrix. Measured, the illuminance distribution I ₁₃₀ (x, y) according to the setting of the large σ stop 130 and the illuminance distribution I according to the setting of the small σ stop 131
₁₃₁ (x, y), the illuminance distribution I by setting annular stop 13 _2
132 (x, y) is obtained sequentially. At the time of illuminance measurement, the exposure mask 23 is removed from the Mac stage MS, or
Alternatively, the mask 23 for exposure is
A plane-parallel plate having the same thickness as is arranged. [Step 2] Next, the transmittance distribution of the filter 160 for correcting the illuminance unevenness (illuminance non-uniformity) included in the illuminance distribution for each illumination condition obtained by the measurement in step 1 is obtained. Prior to this, the area of the filter 160 corresponding to the opening of the small σ stop 131 and the annular stop 13
In order to correct the overlapping area with the area of the filter 160 corresponding to the second opening, the area of the filter 160 corresponding to the opening of each diaphragm (131, 132) is divided into a plurality of areas.

First, as shown in FIGS. 7A and 7B, the aperture of the small σ stop 131 for setting the first illumination condition and the annular stop 132 for setting the second illumination condition are set. Both apertures are divided into a plurality of regions in accordance with the arrangement of the lens elements constituting the optical integrator 17 in consideration of the shapes of the apertures of the apertures and the apertures. Here, FIG. 7A shows a state when the optical integrator 17 is viewed from the small σ stop 131 side when the small σ stop 131 for setting the first illumination condition is arranged in the illumination optical path. ing. FIG. 7B shows a state when the optical integrator 17 is viewed from the annular stop 132 side when the annular stop 132 for setting the second illumination condition is arranged in the illumination optical path. I have.

As can be understood from a comparison between FIGS. 7A and 7B, in FIG. 7A, in the optical integrator 17, "A" and "A" The symbol “B” is attached. In other words, “A” is assigned to a lens element through which a light beam contributing to exposure (illumination) passes even when the small σ stop 131 is disposed.
And the symbol “B”. In particular, in FIG. 7A, in the optical integrator 17, the symbol “A” is given to 16 lens elements limited by the central light-shielding portion that defines the inner diameter of the annular stop 132.

On the other hand, in FIG. 7B, in the optical integrator 17, the symbols "B" and "C" are given to the lens elements which are not restricted by the annular stop 132, in other words, the annular stop 132 The symbols "B" and "C" are given to the lens elements through which the light beam contributing to the exposure (illumination) passes even in the arrangement of. In particular, FIG.
In (B), in the optical integrator 17, “B” is assigned to 44 lens elements corresponding to a region sandwiched between the inner diameter of the annular stop 132 and the opening diameter of the small σ stop 131.
The symbol “C” is assigned to the 60 lens elements corresponding to the area between the aperture diameter of the small σ stop 131 and the outer diameter of the annular stop 132.

Next, based on each measurement result in step 1, as shown in FIG. 7C, the light transmitting portion (first transmitting portion) of the light intensity distribution adjusting filter 160 corresponding to the 16 lens elements A The first transmittance distribution TA (x, y) to be given to each of the elements, and the light transmitting portions (second transmitting elements) of the light intensity distribution adjusting filter 160 corresponding to the 44 lens elements B. The second transmittance distribution TB (x,
y), a third transmittance distribution TC (x, y) to be given to each of the light transmitting portions (third transmitting elements) of the light intensity distribution adjusting filter 160 corresponding to the 60 lens elements C is sequentially obtained. .

From the measurement results in step 1, the transmittance distribution TA (x, y) given to the portion of the filter 160 corresponding to the element lens A is given by the following equation (3).

[0048]

## EQU3 ## where TA (x, y) = C1 / {I ₁₃₀ (x, y) -I ₁₃₂ (x, y)} where C1 is a constant, and the maximum value of TA (x, y) is 1 ( That is, a value that results in a transmittance of 100%) is desirable. In the above equation 3, the illuminance distribution I when the large σ stop 130 is set
Illuminance distribution I when ₁₃₀ (x, y) and annular diaphragm 132 are set
_The transmittance distribution TA (x, y) that can correct the difference from ₁₃₂ (x, y) is obtained. In other words, this means that an aperture having the same size as the central light-shielding portion that defines the inner diameter of the annular aperture 132 is set at the position on the emission side of the optical integrator 17 shown in FIG. A transmittance distribution TA (x, x) for correcting unevenness of the illuminance distribution formed on the substrate 25.
y). Next, filter 16
The transmittance distribution TB (x, y) given to the portion corresponding to the element lens B out of 0 is obtained. Here, for the sake of simplicity, it is assumed that the optical integrator 17 has a uniform light intensity distribution on the incident surface. And calculate. The number of the element lenses A is 16 and the number of the element lenses B is 44. However, since the peripheral element lenses B protrude from the small σ stop 131, the small σ
The calculation is performed on the assumption that the number of element lenses B in the diaphragm 131 is effectively 32. The transmittance distribution TB (x, y) given to the portion corresponding to the element lens B in the filter 160 is given by the following Expression 4.

[0049]

[Expression 4] TB (x, y) = C2 / I ₁₃₁ (x, y) −16 × TA (x, y) / 32 where C ₂ is a constant, and the maximum value of TB (x, y) is A value that becomes 1 is desirable. If the meaning of the above equation 4 is written in words, it is as follows. The transmittance distribution for making the illuminance distribution I ₁₃₁ (x, y) uniform is C2 / I ₁₃₁ (x, y), but the element lens A
Since the transmittance distribution of the corresponding points are accidentally determined, in order to counteract also this effect _{-16 × T A (x, y} ) / 32 is with addition.

Next, a transmittance distribution TC (x, y) to be given to a portion of the filter 160 corresponding to the element lens C is obtained. Here, 16 element lenses A and 4 element lenses B
Although there are four lens elements and 60 element lenses C, the peripheral element lenses C protrude from the large σ stop 130, so the stop 1
Assuming that the number of element lenses C in 30 is effectively 46,
The transmittance distribution TC (x, y) is calculated. Transmittance distribution TC applied to a portion of filter 160 corresponding to element lens C
(x, y) is given by Equation 5 below.

[0051]

## EQU5 ## TC (x, y) = C3 / _I130 (x, y) -16.times.TA (x, y) /
46−44 × TB (x, y) / 46 where C3 is a constant, and it is desirable that the maximum value of TC (x, y) is 1. As described above, even if any of the aperture stops 130 to 132 is set in the illumination light path, extremely high illuminance uniformity can be obtained.

For confirmation, the illuminance distribution when the filter 160 shown in FIG. 7C is set in place of the filter 16 shown in FIG. 1 is calculated. First, the illuminance distribution I ′ ₁₃₀ (x, y) when 130 is selected for the large σ stop is
It is given by Equation 6 below.

[0053]

## EQU6 ## I ′ ₁₃₀ (x, y) = I ₁₃₀ (x, y) × ｛16 × TA (x, y) +
44 × TB (x, y) + 46 × TC (x, y)｝ / 106 By substituting Equation 6 into Equation 5, the following Equation 7 is obtained.

[0054]

I ′ ₁₃₀ (x, y) = 46 × C3 / 106 As shown in the above equation (7), I ′ ₁₃₀ (x, y) is calculated on the irradiated surface (photosensitive substrate 25). It is a constant that does not depend on each position (x, y), and it can be confirmed that the illuminance on the irradiated surface (the photosensitive substrate 25) is uniform even when 130 is selected for the large σ stop.

Next, the illuminance distribution I ' ₁₃₁ (x, y) when the small σ stop 131 is selected is given by the following equation (8).

[0056]

## EQU8 ## I ' ₁₃₁ (x, y) = I ₁₃₁ (x, y) × ｛16 × TA (x, y) +
32 × TB (x, y)｝ / 48 By substituting Equation 8 into Equation 4, the following Equation 9 is obtained.

[0057]

I ′ ₁₃₁ (x, y) = 32 × C2 / 48 As shown by the above equation (9), I ′ ₁₃₁ (x, y) is calculated on the irradiated surface (photosensitive substrate 25). It is a constant that does not depend on each position (x, y), and it can be confirmed that the illuminance on the irradiated surface (photosensitive substrate 25) is uniform even when the small σ stop 131 is selected.

Finally, the illuminance distribution I ′ ₁₃₂ (x, y) when the annular stop 132 is selected is based on the contribution of the central light shielding portion of the annular stop 132 from the illuminance distribution formed by the large σ stop 130. Is given by the following equation (10).

[0059]

I ′ ₁₃₂ (x, y) = I ₁₃₀ (x, y) × {16 × TA (x, y) + 44 × TB (x, y) + 46 × TC (x, y)} / 106 − {I ₁₃₀ (x, y) −I ₁₃₂ (x, y)} × TA (x, y) = 46 × C3 / 106 − {I ₁₃₀ (x, y) −I ₁₃₂ (x, y)} × TA (x, y) By substituting Equation 10 into Equation 3, the following Equation 11 is obtained.

[0060]

I ′ ₁₃₂ (x, y) = 46 × C3 / 106 + C1 As shown in the above equation 12, I ′ ₁₃₂ (x, y) is calculated on the irradiated surface (photosensitive substrate 25). Is constant regardless of each position (x, y), and it can be confirmed that the illuminance on the irradiated surface (photosensitive substrate 25) is uniform even when the annular stop 132 is selected.

As described above, the light intensity distribution adjusting filter 160 shown in FIG. 7C has the first transmittance distribution TA (x,
y)) and a first peripheral region (second transmission region) having a plurality of transmission portions having a second transmittance distribution TB (x, y). (A transmission region) and a second peripheral region (a third transmission region) including a plurality of transmission portions having a third transmittance distribution TC (x, y), thereby providing three types of aperture stop (130). To 132) can be obtained on the photosensitive substrate 25, even if any one of them is set in the illumination light path.

When the small σ stop 131 is set, as shown in FIG. 7A, the first transmittance distribution TA (x,
y) and a second transmission region including a plurality of transmission portions having a second transmittance distribution TB (x, y) are used for adjusting the light intensity distribution. Filter 16
0 constitutes a first light distribution correction unit. In addition, the annular diaphragm 1
When 32 is set, as shown in FIG. 7B, a second transmission region including a plurality of transmission portions having a second transmission distribution TB (x, y) and a third transmission distribution The third transmission region including a plurality of transmission portions having TC (x, y) constitutes a second light distribution correction unit of the light intensity distribution adjustment filter 160. Also, when the large σ stop 130 is set,
A first transmission region including a plurality of transmission portions having a first transmittance distribution TA (x, y) and a second transmission region including a plurality of transmission portions having a second transmittance distribution TB (x, y). The transmission region and the third transmission region including a plurality of transmission portions having the third transmittance distribution TC (x, y) are the second transmission region of the light intensity distribution adjusting filter 160.
Of the light distribution correction unit.

In the light intensity distribution adjusting filters (16, 160) shown in FIG. 4C and FIG. 4C, the illuminance distribution (illumination characteristics) at two different aperture stops (two illumination conditions). Although the example which comprised so that it became optimal was shown, in this invention, it is not limited to this. For example, the light intensity distribution adjusting filters (16, 160) according to the present invention are configured such that the illuminance distribution (illumination characteristics) at two or more different aperture stops (two or more illumination conditions) is optimized. Is also possible.

In the light intensity distribution adjusting filters (16, 160), for example, an aperture stop or the like is used.
Although an example has been shown in which the illuminance distribution (illumination characteristics) is optimized when the shape of the next light source is switched from a circular shape to a ring shape (from a ring shape to a circular shape), the filter (16, 160) according to the present invention employs an example. Optimum illuminance distribution (illumination characteristics) when switching the shape of the secondary light source from a circular shape to a quadrupole shape (quadrupole shape to circular shape) or a ring shape to quadrupole shape (quadrupole shape to ring shape) It can be configured to be. In the example shown in FIG. 1, in order to change the illumination condition, the variable aperture stop AS1 is used to change the light flux.
The part was light-shielded. However, the collimating optical system 1
4 is a variable magnification optical system, and when one of the large σ stop 30 and the small σ stop 31 is set by the variable aperture stop device AS1, if the magnification of the collimating optical system 14 is changed, high illumination efficiency can be obtained. The lighting conditions can be changed under the conditions. In the case of the example shown in FIG. 1, in the optical path between the collimating optical system 14 and the filter 15, as shown in JP-A-5-251308, an optical member having a convex conical refracting surface and a concave An annular light beam forming optical system having an optical member having a convex refracting surface is detachably provided, and the annular light beam forming optical system is set in the optical path when the annular stop 32 is set by the variable aperture stop device AS1. Thus, efficient illumination can be achieved even during annular illumination.

Although a fly-eye lens is used as the optical integrator 17 in FIG.
As shown in FIG. 8A and FIG. 8B, an optical pipe or the like (an internal reflection type rod member or the like) may be used. It may be a rod. In this case, as shown in FIGS. 8A and 8B, a filter (1) is used instead of the fly-eye lens 17 shown in FIG.
6, 160), an optical pipe 41 for receiving the light condensed by the condensing lens 40 at the incident end, and a collimating lens for collimating the light emitted from the exit end of the optical pipe 41. 42 are arranged in order from the light source side. Here, as shown in FIG. 8A, the filter (16, 160) and the exit end of the optical pipe 41 are optically connected to the surface to be illuminated (mask 23) or the surface to be exposed (photosensitive substrate 25). Conjugate,
Further, as shown in FIG.
The position of the entrance end 1 and the positions of the interchangeable aperture stops (30 to 32) by the variable aperture stop device AS1 are optically conjugate with the pupil of the projection optical system 24 or the illumination optical system. Now,
FIG. 1 shows an example of an exposure apparatus using only one optical integrator 17, but the filter (16, 160) according to the present invention employs a configuration using two optical integrators as shown in FIG. May be.

The device shown in FIG. 9 differs from the device shown in FIG. 1 in that the light source unit 1 supplies laser light such as excimer laser light, and that the light source unit 1 and the filter (16,
160) is that the optical integrator 117 and the condensing optical system 118 are arranged in the optical path between the optical integrator 117 and the light condensing optical system 118. Here, the incident surface of the optical integrator 117 on the light source side and the incident surface of the optical integrator 17 on the exposed surface side are optically conjugate with the illuminated surface (mask 23) or the exposed surface (photosensitive substrate 25). In addition, the filters (16, 160) are almost optically conjugate with the surface to be illuminated (mask 23) or the surface to be exposed (photosensitive substrate 25).

Hereinafter, a brief description will be given of a schematic configuration of the exposure apparatus according to the second embodiment shown in FIG. Light source unit 1 includes a excimer laser light source or a wavelength such as F ₂ laser light source for supplying laser light of 157nm light source supplies a laser beam having a wavelength of 248 nm (KrF) or wavelength 193 nm (ArF), from the light source It has a beam forming optical system for shaping the supplied light beam, and an optical delay optical system for reducing speckles and the like generated on the irradiated surface.

Then, the laser beam (approximately parallel light beam) having a predetermined wavelength supplied from the light source unit 1 is incident on the first optical integrator (first flyer lens) 117. Then, on the emission side of the fly-eye integrator 117, the same number of light-condensing points (light source images) as the number of lens elements constituting the fly-eye integrator 117 are formed, and a secondary light source is substantially formed here. The light beam group from the secondary light source is condensed by the first condensing optical system 118 and illuminates the incident surface of the second optical integrator (second flyer lens) 17 in a superimposed manner.

When a large number of light beams from the secondary light source enter the second optical integrator 17 as described above, a large number of lenses constituting the first optical integrator 117 are provided on the exit side of the second optical integrator 17. A number of light condensing points (light source images) equal to the product of the number of elements and the number of lens elements constituting the second optical integrator 17 are formed, where a tertiary light source (surface light source) is substantially formed. Is formed. As a result, in this example, the number of optical integrators increased by one,
Since a larger number of light beams from the tertiary light source (surface light source) illuminate the illuminated surface (mask 23) and the exposed surface (photosensitive substrate 25) in a superimposed manner, the illuminated surface (mask 23) and the exposed surface The illuminance distribution on the (photosensitive substrate 25) becomes even more uniform.

At the position of the tertiary light source (surface light source), mutually interchangeable aperture stops (30 to 32) are provided by a variable aperture stop device AS1, and the tertiary light source is provided by the variable aperture stop device AS1. By determining the size and shape of the (surface light source), the illumination condition (or exposure condition) on the surface to be illuminated (mask 23) or the surface to be exposed (photosensitive substrate 25) is defined. The arrangement and function of the optical system on the exposed surface (photosensitive substrate 25) side of the interchangeable aperture stops (30 to 32) by the variable aperture stop apparatus AS1 are shown in FIG.
The description is omitted because it is the same as the example shown in FIG.

Although the fly-eye lens is used as the optical integrator in FIG. 9, it goes without saying that an optical integrator other than the fly-eye lens may be used. The optical pipe described above can be used as an optical integrator other than the fly-eye lens. Of course, as the first and second optical integrators, a diffractive optical element and a large number of macro lenses are arranged in parallel. Also, an element such as a macro fly-eye lens can be used. Further, a diffusion plate or the like can be used as the first optical integrator.

When a configuration including two optical integrators as shown in FIG. 9 is employed, the light intensity distribution adjusting filter (illuminance distribution adjusting filter) 16 is provided on the incident side of the second optical integrator 17 as shown in FIG. It is desirable to dispose it on a plane optically conjugate with the object to be illuminated 23 (object to be exposed 25). This is because the object 23 to be illuminated on the incident side of the first optical integrator 117 is desired.
This does not deny a configuration in which the light intensity distribution adjusting filters (16, 160) are arranged on a plane optically conjugate with the (exposure target object 25).

In the description of each of the above embodiments, the illuminance distribution of the illuminated object 23 (the exposed object 25) is represented by I (x, y).
The transmittance distribution in the light intensity distribution adjusting filters (16, 160) is defined as T (x, y), and each is a two-dimensional function of x and y.
In this case, an exposure apparatus such as a step-and-repeat method for performing a batch exposure after the stationary apparatus 5 is stopped is considered. The present invention is applicable to an exposure apparatus other than this method, and is also applicable to scan exposure (step-and-scan type exposure or the like) in which exposure is performed while moving the mask 23 and the photosensitive substrate 25. Can be.

For example, in order to perform scanning exposure using the exposure apparatus shown in FIG. 9, during exposure, as shown by the arrow, the mask stage MS holding the mask 23 and the substrate stage WS holding the photosensitive substrate 25 are moved in the X direction ( (Scan direction), the pattern image on the entire surface of the mask is projected and exposed on the photosensitive substrate 25 by the projection optical system 24.

At this time, the illumination target 23 (the exposure target 2
As shown in FIG. 9, the illuminance unevenness in 5) only needs to consider a non-scan direction (Y direction) perpendicular to the scan direction (X direction). That is, the illuminance unevenness in the scan exposure generally takes into account the illuminance value (light intensity) obtained by integrating the illuminance in the scan illumination area along the scan direction formed on the photosensitive substrate 25. In the illuminance distribution to be considered in the above, the illuminance value (light intensity) integrated in the scanning direction of the scanning illumination area is Is, and the value Is is a one-dimensional function in the non-scanning direction (Y direction), that is, Is.
(X). For this reason, the transmittance distribution Ts in each micro area to be formed in the light intensity distribution adjusting filters (16, 160) is also a one-dimensional function in the non-scanning direction (Y direction), that is, Ts (X). Can handle. In other words, when the optical integrator 17 is a fly-eye lens, the optical integrator 17 is formed in a portion corresponding to each lens element in the fly-eye lens in the light intensity distribution adjustment filter (16, 160) in the scan exposure machine. For example, a pattern having a constant transmittance in the scanning direction and having a transmittance distribution Ts (X) such that the transmittance changes only in the non-scanning direction can be used.

In the example shown in FIG. 9, a part of the light beam is shielded by using the variable aperture stop AS1 in order to change the illumination condition. However, when one of the large σ stop 30 and the small σ stop 31 is set by the variable aperture stop device AS1, it is high if at least one of the optical integrator 117 and the condensing optical system 118 is a variable magnification optical system. The lighting conditions can be changed under the lighting efficiency. Also, in the case of the example shown in FIG. 1, the optical path between the light source unit 1 and the filter 15
As shown in -251308, an annular luminous flux forming optical system having an optical member having a convex conical refracting surface and an optical member having a concave conical refracting surface is detachably provided, and a ring formed by a variable aperture stop apparatus AS1 is provided. If the annular light beam forming optical system is set in the optical path when the band stop 32 is set, efficient illumination can be performed even during annular illumination.

The optical members and the stages (MS, WS) shown in FIGS. 1 and 9 are electrically, mechanically or optically connected so as to achieve the functions described above. The exposure apparatus according to the present invention can be assembled. In each of the exposure apparatuses shown in FIGS. 1 and 9, a sensor IS for measuring illumination characteristics (exposure characteristics) on a surface to be exposed (the surface of the photosensitive substrate 25) is provided with a substrate stage WS.
Has been described, but a sensor for measuring the illumination characteristics on the surface to be illuminated (the surface of the mask 23) may be provided at one end of the mask stage MS. Further, both stages (MS, WS) ) May be provided with sensors for measuring the illumination characteristics.

Next, a predetermined circuit pattern is formed on a wafer or the like as a photosensitive substrate using the projection exposure apparatus of each of the embodiments shown in FIGS. An example of a method for obtaining a semiconductor device will be described with reference to the flowchart in FIG. First, in step 301 of FIG. 10, a metal film is deposited on one lot of wafers. In the next step 302, a photoresist is applied on the metal film on the one lot of wafers. Thereafter, in step 303, using one of the projection exposure apparatuses shown in FIGS. 1 and 9, the image of the pattern on the mask (reticle) 23 is transferred onto the wafer 25 of the lot through the projection optical system 24. Are sequentially transferred to each shot area. Thereafter, in step 304, after the photoresist on the one lot of the wafer is developed, step 305 is performed.
In the above, the circuit pattern corresponding to the pattern on the mask 23 is formed in each shot area on each wafer 25 by performing etching on the one lot of wafers using the resist pattern as a mask. After that, by forming a circuit pattern of a further upper layer,
Devices such as semiconductor elements are manufactured.

According to the above-described semiconductor device manufacturing method,
A semiconductor device having an extremely fine circuit pattern can be obtained with high throughput. In the projection exposure apparatus of each embodiment shown in FIGS. 1 and 9 described above, a liquid crystal display element as a micro device can be obtained by forming a predetermined circuit pattern on a plate (glass substrate). . Hereinafter, an example of the technique at this time will be described with reference to the flowchart in FIG. 7 with reference to the flowchart in FIG.

In FIG. 11, a pattern forming step 40 is performed.
In 1, a so-called photolithography process of transferring and exposing a reticle pattern to a photosensitive substrate (a glass substrate coated with a resist) using the exposure apparatus of the present embodiment is performed. By this photolithography process, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to various steps such as a developing step, an etching step, and a reticle peeling step, so that a predetermined pattern is formed on the substrate, and the process proceeds to the next color filter forming step 202.

Next, in a color filter forming step 402, a color filter is formed in which a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix. Then, after the color filter forming step 402, a cell assembling step 403 is performed. In the cell assembling step 403, a pattern forming step 4
A liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in step 01, the color filter obtained in the color filter forming step 402, and the like. In the cell assembling step 403, for example, a liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step 401 and the color filter obtained in the color filter forming step 402, and a liquid crystal panel (liquid crystal cell) is formed. ) To manufacture.

Thereafter, in a module assembling step 404, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described liquid crystal display element manufacturing method, a liquid crystal display element having an extremely fine circuit pattern can be obtained with high throughput.

[0083]

As described above, according to the present invention, an illumination apparatus and an exposure apparatus which can realize extremely good illumination characteristics (illuminance uniformity) under various illumination conditions (each exposure condition) with a relatively simple structure. A device can be obtained. Further, if an exposure method and a method for manufacturing a micro device using these apparatuses are performed, a very good micro device with a low yield can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of an exposure apparatus according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating an arrangement of reticle elements constituting an optical integrator 17;

FIG. 3 is a diagram showing three kinds of aperture stops 30 to 32 which can be exchanged with each other;

FIG. 4A is a diagram illustrating a relationship between an aperture stop 31 and an optical integrator 17 when the aperture stop 31 is set.
FIG. 4B is a diagram showing a relationship between the optical system and the optical integrator 17 when the aperture stop 32 is set. FIG. 4C is a diagram showing the configuration of the light intensity distribution adjusting filter 17 when the three types of aperture stops 30 to 32 shown in FIG. 3 are used.

FIG. 5A is a diagram showing a state of an illuminance distribution on a surface to be irradiated. (B) is a diagram showing a state of a transmittance distribution in the light intensity distribution adjusting filter 17 that can correct the illuminance distribution shown in (A).

FIG. 6 shows three types of aperture stops 130 to 13 which are interchangeable.
It is a figure which shows the situation of 2.

FIG. 7A is a diagram showing a relationship between an optical stop and an optical integrator 17 when an aperture stop 131 is set.
FIG. 7B is a diagram showing a relationship between the optical integrator 17 when the aperture stop 132 is set. (C)
FIG. 7 is a diagram illustrating a configuration of a light intensity distribution adjusting filter 17 when three types of aperture stops 130 to 232 illustrated in FIG. 6 are used.

FIG. 8 is a diagram showing a configuration when the fly-eye lens 17 shown in FIG. 1 is changed to an optical pipe.

FIG. 9 is a diagram showing a configuration of an exposure apparatus according to a second embodiment of the present invention.

FIG. 10 is a flowchart showing a method for manufacturing a semiconductor device as a micro device.

FIG. 11 is a flowchart showing a method for manufacturing a liquid crystal display element as a micro device.

[Explanation of symbols]

1 Light source unit 17 Optical integrator 16, 160 Filter for adjusting light intensity distribution 18 Condensing optical system 19 Field stop 20 ... Front group of relay optical system 22... Rear group of relay optical system 23... Mask (reticle) 24... Projection optical system 25. 30, 31, 32, 130, 131, 132 ... Aperture stop

 ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 5F046 BA03 CA02 CA04 CB05 CB08 CB13 CB23 DA01 DB01 DC03 DC12

Claims (12)

[Claims] 1. A light source means for supplying illumination light, and one of a first light distribution and a second light distribution different from the first light distribution is determined based on the illumination light from the light source means. A light distribution varying means formed at a position, a light guide system for guiding illumination light from the light distribution varying means to an object to be illuminated, and a light guide system arranged in an optical path between the light source means and the object to be illuminated Adjusting means for adjusting an illumination characteristic of the illumination object; the adjustment means configured to correct a first illumination characteristic formed on the illumination object by the first light distribution; A first light distribution correction unit having characteristics,
A second optical characteristic having a predetermined second optical characteristic for correcting a second illumination characteristic formed on the illumination object by the light distribution of
And a light distribution correction unit. 2. The apparatus according to claim 1, wherein the first light distribution correction section and the second light distribution correction section are formed in different areas along a predetermined plane crossing an optical path of the illumination light. The lighting device according to claim 1. 3. The first light distribution correction section, wherein the first light distribution correction section and the second light distribution correction section are formed along a predetermined surface crossing an optical path of the illumination light. The lighting device according to claim 1, wherein the second light distribution correction unit is formed in a part of the area. 4. The first light distribution correction section includes: a first transmission region including a plurality of transmission elements having a predetermined first transmittance distribution; and a predetermined transmission region different from the first transmittance distribution. A second transmissive area including a plurality of transmissive elements having a second transmissivity distribution, wherein the second light distribution correction unit includes a plurality of transmissive elements having a predetermined third transmissivity distribution 2. The apparatus according to claim 1, further comprising a third transmission region and a fourth transmission region including a plurality of transmission elements having a predetermined fourth transmittance distribution different from the third transmittance distribution. The lighting device according to claim 3. 5. The first light distribution correction unit has a first transmission region including a plurality of transmission elements having a predetermined first transmittance distribution, and the second light distribution correction unit includes: 4. The apparatus according to claim 1, further comprising a second transmission region including a plurality of transmission elements having a predetermined second transmittance distribution different from the first transmittance distribution. 5. The lighting device according to claim 1. 6. An optical integrator for forming a secondary light source at the predetermined position or at a position optically conjugate to the predetermined position based on the illumination light, the light distribution varying means; The lighting device according to any one of claims 1 to 5, further comprising changing means for changing a light distribution at a position optically conjugate with the predetermined position. 7. The illumination device according to claim 6, wherein said changing means has a variable aperture stop for changing a shape or a size of a secondary light source formed by said optical integrator. 8. A lighting device according to claim 1, wherein said mask has a predetermined pattern formed thereon, and a projection for projecting an image of said mask onto a photosensitive substrate. An exposure apparatus comprising: 9. A first illumination characteristic at a position where a mask on which a predetermined pattern is formed is set or a position where a photosensitive substrate on which a pattern of the mask is to be exposed is set. A first measurement step for obtaining under a condition; a first correction step of providing a predetermined first light distribution for correcting a first illumination characteristic based on a result of the first measurement step; A second measurement step of obtaining a second illumination characteristic at a position to be set or a position at which the photosensitive substrate is to be set under a second illumination condition; and based on a result of the second measurement step. A second correction step of providing a predetermined second light distribution for correcting a second illumination characteristic; and after each of the correction steps, illuminating the mask and exposing a pattern image of the mask to a photosensitive substrate. An exposure method, comprising: an exposure step. 10. The first correction step includes forming a first light distribution correction section for providing the first light distribution on an illumination light path, wherein the first light distribution correction section includes a predetermined light distribution correction section. A first transmission region including a plurality of transmission elements having a first transmittance distribution, and a second transmission region including a plurality of transmission elements having a predetermined second transmittance distribution different from the first transmittance distribution. A second light distribution correcting unit that provides the second light distribution in an illumination light path, wherein the second light distribution correcting unit includes: A third transmission region including a plurality of transmission elements having a predetermined third transmittance distribution, and a third transmission region including a plurality of transmission elements having a predetermined fourth transmittance distribution different from the third transmittance distribution. The exposure method according to claim 9, wherein the exposure method includes at least four transmission regions. 11. The first correction step includes forming a first light distribution correction section for providing the first light distribution in an illumination light path, wherein the first light distribution correction section includes a predetermined light distribution correction section. A first transmission area including a plurality of transmission elements having a first transmittance distribution; and a second correction step includes: providing a second light distribution correction unit for providing the second light distribution to an illumination light path. Forming, wherein the second light distribution correction unit has a second transmission region including a plurality of transmission elements having a predetermined second transmittance distribution different from the first transmittance distribution. The exposure method according to claim 9, wherein: 12. A method for manufacturing a micro device, comprising manufacturing a micro device using the exposure method according to claim 9. Description: