JP2001106815A - Highly adhesive olefinic resin composition and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a hydrophilic polyurethane resin adhesive agent to adhere to the surface of an olefinic resin composition which is low in wettability. SOLUTION: A polyamide resin of 1-15 wt.% is mixed with an olefinic thermoplastic resin of 99-85 wt.%, and the mixture is held at a specified temperature for development into an alloy-like composition. The surface of the alloy-like composition is irradiated with 70-80 deg.C low-temperature plasma. The surface is thereby enhanced in wettability, which in turn increases the adhesiveness of a hydrophilically polar polyurethane resin to the surface.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polyolefin resin composition capable of adhering a urethane-based adhesive to a polyolefin resin material without applying a special treatment such as primer coating to the surface thereof. In particular, while adding an appropriate amount of polyamide-based resin to the polyolefin-based resin, and irradiating the low-temperature plasma to the urethane-based adhesive, the wettability of the surface portion is improved. And a high-adhesive olefin-based resin composition as described above.

[0002]

2. Description of the Related Art Generally, when an attempt is made to bond another member to the surface of a polyolefin resin material using a urethane resin adhesive, the above polyolefin resin has poor wettability. The urethane adhesive does not adhere. Therefore, conventionally, a predetermined primer material is applied in advance to the surface to which the adhesive is applied, and the surface is modified. That is, a primer treatment is performed, and the urethane-based adhesive is applied to the modified surface on which the primer treatment has been performed to bond other members.

[0003]

By the way, performing the above-mentioned primer treatment (primer application) requires a complicated work, which is not preferable in terms of work efficiency. In addition, instead of such a primer treatment, there is a method of modifying the surface of the olefin resin material by irradiating the surface of the olefin resin material with plasma. It is necessary to irradiate for a long time. Therefore, there is a problem that the strength of the material is degraded by, for example, whitening of the surface of the material. In order to solve such a problem, an appropriate amount of polyamide-based resin is mixed into an olefin-based resin material in the form of an alloy, and the surface of such an alloy-like composition is bonded by applying low-temperature plasma irradiation. It is an object (problem) of the present invention to provide a high-adhesive olefin-based resin composition having improved properties.

[0004]

Means for Solving the Problems In order to solve the above problems, the present invention takes the following measures. That is, based on an olefin-based thermoplastic resin, an olefin-based resin composition having an appropriate amount of a polyamide-based resin in the form of an alloy therein is prepared in an amount of 99 to 85% by weight of the olefin-based resin. A configuration is adopted in which 1 to 15% by weight of a system resin is mixed, and the surface of the alloy-like composition having such a configuration is irradiated with plasma.

By adopting such a constitution, in the present invention, a trace amount of water contained in the polyamide resin mixed in the composition is modified by plasma irradiation to form hydroxyl radicals. Then, the hydrophilic urethane-based adhesive is bonded (adhered) from this point. As a result, in general, an olefin-based resin composition having poor wettability and having a property of not easily adhering to a urethane-based adhesive has high adhesiveness when subjected to the plasma irradiation. In such a surface modification operation, low-temperature plasma means having a temperature of 70 ° C. to 80 ° C. is used for plasma irradiation used in the present invention. No whitening of the part.

Next, the invention according to claim 2 will be described. This is also basically the same as the first aspect. The feature is that it relates to a method for producing a highly adhesive olefin resin composition.
That is, in the present invention, a method for producing a high-adhesive olefin resin composition is described by blending 5 parts by weight of maleic anhydride and 2 parts by weight of benzoyl peroxide (BPO) with 100 parts by weight of a polypropylene resin. And reacting them at a predetermined temperature, thereby producing a maleic acid-modified polypropylene product (C). The polyamide (B) is reacted with 30 parts by weight of the product (C) thus produced. A step of mixing 70 parts by weight of the 6-series resin and maintaining the mixture at a predetermined temperature to form a polyamide-based resin (B) composed of a polyamide-polypropylene alloy; B) mixing 8 to 15 parts by weight with 92 to 85 parts by weight of the olefin resin (A); A step of performing a predetermined plasma irradiation on the surface portion of the mixture formed in this way, we decided to take steps so as to consist of. By adopting such a process, the polyamide-based resin and the olefin-based resin are integrally melted in an alloy shape, and the polyamide-based resin thus integrated becomes hydrophilic by being irradiated with plasma. To form a reactive base point for sex. Then, through these steps, the wettability of the surface portion of the resin composition is improved. Therefore, a hydrophilic urethane-based resin adhesive comes to adhere (adhere) to the surface portion having improved wettability.

[0007]

FIG. 1 shows an embodiment of the present invention.
This will be described with reference to FIG. Although it relates to the present embodiment, the structure thereof is composed of 99 to 85% by weight of an olefin-based resin and 1 to 15% by weight of a polyamide-based resin, wherein these are fused in an alloy. It is based on what consists of. And although it has such a structure, the irradiation surface temperature is about 70 ° C. to 80 ° C.
It is assumed that low-temperature plasma is applied.

In the resin having such a structure, the olefin resin is typically a polyethylene resin (PE) or a polypropylene resin (P
P). Among these olefin-based resins, preferred is a polypropylene (PP) -based resin. Specific examples include propylene homopolymer, random copolymer or block copolymer of propylene-ethylene, and modified polypropylene to which ethylene-propylene rubber is added. Also,
Examples of the polyamide-based resin include those belonging to aliphatic polyamides such as polyamide-6, polyamide-66, and polyamide-12. In addition, what is actually used includes a homopolymer or a copolymer of these, or a polymer alloy containing these as a main component.
Among these, the most preferable one is polyamide-6. Particularly, in consideration of the compatibility with the olefin resin, in the present embodiment, the polyamide-
6 are employed.

Next, a specific example (embodiment) of the present composition having such a configuration will be described with reference to FIG. First, a polypropylene (PP) block copolymer is used as the olefin resin (A). Polyamide-6 is used as the polyamide-based resin (B) to be mixed with the olefin-based resin (A). In the present embodiment, the polyamide-6 is directly made of the polypropylene (PP). Instead of being mixed into the block copolymer, it is mixed as a polyamide-PP alloy (B) formed through the following steps. The procedure and the like will be described below.

First, 100 parts by weight of a polypropylene resin, 5 parts by weight of maleic anhydride, and 2 parts by weight of benzoyl peroxide (BPO) are mixed and reacted at a temperature of about 200 ° C. This gives a maleic acid-modified polypropylene product (C). Next, the product (C)
70 parts by weight of polyamide-6 are mixed with 30 parts by weight, and the mixture is melt-mixed by maintaining the mixture at a temperature of about 250 ° C. As a result, a desired polyamide resin (B) composed of a polyamide-PP alloy is produced.

The olefin-based resin (A) and the polyamide-based resin (B) thus produced are mixed at a weight ratio of 92: 8 (Example 1) or 85: 1.
5 (Example 2). Then, a predetermined plasma irradiation is performed on the surface of these components. For the embodiment thus formed,
FIG. 2 shows the adhesion strength test results of a sample in which a predetermined urethane resin adhesive was applied to the surface and a soft polyvinyl chloride (PVC) member was adhered to such a surface. . As a sample, as shown in FIG. 1, a rectangular member (manufactured by PVC) having a thickness of 5 mm and a width (D) of 8 mm was prepared, and this was coated on the surface of the olefin resin composition formed in the above process. Are adhered in a state where a predetermined urethane resin adhesive is applied. The sample thus formed is pulled at a predetermined speed (50 mm / min) in the direction of the arrow in FIG. Then, the peeling load per unit length at the bonding portion (the portion having the bonding width D) at this time is defined as the bonding strength.

[0012] The results are as follows. First, for a sample having an appropriate amount of polyamide resin and a plasma irradiation time of 10 seconds per 50 cm, a predetermined adhesive strength (peel strength) was obtained as shown in Examples 1 and 2. On the other hand, when the plasma irradiation time was increased to 20 seconds or 40 seconds as shown in Comparative Examples 1, 2, and 3 for those containing no polyamide resin, The adhesive strength (peel strength) has not been improved. This means
The presence of a polyamide resin having hydrophilic polarity has an important meaning. However, in the case of Comparative Example 4 in which the amount of such a polyamide-based resin was extremely increased, the resin exhibited a peeling phenomenon and did not exhibit sufficient adhesive strength. From these facts, it is appropriate that the mixing ratio of the polyamide resin to the olefin resin is in the range of 1% to 15% by weight, and the amount of the hydrophilic polyamide resin is extremely increased. However, it is not possible to improve the adhesiveness.

[0013]

According to the present invention, based on an olefin-based thermoplastic resin, an olefin-based resin composition having an appropriate amount of a polyamide-based resin in the form of an alloy therein contains 99 to 85 wt. %, The above-mentioned polyamide resin is mixed therein in an amount of 1 to 15% by weight, and an alloy composition is formed by maintaining a mixture composed of these components at a predetermined temperature. In the olefin-based resin composition that is irradiated with the low-temperature plasma composed of the temperature of the above, the wettability of the surface portion thereof is increased, and the adhesiveness of the urethane-based resin adhesive having a hydrophilic polarity is improved. Now it can be enhanced. That is,
Through the above steps, a high-adhesive olefin-based resin composition can be obtained.

[Brief description of the drawings]

FIG. 1 is a diagram showing the contents of an adhesive strength test in the present invention.

FIG. 2 shows a test result (experimental example) on the adhesive strength of the olefin resin composition according to the present invention.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 23:26) C08L 23:26) (72) Inventor Yasuo Kinoshita Daifuji Sobue, Sobue-cho, Nakajima-gun, Aichi Prefecture 221 at Kuma 2 Sakae RIKEN KOGYO CO., LTD. F-term (reference) 4F073 AA01 BA06 BA07 BA08 BB01 CA01 4J002 BB031 BB121 BB201 BB213 BP021 CL002 CL012 CL032 GJ01

Claims (2)

[Claims] 1. An olefin-based resin composition having an appropriate amount of a polyamide-based resin in the form of an alloy based on an olefin-based thermoplastic resin, wherein 99 to 85 weight percent of the olefin-based resin is prepared. The above-mentioned polyamide-based resin is mixed in an amount of 1 to 15% by weight, and the surface of the alloy-like composition having the above structure is irradiated with plasma, whereby the property having good wettability with respect to the urethane-based resin adhesive is obtained. A highly adhesive olefin-based resin composition characterized by having a configuration to have. 2. 100 parts by weight of a polypropylene resin are blended with 5 parts by weight of maleic anhydride and 2 parts by weight of benzoyl peroxide (BPO), and these are reacted at a predetermined temperature, whereby maleic acid is mixed. Producing a modified polypropylene product (C), and 30 parts by weight of the product (C) thus produced,
Mixing 70 parts by weight of a polyamide-6-based resin and maintaining the mixture at a predetermined temperature to form a polyamide-based resin (B) made of a polyamide-polypropylene alloy; Mixing 8 to 15 parts by weight of the resin (B) and 92 to 85 parts by weight of the olefin resin (A), and subjecting the surface of the mixture thus formed to predetermined plasma irradiation; A method for producing a highly adhesive olefin-based resin composition, comprising: