JP2001105600A - Liquid jet recording head and producing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the lowering of a printing grade by eliminating the line width difference of a pattern corresponding to a mask boundary part caused by focus shift at the time of exposure of each mask and making the difference in level of printing density gentle to make the same inconspicous in a method for producing a liquid jet recording head forming respective layers of heaters, wiring and liquid channels by exposure performed plural times using a plurality of masks. SOLUTION: Patterns 11a, 12a are respectively formed to two masks Ha1, Hb2 used for patterning a heater material and patterns 11a and non-pattern parts 11b are alternately formed to the region 1p corresponding to eight patterns of the mask Ha while patterns 12a and non-pattern parts 12b are alternately formed to the region 2p of the other mask Hb and the respective patterns of the boundary part of them are arranged in a telescopic state. Exposure is performed successively by using the masks Ha1, Hb2 to perform patterning and heater patterns 11x, 12x having no line width difference in the boundary part are formed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid ejecting recording head for ejecting a recording liquid as droplets from fine ejection nozzles to perform recording on a recording medium, and a method for manufacturing the same. And manufacturing technology of the recording element substrate.

[0002]

2. Description of the Related Art A liquid jet recording head used in a liquid jet recording system (inkjet recording system) has a plurality of fine discharge nozzles (orifices) for discharging a recording liquid such as ink, and a plurality of discharge nozzles communicating with the discharge nozzles. A liquid path and a discharge energy generating element positioned in each liquid path, applying a drive signal corresponding to recording information to the discharge energy generating element, and recording liquid in the liquid path in which the discharge energy generating element is positioned. By applying ejection energy to the recording medium, the recording liquid is ejected from a fine ejection nozzle as flying droplets, and recording is performed on a recording medium.

In a conventional liquid jet recording apparatus, a device that discharges minute droplets using thermal energy, a device that discharges minute droplets using an electromechanical transducer, or a composite of these devices is used. What discharges a minute liquid droplet is known. Among these, a liquid jet recording head that discharges a recording liquid by using thermal energy includes a plurality of heating elements or electrothermal conversion elements (hereinafter, also simply referred to as heaters) and a plurality of discharge nozzles as discharge energy generating elements. Since they can be arranged at a high density, high-resolution recording can be performed, and further, there are advantages such as easy downsizing.

As a method of manufacturing a liquid jet recording head using such a plurality of heaters, the following method has been conventionally known, and will be described with reference to FIGS.

First, a first substrate 10 on which a heat storage layer is formed
A material for a heater is deposited on the mask 1 and a mask H3 shown in FIG.
Exposure is performed using 01 to form a heater material in a predetermined pattern. A required number of mask patterns 311 are formed in parallel on the mask H301, and photolithography process procedures such as application of a resist, exposure through the mask H301, development, etching of a heater material, and removal of the resist. The heater patterns (patterns having shapes as exemplified by 311x and 312x in FIG. 7C) manufactured by the above are formed in parallel by a predetermined number.

[0006] Next, a wiring material such as Al is deposited on the first substrate 101, and is exposed using a mask L303 shown in FIG. Is formed in a predetermined pattern. Note that a required number of mask patterns 313 are also formed in parallel in the mask L303, and are formed by photolithography process procedures such as application of a resist, exposure through a mask, development, etching of a wiring material, and removal of the resist. Wiring patterns to be manufactured (patterns having shapes as exemplified by 313x and 314x in FIG. 8B) are formed in parallel by a predetermined number. The missing portions of each wiring pattern become heat generating portions, and the heater 10
Acts as 2. Thereafter, a heater protective film or the like is formed thereon as appropriate.

Next, as shown in FIG.
A solid layer 103 made of a positive resist is illustrated in FIG. 6C on the first substrate 101 at the liquid passage scheduled portion and the liquid chamber scheduled portion corresponding to the heater 102, similarly to the formation of the heater and the wiring. Using a mask N305 to be formed.

Then, as shown in FIG. 2B, a second substrate 104 to be a common liquid chamber and a liquid supply port is placed thereon.

Next, as shown in FIG. 2C, a resin 105 to be a wall of a liquid path later is injected into a gap between the first substrate 101 and the second substrate 104, and the resin 105 is cured. Let it. After that, the second substrate 104 and the resin 105 are cut at a portion indicated by a dashed line in FIG.
The space 6 is processed and formed, and as shown in FIG. 2D, a liquid chamber sealing plate 107 is adhered to the upper portion of the space using an adhesive to form a common liquid chamber 106.

Next, to form the discharge port 108, the orifice portion of the discharge port 108 is cut. Fig. 2
(D) is indicated by a two-dot chain line.

Thereafter, as shown in FIG. 2F, the solid layer 103 is removed, and the portion is used as a liquid path 109.

Next, a head driving IC 110 including a shift register circuit, a latch circuit, an output transistor of each bit and the like necessary for driving the recording head is mounted on the first substrate 101 by solder flip chip bonding or anisotropically. A bare chip is mounted in a face-down manner using the conductive conductive film (ACF) 111. Head driving IC 110
Between the first substrate 101 and each ejection energy generating element,
A power supply, a ground, and bump terminals for input signals such as image data and clock signals are electrically connected via metal particles in the ACF. Further, the head driving IC is firmly held on the first substrate by the thermosetting resin (FIG. 2 (g)).

With respect to the recording head thus manufactured,
Further, the printed wiring board is electrically connected to the first substrate 101 by means such as wire bonding to a printed wiring board provided with a connector and an electric component for connection with the printer main body. Connect to
It constitutes a liquid jet recording head.

By the way, in the manufacture of a long recording head in which the length of the recording head in the nozzle row direction exceeds 200 mm (8 inches), the pattern of each layer is formed by the nozzle due to the limitation of the exposure apparatus and the mask size. It must be divided into at least two masks in the column direction, and patterning must be performed by a plurality of exposures. For this reason, the mask H for patterning the heater material, the mask L for patterning the wiring material, and the mask N for patterning the solid layer at the liquid passage planned portion correspond to the length of the recording head in the nozzle row direction. It is formed by simply bisected at the center or near the pattern to be formed, in FIG. 7 (a), as shown in (a) and 9 of Figure 8, respectively, of the two masks H _a 301, H _b 302; 2 masks _{L a 303, L b 304;} 2 masks N _a 305,
_Nb 306 is prepared and one mask is used to perform exposure on one side, and then the other mask is used to perform exposure while aligning the remaining portion so as to make up for the remaining portion. A predetermined number of patterns are formed.

For example, the patterning of the heater material will be described as an example. Referring to FIG.
After a heater material is deposited thereon and a resist is applied thereon, the left portion A of the first substrate 101 shown in FIG. 7B is masked using _a mask Ha 301 shown in FIG. After exposure, the right portion B of the first substrate 101 is
Is exposed after alignment using a mask _Hb 302 shown in FIG. Thereafter, heater patterns 311x and 312x are formed by a photolithography process procedure such as development, etching of a heater material, and removal of a resist. In (b) and (c) in FIG. 7, the heater pattern 311x of region indicated by A mask H _a 301
The heater pattern 312x in the area indicated by B is formed by the mask _Hb 302.

The pattern of the wiring materials are also two of similarly shown in FIG. 8 (a) mask L _a 303, the mask L _b 30
4 is formed with, at (b) in FIG. 8, in which the wiring pattern 313x of region indicated by A is formed by the mask L _a 303, the region indicated by B wiring pattern 31
4x is one formed by the mask L _b 304, also performed by using the mask N _a 305, mask N _b 306 patterned similarly two shown in Figure 9 of the solid layer 106 of the liquid passage such as the proposed site It is.

[0017]

However, the conventional method of manufacturing a liquid jet recording head as described above has the following problems.

In the patterning of the heater, wiring, liquid path, etc. in the long recording head, the mask pattern of each layer in the nozzle row direction is divided into a plurality of masks, and the plurality of regions are respectively formed through separate masks. Since the patterning is performed in each exposure, the focus of the mask is shifted in each region at the time of exposure, and the line width of the pattern formed at a position corresponding to the boundary of the mask may be different. .

In the patterning of any one of the layers of the recording head, for example, when a line width of a heater pattern or a wiring pattern at a location corresponding to a boundary portion of a mask occurs when patterning a heater or a wiring, There is a difference in the liquid ejection energy generated in the printing element. Further, when a line width of the liquid path pattern at a location corresponding to the boundary portion of the mask is different during the patterning of the liquid path, the difference in the liquid width and the discharge speed of the liquid droplet are caused by the difference in the line width. Appear as a difference.

As described above, in any of the heater, the wiring, and the liquid path, if a difference occurs in the line width of the pattern at the boundary of the mask, a sharp step in the print density occurs, and the print quality is reduced. The problem of remarkably lowering occurs.

Therefore, the present invention has been made in view of the above-mentioned unsolved problems of the prior art, and each layer of a heater, a wiring, a liquid path, and the like is subjected to a plurality of times using a plurality of photomasks. In a method of manufacturing a liquid jet recording head formed by exposure, a difference in pattern line width at a mask boundary portion due to a defocus at the time of exposure is eliminated, and a step in print density is moderated to make the print density inconspicuous and prevent deterioration in print quality. It is an object of the present invention to provide a liquid jet recording head that can perform the method and a method for manufacturing the same.

[0022]

In order to achieve the above object, a method of manufacturing a liquid jet recording head according to the present invention comprises a method of manufacturing a plurality of ejection energy generating elements, wirings and liquid paths corresponding to a plurality of ejection nozzles. At the time of formation, using a photolithography technique, in a method of manufacturing a liquid jet recording head in which patterning of the same layer is performed by a plurality of exposures through a plurality of photomasks divided at a certain portion in the ejection nozzle row direction, Mask patterns at boundaries between a plurality of photomasks forming a pattern of the same layer are nested in units of a pattern corresponding to one discharge nozzle, and the plurality of photomasks are aligned with each other. It is characterized by patterning.

Further, in the method of manufacturing a liquid jet recording head according to the present invention, when forming a plurality of layers of ejection energy generating elements, wirings and liquid paths corresponding to a plurality of ejection nozzles, respectively, using a photolithography technique. In a method of manufacturing a liquid jet recording head in which patterning of the same layer is performed by a plurality of exposures through a plurality of photomasks divided at a certain portion in an ejection nozzle row direction, a plurality of photomasks each forming a pattern of the same layer Are arranged in a nested manner in units of the number of patterns corresponding to two or more discharge nozzles, and the plurality of photomasks are aligned and patterned.

A liquid jet recording head according to the present invention is manufactured by the above-described method for manufacturing a liquid jet recording head.

[0025]

According to the present invention, in a method of manufacturing a liquid jet recording head in which each layer such as an ejection energy generating element, a wiring, and a liquid path is patterned by using a plurality of photomasks, a plurality of photomasks are formed. By arranging the mask patterns at each boundary in a nested manner, the difference in pattern line width at the mask boundary due to defocus at the time of exposure of each photomask is moderated, and the printing density step in the printing result is eliminated, and printing is performed. Prevent degradation of quality. As a result, the print inspection yield of the recording head is improved, the cost of the recording head can be reduced, and an inexpensive liquid jet recording head with high print quality can be provided.

[0026]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view schematically showing the structure of a liquid jet recording head, and FIG. 2 is a process diagram showing a manufacturing process of the liquid jet recording head.
(B) and (c) are plan views of two masks for forming a heater pattern of a liquid jet recording head, a schematic plan view of a heater pattern formed using the mask, and a part of the heater pattern. 4A and 4B are plan views of two masks for forming a wiring pattern of a liquid jet recording head, and wirings formed using the masks. FIG. 5 is a schematic perspective view of a part of the pattern, and FIG. 5 is a plan view of two masks for patterning a solid layer in a liquid passage and a liquid chamber planned portion of the liquid jet recording head.

In this embodiment, a mask H for patterning a heater material, a mask L for patterning a wiring material, and a positive resist at a liquid channel and a liquid chamber (hereinafter, also simply referred to as a liquid channel) are to be used. as masks N for patterning the solid layer comprising, in FIG. 3 (a), as shown respectively in (a) and 5 Figure 4, the two masks H _a 1 and the mask H _b 2, mask L _a
3 and the mask L _b 4, a mask N _a 5 and the mask N _b 6 respectively used.

2 for patterning the heater material
Mask H_a 1 and mask H_b 2 to the predetermined
FIG. 3 shows a case of forming a star pattern.
explain. As shown in FIG. 3A, one mask H
_a 1, a plurality of mask patterns 11a are formed in parallel.
And corresponds to eight patterns on the right end side.
Pattern 11a and a pattern are formed in the region 1p
Non-patterned part (hereinafter, simply referred to as non-pattern part) 11
b are alternately formed, and the other mask H_b2,
A plurality of mask patterns 12a are respectively formed in parallel.
And an area corresponding to eight patterns at the left end
The mask pattern 12a and the non-pattern portion 12b intersect at 2p.
Are formed mutually. The two cells thus formed
H_a 1 and mask H_b 2 is the mask H_a 1 right end
Region 1p corresponding to 8 turns and mask H_b Left end of 2
Area 2p corresponding to eight patterns of the part overlap each other
-When wrapped, mask H_a 1 area 1p
The other mask H is provided on the portion of the turn portion 11b._b 2 area 2p
Is located, and the mask H _a 1
The mask pattern 11a in the region 1p of FIG._b 
2 is located at the non-pattern portion 12b of the region 1p.
It is formed as follows. That is, two masks H on the left and right_a 
1 and H_b 2 each boundary area
Screen patterns 11a and 12a are nested in each other.
Have been.

The two or more sheets which are formed as the mask H _a
When patterning the heater material by a photolithography process using a mask H _b 2 is the heater material is deposited on a first substrate 101 forming the heater on top of the film-formed heater material Apply resist. Then, first, the mask H _a1 is disposed on the left side of the resist, and the area A shown in FIG. 3B is exposed. Then, the mask H _b2 is disposed on the right side of the resist, and the mask H _a The region B shown in FIG. 3B is exposed by aligning so as to compensate for the portion where the pattern 1 is missing.
At this time, each of the exposure regions by the mask H _a 1 and the mask H _b 2, as shown in (b) of FIG. 3, region 1p and H corresponding to eight cycles of the pattern at the right end of the mask H _a 1 regions 2p corresponding to the pattern 8 pieces of the left end of the _b 2 is the overlap. Thereafter, the pattern is developed and patterned, and the heater patterns 11x, 11x...,.
.. Are formed in parallel by a predetermined number as shown in FIGS. 3B and 3C. In addition, FIG.
In and (c), the heater pattern marked with 11x has been formed by the mask pattern 11a of the mask H _a 1, a heater pattern marked with 12x has been formed by the mask pattern 12a of the mask H _b 2 is there.

[0031] Also in the two masks L _a 3 for patterning the wiring material mask L _b 4, shown in FIG. 4 (a)
As will be shown, the mask H _a 1 and the mask H _b as in respectively the same relationship as sequence relationships pattern in second mask pattern 13a, and 14a are formed,
The regions 3p corresponding to eight cycles of the pattern of the mask L _a 3, a mask pattern 13a and the pattern portion 13b are arranged alternately in the region 4p corresponding to eight cycles of the pattern of the mask L _b 4, a mask pattern 14a and non-pattern part 1
4b are alternately arranged, and these masks La 3 and L _a 3
_b 4 of every other mask pattern 13a in each of the boundary region, 14a are arranged in nested together.

As shown in FIG. 5, the solid layer at the liquid passage scheduled portion is provided on two masks N _a 5 and N _b 6 for patterning the solid layer at a predetermined position of the liquid passage and the liquid chamber. Mask patterns 15a and 16a for forming a solid pattern and a mask pattern 15c and 1
6c are formed along the liquid discharge direction, respectively, and are used to form a mask pattern 15
a, 16a, a region 5 corresponding to eight patterns
p, the mask pattern 15a for 6p, 16a and a non-pattern portion 15b, 16b are arranged alternately, and is formed to have a similar relationship to the arrangement relationship of the pattern of the mask H _a 1 and the mask H _b 2.

When the same layer is patterned by a plurality of exposures using a plurality of masks as described above, each of the boundary portions of the mask is exposed so that the boundaries of the plurality of masks can be overlapped and each pattern can be exposed. By arranging the mask patterns in a nested manner, it is possible to eliminate a line width difference of a pattern corresponding to a mask boundary portion due to defocus at each of a plurality of exposures, which occurs in the related art.

Next, a method for manufacturing a liquid jet recording head of the present invention using the mask formed as described above will be described with reference to FIG.

A heater material is deposited on the first substrate 101 on which the heat storage layer is formed to form a film, and a resist is applied on the formed heater material by a normal photolithography process. H _a 1 performs one side of the exposure of the first substrate 101 by (in FIG. 3 (a)), then (in FIG. 3 (a)) the mask H _b 2 were missing pattern of the mask H _a 1 The heater material is formed into predetermined heater patterns 11x,..., 12x by etching the heater material and removing the resist by aligning and exposing, exposing and patterning the portions (FIG. 3B). And (c)). here,
In shown in FIG. 3 (b) and (c), are those heater pattern 11x of region indicated by A is formed by the mask pattern 11a of the mask H _a 1, the heater pattern 12x of region indicated by B is the mask H _b 2 Formed by the mask pattern 12a of FIG.

[0036] Then, depositing a wiring material such as Al on the first substrate 101, in a conventional photolithographic process steps, the first substrate with a mask L _a 3 (in FIG. 4 (a)) 101
One performs exposure on one side of, then, the other side was exposed by (in FIG. 4 (a)) mask L _b 4, likewise, to form a wiring material in a predetermined wiring pattern. FIG. 4 (b)
In, which wiring patterns 13x of region indicated by A is formed by the mask pattern 13a of the mask L _a 3, a wiring pattern 13x is masked L of a region indicated by B
_b 4 is formed by the mask pattern 14a. In FIG. 4B, a portion indicated by 102 serves as a heat generating portion and functions as a heater. And
A heater protective film and the like are formed on them.

Thereafter, as shown in FIG.
Mask N _a 5 and the mask N _b 6 to the solid layer 103 made on the substrate 101 of the liquid path and the liquid chamber proposed site of a positive resist shown in FIG. 5 in a manner similar to the formation of the heaters and wiring
Is formed by a usual photolithography process procedure.

Thereafter, similarly to the manufacturing procedure described in the conventional example, the common liquid chamber and the second substrate 104, which will be the liquid supply port later, are mounted as shown in FIG. 2B.

In the space between the first substrate 101 and the second substrate 104, a resin
5 is injected and cured, and then the second substrate 104 and the resin 105 are cut at a portion indicated by a dashed line in FIG. 2C to form a space serving as a common liquid chamber 106. (D), the liquid chamber sealing plate 10 is provided above the space.
7 are bonded using an adhesive to form a common liquid chamber 106.

Next, the orifice portion of the discharge port 108 is cut to form the discharge port 108. Fig. 2
(D) is indicated by a two-dot chain line. Then, the solid layer 103 is removed as shown in FIG.
9 is assumed.

Further, the first step is performed by the same steps as in the conventional example.
A head driving IC 110 including a shift register circuit, a latch circuit, an output transistor of each bit, etc. necessary for driving a print head is solder-flip chip bonded or anisotropic conductive film (ACF)
The bare chip is mounted in a face-down manner by using 111. Between the head driving IC 110 and the first substrate 101,
Each of the ejection energy generating elements, a power source and a ground, and bump terminals for input signals such as image data and clock signals are electrically connected through metal particles in the ACF. Further, the head driving IC is firmly held on the first substrate 101 by the thermosetting resin (FIG. 2 (g)). FIG. 1 shows the liquid jet recording head thus manufactured. The liquid jet recording head is further electrically connected to the first substrate 101 by means such as wire bonding to a printed wiring board provided with a connector and an electric component for connection with the printer main body,
Further, the recording liquid supply pipe is connected to the common liquid chamber 106 to complete the liquid jet recording head.

As described above, the mask pattern of each layer in this embodiment has been described in which mask patterns are nested every other one at the boundary between two masks adjacent to each other. It is also possible to arrange two or more mask patterns as a unit, such as every two, every three, etc.

Further, a plurality of types of mask patterns such as every one, every two or every three may be mixed on a pair of masks.

In the embodiment described above, only the minimum film configuration as a liquid jet recording element has been described.
It is also possible to add a new film, change the order of film formation, and the like, and these are included in the scope of the present invention.

[0045]

As described above, according to the present invention,
In a method for manufacturing a liquid jet recording head in which each layer such as an ejection energy generating element, a wiring, and a liquid path is formed by patterning using a plurality of photomasks, mask patterns at boundaries of the plurality of photomasks are mutually nested. By arranging them in a pattern, the line width difference of the pattern corresponding to the mask boundary due to defocus at the time of exposure of each photomask is moderated, it is less noticeable, the step of print density in the print result is eliminated, and the print quality is lowered Can be prevented.

As a result, the print inspection yield of the recording head is improved, the cost of the recording head can be reduced, and a liquid jet recording head that is inexpensive and has high print quality can be provided.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically illustrating a configuration of a liquid jet recording head.

FIG. 2 is a process chart showing a manufacturing process of the liquid jet recording head.

FIGS. 3A, 3B, and 3C are plan views of two masks for forming a heater pattern of a liquid jet recording head, respectively, and FIGS. FIG. 2 is a schematic plan view and a schematic perspective view of a part of a heater pattern.

FIGS. 4A and 4B are a plan view of two masks for forming a wiring pattern of a liquid jet recording head and a schematic diagram of a part of a wiring pattern formed using the masks, respectively. FIG.

FIG. 5 is a plan view of two masks for patterning a liquid layer of a liquid jet recording head and a solid layer at a predetermined portion of a liquid chamber.

FIGS. 6A, 6B, and 6C are plan views of masks used for patterning heaters, wiring, and liquid paths when manufacturing a conventional liquid jet recording head.

FIGS. 7A, 7B, and 7C are plan views of two masks for forming a heater pattern when manufacturing a conventional liquid jet recording head, and FIGS. FIG. 2 is a schematic plan view of a heater pattern and a schematic perspective view of a part of the heater pattern.

FIGS. 8A and 8B are plan views of two masks for forming a wiring pattern at the time of manufacturing a conventional liquid jet recording head, respectively, and FIGS. It is a typical perspective view of a part.

FIG. 9 is a plan view of two masks for patterning a solid layer in a liquid passage and a liquid chamber planned portion in manufacturing a conventional liquid jet recording head.

[Explanation of symbols]

 1, 2 (for heater) mask H 3, 4 (for wiring) mask L 5, 6, (for liquid path) mask N 11a, 12a mask pattern 11b, 12b non-pattern portion 11x, 12x heater pattern 13a, 14a mask pattern 13b , 14b Non-pattern part 13x, 14x Wiring pattern 15a, 16a Mask pattern 15b, 16b Non-pattern part 15c, 16c Mask pattern 101 First substrate 102 Heater 103 Solid layer 104 Second substrate 105 Resin 106 Common liquid chamber 107 Liquid chamber Sealing plate 108 Discharge port 109 Liquid path 110 Head driving IC

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Toru Yamane 3-30-2 Shimomaruko, Ota-ku, Tokyo F-term in Canon Inc. (reference) 2C057 AF25 AF93 AG46 AP14 AP31 AP77 BA03 BA13

Claims (3)

[Claims] In forming a plurality of layers of a plurality of ejection energy generating elements, wirings, and liquid paths corresponding to a plurality of ejection nozzles, respectively, the same layer is patterned using a photolithography technique in a portion in a direction of the ejection nozzle row. In the method of manufacturing a liquid jet recording head, which is performed by a plurality of exposures through a plurality of photomasks divided by a plurality of photomasks, a mask pattern at a boundary between a plurality of photomasks forming a pattern of the same layer is provided to one ejection nozzle. A method for manufacturing a liquid jet recording head, wherein a plurality of photomasks are aligned with each other in a pattern corresponding to each other in units of corresponding patterns, and are patterned. 2. When forming a plurality of layers of a plurality of ejection energy generating elements, wirings, and liquid paths respectively corresponding to a plurality of ejection nozzles, patterning of each of the same layers is performed by using a photolithography technique in a portion in the ejection nozzle row direction. In the method for manufacturing a liquid jet recording head, which is performed by exposing a plurality of times through a plurality of photomasks divided by a plurality of photomasks, a mask pattern at a boundary between a plurality of photomasks forming a pattern of the same layer has two or more discharge nozzles A method of manufacturing a liquid jet recording head, wherein the plurality of photomasks are arranged in a nested manner in units of a number of patterns corresponding to the above, and the plurality of photomasks are aligned and patterned. 3. A liquid jet recording head manufactured by the method of manufacturing a liquid jet recording head according to claim 1.