JP2001105178A - Solder wettability improving agent and method for improving solder wettability of tin and tin alloy - Google Patents
Solder wettability improving agent and method for improving solder wettability of tin and tin alloyInfo
- Publication number
- JP2001105178A JP2001105178A JP28661799A JP28661799A JP2001105178A JP 2001105178 A JP2001105178 A JP 2001105178A JP 28661799 A JP28661799 A JP 28661799A JP 28661799 A JP28661799 A JP 28661799A JP 2001105178 A JP2001105178 A JP 2001105178A
- Authority
- JP
- Japan
- Prior art keywords
- tin
- solder wettability
- plating
- solder
- improving
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明が属する技術分野】本発明は、はんだ濡れ性向上
処理剤、及び錫及び錫合金のはんだ濡れ性の向上方法に
関し、特に、半田付けにより他の部品や基板、信号線等
に接続される電子部品の接続部に、予めめっき処理され
た錫及び錫合金めっき表面を処理するために用いられ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a treatment agent for improving solder wettability and a method for improving solder wettability of tin and tin alloys, and more particularly, to a method for connecting to other parts, substrates, signal lines, etc. by soldering. It is used for treating a tin and tin alloy plating surface which has been plated in advance at a connection portion of an electronic component.
【０００２】[0002]
【従来の技術】従来より半田付け性を重視した電子部品
のはんだ付け部には、鉛を含有するめっき、いわゆる、
はんだめっきが主に施されている。しかしながら、鉛を
含有するはんだめっきは、めっき中に含まれる鉛による
環境汚染の問題があり、鉛を実質的に含まない鉛フリー
のめっきへ移行しているのが現状である。鉛フリーのめ
っきとしては、錫単独めっきや錫主体の錫合金めっき、
即ち、錫−銅、錫−銀、錫−ビスマス、錫−亜鉛、錫−
インジウム等の合金めっきがあげられるが、これらのめ
っきは鉛を含有するはんだめっきの場合に較べて、はん
だ濡れ性、特に経時によるはんだ濡れ性が劣化するとい
う問題があった。2. Description of the Related Art Conventionally, lead-containing plating, so-called,
Solder plating is mainly applied. However, lead-containing solder plating has a problem of environmental pollution due to lead contained in the plating, and at present, it has been shifted to lead-free plating containing substantially no lead. Lead-free plating includes tin-only plating, tin-based tin alloy plating,
That is, tin-copper, tin-silver, tin-bismuth, tin-zinc, tin-
Alloy plating of indium or the like can be mentioned, but these platings have a problem that the solder wettability, particularly the solder wettability with time, is deteriorated as compared with the case of the lead-containing solder plating.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、はんだ用の
鉛を含まない被膜のはんだ濡れ性向上処理剤を提供する
ことを目的とする。本発明は、又、この濡れ性向上処理
剤を用いて鉛を含まないはんだ用の被膜を処理する方法
を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a lead-free coating agent for solder which improves the solder wettability of a coating. Another object of the present invention is to provide a method of treating a lead-free solder coating using the wettability improving agent.
【０００４】[0004]
【課題を解決するための手段】本発明は、ジテルペン酸
またはその誘導体と脂肪族炭化水素を含む処理剤を、鉛
を含まないはんだ用皮膜上にオーバーコート処理する
と、めっき直後および経時のはんだ濡れ性を向上させる
ことができるとの知見に基づいてなされたものである。
すなわち、本発明は、ジテルペン酸またはその誘導体と
脂肪族炭化水素を含有することを特徴とするはんだ濡れ
性向上処理剤を提供する。本発明は、又、錫又は錫合金
めっき表面層に、上記はんだ濡れ性向上処理剤を施すこ
とを特徴とする該めっき表面のはんだ濡れ性の向上方法
を提供する。According to the present invention, when a treating agent containing diterpene acid or a derivative thereof and an aliphatic hydrocarbon is overcoated on a lead-free solder film, the solder wetness immediately after plating and over time can be obtained. This is based on the finding that the property can be improved.
That is, the present invention provides a solder wettability improving treatment agent comprising diterpene acid or a derivative thereof and an aliphatic hydrocarbon. The present invention also provides a method for improving the solder wettability of a plating surface, which comprises applying the above-mentioned solder wettability improving agent to a tin or tin alloy plating surface layer.
【０００５】本発明のはんだ濡れ性向上処理剤に用いる
ジテルペン酸としては、ルベニン酸、アガテンジカルボ
ン酸、ピマル酸、アビエチン酸、ネオアビエチン酸、レ
ボピマル酸、イソ−ｄ−ピマル酸、ポドカルピン酸、ア
ガリシン酸などの１種又は２種以上の混合物をあげるこ
とができる。また、天然ロジンもこのジテルペン酸の混
合物であり、この中に含まれる。このうち、ピマル酸と
アビエチン酸が好ましい。またジテルペン酸の誘導体化
合物としては、メタノール、エタノール、プロパノー
ル、ブタノール、ジエチレングリコール等の炭素数1〜
１８、好ましくは、炭素数1〜６のアルコールと、ジテ
ルペン酸とのエステル化反応物を挙げることができる。
具体的には、アビエチン酸メチル、アビエチン酸ジエチ
レングリコール、２−ヒドロアビエチン酸ジエチレング
リコール等をあげることができる。本発明のはんだ濡れ
性向上処理剤は、これらジテルペン酸またはその誘導体
を、任意の量で含むことができるが、これらを、０．０
１ｇ／Ｌ〜０．５ｇ／Ｌ含有するのが好まし、より好ま
しくは、０．１ｇ／Ｌ〜０．４ｇ／Ｌである。The diterpenic acid used in the solder wettability improving agent of the present invention includes rubenic acid, agatendicarboxylic acid, pimaric acid, abietic acid, neoabietic acid, levopimaric acid, iso-d-pimaric acid, podocarpinic acid, One or a mixture of two or more such as agaric acid can be mentioned. Natural rosin is also a mixture of these diterpenic acids and is included therein. Of these, pimaric acid and abietic acid are preferred. In addition, as the derivative compound of diterpene acid, a compound having 1 to carbon atoms such as methanol, ethanol, propanol, butanol, and diethylene glycol.
18, preferably an esterification reaction product of an alcohol having 1 to 6 carbon atoms and diterpene acid.
Specific examples include methyl abietic acid, diethylene glycol abietic acid, and diethylene glycol 2-hydroabietic acid. The solder wettability improving agent of the present invention can contain these diterpene acids or derivatives thereof in any amount.
The content is preferably 1 g / L to 0.5 g / L, and more preferably 0.1 g / L to 0.4 g / L.
【０００６】本発明のはんだ濡れ性向上処理剤に用いる
脂肪族炭水化物としては、パラフィン系炭化水素を主成
分とした常温で液状の油を挙げることができ、好ましく
は、パラフィンワックスやマシン油である。本発明のは
んだ濡れ性向上処理剤は、これらの脂肪族炭水化物を任
意の量で含むことができるが、これらを、０．０１ｇ／
Ｌ〜２ｇ／Ｌ含有するのが好ましく、より好ましくは、
０．１ｇ／Ｌ〜０．５ｇ／Ｌである。本発明のはんだ濡
れ性向上処理剤は、常温で液状であるのが好ましく、特
に、上記成分を揮発性溶媒に溶解してなるのが好まし
い。溶媒として、メタノール、エタノール、プロパノー
ル、イソプロパノール等のアルコール類が好ましい。本
発明のはんだ濡れ性向上処理剤には、上記成分を均一に
分散させるために、ノニオン、カチオン、アニオン、両
性界面活性剤を含有させるのが好ましい。これらのノニ
オン、アニオン、カチオン、両性界面活性剤の濃度は、
０．０１ｇ／Ｌ〜５ｇ／Ｌであるのが好ましく、より好
ましくは、０．１ｇ／Ｌ〜２ｇ／Ｌである。また必要に
応じ、ベンゾトリアゾール、ベンゾイミダゾール等の一
般的な腐食抑制剤を添加することもできる。Examples of the aliphatic carbohydrate used in the solder wettability improving agent of the present invention include a liquid oil at room temperature containing a paraffinic hydrocarbon as a main component, and preferably a paraffin wax or a machine oil. . The solder wettability improving agent of the present invention can contain these aliphatic carbohydrates in an arbitrary amount.
L to 2 g / L is preferable, and more preferably,
0.1 g / L to 0.5 g / L. The solder wettability improving agent of the present invention is preferably in a liquid state at normal temperature, and particularly preferably, the above components are dissolved in a volatile solvent. As the solvent, alcohols such as methanol, ethanol, propanol and isopropanol are preferable. The solder wettability improving agent of the present invention preferably contains a nonionic, cationic, anionic or amphoteric surfactant in order to uniformly disperse the above components. The concentration of these nonions, anions, cations and amphoteric surfactants is
It is preferably 0.01 g / L to 5 g / L, and more preferably 0.1 g / L to 2 g / L. If necessary, a general corrosion inhibitor such as benzotriazole or benzimidazole can be added.
【０００７】本発明のはんだ濡れ性向上処理剤は、例え
ば、リン青銅や４２アロイなどの金属基材上、又はめっ
き処理により形成した下地めっき層（例えば、ニッケル
めっきや銅めっきなど）の上に、めっき処理により錫及
び錫合金めっきを形成し、その表面に施す。ここで、錫
及び錫合金めっき方法は、例えば、特開昭０６−３４０
９９４号公報などに記載の方法により行うことができ
る。又、錫合金めっきが、錫を主体として、銅、銀、ビ
スマス、亜鉛、インジウムのいずれかを含有する合金の
めっきであるのが好ましい。めっきの厚みは、任意とす
ることができるが、０．５〜２０μであるのが好まし
い。尚、はんだ濡れ性の向上は、ＪＩＳ−Ｃ００５３−
１９９０に記載のメニスコグラフ法により容易に測定で
きる。次に、実施例により本発明を具体的に説明する
が、本発明は下記の実施例に限定されるものではない。[0007] The solder wettability improving agent of the present invention is applied on a metal substrate such as phosphor bronze or 42 alloy, or on a base plating layer (eg, nickel plating or copper plating) formed by plating. Then, tin and tin alloy plating are formed by plating, and are applied to the surface. Here, the tin and tin alloy plating method is described in, for example, JP-A-06-340.
No. 994, for example. Further, the tin alloy plating is preferably a plating of an alloy mainly containing tin and containing any of copper, silver, bismuth, zinc, and indium. The thickness of the plating can be arbitrarily set, but is preferably 0.5 to 20 μm. The improvement in solder wettability is based on JIS-C0053-
It can be easily measured by the meniscograph method described in 1990. Next, the present invention will be specifically described with reference to examples, but the present invention is not limited to the following examples.
【０００８】[0008]
【実施例】実施例１ ジテルペン酸誘導体として天然ロジン０．２ｇ／Ｌ、マ
シン油としてＪＩＳＫ２２３８に規定されているＩＳＯ
ＶＧ ２ マシン油０．２ｇ／Ｌ、分散剤としてノニオ
ン界面活性剤ポリオキシエチレンノニルフェニルエーテ
ル０．５ｇ／Ｌをイソプロピルアルコールに溶解させ
て、本発明のはんだ濡れ性向上処理剤を調製した。一
方、３２１６サイズのチップ抵抗器外部銀電極部にめっ
き処理により下地ニッケルめっき２μｍ、その上に５μ
ｍの錫単独めっき皮膜を形成させた。この錫単独めっき
皮膜を有する部分を、上記はんだ濡れ性向上処理剤に浸
漬し、乾燥した。Example 1 0.2 g / L of natural rosin as a diterpene acid derivative and ISO specified in JIS K2238 as a machine oil
0.2 g / L of VG 2 machine oil and 0.5 g / L of a nonionic surfactant polyoxyethylene nonylphenyl ether as a dispersant were dissolved in isopropyl alcohol to prepare a solder wettability improving agent of the present invention. On the other hand, a 3216 size chip resistor external silver electrode portion was plated with a base nickel plating 2 μm by plating, and a 5 μm
m of tin alone plating film was formed. The portion having the tin-only plating film was immersed in the solder wettability improving agent and dried.
【０００９】実施例２ ジテルペン酸誘導体としてアビエチン酸メチル０．２ｇ
／Ｌ、炭素数２５のパラフィンワックス０．２ｇ／Ｌ、
分散剤としてノニオン界面活性剤ジペンチルスルホコハ
ク酸エステル塩０．５ｇ／をイソプロピルアルコールに
溶解させて、本発明のはんだ濡れ性向上処理剤を調製し
た。一方、１６０８サイズのチップ抵抗器外部銀電極部
にめっき処理により下地ニッケルめっき２μｍ、その上
に５μｍの錫−ビスマス合金めっき皮膜を形成させた。
この錫合金めっき皮膜を有する部分を、上記はんだ濡れ
性向上処理剤に浸漬し、乾燥した。Example 2 0.2 g of methyl abietic acid as a diterpene acid derivative
/ L, paraffin wax having 25 carbon atoms 0.2 g / L,
Nonionic surfactant dipentyl sulfosuccinate salt 0.5 g / as a dispersant was dissolved in isopropyl alcohol to prepare a solder wettability improving agent of the present invention. On the other hand, a 1608 size chip resistor external silver electrode portion was plated with a base nickel plating of 2 μm and a tin-bismuth alloy plating film of 5 μm thereon by plating.
The portion having the tin alloy plating film was immersed in the treatment agent for improving solder wettability and dried.
【００１０】比較例１ ３２１６サイズのチップ抵抗器外部銀電極部にめっき処
理により下地ニッケルめっき２μｍ、その上に５μｍの
錫単独めっき皮膜を形成させた。 この皮膜の後処理は
水洗のみにとどめた。COMPARATIVE EXAMPLE 1 A 3216-size chip resistor external silver electrode portion was formed by plating with a base nickel plating of 2 μm and a tin-only plating film of 5 μm thereon. Post-treatment of this film was limited to water washing only.
【００１１】比較例２ １６０８サイズのチップ抵抗器外部銀電極部にめっき処
理により下地ニッケルめっき２μｍ、その上に５μｍの
錫−ビスマス合金めっき皮膜を形成させた。この皮膜の
後処理は水洗のみにとどめた。COMPARATIVE EXAMPLE 2 A 1608 size chip resistor external silver electrode was formed by plating with a base nickel plating of 2 μm and a tin-bismuth alloy plating film of 5 μm thereon. Post-treatment of this film was limited to water washing only.
【００１２】上記の実施例１及び２のチップ抵抗器と、
比較例１及び２のチップ抵抗器をそれぞれ、メニスコグ
ラフ法にてはんだ濡れ性試験を行ったところ、めっき直
後で比較例１のチップ抵抗器は濡れ時間が０．９秒、比
較例２では０．５秒であった。なお、この濡れ時間は時
間が短いほど、濡れ性がよいことを示す。一方、１００
℃−１００％−１６Ｈｒの条件で、蒸気エージングした
後の比較例１の濡れ時間が５秒、比較例２では１．８秒
であった。The chip resistors according to the first and second embodiments,
Each of the chip resistors of Comparative Examples 1 and 2 was subjected to a solder wettability test by the meniscograph method. 5 seconds. The shorter the wetting time, the better the wettability. On the other hand, 100
Under the conditions of ° C-100% -16Hr, the wetting time of Comparative Example 1 after steam aging was 5 seconds, and that of Comparative Example 2 was 1.8 seconds.
【００１３】これに対して、実施例１のチップ抵抗器の
めっき直後の濡れ時間は０．７秒、実施例２のチップ抵
抗器は０．３秒であった。又、１００℃−１００％−１
６Ｈｒの条件で、蒸気エージングした後の実施例１のチ
ップ抵抗器の濡れ時間は２．３秒、実施例２のチップ抵
抗器の濡れ時間は１．５秒であった。以上の結果から、
本発明によれば、鉛を含まない錫又は錫合金めっき表面
のはんだ濡れ性を向上させることができることがわか
る。On the other hand, the wetting time immediately after plating of the chip resistor of Example 1 was 0.7 seconds, and that of the chip resistor of Example 2 was 0.3 seconds. Also, 100 ° C-100% -1
After the steam aging under the condition of 6 hours, the wetting time of the chip resistor of Example 1 was 2.3 seconds, and the wetting time of the chip resistor of Example 2 was 1.5 seconds. From the above results,
According to the present invention, it can be seen that the solder wettability of the tin or tin alloy plating surface containing no lead can be improved.
【００１４】[0014]
【発明の効果】本発明によれば、金属基材上またはめっ
き処理により形成した下地めっき層の上にめっき処理に
より形成した鉛を含まない錫を主成分とする表面層のは
んだ濡れ性を著しく向上させることができる。According to the present invention, the solder wettability of a lead-free tin-based surface layer formed by plating on a metal substrate or an underlying plating layer formed by plating is remarkably improved. Can be improved.
Claims (5)
炭化水素を含有することを特徴とするはんだ濡れ性向上
処理剤。1. A solder wettability improving agent comprising diterpene acid or a derivative thereof and an aliphatic hydrocarbon.
エステル又はその水添物である請求項１記載の処理剤。2. The treating agent according to claim 1, wherein the derivative of diterpene acid is a diterpene ester or a hydrogenated product thereof.
は２記載の処理剤。3. The treating agent according to claim 1, which is dissolved in a volatile solvent.
〜３のいずれか１項記載のはんだ濡れ性向上処理剤を施
すことを特徴とする該めっき表面のはんだ濡れ性の向上
方法。4. The method according to claim 1, wherein the tin or tin alloy plating surface layer is provided on the surface layer.
4. A method for improving the solder wettability of the plating surface, which comprises applying the treatment agent for improving solder wettability according to any one of the above items.
銀、ビスマス、亜鉛、インジウムのいずれかを含有する
合金のめっきである請求項４記載の方法。5. A tin alloy plating comprising tin as a main component, copper,
The method according to claim 4, wherein the plating is an alloy containing any of silver, bismuth, zinc, and indium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28661799A JP4502430B2 (en) | 1999-10-07 | 1999-10-07 | Solder wettability improving treatment agent and method for improving solder wettability of tin and tin alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28661799A JP4502430B2 (en) | 1999-10-07 | 1999-10-07 | Solder wettability improving treatment agent and method for improving solder wettability of tin and tin alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001105178A true JP2001105178A (en) | 2001-04-17 |
| JP4502430B2 JP4502430B2 (en) | 2010-07-14 |
Family
ID=17706737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28661799A Expired - Fee Related JP4502430B2 (en) | 1999-10-07 | 1999-10-07 | Solder wettability improving treatment agent and method for improving solder wettability of tin and tin alloy |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4502430B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6575354B2 (en) | 2000-11-20 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377792A (en) * | 1989-08-16 | 1991-04-03 | Yuho Chem Kk | Additive for flux and solder paste |
| JPH07132395A (en) * | 1993-11-15 | 1995-05-23 | Showa Denko Kk | Cream solder |
| JPH08155675A (en) * | 1994-11-29 | 1996-06-18 | Sony Corp | Flux for forming solder bump |
| JPH11179586A (en) * | 1997-12-16 | 1999-07-06 | Hitachi Ltd | Lead-free soldered structure, and electronic unit |
| JPH11267884A (en) * | 1998-03-23 | 1999-10-05 | Mitsubishi Electric Corp | Flux and cream solder for solar battery module |
-
1999
- 1999-10-07 JP JP28661799A patent/JP4502430B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0377792A (en) * | 1989-08-16 | 1991-04-03 | Yuho Chem Kk | Additive for flux and solder paste |
| JPH07132395A (en) * | 1993-11-15 | 1995-05-23 | Showa Denko Kk | Cream solder |
| JPH08155675A (en) * | 1994-11-29 | 1996-06-18 | Sony Corp | Flux for forming solder bump |
| JPH11179586A (en) * | 1997-12-16 | 1999-07-06 | Hitachi Ltd | Lead-free soldered structure, and electronic unit |
| JPH11267884A (en) * | 1998-03-23 | 1999-10-05 | Mitsubishi Electric Corp | Flux and cream solder for solar battery module |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6575354B2 (en) | 2000-11-20 | 2003-06-10 | Matsushita Electric Industrial Co., Ltd. | Method for producing tin-silver alloy plating film, the tin-silver alloy plating film and lead frame for electronic parts having the film |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4502430B2 (en) | 2010-07-14 |
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