JP2001102320A - Heat treatment device and method for inspecting abnormality thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inspect lamp failure in a substrate treatment device for heating a substrate by using lamp lights in a simple constitution and method. SOLUTION: Plural heating blocks 200a and 200b, connected with a power supplying part 32a are respectively provided with 4 lamps 21a-21h each. Then, a current detector 210 is arranged across conductive wires 23a and 24a and conductive wires 23b and 24b, a current detector 220 is arranged across the conductive wires 23b and 24b and conductive wires 23c and 24c, and a current detector 230 is arranged across the conductive wires 23c and 24c and conductive wires 23d and 24d, and the two conductive wires of each lamp 21 in which currents are flowing in opposite directions can be set as a pair of objects to be measured. Thus, when lamp failure occurs, the state of magnetic flux is detected by the current detectors 210, 220, and 230 so that the lamps 21a-21d in which the lamp failure is generated can be specified.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat treatment apparatus for irradiating various substrates such as a semiconductor wafer and a liquid crystal display substrate with heating by irradiating a lamp light, and a method for inspecting an abnormality of the heat treatment apparatus.

[0002]

2. Description of the Related Art Conventionally, a substrate for forming a precise pattern such as a semiconductor substrate for a semiconductor manufacturing apparatus, a glass substrate for manufacturing various displays and photomasks (hereinafter referred to as a "substrate").
There is an apparatus (a so-called lamp annealing apparatus) for irradiating the substrate with light from a lamp to heat the substrate in a predetermined atmosphere for processing.

In this conventional heat treatment apparatus, a substrate is mounted on a substrate mounting table in a chamber, and light is irradiated on the surface of the substrate from a plurality of lamps provided opposite to the surface of the mounted substrate. . Thus, heat treatment such as annealing is performed on the surface of the substrate.

[0004] In this heat treatment apparatus, since a plurality of lamps are provided in the chamber, it is not possible to look into the lamps in the processing chamber from outside the chamber. Therefore, when the lamp serving as the heating source is cut off, if the heat treatment is continued while the lamp is cut off, the heat treatment will be uneven on the surface of the substrate. Must be detected.

Therefore, in the conventional heat treatment apparatus, a current detection sensor is provided for each lamp, and the state of the lamp is detected by detecting whether a specified current is flowing through each current detection sensor. are doing.

FIG. 5 is a diagram showing one of a plurality of modules for supplying power to a lamp in such a heat treatment apparatus. That is, one heat treatment apparatus is provided with a plurality of configurations shown in FIG. 4, and controls the lighting of many lamps.

[0007] In the example shown in FIG.
Power is supplied from the power supply module 260 to the power supply module 260, and one power supply module 260 is connected to two lamps 270 and 270.
To supply power. In the power supply module 260, a pair of thyristors 261 reversely connected, two lamps 270,
AC device (curr) that detects the value of AC current flowing to 270
An electric current detector 262 having an ent transformer and a voltage detector 263 having a transformer (potential transformer) for detecting an AC voltage value applied to the lamps 270 and 270 are provided.

[0008] The pair of thyristors 261 controls the power (or current or voltage) supplied to the two lamps 270, 270 by adjusting the firing phase angle of the AC. This power control is performed based on the current value and the voltage value detected by the current detector 262 and the voltage detector 263.

Alternatively, the two lamps 270, 270
The electric power controlled by the pair of thyristors 261 is supplied in parallel, and the current detectors 271 and 271 corresponding to the lamps 270 and 270 are used to detect the value of the current supplied to the lamps 270 and 270. Is the power module 26
0 is provided.

The current values detected by the current detectors 271 and 271 are used to detect whether or not a so-called lamp break (breakage of a filament or the like in the lamp 270) has occurred. Specifically, the output waveform from the voltage detector 263 and the current detectors 271 and 271 for detecting the lamp burnout are detected.
Is compared with the output waveform of FIG. 7, and when the current value is extremely reduced with respect to the voltage value, it is determined that the lamp burnout has occurred.

In the power supply module 260, a pair of thyristors 261 are connected to the current detector 262 and the voltage detector 2.
When the power feedback control is performed based on the output value from 63, the normal 1
There is a possibility that a large amount of power may be supplied to the two lamps 270.
The gate 61 is shut off, and the lamp 270 on which the lamp has not run out is protected.

[0012]

By the way, in the configuration shown in FIG.
In order to detect lamp burnout when supplying power to the lamp 70, it is necessary to mount as many current detectors 271 for lamp burnout detection as the number of lamps 270, and to construct a practical heat treatment apparatus. Can not do.

In particular, in the above-mentioned apparatus, in order to be able to identify a lamp that has run out of lamps, two times the number of cables of the number of lamps 270 are wired from the position where the power supply module 260 is disposed to the position where the lamp 93 is mounted. There is a need to. As a result, the thickness of the entire cable increases and the number of connectors and terminals increases, which may lead to an increase in cost and reliability due to an increase in man-hours for manufacturing the device.

Of course, the current detector 271 is connected to the lamp 27
The power supply module 26
It is also possible to reduce the number of wires from 0 to the lamp 270 side. However, even in this case, each lamp 2
It becomes necessary to secure a space near 70 for providing a circuit for detecting a lamp burnout. Therefore, even if such a design change is made, there is a possibility that cost increases and reliability decreases due to an increase in man-hours for manufacturing the apparatus.

Further, in order to identify the lamp that has run out of lamps for a device in which the current detector 271 is not permanently installed, it is necessary to perform a process of sequentially determining all lamps 270. That is, it is necessary to perform a work of sequentially determining all the lamps 270, and it is still obscene.

The present invention has been made in view of the above-mentioned various problems relating to the state of a heating source such as a burned-out lamp. Even if the number of lamps increases, an abnormality such as a burned-out lamp can be detected by a simple configuration and a simple method. A first object is to provide an apparatus configuration and an abnormality inspection method.

Further, the number of wirings is reduced while appropriately detecting the state of the heating source, thereby reducing the device manufacturing cost and the substrate manufacturing cost, and improving the reliability of the substrate processing. Is the second purpose.

[0018]

Means for Solving the Problems and Their Functions and Effects The present invention has the following configuration in order to achieve such an object. In other words, the invention according to claim 1 is a heat treatment apparatus that performs a process involving heating on a substrate, wherein a plurality of heating units that receive electric power to heat the substrate, and each of the plurality of heating units Detecting means for detecting a state of a magnetic flux by using a plurality of conductive wires connected to supply power in parallel and two conductive wires whose directions of current supplied to the heating means of the conductive wires are opposed to each other as a pair to be measured. Wherein the detecting means simultaneously measures two pairs of the objects to be measured, and makes one of them common to different detecting means.

According to a second aspect of the present invention, in the heat treatment apparatus according to the first aspect, the detecting means includes a notifying means for notifying an abnormality when detecting the magnetic flux of the pair of objects to be measured. .

According to a third aspect of the present invention, there is provided a method for inspecting an abnormality of a heat treatment apparatus for performing a treatment involving heating on a substrate, the heat treatment apparatus comprising: a plurality of heating means for heating the substrate by receiving power supply; A plurality of conductive wires connected to supply a parallel power to each of the plurality of heating means, and two conductive wires of which the direction of the supplied current is opposite among the conductive wires are selected as a pair to be measured. And measuring the state of the magnetic flux by the pair of objects to be measured.

According to a fourth aspect of the present invention, in the abnormality inspection method according to the third aspect, in the measuring step, two pairs of objects to be measured are measured at the same time, and one of the measured objects is repeatedly measured. The measurement is performed by selecting an unmeasured one including the measurement target pair.

According to a fifth aspect of the present invention, there is provided a method for inspecting an abnormality of a heat treatment apparatus for performing a treatment involving heating on a substrate, wherein the heat treatment apparatus comprises: a plurality of heating means for heating the substrate by receiving electric power; A plurality of conductive wires connected to supply a parallel power to each of the plurality of heating means, and two conductive wires of which the direction of the supplied current is opposite among the conductive wires are selected as a pair to be measured. Performing, selecting two pairs of the measured object pairs, and mounting a plurality of detecting means for detecting the state of each magnetic flux, and mounting one of the measured object pairs to another detecting means in the mounting step of the detecting means. Is mounted in common with the pair to be measured.

The operation of the present invention is as follows. In the heat treatment apparatus according to the first aspect of the present invention, the state of the magnetic flux is detected by the detecting means using two conductive wires, which are supplied in parallel to the heating means, of which the direction of the supplied current is opposite, as a pair to be measured. . Then, two pairs of objects to be measured are measured at the same time in the detecting means, and different detecting means are arranged so that one of the pairs is common. Here, when the current directions of the two conductive lines are opposite to each other, when the same current flows, the magnetic flux of the conductive lines is canceled out. Detects a state in which the magnetic flux is out of balance.

For example, when the magnetic flux is not detected by one detecting means and the magnetic flux is detected by a different detecting means of which one of the two pairs to be measured is the measuring object, the former is used. There are no abnormalities in the two measurement target pairs of the detection means. However, it is considered that one of the pairs to be measured by the latter detection means has an abnormality. And it is found that it is not the measured object pair common to both the detecting means that the abnormality is found from the result of the former detecting means, in other words, the measured object pair which is the measuring object independently by the latter detecting means. I understand.

According to a second aspect of the present invention, in the heat treatment apparatus of the first aspect, when the detecting means detects the magnetic flux of the pair of the object to be measured, the notifying means notifies the abnormality. Therefore, the abnormal measurement target pair can be easily visually recognized.

According to the third aspect of the present invention, the state of the magnetic flux is measured by selecting two of the plurality of conductive wires which are opposite in the direction of the supplied current. At this time, when currents of the same level are flowing through the conductive wires, the magnetic fluxes cancel each other out, and when no current flows through one of the conductive wires, the balance of the magnetic flux is lost and a magnetic flux is generated. By measuring the state of this magnetic flux, it is checked that the state of the current of either of the selected conductive lines is abnormal.

According to a fourth aspect of the present invention, in the third aspect of the present invention, two pairs of the object to be measured are simultaneously measured in the measuring step. Then, when this measurement process is repeated, the measured object pair and the unmeasured object pair are selected as two pairs. That is, three pairs of objects to be measured are inspected by repeating the measurement process twice. Therefore, when the magnetic flux is detected in either the first measurement result or the second measurement result, it is specified which of the three pairs to be measured. For example,
When the magnetic flux is detected only the first time, there is an abnormality in the target pair measured independently in the first time, and in the second time only, there is an abnormality in the target pair measured independently in the second time, and both are measured. If so, there is an abnormality in the common target pair. As described above, it is possible to specify an abnormal portion with a small amount of work.

In the method for inspecting an abnormality of a heat treatment apparatus according to a fifth aspect of the present invention, two of the conductive wires which are supplied in parallel to the heating means and whose current directions are opposite to each other are taken as a pair to be measured. select. When a plurality of detection means are simultaneously mounted, the detection means is mounted over the remaining unmeasured object pairs including one of the measured object pairs.

Thus, for example, abnormal measurement target pairs are narrowed down depending on the mounting position of the detecting means for detecting the magnetic flux. If the two detecting means detect at the same time, it is determined that there is an abnormality in the common measured object pair. Next, when only one detecting means is detected, it is determined whether or not the magnetic flux is detected by the detecting means for each of the two pairs of objects to be measured. As described above, an abnormal conductive wire can be narrowed down without mounting the detecting means on a one-to-one basis with respect to the heating means.

[0030]

Next, embodiments of a heat treatment apparatus according to the present invention will be described based on examples. FIG. 1 is a longitudinal sectional view showing the overall configuration of a heat treatment apparatus 1 according to one embodiment of the present invention. The heat treatment apparatus 1 is a so-called lamp annealing apparatus that irradiates light from a large number of lamps to perform predetermined processing on a substrate.

As shown in FIG. 1, the heat treatment apparatus 1 mainly includes a chamber 10, a light emitting section 20, a transmission cover 30, a rotation holding section 40, a reflection section 50, a transmission cap 60, and a temperature measurement section 7.
0, an elevation drive unit 80 and a control unit 90.

The chamber 10 has a reflector 11 on the upper part,
A cylindrical furnace body having a housing 12 in a lower part,
The inner wall surface of the furnace body is covered with quartz, and has a processing space PS which is a space for performing a heat treatment on the wafer W as a kind of substrate and is a processing chamber. Further, a number of cooling pipes 13 (partially omitted with reference numerals) for cooling through the refrigerant are provided inside the reflector 11. The reflector 11 and the housing 12 are vertically separated from each other, and both are connected by an extendable bellows 14 that covers the outer peripheral surface of the housing 12.

Further, in addition to a loading / unloading port 10a for transferring wafers W to / from an external substrate transfer mechanism (not shown) on the side surface of the chamber 10 and loading / unloading the chamber 10, an upper gas supply path 10b and an upper gas supply path 10b. A discharge path 10c and a lower gas supply path 10d are provided. A chamber for supplying a processing gas such as nitric oxide gas (N ₂ O) or oxygen gas (O ₂ ) for forming a nitride film or an oxide film by a chemical reaction is provided in the upper gas supply passage 10b. External replacement for supplying a replacement gas such as a nitrogen gas (N ₂ ) with low chemical reactivity for replacing and discharging a processing gas supply source 15 provided outside the processing gas and a processing gas filled in the chamber 10. It is connected to a gas supply 16. The upper gas discharge path 10c discharges the processing gas and the replacement gas supplied into the chamber 10 (hereinafter, simply referred to as "gas" when both are collectively referred to) to the outside. Further, the lower gas supply passage 10d is connected only to the replacement gas supply source 16.

A shutter 17 is provided outside the side of the loading / unloading port 10a. The shutter 17 can be opened and closed in the vertical direction with respect to the loading / unloading port 10a by driving a lifting mechanism (not shown).

The light emitting section 20 is provided inside the reflector 11 and has a large number of lamps (for example, tungsten halogen lamps) 21 as light emission heating means. Lamp 2
Numerals 1 are provided so as to face the surface of the wafer W and to be distributed substantially uniformly in a plane parallel to the wafer W. Therefore, when the lamp 21 is turned on, the light is applied to the wafer W, and the wafer W is uniformly heated. And each lamp 2
1 is connected to a plurality of power supply modules that generate power for lighting the lamp 21 by receiving power from an external AC power supply described later, and each power supply module supplies power to the plurality of lamps 21 to control the lighting of the lamp 21. I do.

The transmission cover 30 is a low-chemical-reactivity quartz cover provided below the light-emitting unit 20 and transmits the light emitted from the lamp 21. This transparent cover 30
Is connected to a gas reservoir 30a communicating with the upper gas supply passage 10d.

The lower surface of the permeable cover 30 is provided with an upper gas inlet 30 which is a plurality of pores communicating with the gas reservoir 30a.
b is provided. When the gas is supplied, the gas flows into the processing space P like a shower through the upper gas inlet 30b.
S. As described above, in the heat treatment apparatus 1, the upper gas inlet 30b is provided uniformly in a plane parallel to the processing surface of the wafer W, so that the gas flow in the processing surface of the wafer W is uniform, The non-uniformity of the temperature drop of the wafer W due to the gas flow is also suppressed.

The holding and rotating unit 40 holds the edge of the wafer W at the entire periphery thereof, and has a heat equalizing ring 41 made of SiC for compensating for the release of heat from the periphery. It is supported by cylindrical support legs 42. A rotor 43a is provided at the lower end of the outer peripheral surface of the support leg 42, and a linear motor 43 in which a corresponding stator 43b is attached to the fixed member 52 is provided. When the linear motor 43 rotates, the support legs 4
2 rotates about the center of the cylinder, and accordingly, the heat equalizing ring 41 is also rotatable about a center in the horizontal plane in a horizontal plane parallel to the processing surface (upper surface) of the wafer W. . Note that a gear and an electric motor may be used instead of the linear motor.

The reflecting section 50 is formed by fixing a reflecting plate 51 having a mirror surface having a high reflectance to the housing 12 via a fixing member 52 in parallel with the wafer W held by the heat equalizing ring 41. The light emitted from the wafer W is reflected by the reflection plate 51. Then, the lower surface of the wafer W further reflects the reflected light, so that a phenomenon of multiple reflection in which the reflected light is repeated between the wafer W and the reflection plate 51 occurs.
The reflector 51 has a plurality of holes 51a.

The transmission cap 60 is a cylindrical member having a high light transmittance and a low chemical reactivity having a cylindrical shape and closed at the upper end, and covers the upper portion of the reflection portion 50. Thereby, the surface of the reflection plate 51 is prevented from reacting with the processing gas and becoming “cloudy” or the like, thereby preventing the reflectance from lowering. The upper surface of the transmission cap 60 has three concentric circles.
The support pins 61 made of quartz are provided, and the wafer W can be horizontally mounted on the upper ends of the support pins 61 as substrate holding means.

An air cylinder 62 is provided below the transmission cap 60 to move up and down the entire transmission cap 60. When the wafer W is received by the expansion and contraction of the air cylinder 62, the transmission cap 60 is raised and placed on the support pins 61, and then the transmission cap 60 is lowered, so that the heat equalizing ring 41
The wafer W is mounted thereon. Conversely, when transferring the wafer W to the substrate transfer mechanism, the reverse procedure is performed.

The transmission cover 30 and the transmission cap 60
Further, since the inner wall of the chamber 10 is made of quartz and the heat equalizing ring 41 is made of SiC, the metal member is hardly directly exposed to the processing gas inside the chamber 10, so that the metal contamination on the wafer W can be prevented. Has no effect.

The temperature measuring section 70 is attached below each of the cylindrical holes 51a provided in the reflection plate 51,
The light after multiple reflection can be taken into the inside through the hole 51a. Then, the temperature measuring unit 70
A temperature of the wafer W is measured based on the light by a radiation thermometer (not shown) provided therein, and the temperature signal is transmitted to a control unit 90 described later.

The elevation drive unit 80 includes a ball screw 81 and a motor 82. The rotation of the motor 82 raises and lowers the housing 12, the reflection unit 50, the holding rotation unit 40, and the temperature measurement unit 70 attached thereto. (Relative to or closer to the reflector 11). Thus, the wafer W placed on the heat equalizing ring 41 can be moved up and down.

The control unit 90 includes a CPU and a memory (not shown) therein, and supplies electric power to each of the shutter 17, the lamp 21, the linear motor 43, and the motor 82 (not shown). Connected to drivers (not shown), and controls the operations of the above-described units through control of the power supplied by the drivers;
The supply amounts of air and gas are controlled by opening and closing electromagnetic valves (not shown) provided to an air supply source (not shown), the processing gas supply source 15, and the replacement gas supply source 16 to the air cylinder 62.

Next, a configuration for controlling the lighting of the lamp 21 in the heat treatment apparatus 1 will be described with reference to FIG. FIG. 2 is a diagram showing one power supply module 100 and eight lamps 21 connected to the power supply module 100. In the heat treatment apparatus 1, a plurality of power supply modules 100 are provided to control the lighting of many lamps 21.

The power supply module 100 includes a pair of thyristors 110 connected in reverse to each other, a current detector 120 for detecting an AC current value output from the power supply module 100, and a voltage detector 130 for detecting an output AC voltage value. These components constitute a power supply unit 100a that converts power from the AC power supply 140 and generates power to be supplied to the lamp 21.

As shown in FIG. 2, in the heat treatment apparatus 1, one power supply module 100 supplies electric power to eight lamps 21a to 21h arranged in the light emitting section 20 in parallel. It is divided into two sets (a to d and e to h). That is, a heating block 200a having four lamps 21a to 21d is provided in the power supply unit 100a.
Heating block 200 having two lamps 21e to 21h
b are connected (in parallel) and the heating block 200a
Is provided with a current detector 201a for detecting lamp burnout,
The heating block 200b is provided with a current detector 201b for detecting burnout of the lamp.

The outputs from the two current detectors 201a and 201b are input to a lamp group burnout detection circuit 25, and the lamp burnout is detected by a method described later. Further, the lamp burnout detection circuit 25 is connected to a control unit 90 that controls the overall trend of the heat treatment apparatus 1.
Heating blocks 200a, 200 to which the lamps are connected
b is specified, and the control unit 90 is notified to that effect.

On the other hand, a pair of thyristors 110 of the power supply unit 100a are connected to the power control circuit 150,
The power control circuit 150 adjusts the firing phase angle of the alternating current input to the pair of thyristors 110 so that the power supply unit 1
The power output from 00a is controlled according to the progress of the processing of the wafer W. The current value and the voltage value from the current detector 120 and the voltage detector 130 are input to the power control circuit 150, and the power output from the power control circuit 150 is feedback-controlled.

The power control circuit 150 is connected to the control unit 90, and when the lamp out detection circuit 25 notifies the control unit 90 of the detection of the lamp out, the control unit 90 controls the power control circuit 150 as necessary. The power control circuit 150 shuts off the gates of the pair of thyristors 110 and turns off all the lamps 21a to 21h.

In the drawing, reference numerals 210, 220, and 230 denote current detectors for specifying the lamp 21 in which an abnormality such as a lamp burnout has occurred, and is arranged commonly to the heating blocks 200a and 200b. Specifically, the first current detector 21
0 is a conductive line 2 from the power supply unit 100a to the lamp 21a.
3a and a conductive wire 24a from the power supply unit 100a to the lamp 21e are simultaneously arranged as objects to be measured. At this time, the direction of the current flowing through the conductive line 23a goes from the top to the bottom in FIG. 2, but in the conductive line 24a, the direction of the current is opposite to the direction from the bottom to the top. Therefore, the conductive line 23a and the conductive line 24a correspond to a pair to be measured in the present invention.

Then, similarly to the first pair of the object to be measured by the conductive line 23a and the conductive line 24a, the conductive line 23b and the conductive line 2
4b, the conductive lines 23c and 24c, and the conductive lines 23d and 24d face each other in a state where the current flows in opposite directions.
The third and fourth pairs to be measured are set.

Further, two pairs of the first current detectors 210 are simultaneously arranged as the objects to be measured over the first and second pairs of the objects to be measured from the power supply unit 100a. The sensor 220 is arranged as an object to be measured simultaneously over the second and third pairs of objects to be measured from the power supply unit 100a, and the third current detector 230 is connected to the power supply unit 100a
From the third and fourth pairs of objects to be measured at the same time. The first to third current detectors 210, 220, 230 correspond to the detecting means of the present invention.

The configuration of each of the current detectors 210, 220, 230 is such that only the first current detector 210 is shown in FIG. Specifically, the current detector 210
Is to detect the state of the current flowing through the conductive wires 23a, 23b, 24a, 24b based on the magnetic flux generated by the current, and to detect the conductive wires 23a, 23b, 24
The conductive wires 23a, 23b, 24
A core 211 made of an annular magnetic body, a directional silicon steel plate, or the like is provided so as to surround a, 24b. Core 21
One of the annular soft magnetic materials is made of conductive wires 23a, 23b, 24.
In order to detect the AC components a and 24b, it is desirable to select a material having good AC magnetic characteristics, and Mn-Zn soft ferrite or Ni-Zn soft ferrite can be used.

A magnetic flux change detecting winding 212 for detecting a magnetic flux generated in the core 211 by a voltage is wound around the core 211, and a magnetic flux change detecting winding 212 is provided between both terminals of the magnetic flux change detecting winding 212. Current detection resistor 2 for detecting the current of
13 are interposed. Each terminal of the current detection resistor 213 is separately connected to the current detection terminals 214a and 214b.

The current detection terminals 214a and 214b are connected to a lamp burnout detection circuit 26 as shown in FIG. 2, and the lamp burnout detection circuit 26 is connected to a control unit 90.
When the lamp burns out, the four lamps 21 to be detected are specified. Further, each current detector 210, 2
One of the lamps 21 is specified by the determination method described later based on the outputs from the output units 20 and 230, and the control unit 90 notifies the lamp 21 of that.

A light source 215 such as an LED is interposed in a wiring portion derived from the wound portion of the magnetic flux change detection winding 212, similarly to the current detection resistor 213. Light source 215
When the current flows through the magnetic flux change detection winding 212, the light is emitted, and the state of the magnetic flux in the pair to be measured can be visually recognized. And
The light source 215 corresponds to a notification unit in the present invention.

The operation of the first current detector 210 will be described. Non-contact two conductive wires 23a, 2
When the current flows through the 4a, the magnetic flux is generated by the current. However,
Since the directions of current flow are opposite, the magnetic flux cancels out,
No magnetic flux is induced in the core 211.

On the other hand, when the current value of one of the conductive lines 23a, 24a changes and the magnetic flux becomes unbalanced, the core 211
Generates magnetic flux. The magnetic flux generated in the core 211 interlinks with the magnetic flux change detection winding 212, and the magnetic flux change detection winding 212
, A voltage corresponding to the magnetic flux is induced, whereby a current flows through the current detection resistor 213 and a voltage drop occurs in the current detection resistor 213. The terminal 214 of the current detection resistor 213
The current state of the conductive lines 23a and 24a is detected by the voltage between the terminals a and 214b. In addition, when the light source 215 is turned on by the current induced in the magnetic flux change detection winding 212, the abnormality of one of the conductive wires 23a and 24a is notified.

Here, in the case of the present invention, the first current detector 210 is a first pair of the object to be measured (the conductive wires 23a and 24a).
And the second measured object pair (conductive wires 23b and 24b) are simultaneously measured. That is, in the above configuration, when the same AC current is flowing through all the conductive wires and when no AC current is flowing, no AC current is induced in the magnetic flux change detection winding 212, and the current balance of the pair to be measured is maintained. An AC current will be induced when the vehicle does not swing. As a result, the light source 215 is turned on, and an abnormal state such as a disconnection is detected and reported to one of the pair of objects to be measured.

Similarly, the second current detector 220 is arranged for the second and third pairs of objects to be measured, and the third current detector 230 is arranged for the third and fourth pairs of objects to be measured. It is. The outputs from the current detectors 210, 220, and 230 are input to the lamp burnout detection circuit 26, and the lamp burnout detection is performed in the same manner as in the lamp group burnout detection circuit 25 described below. That is, the current detected by the current detectors 210, 220, and 230 is sent to the amplifier, and a signal based on the sent current value is sent to the control unit 90.

Next, the operation of the heat treatment apparatus 1 when the lamp burnout is detected during the processing of the wafer W in the heat treatment apparatus 1 having the above configuration will be described.

As described above, in the processing operation of the heat treatment apparatus 1, first, an unprocessed wafer W is loaded into the chamber 10. The unprocessed wafer W is first carried into the chamber 10 while being held by an external transfer robot hand.
The hand is capable of moving up and down, and moves down after carrying the wafer W into the processing space PS.

At this time, the entire transparent cap 60 is raised and lowered, and the wafer W held by the hand is placed on the support pins 61. After that, the hand retreats out of the chamber 10,
The shutter 17 closes the loading / unloading port 10a of the chamber 10.

When the wafer W is placed on the support pins 61, the vertically movable transmission cap 60 is lowered, and the wafer W is placed on the soaking ring 41. In addition, processing gas supply source 1
A predetermined gas is supplied from 5 into the processing space PS, and the periphery of the wafer W is set to an atmosphere suitable for processing.

Next, the lamp 21 is turned on under the atmosphere of the processing gas to start the processing. When the preparation for the process is completed, power is supplied from the power supply module 100 to the lamp 21, and the lamp 21 is turned on. As a result, the wafer W is irradiated with lamp light from the large number of lamps 21, and a process involving heating such as annealing and CVD (Chemical Vapor Deposition) is performed on the wafer W. Also, the lamp 21
The electric power supplied to the chamber 10 is controlled so as to change appropriately in accordance with the content of the processing, and the atmosphere inside the chamber 10 is appropriately adjusted.

When the processing on the wafer W is completed, the chamber 1
The gas inside 0 is replaced with an inert gas, and then the wafer W is transferred by the transfer robot with the shutter 17 opened. The unloading of the wafer W is performed by an operation reverse to the operation at the time of loading.

When there is a wafer W to be processed next, the above steps are repeated, and the processing is sequentially performed on a plurality of wafers W.

Here, in the heat treatment apparatus 1, it is confirmed whether or not the lamp has run out during the processing of the wafer W. if,
When the lamp burnout occurs, the lamp group burnout detection circuit 22 and the lamp burnout detection circuit 24 shown in FIG.
Notify 0 that the lamp has run out and display an error on the display to notify the operator.

In the heat treatment apparatus 1, when the lamp is cut off, the heat treatment apparatus 1 stops the processing operation for the next wafer W, and does not carry the next wafer W into the chamber 10. After that, the operator searches for a lamp 21 to be replaced from the group of lamps 21 that have run out according to the error display, replaces the lamp 21, and resumes substrate processing.

Next, a method of detecting a lamp explosion in the heat treatment apparatus 1 will be described with reference to a flowchart of FIG. In the configuration related to one power supply module 100 shown in FIG. 2, all eight lamps 21 have the same rating (substantially the same characteristics). In addition, since the two heating blocks 200a and 200b are supplied with power in parallel from the power supply unit 100a and always have the same voltage (effective value), the two heating blocks 200a and 200b
The current value (effective value) flowing into b becomes the same (assuming that the impedances of the section circuits are equal).

Here, one of the heating blocks 200
a, 200b, when one lamp 21 is disconnected, the heating block 200a, 200 in which the lamp is cut off
The value of the current flowing through b is approximately 3/4 of the value of the current flowing through the heating blocks 200a and 200b where the lamp has not burned out.
Becomes Therefore, the lamp group outage detection circuit 25
By comparing the outputs from the two current detectors 201a and 201b, it is possible to detect the heating block in which the lamp has run out (step S1).

Next, the specification of the lamp 21 will be described following the specification of the heating blocks 200a and 200b (step S2). In the following detection method, it is not assumed that the same number of lamps are cut off simultaneously in the two heating blocks 200a and 200b, but there is almost no possibility that such a disconnection will occur in a normal use state. There is no practical problem.

First, the specified heating block 200a
Only the power supply module 100 to which (200b) is connected is enabled and power is supplied to turn on all the lamps 21a to 21h. If the current detectors 210, 220, and 230 detect the state of the current, all the current detectors 210, 22
0, 230, if no current is output (step S
3, S4, S5, S6, S7, S8), heating block 2
It can be determined that there is no abnormality in the lamps 21 of 00a and 200b (step S9).

Next, when only the first current detector 210 outputs a current (steps S3 and S4), and the second and third current detectors 220 and 230 do not output a current (step S3).
10, S11, S12), and any of the lamps 21a, b has an abnormality such as lamp burnout, and the conductive wires 23a,
24a, in which no current is flowing. This is because the second current detector 220 does not output a current (steps S10 and S11), so that the second pair of measurement targets common to the first and second current detectors 210 and 220 has an abnormality. It can be determined that there is not. Therefore, in the above case, it is determined that an abnormality such as a lamp burnout has occurred in the conductive wires 23a and 24a of the first pair of the measurement target (Step S).
13).

In the same manner, the third current detector 230
Only when only the current is detected, that is, in step S8, Y
In the case of ES (steps S3, S4, S5, S6, S
7, S8), the lamp 21 on the conductive lines 23d and 24d.
It is determined that an abnormality such as a lamp burnout has occurred in either d or the lamp 21h (step S14).

The first and second current detectors 210, 2
If the current is detected in step 20, ie, step S11
In the case of YES, (Steps S3, S4, S10, S1
1, S15), the lamp 2 on the conductive wires 23b and 24b.
It is determined that an abnormality such as a lamp burnout has occurred in either the lamp 1b or the lamp 21f (step S16).

Further, the second and third current detectors 220 and 2
If the current is detected in step 30, that is, if YES in step S6 (steps S3, S4, S5, S6, S
17) It is determined that an abnormality such as lamp burnout has occurred in either the lamp 21c or the lamp 21g in the conductive wires 23c and 24c (step S18).

These determinations are made based on each of the current detectors 210-2.
The output from 30 is input to the lamp burnout detection circuit 26,
This is performed by the lamp burnout detection circuit 26.

The control unit 90 uses the signal from the lamp burnout detection circuit 25 and the signal from the lamp burnout detection circuit 26 to determine the lamps 21a and b and the lamps 21d and h specified in steps S13, S14, S16 and S18. It is determined which one of the heating blocks 200a, 200b is abnormal among the lamps 21b, f and the lamps 21c, g, and one lamp is specified.

In order to prevent rush current at the start of lamp lighting or erroneous detection in a transient state, the lamp 21
The lamp burnout detection is performed only when the voltage is applied at about 50% or more of the rated voltage, and erroneous detection is appropriately prevented using various filter circuits and software processing.

In the above embodiment, the lamp burnout is automatically detected. However, based on the display of the change in the magnetic flux, the operator judges the lamp burnout, and determines whether to stop or continue the process. You may. That is, each current detector 21
Since the light source 215 for notifying the current state is disposed at 0 to 230, the worker visually recognizes that a current is generated in the corresponding current detectors 210 to 230 when the light source 215 emits light. can do. When an abnormality is displayed by the lamp group burnout detection circuit 25 via the control unit 90, only the corresponding power supply module 100 is energized, and the lighting state of the light source 215 is determined in the same manner as in the lamp burnout detection circuit 24, thereby making the abnormality. The lamp and the conductive wire having an abnormality are identified.

That is, when only the current detector 210 is turned on, one of the lamps 21a and b is turned on. When only the current detector 230 is turned on, one of the lamps 21d and h is turned on.
When the lamps 10 and 220 are turned on, one of the lamps 21b and f is turned on. When the current detectors 220 and 230 are turned on, the lamp 21 is turned off.
One of c and g can be determined to be abnormal.

Further, even in a device in which the current detectors 210 to 230 are not permanently provided as in the above-described device, the following method can detect an abnormality similarly to the device of the present invention.
That is, when the occurrence of an abnormality such as a lamp burnout is specified by the lamp burnout detection circuit 25, the current detector shown in FIG. 3 for the specified heating blocks 200a and 200b is equivalent to the arrangement shown in FIG. To perform the operation of identifying the location where the abnormality has occurred in the light emitting state of the light source 215.

That is, the eight conductive lines 23a to 23d, 24
a to 24d, the first and second pairs of objects to be measured are inspected,
Next, an inspection is performed simultaneously with an unmeasured third target object pair including one of the measured objects. In repeating this inspection, the lamp 2 having an abnormality in the light emitting state of the light source 215
1 is specified.

Alternatively, the inspection is repeated for the two pairs of objects to be measured. At this time, the inspection of the conductive wire is performed, for example, with the first and second pairs and the third and fourth pairs to be measured being paired so that the inspections do not overlap. From this result, first, two pairs of the measured objects having an abnormality are specified, and the two pairs are inspected as a pair with the other non-abnormal measured object pair, respectively. Detect if there is any abnormality. Finally, when the pair to be measured is specified, one lamp is specified together with the specification of the heating block by the lamp group break detection circuit 25.

As described above, the heat treatment apparatus 1
The lamps 21 constitute one set, and each block is provided with a circuit 25 for detecting a lamp outage in this heating block and a circuit 26 for detecting one lamp out of the four lamps 21. Therefore, it is not necessary to wire twice the number of lamps between the power supply module and the large number of lamps as in the prior art, and the current detector for detecting lamp burnout does not require the number of lamps. It is enough to mount three lamps for each lamp.

In particular, when a large number of small and spherical lamps are used as the lamps 21 as shown in FIG. 1, it is necessary to provide more lamps than when heating the wafer W using a straight tube type lamp. Even in such a case, a practical substrate processing apparatus can be manufactured by connecting a plurality of lamps 21 in parallel to form a group.

Also, in the inspection method for identifying a lamp that is out of lamp, first, a target heating block is identified, and thereafter, it is not necessary to individually inspect all lamps. Can be detected.

Although the heat treatment apparatus 1 according to one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible.

For example, in the above-described embodiment, eight lamps 21 are connected to one power supply module 100, and these lamps 21 are further divided into four sets (two sets) for detecting lamp burnout. But one power supply module 1
The number of sets of lamps 21 connected to 00 may be three or more. That is, three or more heating blocks 200a (200b) may be connected to the power supply unit 100a. If three or more lamps 21 are provided in one heating block 200a (200b), the effect of reducing the number of inspection steps can be obtained.

The substrate processing apparatus 1 has four lamps 21.
This is a preferable number from the viewpoint that the operator does not feel troublesome in identifying the lamp 21 whose lamp has been cut off, and the current detector 210 when the lamp cuts out. , 220, 230, etc., can be easily detected based on the fluctuation of the current value from the lamp.

In the above embodiment, the two heating blocks 200a and 200b are supplied with power in parallel. However, power may be supplied to each of the two heating blocks 200a and 200b independently. In this case, the value of the current or the power supplied to the heating blocks 200a and 200b in a normal state may be stored in advance, and the burnout of the lamp may be detected from a change in these values. In addition, when the lamp burnout is detected by such a method, the number of lamps 21 provided in each of the heating blocks 200a and 200b can be different.

In the above-described embodiment, the supply power is controlled by adjusting the firing phase angle of the pair of thyristors 110 connected in reverse. However, any method of controlling the supply power may be used. For example, a triac equivalent to the pair of thyristors 110 may be used, or an equivalent circuit may be formed using transistors.

In the above embodiment, the state of the magnetic flux of the pair to be measured is detected by the magnetic flux change detection winding 212 by the magnetic flux generated in the core 211 of the current detector.
Instead of the magnetic flux change detection winding 212, the voltage signal may be converted by a Hall element.

Further, in the above embodiment, the current detectors are arranged on the conductive wires of the two heating blocks. However, the conductive wires are in contact with the ring inside the core of the current detector without contact. The current detector may be commonly used for two different heating blocks if they can be inserted. That is,
The present invention can also be implemented by inserting four pairs of the measured objects (eight conductive lines) into one current detector. in this case,
Abnormalities of four heating blocks can be detected by three current detectors. In addition, the current detector may be commonly used for other heating blocks as long as the conductive wires can be inserted into the core inside in a non-contact manner in a non-contact manner.

[0098]

As described above, according to the first aspect of the present invention, there is provided a heat treatment apparatus for performing a process involving heating on a substrate,
A plurality of heating means for heating the substrate under the supply of electric power,
A plurality of conductive wires connected to supply power in parallel to each of the plurality of heating means, and two conductive wires in which the direction of the current supplied to the heating means of the conductive wires is opposed to each other as a pair to be measured. Detecting means for detecting the state of the magnetic flux, wherein the detecting means simultaneously measures two pairs of the measured objects, and detects the state of the magnetic flux by sharing one of the pairs with different detecting means. Then, when there is an abnormality in the current flowing through the conductive wire, the magnetic flux from the pair to be measured is detected. An abnormal measurement target pair is specified by measuring the magnetic flux by different detection means using one of the two measurement target pairs as the measurement target as the measurement target.

The invention according to claim 3 is a method for inspecting an abnormality of a heat treatment apparatus for performing a treatment involving heating on a substrate, the heat treatment apparatus comprising: a plurality of heating means for heating the substrate by receiving power supply; A plurality of conductive wires connected to supply a parallel power to each of the plurality of heating means, and two conductive wires of which the direction of the supplied current is opposite among the conductive wires are selected as a pair to be measured. And the step of measuring the state of the magnetic flux by the pair of objects to be measured, the magnetic flux is canceled when currents of the same level are flowing through the conductive wires,
On the other hand, in a state where no current flows, the balance of the magnetic flux is lost and a magnetic flux is generated. By measuring the state of the magnetic flux, the selected target object pair is inspected.

The invention according to claim 5 is a method for inspecting an abnormality of a heat treatment apparatus for performing a treatment involving heating on a substrate, wherein the heat treatment apparatus comprises a plurality of heating means for heating the substrate by receiving power supply; A plurality of conductive wires connected to supply a parallel power to each of the plurality of heating means, and two conductive wires of which the direction of the supplied current is opposite among the conductive wires are selected as a pair to be measured. Performing, selecting two pairs of the measured object pairs, and mounting a plurality of detecting means for detecting the state of each magnetic flux, and mounting one of the measured object pairs to another detecting means in the mounting step of the detecting means. Is mounted in common with the pair to be measured, and detects magnetic flux. If the two detecting means are detecting at the same time, it is determined that there is an abnormality in the common pair of the measured object, and if only one detecting means is detecting,
It is determined whether the two magnetic flux pairs are individually detected for magnetic flux.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view schematically showing an overall configuration of a heat treatment apparatus according to one embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of one power supply module and a lamp connected thereto in the heat treatment apparatus shown in FIG.

FIG. 3 is a schematic configuration diagram schematically showing a configuration of a current detector shown in FIG. 1;

FIG. 4 is a flowchart illustrating a method of abnormality inspection.

FIG. 5 is a diagram showing a configuration of one power supply module in a conventional heat treatment apparatus and a lamp connected to the power supply module.

[Explanation of symbols]

Reference Signs List 1 heat treatment apparatus W substrate 21a, 21b, 21c, 21d, 21e, 21f, 2
1g, 21h, 270 lamps 23a, 23b, 23c, 23d, 24a, 24b, 2
4c, 24d Conductive line 25 Lamp burnout detection circuit 26 Lamp burnout detection circuit 90 Control unit 100, 260 Power supply module 100a Power supply unit 120, 201a, 201b, 210, 210, 22
0, 262, 271 Current detector 140, 250 AC power supply 215 Light source 200a, 200b Heating block

Claims (5)

[Claims] 1. A heat treatment apparatus for performing a process involving heating on a substrate, comprising: a plurality of heating means for heating the substrate by receiving electric power; and a plurality of heating means connected to each of the plurality of heating means for supplying power in parallel. A plurality of conductive wires, and detecting means for detecting a state of a magnetic flux with two conductive wires facing each other in a direction of a current supplied to the heating means of the conductive wires as a pair to be measured. Means for simultaneously measuring two pairs of objects to be measured,
A heat treatment apparatus characterized in that a pair is shared with different detection means. 2. The heat treatment apparatus according to claim 1, wherein the detection unit includes a notification unit that reports an abnormality when detecting a magnetic flux of the pair of measurement targets. 3. A method for inspecting an abnormality of a heat treatment apparatus for performing a treatment involving heating on a substrate, wherein the heat treatment apparatus comprises: a plurality of heating means for heating the substrate by receiving power; A plurality of conductive lines connected to supply power in parallel to each other, and a step of selecting two conductive lines in which the direction of the supplied current is opposite among the conductive lines as a pair to be measured, and Measuring the state of the magnetic flux of the pair of objects to be measured. 4. The abnormality inspection method according to claim 3, wherein the measuring step simultaneously measures two pairs of the measured objects,
An abnormality inspection method for a heat treatment apparatus, comprising: selecting and measuring an unmeasured object including one measured object pair in a repeated measurement process. 5. A method for inspecting an abnormality of a heat treatment apparatus for performing a treatment involving heating on a substrate, wherein the heat treatment apparatus comprises: a plurality of heating means for heating the substrate by receiving a supply of electric power; A plurality of conductive lines connected to supply power in parallel to each other, and a step of selecting two conductive lines in which the direction of the supplied current is opposite among the conductive lines as a pair to be measured, and A step of mounting a plurality of detecting means for selecting two pairs of the object to be measured and detecting the states of the respective magnetic fluxes; A method for inspecting an abnormality of a heat treatment apparatus, wherein the method is installed in common with the apparatus.