JP2001098379A - Vapor phase epitaxial growth device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the positioning accuracy of the center of a substrate holding member with respect to a rotating cylindrical member, and to prevent both members from being fixed to each other by a film forming material. SOLUTION: The vapor phase epitaxial growth device comprises a substrate holding member 2 having a circular recessed part 5 to receive a substrate to be treated on an upper surface and a circular opening part 6 smaller in diameter than the substrate formed on a bottom surface of the circular recessed part 5, and a rotating cylindrical member 3 with the substrate holding member 2 mounted thereon in an attachable/detachable manner. A plurality of fitting projecting parts 7 are provided on a circumferential edge part of the bottom surface of the substrate holding member 2 toward the rotating cylindrical member 3 side and a plurality of fitting recessed parts 8 with a plurality of fitting projecting parts fitted thereto as densely as possible are formed on a circumferential edge part of an end face of the rotating cylindrical member 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor phase growth apparatus for supplying a film forming gas to the surface of a substrate to be processed and performing a film forming process by vapor phase growth utilizing a thermal reaction.

[0002]

2. Description of the Related Art FIGS. 4 (a) and 4 (b) show a substrate holding device of a conventional vapor phase growth apparatus. This conventional substrate holding device 40 comprises a substrate holding member 41 and a substrate holding member 41. 4
1 has a rotatable rotary cylindrical member 42 fitted at the upper end. A cylindrical shielding member 43 is arranged around the rotating cylindrical member 42.

A circular recess 44 for receiving a substrate to be processed is formed on the upper surface of the substrate holding member 41.
4 has a circular opening 45 smaller in diameter than the substrate to be processed.
Are formed. An annular piece 47 which is fitted as closely as possible to the reduced diameter portion 46 at the upper end of the rotary cylindrical member 42 is formed at the periphery of the bottom surface of the substrate holding member 41.

[0004]

As described above, in the conventional substrate holding apparatus 40 of the vapor phase growth apparatus, the annular piece 47 formed on the peripheral edge of the bottom surface of the substrate holding member 41 is reduced in diameter at the upper end of the rotary cylindrical member 42. Since the fitting is made to the portion 46, the accuracy of the alignment of the center position of the substrate holding member 41 with respect to the rotary cylindrical member 42 is improved by the annular piece 47 and the reduced diameter portion 46.
Depends on the accuracy of the cylindrical processing.

[0005] However, it is generally difficult to accurately process the cylindrical shape, and as a result, the accuracy of the positioning of the substrate holding member 41 with respect to the rotating cylindrical member 42 deteriorates.

Further, when performing a film forming process on a substrate to be processed, a film forming material flows around through a gap between the substrate holding member 41 and the cylindrical shielding member 43, and the substrate holding member 41 and the rotating cylinder are rotated. There is a case where the film-forming material adheres to the connection portion with the member 42 to fix them together.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and can improve the accuracy of positioning the center position of a substrate holding member with respect to a rotating cylindrical member, and prevent the two members from sticking to each other by a film forming material. It is an object of the present invention to provide a vapor phase growth apparatus capable of performing the above.

[0008]

In order to solve the above-mentioned problems, in the vapor phase growth apparatus according to the present invention, a circular concave portion for receiving a substrate to be processed is formed on an upper surface, and a circular concave portion is formed on a bottom surface of the circular concave portion. A substrate holding member formed with a circular opening having a small diameter, and a rotatable rotating cylindrical member to which the substrate holding member is detachably attached. A plurality of projections are provided protruding toward the rotary cylindrical member, and a plurality of fitting recesses into which the plurality of fitting projections are fitted as closely as possible are provided at the peripheral edge of the rotating cylindrical member. It is characterized by being formed.

Preferably, the plurality of fitting protrusions and the plurality of fitting recesses are respectively arranged at equal angular intervals.

Preferably, the apparatus further comprises a cylindrical shielding member disposed around the rotary cylindrical member, and an annular shape extending on a side peripheral surface of the substrate holding member beyond a tip end of the cylindrical shielding member. An overhanging piece is provided.

Preferably, an annular bent piece is formed from a peripheral portion of the annular projecting piece toward the cylindrical shielding member.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a vapor phase growth apparatus according to an embodiment of the present invention will be described with reference to the drawings.

FIGS. 1A and 1B show a substrate holding device for holding a substrate to be processed in the vapor phase growth apparatus according to the present embodiment. The substrate holding device 1 includes a substrate holding member 2. And a rotatable rotary cylindrical member 3 to which the substrate holding member 2 is detachably attached at the upper end. A cylindrical shielding member 4 is arranged around the rotating cylindrical member 3. A circular recess 5 for receiving the substrate to be processed is formed on the upper surface of the substrate holding member 2, and a circular opening 6 having a smaller diameter than the substrate to be processed is formed on the bottom of the circular recess 5.

A plurality of fitting projections 7 project downward from the peripheral edge of the bottom surface of the substrate holding member 2. On the other hand, a plurality of fitting recesses 8 are formed in the peripheral edge of the upper end surface of the rotating cylindrical member 3. The fitting protrusion 7 is composed of a pair of parallel side surfaces extending in the direction of the rotation axis of the rotary cylindrical member 3 and a bottom surface extending in a direction perpendicular to the rotation axis. , A pair of parallel side surfaces extending in the direction of the rotation axis, and a bottom surface extending in a direction perpendicular to the rotation axis.

A plurality of fitting projections 7 and a plurality of fitting recesses 8
Are arranged at equal angular intervals, and specifically, eight are formed at 45-degree intervals. Each fitting projection 7 is fitted as closely as possible to each fitting recess 8, whereby the substrate holding member 2 is detachably attached to the upper end of the rotary cylindrical member 3.

The arrangement of the plurality of fitting projections 7 and the plurality of fitting recesses 8 is not limited to equiangular intervals, but may be arranged at unequal angular intervals.

When the substrate holding member 2 is attached to the rotary cylindrical member 3 by fitting the fitting projection 7 and the fitting recess 8 as described above, the processing accuracy of the fitting projection 7 and the fitting recess 8 depends on the processing accuracy. The positioning accuracy between the two members 2 and 3 is determined. Since the fitting projection 7 and the fitting recess 8 can be formed by planar processing, the processing is easy and high-precision processing is possible, and the center position of the substrate holding member 2 with respect to the rotary cylindrical member 3 can be adjusted. Positioning accuracy can be improved.

As described above, according to the vapor phase growth apparatus of the present embodiment, the connection between the substrate holding member 2 and the rotating cylindrical member 3 is achieved by the fitting of the fitting projection 7 and the fitting recess 8. As a result, the positioning accuracy of the center position of the substrate holding member 2 with respect to the rotating cylindrical member 3 can be improved.

As a first modification of the present embodiment, as shown in FIG. 2, an annular projecting piece 9 extending beyond the upper end of the cylindrical shielding member 4 is provided on the side peripheral surface of the substrate holding member 2. It can be protruded.

The provision of the annular projecting piece 9 on the substrate holding member 2 prevents the film-forming material from going inside the cylindrical shielding member 4 when performing the film-forming process on the substrate to be processed. This makes it possible to prevent the substrate holding member 2 and the rotating cylindrical member 3 from sticking to each other due to the adhesion of the film forming material.

As a second modification of the present embodiment, as shown in FIG. 3, an annular bent piece 10 can be formed downward from the peripheral edge of the annular projecting piece 9.

This makes it possible to more reliably prevent the film-forming material from wrapping around than in the first modification.

[0023]

As described above, according to the vapor phase growth apparatus of the present invention, the connection between the substrate holding member and the rotary cylindrical member is achieved by the fitting between the fitting projection and the fitting recess. Therefore, the alignment accuracy of the center position of the substrate holding member with respect to the rotating cylindrical member can be improved.

Further, according to the vapor phase growth apparatus of the present invention, since the annular projecting piece protrudes from the side peripheral surface of the substrate holding member, it is possible to prevent the substrate holding member and the rotating cylindrical member from sticking to each other due to the wraparound of the film forming material. Can be prevented.

[Brief description of the drawings]

FIG. 1A is a plan view showing a substrate holding device of a vapor phase growth apparatus according to an embodiment of the present invention, and FIG. 1B is a side view in which a cylindrical shielding member is added to FIG. FIG.

FIG. 2 is a side view showing a first modified example of the embodiment shown in FIG. 1, and is a partly sectional view.

1. FIG. 3 is a side view showing a second modification of the embodiment shown in FIG.

FIG. 4A is a plan view showing a substrate holding device of a conventional vapor phase growth apparatus, and FIG. 4B is a side view showing a state in which a cylindrical shielding member is added to FIG. Figure.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate holding device 2 Substrate holding member 3 Rotating cylindrical member 4 Cylindrical shielding member 5 Circular concave part 6 Circular opening part 7 Fitting convex part 8 Fitting concave part 9 Annular protruding piece 10 Annular bent piece

Claims (4)

[Claims] 1. A substrate holding member having a circular concave portion formed on an upper surface for receiving a substrate to be processed and a circular opening smaller in diameter than the substrate to be processed formed on a bottom surface of the circular concave portion. A freely rotating rotatable cylindrical member, wherein a plurality of fitting projections are provided on a peripheral edge of a bottom surface of the substrate holding member so as to project toward the rotary cylindrical member, and the rotary cylindrical member is provided. A plurality of fitting recesses into which the plurality of fitting protrusions are fitted as closely as possible at an end surface peripheral portion. 2. The vapor phase growth apparatus according to claim 1, wherein said plurality of fitting projections and said plurality of fitting recesses are respectively arranged at equal angular intervals. 3. The apparatus according to claim 1, further comprising: a cylindrical shielding member disposed around the rotary cylindrical member, wherein a side peripheral surface of the substrate holding member is provided.
The vapor phase growth apparatus according to claim 1, wherein an annular projecting piece extending beyond a distal end portion of the cylindrical shielding member is protruded. 4. The vapor phase growth apparatus according to claim 3, wherein an annular bent piece is formed from a peripheral edge of said annular projecting piece toward said cylindrical shielding member.