JP2001093882A5 - - Google Patents

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Publication number
JP2001093882A5
JP2001093882A5 JP1999268328A JP26832899A JP2001093882A5 JP 2001093882 A5 JP2001093882 A5 JP 2001093882A5 JP 1999268328 A JP1999268328 A JP 1999268328A JP 26832899 A JP26832899 A JP 26832899A JP 2001093882 A5 JP2001093882 A5 JP 2001093882A5
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JP
Japan
Prior art keywords
substrate
etch
plasma
introducing
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1999268328A
Other languages
Japanese (ja)
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JP2001093882A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP26832899A priority Critical patent/JP2001093882A/en
Priority claimed from JP26832899A external-priority patent/JP2001093882A/en
Publication of JP2001093882A publication Critical patent/JP2001093882A/en
Publication of JP2001093882A5 publication Critical patent/JP2001093882A5/ja
Pending legal-status Critical Current

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Description

基板１２が所定温度に昇温したところでガス導入系１３からエッチングガスを導入すると共にカソード電極２３に電圧を印加し、基板１２表面にプラズマを生成させ、基板１２のエッチングを行う。
A voltage is applied to the cathode electrode 23 with the substrate 12 to introducing an etching gas from the gas introduction system 13 was heated to a predetermined temperature, the substrate 12 surface to produce a plasma, to etch the substrate 12.

JP26832899A 1999-09-22 1999-09-22 Temperature measuring device and vacuum treating device equipped with the same Pending JP2001093882A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP26832899A JP2001093882A (en) 1999-09-22 1999-09-22 Temperature measuring device and vacuum treating device equipped with the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26832899A JP2001093882A (en) 1999-09-22 1999-09-22 Temperature measuring device and vacuum treating device equipped with the same

Publications (2)

Publication Number Publication Date
JP2001093882A JP2001093882A (en) 2001-04-06
JP2001093882A5 true JP2001093882A5 (en) 2005-11-04

Family

ID=17457026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26832899A Pending JP2001093882A (en) 1999-09-22 1999-09-22 Temperature measuring device and vacuum treating device equipped with the same

Country Status (1)

Country Link
JP (1) JP2001093882A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI320951B (en) * 2002-08-13 2010-02-21 Lam Res Corp Methods for in situ substrate temperature monitoring by electromagnetic radiation emission
US7341673B2 (en) 2003-08-12 2008-03-11 Lam Research Corporation Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission
US7235155B2 (en) * 2003-03-14 2007-06-26 Tokyo Electron Limited Method and apparatus for monitoring plasma conditions using a monitoring ring
US7112763B2 (en) * 2004-10-26 2006-09-26 Applied Materials, Inc. Method and apparatus for low temperature pyrometry useful for thermally processing silicon wafers
JP2010025756A (en) * 2008-07-18 2010-02-04 Fuji Electric Systems Co Ltd Temperature measuring instrument and temperature distribution measuring system
JP5577160B2 (en) * 2010-06-07 2014-08-20 株式会社日立ハイテクノロジーズ Plasma processing apparatus and plasma processing method
JP6295674B2 (en) * 2014-01-20 2018-03-20 ウシオ電機株式会社 Heat treatment apparatus and lamp control method
CN113970571A (en) * 2021-10-25 2022-01-25 攀钢集团攀枝花钢铁研究院有限公司 Simple blackness coefficient comparison device and blackness coefficient rapid determination method

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