JP2001086732A - Power conversion system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small and light power conversion system having a small number of parts and improved reliability in system. SOLUTION: In a cooling fan of a cooling unit for a semiconductor element 1, the semiconductor element 1 is mounted on one face of a cooling block 2, and a plurality of cooling fins are mounted on the other face of the cooling block 2. In this case, the cooling fins are projected to the outside, through the hole of a main frame body 3, and the power conversion system is made waterproof, by using a waterproof packing at an interface part between the cooling block 2 and the main frame body 3. A packing guide 8 for supporting the waterproof packing 7 is mounted directly on the cooling block 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a power converter using a semiconductor device, and more particularly to a small and lightweight power converter having a small number of components and significantly improving the reliability of the device. It is.

[0002]

2. Description of the Related Art FIG. 7A is a partial side sectional view showing an example of the configuration of a conventional power converter of this type, and FIG.
It is a partial perspective view showing an example of important section composition of an electric power converter of (a).

In FIG. 7A and FIG. 7B, a semiconductor element 1 is provided on one side of a cooling block 2 for cooling the semiconductor element 1 provided for the purpose of discharging heat generated during energization and switching. Cooling block 2
A plurality of cooling fins (hereinafter, simply referred to as fins) 5 are arranged in a portion (outside air portion) of the device housing (hereinafter, simply referred to as “housing”) 3 on the opposite side to the open portion 4. It is necessary to consider waterproofing at the boundary between the closed part 6 and the open part 4 of the body 3.

Therefore, the cooling block 2 is mounted on a panel 9 on which a packing guide 8 in which a waterproof packing 7 is incorporated is attached.
, And the cooling block 2 is assembled into the housing 3 via the panel 9 so that the boundary between the sealed portion 6 and the open portion 4 of the housing 3 can be waterproofed.

On the other hand, in fixing a power conversion unit (hereinafter simply referred to as a unit) 10 in which the cooling block 2 in the sealed portion 6 of the housing 3 is assembled together with its peripheral circuit components into one unit. Are fixed to the lower surface mounting portion 11 of the housing 3 in a state where the unit 10 is incorporated in the housing 3.

In electrically connecting the inside of the unit 10, a surge absorbing capacitor 12 is connected in parallel to both ends of two semiconductor elements 1 connected in series.

The surge absorbing capacitor 12 suppresses the voltage applied to both ends of the semiconductor element 1 during switching of the semiconductor element 1 to within the rated voltage of the semiconductor element 1.
Since it is necessary to reduce the inductance of the loop circuit formed by the semiconductor element 1 and the surge absorbing capacitor 12, the surge absorbing capacitor 12 needs to be disposed immediately near the semiconductor element 1.

In the above description, the cooling block 2 and the fins 5 constitute a semiconductor device cooler.

The main circuit power input to the power converter having the above configuration is supplied with a power having a stable voltage by a filter capacitor 14 connected in parallel to the power converter by a conductor 13. An external power supply is connected to the outside via a conductor 13a connected to the terminal of the filter capacitor 14 and a main circuit terminal 15 arranged behind the unit 10.

A main circuit power output from the power converter having the above-described configuration is output from an intermediate connection point of the semiconductor element 1 connected in series, and is transmitted through the conductor 13b connected to the intermediate connection point and the main circuit terminal 15. Output to the outside.

Further, the semiconductor element 1 which is a control circuit input
Is input from the gate amplifier 16 and input to the semiconductor element 1 via the gate lead wire 17.

The gate amplifier 16 is connected to a control circuit outside the unit 10 via a control terminal 18 in the gate amplifier 16.

[0013]

However, in the conventional power converter described above, the cooling block 2
Since the panel 9 to which the packing guide 8 in which the waterproof packing 7 is incorporated is attached is attached, it is necessary to make the panel 9 larger in size than the outer shape of the cooling block 2. This leads to an increase in the size and weight of the housing 3 to be incorporated.

The unit 10 is mounted and fixed to the housing 3 by supporting the unit 10 on the lower surface of the housing 3. The load of the unit 10 is applied to the lower part of the housing 3. Since the device itself is hung under the floor of the vehicle body, the upper portion of the housing 3 serving as a support portion of the housing 3 and the lower portion of the housing 3 serving as a support portion of the unit 10 are firmly connected to each other. It is necessary to make the whole body 3 rigid. This leads to an increase in the size and weight of the housing.

Further, in the electrical connection in the device,
When arranging the surge absorbing capacitor 12 divided into two groups in the immediate vicinity of the semiconductor element 1, the surge absorbing capacitor 12 is connected in parallel to the semiconductor element 1 arranged in series. And capacitor 12 for surge absorption
In order to reduce the inductance of the loop circuit constituted by the following, it is necessary to extend the outer dimensions of the surge absorbing capacitor 12 up and down, or extend the terminals of the surge absorbing capacitor 12 up and down. It is necessary to change the shape of the surge absorbing capacitor 12 for the change of the shape, arrangement, etc. of 1, and the advantages of the freedom of arrangement and the standardization of the external shape of the capacitor created by dividing and miniaturizing the capacitor are impaired. The result is.

On the other hand, in the electrical connection of the control section, the gate amplifier 16 for driving the semiconductor element 1 is connected to the filter capacitor 14 in consideration of the connection of the control circuit to the outside.
, The length of the gate lead 17 connecting the semiconductor element 1 and the gate amplifier 16 is long,
Further, since the gate amplifier 16 and the 15 main circuit terminals are arranged close to each other, noise is reduced.
It is necessary to consider an arrangement for preventing the malfunction of the semiconductor element 1 such as separating the bundles between the electric wires, giving a shielding effect by adding members, etc., and thus, a device having poor manufacturability and sufficient wiring space is required. This is a factor that hinders miniaturization.

Further, since the filter 14 itself and the gate amplifier 16 are installed on the back surface, it is necessary to secure a work space in consideration of workability such as parts inspection and removal in the event of a failure. Therefore, this is a factor that hinders downsizing of the device.

As described above, in the conventional power conversion device, it is difficult to reduce the size and weight of the device, the number of components is large, the reliability is ensured, and the maintenance is simplified.
There is a strong demand for realizing a power converter with a simple configuration.

An object of the present invention is to provide a small and lightweight power converter that has a small number of parts and can significantly improve the reliability of the device.

[0020]

According to a first aspect of the present invention, a semiconductor device is mounted on one surface of a cooling block and a plurality of cooling fins are mounted on an opposite surface of the cooling block. The cooling fin portion of the semiconductor element cooler configured by attaching the cooling fin portion to the outside air portion from the hole provided in the device housing, and the boundary between the cooling block and the hole provided in the device housing is sealed with waterproof packing. In a power conversion device that is waterproofed through a gasket, a packing guide that supports the waterproof packing is directly attached to the cooling block.

Therefore, in the power converter according to the first aspect of the present invention, since the packing guide supporting the waterproof packing is directly attached to the cooling block, the cooling block also serves as the panel on which the packing guide is attached. It is possible to reduce the weight of the device and the number of parts.

Further, in the invention corresponding to claim 2, the cooling in the semiconductor element cooler constituted by attaching the semiconductor element to one surface of the cooling block and attaching a plurality of cooling fins to the opposite surface of the cooling block. In a power converter in which a fin portion is protruded from a hole provided in the device housing to an outside air portion, and a boundary between the cooling block and the hole provided in the device housing is waterproofed through waterproof packing. A groove is formed directly on the block surface so as to cover the cooling fin portion, and the groove is used as a packing guide for supporting the waterproof packing.

Therefore, in the power converter according to the second aspect of the present invention, the groove is formed directly on the cooling block surface so as to cover the cooling fin portion, and the groove is used as a packing guide for supporting the waterproof packing. In addition to reducing the weight of the device and the number of parts, the entire cooling fins of the cooling block protrude into the open part, so that the cooling fins enhance the heat radiation effect, thereby increasing the cooling efficiency, making the cooling block smaller and lighter. Can also be planned.

According to a third aspect of the present invention, in the power converter according to the first or second aspect, the semiconductor device cooler and its peripheral circuit components are integrated into one unit. A power conversion unit is mounted on the power conversion unit, and an attachment portion to the device housing is provided above the power conversion unit. The upper portion of the power conversion unit is suspended from the upper portion of the device housing and supported and fixed.

Therefore, in the power conversion device according to the third aspect of the present invention, the power conversion unit is fixed to the device housing by suspending the upper portion of the power conversion unit from the upper portion of the device housing. The device housing support for hanging the device housing itself under the floor of the vehicle body and the unit support for fixing the power conversion unit to the device housing are installed and shared in the upper part of the device housing. Therefore, it is possible to reduce the size, weight, and the number of parts of the entire device by providing the rigidity of the entire device housing without connecting the device housing support portion and the unit support portion. Can be planned.

On the other hand, in the invention corresponding to claim 4, at least two sets of semiconductor switching circuits each having a surge absorbing capacitor connected in parallel to both ends of two semiconductor elements connected in series are connected in parallel. In each semiconductor switching circuit, both ends of the series-connected semiconductor element in each semiconductor switching circuit are connected to both ends of the filter capacitor, and both ends of the filter capacitor and an intermediate connection point of the series-connected semiconductor elements are used as main circuit terminals for external connection, Power configured to be configured as a power conversion unit by connecting the output side of a gate amplifier for driving a semiconductor element connected in series to the gate of the semiconductor element and providing a control terminal for inputting a signal from outside to the gate amplifier In the converter, a semiconductor element connected in series in each semiconductor switching circuit is The negative electrode terminal of the semiconductor element on the arm side and the positive electrode terminal of the semiconductor element on the lower arm side are connected by a conductor, and a capacitor for surge absorption is formed from two sets of capacitors having both terminals on one surface. And two sets of surge absorbing capacitors are arranged so that the terminals face each other, and installed so that the terminals of the surge absorbing capacitor are located at approximately the middle position between the two semiconductor elements connected in series. Then, the positive terminal of the semiconductor element on the upper arm side and the negative terminal of the semiconductor element on the lower arm side are connected to both terminals of the surge absorbing capacitor with conductors.

Therefore, in the power converter of the invention according to claim 4, the semiconductor element connected in series in each semiconductor switching circuit is connected to the negative terminal of the semiconductor element on the upper arm side and the semiconductor terminal on the lower arm side. The positive electrode terminal of the element is connected with a conductor, and the capacitor for surge absorption is composed of two sets of capacitors with both terminals installed on one surface, and these two sets of capacitors for surge absorption face each other. It is installed so that the terminal of the surge absorbing capacitor is located at almost the middle position between the two semiconductor elements connected in series, and the positive terminal of the semiconductor element on the upper arm side and the lower arm side The surge absorbing capacitor is divided by connecting the negative terminal of the semiconductor element to each terminal of the surge absorbing capacitor with a conductor. To reduce the inductance of the loop circuit composed of the semiconductor element and the surge absorbing capacitor without impairing the advantages of freedom of arrangement created by miniaturization and miniaturization, and the advantage of standardizing the external shape of the surge absorbing capacitor. Can be.

According to a fifth aspect of the present invention, in the power converter according to the fourth aspect of the present invention, a mounting portion for the power conversion unit is provided above the filter capacitor, and the filter is provided from the upper surface of the power conversion unit. By mounting the capacitor by suspending it, the gate amplifier is arranged on the lower surface of the filter capacitor, and the main circuit terminal for external connection and the gate amplifier are vertically separated via the filter capacitor.

Therefore, in the power converter of the invention corresponding to claim 5, a mounting portion for the power conversion unit is provided above the filter capacitor, and the filter capacitor is suspended from the upper surface of the power conversion unit and mounted.
The gate amplifier is arranged on the lower surface of the filter capacitor, and the main circuit terminal for external connection and the gate amplifier are vertically separated via the filter capacitor. , The noise resistance can be improved.

According to a sixth aspect of the present invention, in the power converter according to the fourth aspect of the present invention, the terminal for connecting the gate lead wire of the semiconductor element disposed in the gate amplifier is connected to the semiconductor element. To the side, the control terminal for external connection arranged in the gate amplifier,
It is arranged facing the rear of the power conversion unit opposite to the semiconductor element side.

Therefore, in the power converter according to the present invention, the terminal for connecting the gate lead wire of the semiconductor element arranged in the gate amplifier is arranged in the gate amplifier with the terminal facing the semiconductor element. By arranging the control terminal for the external connection, which is located toward the rear of the power conversion unit opposite to the semiconductor element side, the wiring length between the semiconductor element and the gate amplifier can be shortened. In addition, the breaking performance of the semiconductor element can be improved.

As described above, the common use and standardization of parts
Appropriate arrangement of the devices is achieved, the number of parts is small, the reliability of the device can be remarkably improved, and the size and weight of the device can be reduced.

[0033]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(First Embodiment: Corresponding to Claim 1) FIG. 1 is a partial cross-sectional view showing a configuration example of a power converter according to the present embodiment, and is similar to FIGS. 7A and 7B. The same portions are denoted by the same reference numerals and description thereof will be omitted, and only different portions will be described here.

That is, as shown in FIG. 1, the power converter of this embodiment does not include the panel 9 for mounting the packing guide 8 in FIGS. 7A and 7B and supports the waterproof packing 7. The packing guide 8 is directly attached to the cooling block 2.

In the power converter of the present embodiment configured as described above, the waterproof packing 7 is attached to the packing guide 8 attached to the cooling block 2, and the cooling block 2 is pressed against the housing 3. By the unit 10
The boundary between the housing and the housing 3 can be waterproofed.

In this case, the packing guide 8 supporting the waterproof packing 7 can be directly attached to the cooling block 2 and the cooling block 2 can also be used as a panel for attaching the packing guide 8 as compared with the above-described conventional power converter. Therefore, the size and weight of the apparatus can be reduced, and the number of parts can be reduced.

As described above, in the power converter of the present embodiment, since the components can be shared, the number of components can be reduced, the size and weight of the device can be reduced, and the reliability of the device can be improved. Properties can be significantly improved.

(Second Embodiment: Corresponding to Claim 2) FIG. 2 is a partial cross-sectional view showing a configuration example of a power converter according to the present embodiment, and is similar to FIGS. 7 (a) and 7 (b). The same portions are denoted by the same reference numerals and description thereof will be omitted, and only different portions will be described here.

That is, as shown in FIG. 2, the power converter of this embodiment omits the panel 9 for mounting the packing guide 8 in FIGS. A groove is formed directly so as to cover the fin 5 and the groove is used as a packing guide 8 for supporting the waterproof packing 7.

In the power converter of the present embodiment configured as described above, the waterproof packing 7 is attached to the groove which is formed directly on the cooling block 2 and serves as the packing guide 8, and the cooling block 2 is pushed onto the housing 3. Due to the contact, the boundary between the unit 10 and the housing 3 can be waterproofed.

In this case, as compared with the above-described conventional power converter, a groove serving as a packing guide 8 for supporting the waterproof packing 7 is formed directly on the cooling block 2, and the cooling block 2 is used as a panel for mounting the packing guide 8. Since the device can be used for both purposes, the device can be reduced in size and weight, and the number of parts can be reduced.

Further, since the groove serving as the packing guide 8 is formed directly in the groove of the cooling block 2, the entire fin 5 of the cooling block 2 projects to the opening 4, so that the heat radiation effect of the fin 5 is enhanced. Therefore, the cooling efficiency is increased, and the size and weight of the cooling block 2 can be reduced.

As described above, in the power converter of the present embodiment, the parts can be shared, so that the number of parts can be reduced, and the size and weight of the device can be further reduced. It is possible to further remarkably improve the reliability of the device.

(Third Embodiment: Corresponding to Claim 3) FIG. 3 is a partial cross-sectional view showing a configuration example of a power conversion device according to the present embodiment, and the same portions as FIG. 1 and FIG. The same reference numerals are given and the description is omitted, and only different portions will be described here.

That is, as shown in FIG. 3, the power converter of this embodiment is different from the first or second embodiment described above in that the cooling block 2, fins 5, An upper surface mounting portion 10 for the housing 3 is provided on an upper portion of the unit 10 in which the peripheral circuit components are collectively incorporated, and the upper portion of the unit 10 is suspended from the upper portion of the housing 3 to be supported and fixed.

In the power converter of the present embodiment configured as described above, the unit 10 is fixed to the housing 3 by suspending the upper part of the unit 10 from the upper part of the housing 3. Thus, the housing 3 support for hanging the housing 3 under the floor of the vehicle body and the unit 10 support for fixing the unit 10 to the housing 3 are installed and shared in the upper part of the housing 3. Therefore, as compared with the above-described conventional power conversion device, the housing 3 support portion and the unit 10
By providing the entire housing 3 with rigidity without connecting to the support portion, it is possible to reduce the size, weight, and the number of parts of the entire device.

As described above, in the power converter of the present embodiment, the parts can be shared, so that the number of parts can be reduced, and the size and weight of the apparatus can be further reduced. It is possible to further remarkably improve the reliability of the device.

(Fourth Embodiment: Corresponding to Claim 4) FIG. 4 (a) is a partial side sectional view showing an example of the configuration of this type of conventional power converter, and FIG. 4 (b) is FIG. FIG. 8A is a partial perspective view illustrating an example of a configuration of a main part of the power conversion device of FIG. 7A, and the same elements as those in FIGS.

In FIGS. 4A and 4B, two sets of semiconductor switching circuits each having a surge absorbing capacitor 12 connected in parallel to both ends of two semiconductor elements 1 connected in series, respectively. Are connected to the negative terminal 22 of the semiconductor element 1 on the upper arm side and the positive terminal 21 of the semiconductor element 1 on the lower arm side.
Are connected by a conductor 13c.

Further, the surge absorbing capacitor 12 is
It is composed of two sets of capacitors each having a bipolar terminal 23 on each surface, and the two sets of surge absorbing capacitors 12 are arranged such that the terminals 23 face each other.

Further, the terminal 23 of the surge absorbing capacitor 12 is installed at a substantially intermediate position between the two semiconductor elements 1 connected in series, and the positive terminal 21 of the semiconductor element 1 on the upper arm side, Semiconductor element 1 on the arm side
Of each of the negative terminals 22 of the surge absorbing capacitor 1
The two terminals 23 are connected to the conductors 13d.

In the power converter of this embodiment configured as described above, the semiconductor element 1 connected in series in each semiconductor switching circuit is connected to the negative terminal 22 of the semiconductor element 1 on the upper arm side and the lower arm. The positive electrode terminal 21 of the semiconductor element 1 on the side is connected by the conductor 13c,
Surge absorbing capacitor 12 has two terminals 2
3, two sets of surge absorbing capacitors 12 are arranged such that the terminals 23 face each other, and the two sets of capacitors are arranged substantially in the middle of the two semiconductor elements 1 connected in series. Surge absorption capacitor 1
2 and the positive terminal 21 of the semiconductor element 1 on the upper arm side and the negative terminal 22 of the semiconductor element 1 on the lower arm side are respectively connected to the two terminals 23 of the surge absorbing capacitor 12. The connection by the conductor 13d makes it possible to reduce the inductance of the loop circuit formed by the semiconductor element 1 and the surge absorbing capacitor 12 without changing the outer shape of the surge absorbing capacitor 12.

In this case, the semiconductor element 1 and the surge absorbing capacitor 12 can be connected without deteriorating the advantages of the split configuration and the miniaturization of the surge absorbing capacitor 12 and the flexibility of arrangement and the standardization of the external shape of the surge absorbing capacitor 12. The inductance of the loop circuit constituted by the capacitor 12 can be reduced.

As described above, in the power converter according to the present embodiment, since the components can be shared and standardized, the surge absorbing capacitor 12 can be divided into smaller parts and the arrangement of the equipment can be made freely. It is possible to reduce the inductance of the loop circuit formed by the semiconductor element 1 and the surge absorbing capacitor 12 without losing the advantages of the standardization of the degree and the external shape of the surge absorbing capacitor 12.

(Fifth Embodiment: Corresponding to Claim 5) FIG. 5 is a partial side sectional view showing a configuration example of a power conversion device according to the present embodiment, and FIG. 4 (a) and FIG. The same parts as in b) are denoted by the same reference numerals, and the description thereof will be omitted. Only different parts will be described here.

That is, as shown in FIG. 5, the power converter according to the present embodiment is different from the fourth embodiment in that the unit 1 is provided above the filter capacitor 14 in the fourth embodiment.
0, and the filter capacitor 14 is suspended from the upper surface of the unit 10 and mounted, so that the gate amplifier 16 is disposed on the lower surface of the filter capacitor 14, and the main circuit terminal 15 for external connection and the gate are connected. The configuration is such that the amplifier 16 and the amplifier 16 are vertically separated via a filter capacitor 14.

In the power converter of the present embodiment configured as described above, the mounting portion 24 for the unit 10 is provided above the filter capacitor 14 and the filter capacitor 14 is hung from the upper surface of the unit 10 for mounting. As described above, the gate amplifier 16 is arranged on the lower surface of the filter capacitor 14, and the main circuit terminal 15 for external connection and the gate amplifier 16 are vertically separated via the filter capacitor 14. Compared with the conventional power converter, the main circuit terminal 15 and the gate amplifier 16
Since the distance between them is longer, noise resistance can be improved.

As described above, in the power converter according to the present embodiment, since the components can be shared and standardized and the arrangement of the devices can be optimized, the distance between the main circuit terminal 15 and the gate amplifier 16 can be improved. , The noise resistance can be improved.

(Sixth Embodiment: Corresponding to Claim 6) FIG. 6 is a partial side sectional view showing a configuration example of a power conversion device according to the present embodiment, and FIG. 4 (a) and FIG. The same parts as in b) are denoted by the same reference numerals, and the description thereof will be omitted. Only different parts will be described here.

That is, as shown in FIG. 6, the power converter according to the present embodiment is different from the power converter according to the fourth embodiment described above in that the gate lead line 17 of the semiconductor element 1 disposed in the gate amplifier 16 is provided. Is connected to the semiconductor element 1 side, and the control terminal 18 for external connection arranged in the gate amplifier 16 is arranged toward the rear of the unit 10 opposite to the semiconductor element 1 side. It has a configuration.

In the power converter of the present embodiment configured as described above, the terminal 25 connecting the gate lead 17 of the semiconductor element 1 disposed in the gate amplifier 16 is directed toward the semiconductor element 1. By arranging the control terminal 18 for external connection arranged in the gate amplifier 16 toward the rear of the unit 10 opposite to the semiconductor element 1 side, the conventional power conversion device described above is provided. In comparison, the length of the gate lead wire 17 between the semiconductor element 1 and the gate amplifier 16 can be reduced, so that the cutoff performance of the semiconductor element 1 can be improved.

As described above, in the power converter according to the present embodiment, since the components can be used and standardized and the arrangement of the devices can be optimized, the gate lead between the semiconductor element 1 and the gate amplifier 16 can be achieved. It is possible to improve the breaking performance of the semiconductor element 1 by reducing the wiring length of the line 17.

[0064]

As described above, according to the power converter of the present invention, the number of components is reduced and the reliability of the device is remarkably improved by using and standardizing components and optimizing the arrangement of components. It is possible to reduce the size and weight of the device.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing a first embodiment of a power converter according to the present invention.

FIG. 2 is a partial sectional view showing a second embodiment of the power converter according to the present invention.

FIG. 3 is a partial cross-sectional view showing a third embodiment of the power converter according to the present invention.

FIG. 4 is a partial side sectional view and a partial perspective view showing a fourth embodiment of the power converter according to the present invention.

FIG. 5 is a partial side sectional view showing a fifth embodiment of the power converter according to the present invention.

FIG. 6 is a partial side sectional view showing a sixth embodiment of the power converter according to the present invention.

FIG. 7 is a partial side sectional view and a partial perspective view showing a configuration example of a conventional power converter.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Semiconductor element 2 ... Cooling block 3 ... Housing 4 ... Opening part 5 ... Fin 6 ... Sealing part 7 ... Waterproof packing 8 ... Packing guide 9 ... Panel 10 ... Unit 11 ... Lower surface mounting part 12 ... Surge absorption capacitor 13- 13d ... conductor 14 ... filter capacitor 15 ... main circuit terminal 16 ... gate amplifier 17 ... gate lead wire 18 ... control terminal 19 ... cooling air 20 ... top surface mounting part 21 ... positive electrode terminal 22 ... negative electrode terminal 23 ... surge absorption capacitor terminal 24 ... Filter capacitor mounting part 25 ... Gate lead wire connection terminal.

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Takashi Hashimoto 1 Toshiba-cho, Fuchu-shi, Tokyo F-term in Fuchu Plant, Toshiba Corporation (reference) 5H740 MM03 MM08 PP02 PP06

Claims (6)

[Claims] 1. A cooling device for a semiconductor device comprising: a semiconductor element mounted on one surface of a cooling block; and a plurality of cooling fins mounted on an opposite surface of the cooling block. A power converter that protrudes from the hole provided in the outside air portion through a hole provided in the cooling unit and waterproofs a boundary between the cooling block and the hole provided in the device housing via a waterproof packing. A power converter, wherein a packing guide is directly attached to the cooling block. 2. The apparatus according to claim 1, wherein said cooling fin portion of said semiconductor device cooler is provided by mounting a semiconductor element on one surface of a cooling block and mounting a plurality of cooling fins on an opposite surface of said cooling block. A power converter that projects from the hole provided in the outside air portion to a boundary between the cooling block and the hole provided in the device housing, so as to be waterproof through a waterproof packing. A power converter, wherein a groove is directly formed so as to cover a cooling fin portion, and the groove is used as a packing guide for supporting the waterproof packing. 3. The power converter according to claim 1, wherein the cooler for the semiconductor element and its peripheral circuit components are one
The power conversion unit is assembled into a single unit to form a power conversion unit, and a mounting portion for mounting to the device housing is provided above the power conversion unit, and the upper portion of the power conversion unit is suspended from the upper portion of the device housing. A power converter characterized by being supported and fixed. 4. At least two sets of semiconductor switching circuits configured by connecting surge absorbing capacitors in parallel to both ends of two semiconductor elements connected in series are connected in parallel, and the semiconductor switching circuits in each of the semiconductor switching circuits are connected in parallel. Both ends of the series-connected semiconductor element are connected to both ends of a filter capacitor, and both ends of the filter capacitor and an intermediate connection point of the series-connected semiconductor elements are used as main circuit terminals for external connection, and the series-connected semiconductor elements are connected in series. A power conversion device in which an output side of a gate amplifier for driving a semiconductor element is connected to a gate of the semiconductor element, and a control terminal for inputting a signal from the outside to the gate amplifier is provided, so as to be configured as a power conversion unit. In the said each semiconductor switching circuit in each said semiconductor switching circuit A negative electrode terminal of the semiconductor element on the upper arm side and a positive electrode terminal of the semiconductor element on the lower arm side are connected by a conductor, and the surge absorbing capacitor is provided with two sets of terminals each having a bipolar electrode on one surface. Wherein the two sets of surge absorbing capacitors are arranged so that the terminals face each other, and the surge absorbing capacitor of the surge absorbing capacitor is provided at a substantially intermediate position between the two semiconductor elements connected in series. A terminal is located so that a positive terminal of the semiconductor element on the upper arm side and a negative terminal of the semiconductor element on the lower arm side are connected to both terminals of the surge absorbing capacitor with conductors. A power converter characterized by the above-mentioned. 5. The power conversion device according to claim 4, wherein a mounting portion for the power conversion unit is provided above the filter capacitor, and the filter capacitor is hung from an upper surface of the power conversion unit. Wherein the gate amplifier is arranged on the lower surface of the filter capacitor, and the main circuit terminal for the external connection and the gate amplifier are vertically separated via the filter capacitor. apparatus. 6. The power conversion device according to claim 4, wherein a terminal for connecting a gate lead wire of a semiconductor element disposed in the gate amplifier faces the semiconductor element, A power conversion device, wherein the disposed control terminal for external connection is disposed toward the rear of the power conversion unit opposite to the semiconductor element side.