JP2001085231A - Laminated inductor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a laminated inductor with which the size and pitch of electronic equipment can be reduced and the density of the equipment can be increased more easily than the conventional manufacturing method. SOLUTION: A laminated inductor has first and second magnetic material layers 1 and 1', four magnetic material layers 3 having notched windows 4 formed at prescribed portions of the surfaces of the layers 3 between the magnetic material plates 1 and 1', and a conductive pattern 2 laminated upon the first magnetic material plate 1 by printing. The inductor is formed in such a way that the printed layers 3 are laminated upon another by a printing method so that the notched windows 4 may become coincident with the terminating end section 2b of the pattern 2, and a conductive pattern 5 is laminated upon one magnetic layer 5 so that its starting end section 5a may be connected to the terminating end section 2b through the notched window 4. After the magnetic material layers 3 are successively laminated upon another by the above-mentioned method and a conductive pattern 8 is finally laminated upon the uppermost magnetic material layer 3, a small element 22 is formed by press-fixing the magnetic material plate 1' to the pattern 8 and a plurality of small elements 11 thus formed are laminated upon another.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high frequency band lamination in which a magnetic layer and a conductive pattern are laminated, and a multi-line mounted on a printed wiring board acts as a single element as an inductor element and an impedance element. It relates to a type inductor.

[0002]

2. Description of the Related Art A multilayer inductor mounted on a printed wiring board or the like has a plurality of magnetic plates formed by processing a raw magnetic sheet formed of a ferromagnetic material such as ferrite into a desired size, and a plurality of magnetic plates between them. And a plurality of conductive patterns alternately inserted in a two-dimensional space are formed as one element.

[0003]

However, in recent years, there has been a remarkable demand for downsizing, lower pitch, and higher density in electronic devices, and the conventional technology described above has a limit on the surface kong for forming a small element. It was difficult to cope with miniaturization.

For example, a length of 3.2 mm, a width of 1.6 mm,
When a four-line array having a height of 1.6 mm is to be formed, one small element has a length × width of 0.6 mm × 1.6 m.
m. In the present invention, one small element only needs to form a small element of 1.6 mm × 1.6 mm, which is advantageous in miniaturization and enables the magnetic circuit to be effective.

An object of the present invention is to provide a multilayer inductor that solves the above problems.

[0006]

According to the present invention, a pair of a first magnetic plate and a second magnetic plate, and a notch window formed between the pair of first and second magnetic plates at a predetermined portion of the surface. N is an integer of 1 or more) magnetic material layers, and a spiral-shaped first conductive pattern is laminated on the lowermost magnetic material plate by a printing method, and is provided at an end portion of the spiral-shaped conductive pattern. The first magnetic layer is laminated by a printing method so that the cutout windows coincide with each other, and a second spiral conductive pattern is formed thereon from above.
The first magnetic layer is laminated on the first magnetic layer by a printing method so that the start end portion is connected to the end portion through the cutout window, and then sequentially laminated by the above-described method. After laminating the (N + 1) th spiral conductive pattern on the Nth magnetic layer, the second magnetic plate is pressed to form small elements, and a plurality of such small elements are laminated. Thus, a multilayer inductor is obtained.

Further, according to the present invention, both the start end portion of the conductive pattern that is in close contact with the first magnetic plate and the end portion of the conductive pattern that is in close contact with the second magnetic plate are formed on the magnetic plate. The multilayer inductor is formed so as to be exposed at the edge, and the exposed portion is connected to the external electrode.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is an exploded perspective view of an array type multilayer chip inductor according to an embodiment of the present invention. FIG. 2 is an external perspective view of the array-type multilayer chip inductor of FIG. First, 5 wt% of a binder resin (PVB resin) and 60 wt% of an organic solvent (ethylene glycol ether) are added to the insulating magnetic powder, mixed, and slurried. This slurry is used to form a long insulating magnetic plate having a thickness of 200 to 600 μm by using a doctor blade method.

As shown in FIG. 1, on a magnetic plate obtained, one chip continuously generated
The first starting end portion 2a is projected along the edge, and the first conductive pattern 2 in the form of a swirl is printed by a screen printing method using an Ag paste or the like, and dried by heating. A thin magnetic layer 3 in which a cutout window 4 is formed (engraved) at a position where the terminal end portion 2b is exposed on the first conductive pattern 2 is bonded to the insulating nonmagnetic powder with a binder resin ( P
VB resin), 5 wt% of an organic solvent (ethylene glycol ether), etc. are added, and the mixture is printed by a screen printing method using a mixed slurry, and dried by heating. Further, the cutout window 4 is formed on the magnetic layer 3.
Terminal portion 2b of first conductive pattern 2 exposed inside
The second conductive pattern 5 having a line width different from that of the first conductive pattern 2 is formed in the same manner as described above so that the start end portion 5a of the second conductive pattern 5 is electrically connected to the first conductive pattern 5. Hereinafter, similarly, the end portion 5b of the second conductive pattern 5 is connected to the start end portion 6a of the third conductive pattern 6 via the magnetic layer 3 provided with the cutout window 4.

As described above, the magnetic plate 1 'as an upper insulating magnetic layer is press-bonded on the plurality of elements, in the drawing, on the fifth conductive pattern 8 by hot pressing to form an unfired sheet. Next, as described above, a plurality of the small elements 11 printed by lamination are formed, and a plurality of the small elements 11 are positioned and overlapped.
An array type multilayer inductor element corresponding to a desired number of lines is formed. FIG. 2 shows the array-type laminated inductor element after the assembly.

The unsintered sheet is cut into a predetermined size to form individual unsintered chips. After debinding these unfired chips in an air atmosphere, integrated firing by air firing is performed, barrel polishing is performed for chamfering of the chips, and connected to the internal electrodes exposed to the outside at both ends of the coil. Then, an Ag paste or the like is applied to the side surface of the chip by dip, dried at a predetermined temperature and time, and baked at a temperature of about 600 ° C. in an air atmosphere to form electrode terminals.

Next, the obtained electrode terminals are packaged by solder plating via a nickel plating layer by electrolytic plating to obtain an array type multilayer chip inductor.

According to the array type multilayer chip inductor obtained by the above method, the length is 3.2 mm and the width is 1.6.
In order to form a four-line array having a height of 1.6 mm and a height of 1.6 mm, it is sufficient that one small element forms a small element of 1.6 mm × 1.6 mm, which is advantageous for miniaturization and has a magnetic circuit. Can be enabled.

When one small element is formed, a predetermined conductive pattern may be printed and laminated on a magnetic sheet provided with a cutout window.

[0015]

As described above, according to the present invention, a plurality of small elements having the same structure are positioned and overlapped on a small element to form a three-dimensional structure, thereby securing an area for forming one element. In addition to this, an array-type multilayer inductor for multiple lines can be obtained, a magnetic circuit can be made effective, and the demand for miniaturization, low pitch, and high density in electronic devices in recent years is easier than conventional manufacturing methods. Can respond to.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an array type multilayer chip inductor according to a first embodiment of the present invention.

FIG. 2 is an external perspective view of the array-type multilayer chip inductor of FIG.

[Explanation of symbols]

 1,1 'magnetic plate 2,5,6,7,8 conductive pattern 2a, 5a, 6a, 7a, 8a start end 2b, 5b, 6b, 7b, 8b end 2c, 8c conductive pattern exposed portion 3 magnetic material Layer 4 Notch window 9 External terminal 10 Inductor element 11 Small element

Claims (2)

[Claims] An N number (N is an integer of 1 or more) of a pair of a first magnetic plate and a second magnetic plate, and a cutout window formed in a predetermined portion of a surface between the first magnetic plate and the second magnetic plate. A first conductive pattern in the form of a spiral band is laminated on the lowermost magnetic plate by a printing method, and the cutout window is aligned with the terminal portion of the conductive pattern in the spiral band. A first magnetic material layer is laminated by a printing method, and a second spiral conductive pattern is formed on the first magnetic material layer by a printing method so that a start end portion is connected to the end portion through the cutout window. After that, after laminating on the first magnetic layer, and sequentially laminating by the above-mentioned method, after laminating the (N + 1) th spiral band conductive pattern on the Nth magnetic layer, A small element is formed by pressing the second magnetic plate, and a plurality of the small elements are laminated. A multilayer inductor characterized by the following. 2. A method according to claim 1, wherein a starting portion of the conductive pattern that is in close contact with the first magnetic plate and an ending portion of the conductive pattern that is in close contact with the second magnetic plate are both exposed to the edge of the magnetic plate. The multilayer inductor according to claim 1, wherein the exposed portion is formed and connected to an external electrode.