JP2001084654A - Sticking method for stuck type optical disk and sticking device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To straighten distortion before irradiation and to control deformation owing to heat generation caused by irradiation of ultraviolet rays by pressurizing an upper surface of a substrate stuck with a light transmissive flat member and executing irradiation by the ultraviolet rays to harden an adhesive. SOLUTION: Since press glass 4, a glass holder 5 and a holder receiving base 6 are circular matching a disk substrate 9, the center of the holder receiving base 6 is made to coincide with the center of the rotation of a holding table 8. The disk substrate 9 on the holding table 8 always is lightly pressurized by the press glass 4 in a concentric state. Next, the holding table 8 on which the disk substrate 9 lightly pressurized by the press glass 4 is placed is rotated by a motor A 13, irradiation of ultraviolet rays by a lamp 1 is started, the upper surface of the disk substrate 9 is irradiated through the press glass 4, and a non-hardened adhesive layer is hardened. After the composite disk substrate is vacuum-sucked to the holding table 8, the rotation of the holding table 8 is stopped, the holding table 8 is lowered by a cylinder 14 and the disk substrate is separated from the press glass 4.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to DVD-5, DVD-
9 relates to a bonding apparatus in the manufacturing process of a bonding type optical disc composed of a substrate having a light-transmitting surface on one side, such as a bonding completed product due to distortion of the substrate before bonding or thermal distortion during ultraviolet irradiation. It can effectively prevent deterioration in quality due to deformation of the product, and can be used also in a laminating process of various laminated products obtained by laminating an extremely thin plastic product with an ultraviolet curable adhesive. .

[0002]

2. Description of the Related Art With the recent increase in demand for large information amount removable media, a conventional CD (compact disk)
The market demand for DVDs (digital video discs) having a storage capacity of about 6 to 8 times that of the above is increasing. This DV
In D, a 0.6 mm thick thin substrate provided with an information recording layer on one side is bonded to another light-transmitting thin substrate to form one bonded optical disk. DVDs are roughly classified into several types according to the configuration of the information recording layer.
DVD-9 having two information recording layers and a DV capable of reversible recording with a single-layer information substrate facing both sides.
D-10 and the like. The production of these laminated optical disks is performed in the following procedure. First, apply an adhesive to one or both of the thin substrates, overlay both substrates,
It is rotated at a high speed by, for example, a rotating device to form an adhesive layer having a uniform thickness on the bonding surface while shaking off excess adhesive. Next, the rotation is stopped, and then sent to a device for curing the adhesive layer of the two thin substrates adhered through the adhesive (for example, an ultraviolet irradiation device in the case of an ultraviolet-curable adhesive), and the adhesive is cured to obtain one sheet. Is completed. In addition, the procedure of the conventional laminating method is the sequence of steps of adhesive application, superposition, shaking, and curing of the adhesive. The movable disk holding table (a predetermined concentric line on the outer peripheral portion of the index table). One of the base materials is placed on the disk holding table and held, and while the disk holding table is being rotated at a low speed, an ultraviolet curable adhesive is dropped and applied in a ring shape. The substrates are overlapped, the disc holding table is rotated at a high speed, and the adhesive is diffused between the vertically stacked substrates by centrifugal force, and the excess adhesive is discharged to the outside of the outer periphery. The adhesive is cured by irradiating ultraviolet rays from above with an ultraviolet lamp, and the two substrates are bonded to each other.

If the irradiation of ultraviolet rays is uniform over the entire surface of the substrate, the adhesive cures at a uniform rate over the entire surface of the substrate and the adhesion is uniform over the entire surface. Therefore, the curing speed of the adhesive is not uniform, and the bonding and bonding are not uniform over the entire surface. Japanese Patent Application Laid-Open No. H10-334521 discloses an invention which solves this problem by rotating the disk holding table during ultraviolet irradiation to uniformly irradiate the entire surface of the substrate and simultaneously irradiating the outer peripheral surface with ultraviolet light from the outside in the radial direction. Have been. SUMMARY OF THE INVENTION The present invention aims to uniformize the entire surface of an ultraviolet ray to prevent the quality of finished bonded products from deteriorating due to uneven bonding. Can be done. Deformation due to non-uniform temperature distribution or temperature difference between the upper and lower substrates, in addition to non-uniform irradiation of ultraviolet rays, results in deterioration of the quality of the finished bonded product due to the deformation. That is, in the conventional method, an ultraviolet curable resin type adhesive (radical polymerization or cationic polymerization adhesive) is used as the adhesive.
Is used to irradiate ultraviolet rays with an ultraviolet irradiation device to cure the adhesive, but the substrate is easily deformed by the heat generated by the ultraviolet irradiation. This is because the thickness of the substrate is reduced to 0.6 mm and the effect of heat is large, and there is a difference in the degree of thermal deformation when laminating substrates with different constituent layers. It is presumed to be due to warping. If cured and bonded in such a deformed state, the quality of the finished substrate will be significantly reduced. In addition, “warpage” in the substrate bonding process is largely due to a difference in temperature between the two substrates to be bonded. In addition, the degree of "warpage" of the cured substrate is greatly affected by the temperature distribution of the substrate during irradiation with ultraviolet light (temperature difference between the inner and outer circumferences).

[0004]

SUMMARY OF THE INVENTION Accordingly, the present invention reduces the thermal deformation of a substrate during the irradiation of ultraviolet rays, and reduces the deformation of the substrate up to the previous process such as molding and the deformation due to aging due to storage. It is an object of the present invention to devise a bonding method and a bonding apparatus capable of obtaining a high-quality bonded optical disk by bonding while mechanically correcting. This problem is further subdivided as follows.

[Problem 1] This problem 1 is an object of the invention according to claim 1, in which after a disc substrate to be bonded is set on a holding member, a flat member is superimposed on the held disc substrate, and To correct the distortion before irradiation by lightly pressing the disk substrate, and to allow the substrate to be irradiated with ultraviolet rays while suppressing deformation due to heat generated by ultraviolet irradiation. [Problem 2] Even if a flat member with high flatness accuracy is used as a flat member to be superimposed on the substrate on the substrate holding member, when the substrate is irradiated with ultraviolet rays through the flat member, the light transmittance and the refractive index inside the material of the flat member are reduced. It is inevitable that the lamp becomes non-uniform, and in the ultraviolet lamp, the lamp itself has irradiation unevenness due to a light emitting portion. For this reason, there is a possibility that a correction failure due to uneven energy due to irradiation unevenness to the substrate during correction hardening and a correction failure due to uneven residual internal stress of the substrate after bonding may occur. Problem 2 is an object of the invention according to claim 2, the invention according to claim 3, and the invention according to claim 4. Even if a member having high flatness accuracy is used,
The object of the present invention is to make the ultraviolet irradiation on the upper surface of the substrate uniform over the entire surface of the substrate when the substrate is irradiated with ultraviolet light through the flat member. [Problem 3] When a flat member is superimposed on or separated from a substrate on a substrate holding member, and when the flat member relatively moves relative to the substrate on the substrate holding member at the time of irradiation with ultraviolet rays, this causes A shear force is applied to the substrate to cause distortion. Problem 3 is an object of the invention according to claim 5 in which the flat member approaches and separates concentrically and vertically with respect to the substrate on the substrate holding member, and is flat so that it is concentrically held during ultraviolet irradiation. It is to devise a support mechanism for the member by the substrate holding member.

[0006]

Means taken to solve the problem The means taken to solve the above problem 1 is based on the following method (a) (a), based on a disk bonding method in the manufacturing process of a bonded optical disk such as an LD or DVD. B). (A) a light-transmissive flat member is installed between the substrate and the substrate held by the substrate holding member, which is superimposed on the ultraviolet irradiation source, and the upper surface of the substrate to be bonded thereto is pressed;
(B) UV irradiation is performed in a state where the distortion of the substrate is corrected by the pressing force of the flat member, and the adhesive is cured to bond the substrates.

[0007]

The ultraviolet light from the ultraviolet irradiation source passes through the flat member and is irradiated on the substrate on the substrate holding member, whereby the adhesive is cured. A light-transmissive flat member was set between the substrate held by the substrate holding member and the ultraviolet irradiation source, and the upper surface of the substrate to be bonded to the flat member was pressed. The substrate is pinched between the substrate holding member and the flat member to correct the distortion. Then, by performing ultraviolet irradiation in a state where the distortion of the substrate is corrected by the pressing force of the flat member, by curing the adhesive and bonding the substrates, the difference in thermal distortion between the upper and lower substrates due to the ultraviolet irradiation, Despite the difference in thermal distortion between the inner and outer peripheral sides of the substrate, deformation of the superimposed substrate is suppressed, and the adhesive is hardened and fixed with no deformation, so there is no deformation. A substrate (the above-mentioned substrate is bonded, the same applies hereinafter) is generated. In a disk bonding method in a manufacturing process of a bonded optical disk such as an LD or a DVD, a flat and light-transmissive member is installed between an ultraviolet irradiation source and a disk substrate to be bonded, and the disk substrate bonded to the member is mounted. Light pressure, irradiate ultraviolet rays while straightening the disk substrate, cure the adhesive, and bond to reduce the thermal deformation of the substrate at the time of ultraviolet irradiation, and by the molding and pre-process of the substrate It is possible to correct the deformation that has occurred and the deformation due to a temporal change due to storage, etc., and to obtain a high-quality bonded optical disc.

[0008]

[Embodiment 1] An embodiment 1 is a laminating type disk laminating method according to the above-mentioned solving means, wherein the ultraviolet irradiation is performed while rotating the substrate holding member in a state where the substrate is lightly pressed by a light transmissive flat member. It is to do.

By irradiating the above-mentioned ultraviolet rays while rotating the substrate holding member in a state where the substrate is lightly pressed by a light-transmissive flat member, the uneven light emission of the light source and the uneven light transmittance of the flat member are reduced. Averaged,
Since the entire surface of the substrate is made uniform, deformation of the composite substrate due to unevenness of the ultraviolet curing rate of the adhesive is prevented.

[0009]

Embodiment 2 Embodiment 2 is a bonding type optical disk bonding apparatus for carrying out the bonding type optical disk bonding method according to claim 2, and is constituted by the following (a) to (d). Things. (B) A press mechanism for raising and lowering the substrate holding member is provided. (B) The substrate holding member is raised to bring the upper surface of the substrate into contact with the lower surface of the flat member to be lightly pressed to lower the substrate holding member. The upper surface of the substrate is separated from the lower surface of the flat member; (c) a rotation drive mechanism for rotating the substrate holding member; and (iv) ultraviolet light while rotating the substrate and the flat member on the substrate holding member. Irradiation was performed.

The substrate on the substrate holding member is pressed against and separated from the lower surface of the flat member by the raising / lowering operation of the substrate holding member,
Also, by rotating the substrate holding member, it is possible to uniform the ultraviolet irradiation unevenness over the entire surface of the substrate,
Thermal distortion by a simple mechanism, it is possible to generate a composite substrate without deformation by eliminating uneven UV irradiation, and by pressing the substrate on the substrate holding member against the lower surface of the flat member by the elevating operation of the substrate holding member, Since the substrates are separated from each other, the substrate on the substrate holding member can be quickly overlapped and separated from the flat member. Therefore,
High quality composite substrates can be efficiently produced.

[0010]

[Embodiment 3] In Embodiment 3, the mirroring type optical disc bonding apparatus of Embodiment 2 is provided with a mirror-like reflecting mechanism below an ultraviolet light source to diffusely reflect ultraviolet irradiation light.

[Function] A mirror-like reflecting mechanism is provided below the ultraviolet light source,
By irregularly reflecting ultraviolet irradiation light,
Since the ultraviolet light from the ultraviolet light source is irregularly reflected by the reflecting mirror and irradiates the upper surface of the flat member, the irradiation unevenness of the ultraviolet light on the upper surface of the flat member is reduced.

[0011]

Embodiment 4 Embodiment 4 is Embodiment 2 and Embodiment 3.
An eccentricity preventing mechanism for preventing a displacement of the substrate and the flat member with respect to the substrate holding member is provided in the bonding type optical disk bonding apparatus.

With the provision of an eccentricity preventing mechanism for preventing the displacement of the substrate and the flat member with respect to the substrate holding member, the flat member is pressed when the substrate holding member rises to press the substrate on the substrate holding member against the flat member. Is prevented from being displaced with respect to the substrate, and the flat member is displaced with respect to the substrate when the substrate holding member is lowered and the substrate on the substrate holding member is separated from the flat member. Is prevented. Therefore, the deterioration of the quality of the composite substrate due to the displacement is prevented.

[0012]

Next, an embodiment will be described with reference to the drawings. The basic configuration of the apparatus according to the present invention is the same as that of the conventional apparatus. The ultraviolet irradiation lamp 1, a substrate holding member (hereinafter referred to as a “holding table”) 8 for holding a substrate to be irradiated with ultraviolet rays, It is equipped with an arm to transfer, an arm to transfer the composite substrate (one on which the upper and lower substrates are pasted) from the holding table to the carry-out stage, etc., and press glass with flat quartz glass that lightly presses the substrate to be bonded placed on the holding table 4, a glass holder 5 for holding the press glass 4, a holder receiving table 6 for receiving the glass holder 5, a holding table 8 for positioning and holding a disc-shaped substrate 9 to be bonded, and a lifting table 8 for moving the holding table 8 up and down. The cylinder 14, the motor 13 for rotating the holding table 8, and the UV irradiation lamp 1 Reflector unit for reflecting that ultraviolet (units by multiple concave mirrors)
3 is provided. A loading stage 18 for transferring the substrate 9 to the holding table 8 and a loading stage 18
And holding table 8, holding table 8 and unloading stage 26
There is a transport mechanism 17 for transporting between
And the gantry 24. The operation procedure for bonding the disc-shaped substrate 9 and details of its mechanism are as follows. An ultraviolet-curable adhesive is applied, and the uncured laminated disk substrate 9 that has been shaken to a desired film thickness by a shake-off rotating device (spinner) or the like is placed on the loading stage 18. Note that a shake-off rotating device or the like may be provided at the installation location of the loading stage 18. When the sensor 19 detects the substrate 9 on the holding table, the substrate 9 is sucked by the suction pad 23 at the tip of the one arm 20 and the arm 20 is rotated to the holding table side to place the sucked substrate on the holding table 8. Put on. Note that positioning pins 2 for preventing the upper substrate and the lower substrate superimposed during the transfer from being displaced.
2 is arranged at the center position of the suction pad 23, and the arm 20 is driven by the transport mechanism 17.

In this embodiment, the transport mechanism 17 rotates (horizontally rotates) and moves up and down to pick up and place the substrate.
Any transport mechanism may be used as long as it can be transported to the transport mechanism. The transport mechanism 17 rotates the arm 20 on the loading stage 18 from the standby position, lowers the suction pad 23 at the tip thereof onto the loading stage 18, and brings the substrate 9 on the loading stage 18 into contact with the suction pad 23. , Suction pad 23
Then, the disk substrate 9 is sucked by vacuum. At this time, the positioning pins 22 arranged on the arm 20 are
A positional shift is prevented from occurring between the upper substrate and the upper substrate which are fitted in the center hole and overlapped. Next, the transport mechanism 17 is driven again, the arm 20 is raised and rotated, and the substrate 9 is transferred onto the holding table 8. The disk substrate 9 transferred onto the holding table 8 is positioned by the center pin of the holding table 8, and the state is determined by the center of the substrate 9 and the holding table 8.
Are installed so that the center of rotation of them is the same. In addition,
Since the uncured thin adhesive layer is sandwiched between the upper and lower substrates transferred from the loading stage to the holding table, the upper and lower substrates are not relatively moved or separated by the interfacial tension of the adhesive layer. . However, a shift occurs when the shearing force between the upper and lower substrates due to acceleration in the shearing direction during transfer exceeds the interfacial tension due to an increase in the speed of the apparatus or the like. The positioning pin 22 is attached to prevent the above-mentioned displacement.

The positioning pin 22 is supported by the linear bush 22a of the arm 21 so as to be vertically movable, and is urged lightly downward by the coil spring S. Even if the center is slightly shifted, the tip of the positioning pin 22 is fitted into the center hole of the composite board without any difficulty (see FIG. 5). The shaft of the holding table 8 is rotatably supported on a base 15 by a bearing, and is driven by a motor 13 via gears 11 and 12. In addition, base 15
Is supported by the gantry 24 so as to be able to move up and down.
4 is moved up and down by expansion and contraction. The cylinder 14 is extended to raise the holding table 8 toward the ultraviolet lamp, the substrate 9 to be bonded on the raised holding table 8 is brought into contact with the press glass 4, and the press glass 4 is placed on the glass holder receiving stand 5.
The lifting operation of the holding table 8 is stopped in a state in which the holding table 8 is slightly lifted from. At this time, since all of the weight of the press glass 4 is applied to the substrate 9 on the holding table, this weight is a pressing force for pressing the substrate 9 against the press glass 4. The positioning of the press glass 4 with respect to the holding table 8 is performed by aligning the center hole of the press glass 4 with the center pin 2 of the holding table 8.
5, but when the holding table 8 is lowered and the press glass 4 is separated from the substrate 9 on the holding table 8, the press glass 4 is in a floating state as described above. It is easy to cause displacement. As a result, when a positional displacement with the center pin 25 occurs,
Good and smooth fitting operation cannot be obtained, and damage at the time of contact with the press glass 4 due to forcible fitting, and misalignment of the center (misalignment between the rotation center of the holding table 8 and the center position of the press glass 4) are caused. As a result, a good bonded substrate may not be obtained. In order to address the above problems, a glass holder 5 for holding the press glass 4
The outer peripheral surface and the inner peripheral surface of the glass holder receiver 6 are fitted with inclined surfaces (tapered surfaces) 5s and 6s (see FIG. 6). Since the press glass 4, the glass holder 5, and the glass holder cradle 6 are circular in conformity with the substrate 9, the center of the glass holder cradle 6 is aligned with the rotation center of the holding table 8, so that the glass holder is separated from the holding table 8. But
The center of the press glass 4 is centered on the inclined surfaces (tapered surfaces) 5s and 6s, and is located on the rotation center axis of the holding table 8. Therefore, the press glass 4 constantly presses the substrate 9 on the holding table 8 lightly and concentrically. Next, the holding table 8 on which the substrate 9 lightly pressed by the press glass 4 is placed is rotated by the motor 13. When the holding table 8 is rotated, ultraviolet irradiation by the ultraviolet lamp 1 is started, and the ultraviolet light is irradiated on the upper surface of the substrate 9 through the press glass 4 to cure the uncured adhesive layer. At this time, since the inclined surface 5s of the glass holder 5 is slightly raised from the inclined surface 6s of the glass holder receiving base 6, the press glass 4 rotates together with the substrate 9 on the holding table 8 without any trouble. Further, a reflector unit (with a large number of concave mirrors 3a arranged concentrically) 3 disposed between the press glass 4 and the ultraviolet lamp 1 is caused to reciprocate by rotating the motor 16 (alternately changing the rotation direction). By oscillating each concave mirror 3a about the horizontal axis 3b, the reflection angle of the ultraviolet light is changed, and the irradiation position of the reflected light is changed, whereby uniform irradiation without irradiation unevenness can be obtained. The horizontal axes 3b of a number of concave mirrors 3a arranged concentrically are sequentially connected by a universal joint 3c, and are arranged below the press glass 4 in a polygonal shape around the center axis of the press glass 4. By reciprocating the two horizontal shafts 3b in the forward and reverse directions, all the horizontal shafts 3b are rotated forward and backward in conjunction with each other. In addition, by providing a cooling device for this UV lamp or using a flash type UV lamp (xenon flash lamp), it is possible to reduce the effects of heat on the atmosphere and peripheral devices and the effects of heat storage during continuous operation during mass production. Can be.

When the holding table 8 is lowered, the composite substrate 9 (the upper and lower substrates 9 and 9 are bonded together to form an integral body) when the holding table 8 is lowered. Since there is a possibility that the composite substrate is left behind, the vacuum source (not shown) is driven to vacuum adsorb the composite substrate to the holding table to prevent this. After the composite substrate is vacuum-sucked on the holding table 8, the rotation of the holding table 8 is stopped, and the holding table 8 is
Is lowered to separate it from the press glass 4. The composite substrate obtained by bonding and laminating the disk-shaped upper and lower substrates 9 that have been bonded and cured is transferred to the discharge stage 26 by the other arm 21. One arm 20 and the other arm 2
Numeral 1 is connected to the same transport mechanism 17, so that the supply and discharge of the unbonded substrate and the bonded composite substrate are performed simultaneously.

The support mechanism for the press glass 4 may be any as long as it can vertically support the press glass 4 in a state of being aligned with the axis of the holding table 8. Provide multiple vertical pins,
This may be fitted into a hole provided in the glass holder 5 to guide precisely. In this case, an urging spring is fitted on the vertical pin and provided by the urging spring.
Can be urged downward, and the urging force of this urging spring can be adjusted to adjust the pressing force between the press glass 4 and the substrate on the holding table 8. On the other hand, when the press glass is too heavy, the biasing spring fitted to the vertical pin may be arranged below the glass holder to reduce the pressing force by the press glass.

[0017]

The present invention has been described above, but the effects of the present invention are organized as follows for each of the claimed inventions. 1. Regarding the invention according to claim 1 In the bonding method of the bonding type optical disk according to the invention according to claim 1, a light-transmissive flat member is provided between the ultraviolet irradiation source and the disk-shaped substrate to be bonded. By gently pressing the substrate to be bonded to it, curing the adhesive by irradiating ultraviolet light while correcting it flat, and bonding the substrate, distortion of the substrate caused by molding and the previous process,
It is possible to correct a distortion due to a temporal change such as storage, and to suppress a thermal deformation of the substrate at the time of irradiating ultraviolet rays to obtain a high-quality bonded optical disk.

2. Regarding the invention according to claim 2 and the invention according to claim 3 In the method for bonding a bonded optical disk according to the invention according to claim 2 and the bonding apparatus for a bonded optical disk according to the invention according to claim 3, In addition to the effects of the invention according to Item 1, the upper and lower substrates and the holding member, which are laminated by laminating the flat member, are relatively rotated with respect to the ultraviolet irradiation source to change the position where the light beam strikes, thereby eliminating irradiation unevenness. In addition, poor curing of the adhesive layer and imbalance in residual stress due to uneven irradiation can be eliminated, and a high-quality bonded optical disc can be obtained.

3. Regarding the invention according to claim 4 In the bonding apparatus of the bonding type optical disc according to the invention according to claim 4, in addition to the effect of the invention according to claim 1,
By reciprocating the mirror-like reflection mechanism that diffusely reflects the ultraviolet light emitted from the ultraviolet irradiation source, the location where the light hits is changed to eliminate irradiation unevenness. Can be eliminated, and a high-quality bonded optical disc can be obtained.

4. About the invention according to claim 6 In the bonding apparatus of the bonding type optical disc according to the invention according to claim 6, by providing an eccentricity prevention mechanism for preventing a displacement of the substrate and the flat member with respect to the substrate holding member, In addition to the effects of the inventions according to claims 1 to 4, the above-mentioned eccentricity causes displacement between the upper and lower substrates placed on the substrate holding member and the flat member, and uneven centrifugal force caused by eccentric rotation. By reducing the shear stress between the upper and lower substrates, distortion of the composite substrate caused by the shear stress can be eliminated, and a high-quality bonded optical disc can be obtained.

[Brief description of the drawings]

FIG. 1 is a front view of an apparatus main body according to an embodiment.

FIG. 2 is a plan view of the apparatus main body of the embodiment.

FIG. 3 is an enlarged cross-sectional view of an ultraviolet irradiation section of the embodiment.

FIG. 4 is a plan view showing the arrangement of the reflector units of the embodiment.

FIG. 5 is an enlarged sectional view of a main part of an arm tip.

FIG. 6 is an enlarged sectional view of a support structure of a press glass (a transparent flat member) by a holder receiving base.

[Explanation of symbols]

 1: UV lamp 2: Lamp box 3: Reflector unit 3a: Concave mirror 3b: Horizontal axis 3c: Universal joint 4: Press glass 5: Glass holder 5s: Inclined surface 6: Holder holder 6s: Inclined surface 7: Light shielding plate 8: Holding table 9: Substrate 10: Rotating shaft 11, 12: Gear 13: Motor 14: Cylinder 15: Base 16: Motor 17; Transport climate 18: Loading stage 19: Sensor 20, 21: Arm 22: Positioning pin 22a: Linear bush 23: Suction pad 24: Stand 25: Center pin of holding table 8 26: Unloading stage S: Coil spring

Claims (9)

[Claims] 1. A disc bonding method in a manufacturing process of a bonded optical disk such as an LD or a DVD, wherein a flat plate having a light transmitting property is provided between the substrate and a substrate held by a substrate holding member, which is superposed on an ultraviolet irradiation source. A member is placed, and the upper surface of the substrate to be bonded is pressed, and the substrate is irradiated with ultraviolet light in a state where the distortion of the substrate is corrected by the pressing force of the flat member, and the adhesive is cured to bond the substrate. Lamination type optical disk lamination method. 2. The bonding type disk bonding method according to claim 1, wherein the ultraviolet irradiation is performed while rotating the substrate holding member while the substrate is lightly pressed by a flat member having a light transmitting property. 3. A press mechanism for raising and lowering the substrate holding member, wherein the substrate holding member is raised to bring the upper surface of the substrate into contact with the lower surface of the flat member and lightly pressed, and the substrate holding member is lowered to lower the upper surface of the substrate. 3. The apparatus according to claim 2, further comprising: a rotary drive mechanism for rotating the substrate holding member, wherein the ultraviolet irradiation is performed while rotating the substrate and the flat member on the substrate holding member. A lamination type optical disk laminating apparatus for performing a lamination type optical disk lamination method. 4. The bonding type optical disk bonding apparatus according to claim 3, wherein a mirror-like reflecting mechanism is provided below the ultraviolet light source to diffusely reflect the ultraviolet irradiation light. 5. The bonding type optical disk bonding apparatus according to claim 4, wherein a number of concave mirrors are annularly arranged below the ultraviolet light source, and these concave mirrors are reciprocally oscillated about a horizontal axis. 6. The bonding type optical disk bonding apparatus according to claim 3, further comprising an eccentricity preventing mechanism for preventing a displacement of the substrate and the flat member with respect to the substrate holding member. 7. The bonding type optical disk bonding apparatus according to claim 4, wherein a center pin for positioning the substrate provided on the substrate holding member is fitted into a center hole of the flat member. 8. A positioning member having an inclined surface is provided on an outer periphery of the substrate holding member, and an inclined surface of a holder outer periphery of the flat member is brought into contact with the inclined surface of the substrate holding member, so that the flat member is a substrate holding member. 8. The bonding type optical disk bonding apparatus according to claim 7, wherein the apparatus is self-centered with respect to the optical disk. 9. When the holder of the flat member is vertically supported by a supporting member and the substrate on the substrate holding member is pressed against the lower surface of the supporting member, the holder is pushed up by the substrate holding member. 9. The bonding type optical disk bonding apparatus according to claim 8, wherein the bonding apparatus is adapted to be used.