JP2001072479A - Silicon carbide porous body and production thereof - Google Patents

Silicon carbide porous body and production thereof

Info

Publication number
JP2001072479A
JP2001072479A JP24727999A JP24727999A JP2001072479A JP 2001072479 A JP2001072479 A JP 2001072479A JP 24727999 A JP24727999 A JP 24727999A JP 24727999 A JP24727999 A JP 24727999A JP 2001072479 A JP2001072479 A JP 2001072479A
Authority
JP
Japan
Prior art keywords
silicon carbide
outer layer
substrate
average pore
pore diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP24727999A
Other languages
Japanese (ja)
Inventor
Nobuhiro Shinohara
伸広 篠原
Naomichi Miyagawa
直通 宮川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AGC Inc
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Priority to JP24727999A priority Critical patent/JP2001072479A/en
Publication of JP2001072479A publication Critical patent/JP2001072479A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B38/00Porous mortars, concrete, artificial stone or ceramic ware; Preparation thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00793Uses not provided for elsewhere in C04B2111/00 as filters or diaphragms

Abstract

PROBLEM TO BE SOLVED: To provide a silicon carbide porous body that is suitable for filtration and separation of fine particles. SOLUTION: In this silicon carbide porous body, an outer layer of silicon carbide having pores of smaller pore diameter then the average diameter of the base material is formed at least a part of the surface of silicon carbide base material having a prescribed average pore diameter, and the silicon carbide particles on the surface of the base material are bonded via silica to the silicon carbide particles on the outer layer part and the silicon carbide particles on the outer layer are bonded to each other via silica.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は炭化ケイ素質多孔体
およびその製造方法に関する。特に、ろ過速度の著しい
低下を招くことなく微細粒子の除去等のろ過ができ、分
離用フィルタとして充分な特性を有する炭化ケイ素質多
孔体に関する。
The present invention relates to a porous silicon carbide body and a method for producing the same. In particular, the present invention relates to a porous silicon carbide body which can perform filtration such as removal of fine particles without causing a significant decrease in filtration speed, and has sufficient characteristics as a separation filter.

【0002】[0002]

【従来の技術】炭化ケイ素質焼結体は、高い硬度、優れ
た耐摩耗性、優れた化学的安定性に加え、小さい熱膨張
率、高温での高い強度など耐熱材料として優れた特性を
有していることから、高温炉用耐火材料、熱交換器など
の高温構造用材料として広く使用できる。これらの優れ
た特性を生かし、炭化ケイ素質焼結体の多孔体(以下、
単に炭化ケイ素質多孔体と称する)を用い、ディーゼル
エンジンの脱塵装置用フィルタや、高温燃焼ガス中に含
まれる灰等を分離するための高温フィルタに適用する試
みがなされている。
2. Description of the Related Art In addition to high hardness, excellent abrasion resistance, and excellent chemical stability, a silicon carbide sintered body has excellent properties as a heat-resistant material such as a small coefficient of thermal expansion and high strength at high temperatures. Therefore, it can be widely used as a refractory material for high-temperature furnaces and a high-temperature structural material such as a heat exchanger. Taking advantage of these excellent properties, a porous silicon carbide sintered body (hereinafter referred to as
Attempts have been made to apply the present invention to a filter for a dust removal device of a diesel engine or a high-temperature filter for separating ash or the like contained in a high-temperature combustion gas using a silicon carbide-based porous body).

【0003】このようなフィルタに用いる多孔体には、
耐熱性、耐食性だけでなく、流体の透過抵抗が小さく、
かつ高い効率で微細な異物粒子を取り除くことができる
ことが要求される。
[0003] Porous materials used in such filters include:
Not only heat resistance and corrosion resistance, but also low fluid permeation resistance,
It is required that fine foreign particles can be removed with high efficiency.

【0004】このような用途に適した多孔体としては、
特定の気孔径を有する炭化ケイ素質多孔体の外側面に炭
化ケイ素の外層部を結合してなる多孔質炭化ケイ素焼結
体が知られており、例えば特公平7−100633号や
特開平1−58305号に開示されている。
[0004] Porous materials suitable for such applications include:
A porous silicon carbide sintered body in which an outer layer portion of silicon carbide is bonded to an outer surface of a silicon carbide porous body having a specific pore diameter is known, for example, Japanese Patent Publication No. 7-100633 and Japanese Patent Laid-Open No. No. 58305.

【0005】特公平7−100633号には、炭化ケイ
素粉末の成形体を焼成して得た焼結体の外面に炭化ケイ
素粉末層を形成した後、非酸化性雰囲気中1500℃〜
2200℃で、成形体焼成温度より低い温度で加熱して
外層部を形成する炭化ケイ素多孔体の製造方法が記載さ
れている。
[0005] Japanese Patent Publication No. 7-100633 discloses that a silicon carbide powder layer is formed on the outer surface of a sintered body obtained by firing a silicon carbide powder compact, and then heated to 1500 ° C. in a non-oxidizing atmosphere.
A method for producing a porous silicon carbide body in which an outer layer is formed by heating at 2200 ° C. at a temperature lower than the firing temperature of a molded body is described.

【0006】しかし、この方法においては本来難焼結性
である炭化ケイ素の焼結性を高めるため、1500℃以
上の高温で加熱処理するとともに、炭化ケイ素粒子どう
しの結合強化をはかるため炭化ケイ素粉末層にアルミニ
ウム、ホウ素、イットリウム、炭素等を添加している。
また、高温で加熱処理する際に炭化ケイ素が変質するの
を防ぐため、雰囲気をアルゴン等の不活性雰囲気に保つ
必要があり、使用できる熱処理炉が限定される問題があ
る。
However, in this method, heat treatment is performed at a high temperature of 1500 ° C. or more to enhance the sinterability of silicon carbide, which is inherently difficult to sinter, and silicon carbide powder is used to strengthen the bonding between silicon carbide particles. Aluminum, boron, yttrium, carbon, etc. are added to the layer.
Further, in order to prevent the silicon carbide from being deteriorated during the heat treatment at a high temperature, it is necessary to maintain the atmosphere in an inert atmosphere such as argon, and there is a problem that the usable heat treatment furnace is limited.

【0007】また、特開平1−58305号には、炭化
ケイ素質多孔体からなる基材を、均一な粒径のセラミッ
ク粉末を含むスラリー中に浸漬し、基材の内外に圧力差
を生じさせて圧力の高い側の面にスラリーからなるコー
ティング層を形成し、乾燥した後、コーティング層を基
材とともに焼結させて一体化する方法が記載されてい
る。しかし、この方法においてはスラリー中における炭
化ケイ素粒子の調整や熱処理条件の配慮が充分でなく、
基材とコーティング層との結合強化、およびコーティン
グ層の細孔径制御が充分にはなされていない。
Japanese Patent Application Laid-Open No. 1-58305 discloses that a substrate made of a porous silicon carbide material is immersed in a slurry containing ceramic powder having a uniform particle size to generate a pressure difference between the inside and outside of the substrate. A method is described in which a coating layer made of a slurry is formed on the surface on the side where the pressure is high, and after drying, the coating layer is sintered together with the base material and integrated. However, in this method, adjustment of silicon carbide particles in the slurry and consideration of heat treatment conditions are not sufficient,
The reinforcement of the bond between the substrate and the coating layer and the control of the pore size of the coating layer have not been sufficiently performed.

【0008】[0008]

【発明が解決しようとする課題】本発明は、所定の平均
気孔径を有する炭化ケイ素質基材の外側面の少なくとも
一部に、該基材の平均気孔径よりも小さい平均気孔径を
有する炭化ケイ素質の外層部が形成された炭化ケイ素質
多孔体であって、炭化ケイ素粒子間の結合を強化するた
めの他成分を含有せず、基材と外層部が強固に結合さ
れ、かつ、外層部中の炭化ケイ素粒子どうしが強固に結
合された炭化ケイ素質多孔体の提供を目的とする。
SUMMARY OF THE INVENTION According to the present invention, there is provided a carbonized carbonaceous substrate having a predetermined average pore size, wherein at least a portion of the outer surface of the silicon carbide substrate has an average pore size smaller than the average pore size of the substrate. A silicon carbide-based porous body having a silicon-based outer layer portion formed thereon, which does not contain other components for strengthening the bond between silicon carbide particles, the base material and the outer layer portion are firmly bonded, and the outer layer It is an object of the present invention to provide a silicon carbide-based porous body in which silicon carbide particles in each part are strongly bonded.

【0009】また、本発明は、上記多孔体を低温かつ酸
化性雰囲気中で加熱処理することにより製造できる炭化
ケイ素質多孔体の製造方法の提供を目的とする。
Another object of the present invention is to provide a method for producing a silicon carbide porous body which can be produced by subjecting the above porous body to heat treatment at a low temperature in an oxidizing atmosphere.

【0010】[0010]

【課題を解決するための手段】本発明は、所定の平均気
孔径を有する炭化ケイ素質基材の表面の少なくとも一部
に、該基材の平均気孔径より小さい平均気孔径を有する
炭化ケイ素質の外層部が形成されている炭化ケイ素質多
孔体であって、基材表面の炭化ケイ素粒子と外層部の炭
化ケイ素粒子との間、および外層部の炭化ケイ素粒子ど
うしの間がシリカによって結合されていることを特徴と
する炭化ケイ素質多孔体を提供する。
According to the present invention, there is provided a silicon carbide substrate having an average pore size smaller than the average pore size of at least a part of the surface of the silicon carbide substrate having a predetermined average pore size. The outer layer portion of the silicon carbide-based porous body is formed, between the silicon carbide particles of the substrate surface and the silicon carbide particles of the outer layer portion, and between the silicon carbide particles of the outer layer portion is bonded by silica. The present invention provides a silicon carbide-based porous body characterized in that:

【0011】また、本発明は、所定の平均気孔径を有す
る炭化ケイ素質基材の表面に、該基材の平均気孔径より
最大粒子径が小さい炭化ケイ素粉末を含むスラリーを塗
布または含浸した後、酸化性雰囲気中、750〜120
0℃で加熱して基材の表面に炭化ケイ素質の外層部を形
成することを特徴とする炭化ケイ素質多孔体の製造方法
を提供する。
Further, the present invention provides a method for coating or impregnating a slurry containing a silicon carbide powder having a maximum particle diameter smaller than the average pore diameter of the substrate on the surface of the silicon carbide substrate having a predetermined average pore diameter. 750 to 120 in an oxidizing atmosphere
Provided is a method for producing a silicon carbide-based porous body, which comprises heating at 0 ° C. to form a silicon carbide-based outer layer on the surface of a substrate.

【0012】[0012]

【発明の実施の形態】本発明の炭化ケイ素質多孔体は、
所定の平均気孔径を有する炭化ケイ素質基材の表面の少
なくとも一部に、該基材の平均気孔径より小さい平均気
孔径を有する炭化ケイ素質の外層部が形成されてなる炭
化ケイ素質多孔体である。
BEST MODE FOR CARRYING OUT THE INVENTION The silicon carbide porous body of the present invention
A silicon carbide-based porous body having a silicon carbide-based outer layer having an average pore diameter smaller than the average pore diameter of at least a portion of the surface of a silicon carbide-based substrate having a predetermined average pore diameter. It is.

【0013】本発明の多孔体において、炭化ケイ素質基
材の平均気孔径は10μm以下、特には5μm以下であ
るのが好ましい。上記基材の平均気孔径が10μm以下
である場合は、基材表面の気孔を外層部を形成する炭化
ケイ素粒子によって充分に塞ぐことができ、基材表面に
均一な厚さの外層部を形成できる。
In the porous body of the present invention, the average pore diameter of the silicon carbide base material is preferably 10 μm or less, particularly preferably 5 μm or less. When the average pore diameter of the substrate is 10 μm or less, the pores on the surface of the substrate can be sufficiently closed by the silicon carbide particles forming the outer layer, and the outer layer having a uniform thickness is formed on the surface of the substrate. it can.

【0014】一方、炭化ケイ素質基材の平均気孔径は
0.01μm以上、特には0.1μn以上であるのが好
ましい。上記基材の平均気孔径が0.01μm未満であ
る場合は、外層部の平均気孔径を基材の平均気孔径より
小さくすることが難しい。なお、上記平均気孔径は水銀
圧入法によって測定された値である。
On the other hand, the average pore diameter of the silicon carbide substrate is preferably at least 0.01 μm, particularly preferably at least 0.1 μn. When the average pore diameter of the substrate is less than 0.01 μm, it is difficult to make the average pore diameter of the outer layer smaller than the average pore diameter of the substrate. The average pore diameter is a value measured by a mercury intrusion method.

【0015】また、炭化ケイ素質基材の見掛け気孔率
は、10〜80%、特には20〜60%であるのが好ま
しい。見掛け気孔率が80%を超える場合は、基材の強
度が充分ではなく、基材表面に外層部が形成される際に
基材が変形したり、割れたりするおそれがある。一方、
10%未満である場合は、基材の通気性が充分ではない
場合が多く、フィルタ等の用途として用いることが難し
い。なお、上記見掛け気孔率はアルキメデス法によって
測定された値である。
The apparent porosity of the silicon carbide substrate is preferably from 10 to 80%, particularly preferably from 20 to 60%. When the apparent porosity exceeds 80%, the strength of the substrate is not sufficient, and the substrate may be deformed or cracked when the outer layer portion is formed on the surface of the substrate. on the other hand,
If it is less than 10%, the air permeability of the base material is often insufficient, and it is difficult to use it as a filter or the like. The apparent porosity is a value measured by the Archimedes method.

【0016】一方、炭化ケイ素質の外層部の平均気孔径
は、1μm以下、特には0.1μm以下であるのが好ま
しい。上記外層部の平均気孔径が1μm以下である場合
は、外層部の炭化ケイ素粒子どうしがシリカによって強
固に結合されるので好ましい。なお、上記平均気孔径は
水銀圧入法によって測定された値である。
On the other hand, the average pore diameter of the silicon carbide outer layer is preferably 1 μm or less, particularly preferably 0.1 μm or less. The case where the average pore diameter of the outer layer portion is 1 μm or less is preferable because the silicon carbide particles of the outer layer portion are firmly bonded by silica. The average pore diameter is a value measured by a mercury intrusion method.

【0017】また、本発明の炭化ケイ素質多孔体をフィ
ルタ等の用途として用いるためには、炭化ケイ素質の外
層部の気孔径分布はシャープであることが好ましく、具
体的には、最大気孔径が平均気孔径の2倍以下であるこ
とが好ましい。
In order to use the porous silicon carbide material of the present invention as a filter or the like, the pore size distribution of the silicon carbide-based outer layer is preferably sharp, and specifically, the maximum pore size Is preferably not more than twice the average pore diameter.

【0018】炭化ケイ素質の外層部の厚さは、1〜10
0μm、特には5〜50μmであるのが好ましい。上記
外層部の厚さが上記範囲である場合は、炭化ケイ素質多
孔体が充分な通気性を有し、かつ、基材表面に均一な外
層部を形成できる。
The thickness of the silicon carbide outer layer is 1 to 10
It is preferably 0 μm, particularly preferably 5 to 50 μm. When the thickness of the outer layer portion is in the above range, the silicon carbide porous body has sufficient air permeability and can form a uniform outer layer portion on the surface of the base material.

【0019】また、本発明の炭化ケイ素質多孔体は、炭
化ケイ素質基材表面の炭化ケイ素粒子と炭化ケイ素質外
層部の炭化ケイ素粒子との間がシリカにより結合され、
かつ、外層部の炭化ケイ素粒子どうしの間がシリカによ
って結合されてなる。
In the silicon carbide porous body of the present invention, the silicon carbide particles on the surface of the silicon carbide substrate and the silicon carbide particles in the silicon carbide outer layer are bonded by silica,
Further, the silicon carbide particles in the outer layer portion are bonded by silica.

【0020】このような本発明の炭化ケイ素質多孔体
は、所定の平均気孔径を有する炭化ケイ素質基材の表面
に、該基材の平均気孔径より最大粒子径が小さい炭化ケ
イ素粉末を含むスラリーを塗布または含浸した後、酸化
性雰囲気中、750〜1200℃で加熱して基材の表面
に炭化ケイ素質の外層部を形成することにより製造でき
る。
Such a silicon carbide porous body of the present invention contains a silicon carbide powder having a maximum particle diameter smaller than the average pore diameter of the substrate on the surface of the silicon carbide substrate having a predetermined average pore diameter. After the slurry is applied or impregnated, it can be manufactured by heating at 750 to 1200 ° C. in an oxidizing atmosphere to form a silicon carbide outer layer on the surface of the substrate.

【0021】所定の平均気孔径を有する炭化ケイ素質基
材の表面に、該基材の平均気孔径より最大粒子径が小さ
い炭化ケイ素粉末を含むスラリーを塗布または含浸する
ことにより、炭化ケイ素質基材の表面に該基材の平均気
孔径より小さい平均気孔径を有する炭化ケイ素質の外層
部を形成できる。
The surface of a silicon carbide substrate having a predetermined average pore size is coated or impregnated with a slurry containing silicon carbide powder having a maximum particle size smaller than the average pore size of the substrate, thereby forming a silicon carbide substrate. An outer layer of silicon carbide having an average pore diameter smaller than the average pore diameter of the substrate can be formed on the surface of the material.

【0022】本発明において、炭化ケイ素粉末を含むス
ラリーを使用するのは、スラリーを用いないと基材表面
を被覆することが難しく、外層部の厚みが不均一となり
強固に結合された外層部が得られにくいためである。
In the present invention, the use of a slurry containing silicon carbide powder makes it difficult to coat the surface of the base material without using the slurry, the thickness of the outer layer becomes uneven, and the strongly bonded outer layer is formed. This is because it is difficult to obtain.

【0023】所望の最大粒子径を有する炭化ケイ素粉末
を含むスラリーは、通常よく用いられる分級法によって
得られる。例えば、粒度調整した炭化ケイ素粉末を水中
に分散させてスラリーとした後、所定の時間静置し、粒
子の沈降速度によって決まる所定の位置までのスラリー
を回収すればよい。
The slurry containing the silicon carbide powder having the desired maximum particle size can be obtained by a commonly used classification method. For example, after the silicon carbide powder having the adjusted particle size is dispersed in water to form a slurry, the slurry is allowed to stand for a predetermined time, and the slurry up to a predetermined position determined by the sedimentation speed of the particles may be collected.

【0024】基材表面に所望の外層部を形成するために
は、基材を炭化ケイ素粉末を含むスラリー中に浸漬した
後、取り出して乾燥するという操作を、必要に応じて繰
り返して行えばよい。このとき吸引操作を併用すると、
表面に露出した気孔内への粒子の浸入や付着が促進され
るためより効果的に外層部を形成できる。また、基材を
スラリー中に浸漬した後、減圧操作を行うことも気孔中
に炭化ケイ素粒子の侵入が促進されるため効果的であ
る。
In order to form a desired outer layer on the surface of the base material, the operation of immersing the base material in a slurry containing silicon carbide powder, removing the base material and drying the base material may be repeated as necessary. . At this time, if the suction operation is used together,
Since the penetration and adhesion of the particles into the pores exposed on the surface are promoted, the outer layer portion can be formed more effectively. It is also effective to perform a pressure reduction operation after immersing the substrate in the slurry, since penetration of silicon carbide particles into pores is promoted.

【0025】本発明の製造方法においては、基材表面の
炭化ケイ素粒子と外層部の炭化ケイ素粒子との間、およ
び外層部の炭化ケイ素粒子どうしの間を強固に結合する
ために、基材表面に外層部を形成した後、酸化性雰囲気
中750℃〜1200℃で加熱処理を行う。上記温度で
加熱処理を行うことにより、基材表面の炭化ケイ素粒子
と外層部の炭化ケイ素粒子、および外層部の炭化ケイ素
粒子が酸化されてガラス質のシリカ(SiO)を形成
し、基材表面の炭化ケイ素粒子と外層部の炭化ケイ素粒
子の結合、および外層部の炭化ケイ素粒子どうしの結合
が強化される。
In the production method of the present invention, in order to firmly bond between the silicon carbide particles on the surface of the substrate and the silicon carbide particles in the outer layer and between the silicon carbide particles in the outer layer, After forming the outer layer portion, a heat treatment is performed at 750 ° C. to 1200 ° C. in an oxidizing atmosphere. By performing the heat treatment at the above temperature, the silicon carbide particles on the substrate surface, the silicon carbide particles in the outer layer portion, and the silicon carbide particles in the outer layer portion are oxidized to form vitreous silica (SiO 2 ). The bonding between the silicon carbide particles on the surface and the silicon carbide particles in the outer layer and the bonding between the silicon carbide particles in the outer layer are strengthened.

【0026】炭化ケイ素粒子の表面に形成されるシリカ
の量は、上記加熱処理前後の重量変化率を指標にでき
る。すなわち、加熱前の基材および外層部の重量の合計
に対する、加熱後の基材および外層部の重量の合計の割
合は1.01〜1.05であるのが好ましい。上記割合
を上記範囲とすることにより、外層部を実質的に炭化ケ
イ素からなる層に維持でき、かつ、基材表面の炭化ケイ
素粒子と外層部の炭化ケイ素粒子との間、および外層部
の炭化ケイ素粒子どうしの間を強固に結合できる。
The amount of silica formed on the surface of the silicon carbide particles can be determined using the weight change rate before and after the heat treatment as an index. That is, the ratio of the total weight of the base material and the outer layer portion after heating to the total weight of the base material and the outer layer portion before heating is preferably 1.01 to 1.05. By setting the above ratio to the above range, the outer layer portion can be maintained in a layer substantially composed of silicon carbide, and between the silicon carbide particles on the substrate surface and the silicon carbide particles in the outer layer portion, and the carbonization of the outer layer portion. It is possible to firmly bond between silicon particles.

【0027】加熱処理の温度が750℃未満では炭化ケ
イ素粒子が充分に酸化しないため、ガラス質のシリカに
よる結合層が充分に形成されず、結合強度が弱いため外
層部の剥離が起こりやすい。また1200℃を超える温
度ではガラス質シリカの結晶化が起こりやすくなり、ク
リストバライトが生成して結合の効果が得られなくなる
おそれがある。より好ましい加熱処理の温度は800〜
1100℃である。
If the temperature of the heat treatment is lower than 750 ° C., the silicon carbide particles are not sufficiently oxidized, so that the bonding layer of vitreous silica is not sufficiently formed, and the bonding strength is weak, so that the outer layer portion is liable to peel off. If the temperature exceeds 1200 ° C., crystallization of the vitreous silica is likely to occur, and cristobalite may be formed, and the bonding effect may not be obtained. A more preferred temperature of the heat treatment is 800 to
1100 ° C.

【0028】加熱処理の時間は、得られる炭化ケイ素質
多孔体の強度が充分となる範囲であれば特に限定されな
いが、1〜24時間、特には1〜10時間とするのが好
ましい。
The time of the heat treatment is not particularly limited as long as the strength of the obtained silicon carbide porous body is sufficient, but it is preferably 1 to 24 hours, particularly preferably 1 to 10 hours.

【0029】本発明の炭化ケイ素質多孔体が形成される
メカニズムについては定かにはわかっていないが次のよ
うなことが考えられる。すなわち、炭化ケイ素を酸化性
雰囲気中で加熱すると、酸化によってシリカが形成され
る際に約45%体積膨張を伴う。このため外層部の微細
な炭化ケイ素粒子がシリカの形成に伴って膨張し、粒子
間に存在する気孔を効果的に微細化するとともに強固な
結合が可能となると考えられる。
Although the mechanism for forming the silicon carbide porous body of the present invention is not clearly understood, the following may be considered. That is, when silicon carbide is heated in an oxidizing atmosphere, it undergoes about 45% volume expansion when silica is formed by oxidation. For this reason, it is considered that the fine silicon carbide particles in the outer layer expand along with the formation of silica, thereby effectively miniaturizing the pores existing between the particles and enabling strong bonding.

【0030】[0030]

【実施例】以下に本発明を実施例および比較例によって
さらに説明する。例1は本発明の実施例であり、例2は
本発明の比較例である。
The present invention will be further described below with reference to examples and comparative examples. Example 1 is an example of the present invention, and Example 2 is a comparative example of the present invention.

【0031】[例1]イオン交換水2リットル中に平均
粒径が0.6μmの炭化ケイ素粉末(昭和電工社製品
名:A−1)300gを添加し、撹拌しながらモノエタ
ノールアミンを滴下してpHを8に調整した懸濁液を得
た。この懸濁液を超音波ホモジナイザーを用いて分散さ
せた後、室温で放置して分級し、粒径が1μm以下の炭
化ケイ素粒子のみを含む懸濁液を回収した。この懸濁液
中に、水銀圧入法によって測定された平均気孔径の値が
1.5μmであり、見掛け気孔率が35%である炭化ケ
イ素質基材(20mm×20mm×1mm)を浸漬して
減圧操作を行い、基材の表面に炭化ケイ素粒子を吸着さ
せた。
Example 1 300 g of silicon carbide powder having an average particle size of 0.6 μm (product name: A-1) was added to 2 liters of ion-exchanged water, and monoethanolamine was added dropwise with stirring. To obtain a suspension whose pH was adjusted to 8. This suspension was dispersed using an ultrasonic homogenizer, and then allowed to stand at room temperature for classification, to recover a suspension containing only silicon carbide particles having a particle size of 1 μm or less. A silicon carbide substrate (20 mm × 20 mm × 1 mm) having an average pore diameter of 1.5 μm and an apparent porosity of 35% measured by a mercury intrusion method is immersed in this suspension. A vacuum operation was performed to adsorb the silicon carbide particles on the surface of the substrate.

【0032】この基材を取り出して乾燥させた後、基材
の表面に炭化ケイ素粒子を吸着させる操作を再度行っ
た。このようにして得られた基材の表面に炭化ケイ素質
の外層部が形成されてなる炭化ケイ素質多孔体を、電気
炉を用いて大気中1000℃で10時間加熱処理した。
After the substrate was taken out and dried, the operation of adsorbing silicon carbide particles on the surface of the substrate was performed again. The silicon carbide-based porous body obtained by forming a silicon carbide-based outer layer on the surface of the substrate thus obtained was subjected to a heat treatment at 1000 ° C. for 10 hours in the air using an electric furnace.

【0033】加熱後、X線マイクロアナリシス法を用い
て外層部表面の元素分析を行ったところ(JXA−88
00M:JEOL社装置を使用)、酸素のピークが確認
され、シリカが生成していることがわかった。なお、加
熱前の基材および外層部の重量の合計に対する、加熱後
の基材および外層部の重量の合計の割合は1.02であ
った。
After heating, the surface of the outer layer was subjected to elemental analysis by X-ray microanalysis (JXA-88).
00M: using a JEOL apparatus), an oxygen peak was confirmed, and it was found that silica had been formed. The ratio of the total weight of the base material and the outer layer after heating to the total weight of the base material and the outer layer before heating was 1.02.

【0034】得られた炭化ケイ素質多孔体の外層部表面
を走査型電子顕微鏡で観察した(図1参照)。また、得
られた炭化ケイ素質多孔体の断面を走査型電子顕微鏡で
観察したところ、外層部の厚さは約10μmであった
(図2参照)。
The surface of the outer layer portion of the obtained porous silicon carbide body was observed with a scanning electron microscope (see FIG. 1). When the cross section of the obtained silicon carbide based porous material was observed with a scanning electron microscope, the thickness of the outer layer was about 10 μm (see FIG. 2).

【0035】また、水銀圧入法にて測定したところ、外
層部の平均気孔径は0.08μmであり、シャープな気
孔径分布(80%以上の気孔が0.05μm以上であ
り、最大気孔径が0.15μm)を有していることが確
認され、気孔は充分に微細化されていることがわかっ
た。外層部中の炭化ケイ素粒子どうしは強固に結合して
おり、剥離、割れおよび粒子の脱離等は認められなかっ
た。
When measured by a mercury intrusion method, the average pore size of the outer layer was 0.08 μm, and the sharp pore size distribution (80% or more of the pores was 0.05 μm or more, and the maximum pore size was 0.15 μm), indicating that the pores were sufficiently fine. The silicon carbide particles in the outer layer were firmly bonded to each other, and no peeling, cracking, detachment of the particles, etc. were observed.

【0036】[例2]炭化ケイ素粉末を用いるかわりに
平均粒径が0.5μmのアルミナ粉末(住友化学工業社
製品名:AKP−20)を用いた以外は例1と同様にし
て、基材の表面にアルミナ質の外層部が形成されてなる
炭化ケイ素質多孔体を作製し、電気炉を用いて大気中1
000℃で10時間加熱処理した。
Example 2 A substrate was prepared in the same manner as in Example 1 except that instead of using silicon carbide powder, alumina powder having an average particle diameter of 0.5 μm (product name: AKP-20, manufactured by Sumitomo Chemical Co., Ltd.) was used. To produce a silicon carbide porous body having an alumina outer layer formed on the surface of
Heat treatment was performed at 000 ° C. for 10 hours.

【0037】水銀圧入法にて測定したところ、外層部の
平均気孔径は0.3μmであった。また、得られた炭化
ケイ素質多孔体の断面を走査型電子顕微鏡で観察したと
ころ、外層部の厚さは8μmであり、外層部の一部には
クラックの発生が認められた。
When measured by a mercury intrusion method, the average pore diameter of the outer layer was 0.3 μm. When the cross section of the obtained silicon carbide based porous material was observed with a scanning electron microscope, the thickness of the outer layer was 8 μm, and cracks were observed in a part of the outer layer.

【0038】[0038]

【発明の効果】本発明の炭化ケイ素質多孔体は、炭化ケ
イ素粒子間の結合を強化するための他の助剤の添加を必
要とせず、表面が微細な気孔径を有する外層部で形成さ
れている。また、基材と外層部が強固に結合され、か
つ、外層部の炭化ケイ素粒子どうしが強固に結合された
ものである。したがって、精密ろ過、分離用フィルタ等
の用途に用いた場合、ろ過速度の著しい低下を招くこと
なく微細粒子を除去することができ、かつ、充分な耐久
性を有する。
The silicon carbide porous body of the present invention does not require the addition of any other auxiliary agent for strengthening the bond between silicon carbide particles, and its surface is formed of an outer layer having a fine pore diameter. ing. Further, the base material and the outer layer portion are firmly bonded, and the silicon carbide particles in the outer layer portion are firmly bonded. Therefore, when used for applications such as microfiltration and separation filters, fine particles can be removed without causing a significant decrease in filtration speed, and the filter has sufficient durability.

【図面の簡単な説明】[Brief description of the drawings]

【図1】例1の炭化ケイ素質多孔体の外層部表面の走査
型電子顕微鏡による拡大写真。
FIG. 1 is an enlarged photograph of a surface of an outer layer portion of a silicon carbide porous body of Example 1 taken by a scanning electron microscope.

【図2】例1の炭化ケイ素質多孔体の断面の走査型電子
顕微鏡による拡大写真。
FIG. 2 is an enlarged photograph of a cross section of the silicon carbide porous body of Example 1 taken by a scanning electron microscope.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 所定の平均気孔径を有する炭化ケイ素質
基材の表面の少なくとも一部に、該基材の平均気孔径よ
り小さい平均気孔径を有する炭化ケイ素質の外層部が形
成されている炭化ケイ素質多孔体であって、基材表面の
炭化ケイ素粒子と外層部の炭化ケイ素粒子との間、およ
び外層部の炭化ケイ素粒子どうしの間がシリカによって
結合されていることを特徴とする炭化ケイ素質多孔体。
1. A silicon carbide-based outer layer having an average pore diameter smaller than the average pore diameter of the substrate is formed on at least a part of the surface of the silicon carbide-based substrate having a predetermined average pore diameter. A carbonized silicon carbide body, characterized in that silica is bonded between the silicon carbide particles on the substrate surface and the silicon carbide particles in the outer layer, and between the silicon carbide particles in the outer layer by silica. Silicone porous body.
【請求項2】 シリカがガラス質である請求項1に記載
の炭化ケイ素質多孔体。
2. The silicon carbide-based porous body according to claim 1, wherein the silica is vitreous.
【請求項3】 所定の平均気孔径を有する炭化ケイ素質
基材の表面に、該基材の平均気孔径より最大粒子径が小
さい炭化ケイ素粉末を含むスラリーを塗布または含浸し
た後、酸化性雰囲気中、750〜1200℃で加熱して
基材の表面に炭化ケイ素質の外層部を形成することを特
徴とする炭化ケイ素質多孔体の製造方法。
3. An oxidizing atmosphere after applying or impregnating a slurry containing silicon carbide powder having a maximum particle diameter smaller than the average pore diameter of the substrate on the surface of the silicon carbide substrate having a predetermined average pore diameter. A method for producing a silicon carbide-based porous body, comprising heating at 750 to 1200 ° C. to form a silicon carbide-based outer layer on the surface of a substrate.
JP24727999A 1999-09-01 1999-09-01 Silicon carbide porous body and production thereof Pending JP2001072479A (en)

Priority Applications (1)

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JP24727999A JP2001072479A (en) 1999-09-01 1999-09-01 Silicon carbide porous body and production thereof

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Publication Number Publication Date
JP2001072479A true JP2001072479A (en) 2001-03-21

Family

ID=17161107

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Country Status (1)

Country Link
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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002371823A (en) * 2001-06-19 2002-12-26 Mitsui Eng & Shipbuild Co Ltd Exhaust emission control device for diesel engine
US20120186240A1 (en) * 2009-09-30 2012-07-26 Honda Motor Co., Ltd. Exhaust gas purifying filter
KR101170030B1 (en) 2007-10-05 2012-08-01 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 Polishing of sapphire with composite slurries
US8815396B2 (en) 2007-10-05 2014-08-26 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles comprising nano-sized silicon carbide particles surface-coated with silica, and methods using same
JP2014208346A (en) * 2008-11-26 2014-11-06 コーニング インコーポレイテッド Coated particulate filter and method
KR20200048735A (en) * 2018-10-30 2020-05-08 한국과학기술연구원 Liquid phase sintered silicon carbide porous body having dual pore structure and method for producing same

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002371823A (en) * 2001-06-19 2002-12-26 Mitsui Eng & Shipbuild Co Ltd Exhaust emission control device for diesel engine
KR101170030B1 (en) 2007-10-05 2012-08-01 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 Polishing of sapphire with composite slurries
US8721917B2 (en) 2007-10-05 2014-05-13 Saint-Gobain Ceramics & Plastics, Inc. Polishing of sapphire with composite slurries
US8815396B2 (en) 2007-10-05 2014-08-26 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles comprising nano-sized silicon carbide particles surface-coated with silica, and methods using same
JP2014208346A (en) * 2008-11-26 2014-11-06 コーニング インコーポレイテッド Coated particulate filter and method
US20120186240A1 (en) * 2009-09-30 2012-07-26 Honda Motor Co., Ltd. Exhaust gas purifying filter
JP5690273B2 (en) * 2009-09-30 2015-03-25 住友大阪セメント株式会社 Exhaust gas purification filter
US9273574B2 (en) 2009-09-30 2016-03-01 Sumitomo Osaka Cement Co., Ltd. Exhaust gas purifying filter
KR20200048735A (en) * 2018-10-30 2020-05-08 한국과학기술연구원 Liquid phase sintered silicon carbide porous body having dual pore structure and method for producing same
KR102124783B1 (en) 2018-10-30 2020-06-22 한국과학기술연구원 Liquid phase sintered silicon carbide porous body having dual pore structure and method for producing same

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