JP2001064481A - Flexible epoxy putty composition - Google Patents
Flexible epoxy putty compositionInfo
- Publication number
- JP2001064481A JP2001064481A JP23713499A JP23713499A JP2001064481A JP 2001064481 A JP2001064481 A JP 2001064481A JP 23713499 A JP23713499 A JP 23713499A JP 23713499 A JP23713499 A JP 23713499A JP 2001064481 A JP2001064481 A JP 2001064481A
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- Prior art keywords
- parts
- epoxy resin
- organic
- epoxy
- putty composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
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Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、可撓性エポキシパ
テ組成物に関し、更に詳しくは、自動車のバンパー、木
部、金属、モルタルなどの各種素地面にヘラなどでしご
き込み、平滑な表面を形成するのに好適な可撓性エポキ
シパテ組成物に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible epoxy putty composition, and more particularly, to a smooth surface by squeezing a bumper, wood, metal, mortar and other various grounds of an automobile with a spatula or the like. And a flexible epoxy putty composition suitable for use.
【０００２】[0002]
【従来の技術】自動車のボディやバンパーなどの補修用
パテは、不飽和ポリエステルパテ、エポキシパテ、ウレ
タンパテ、ラッカーパテなどが用いられている。また、
木部、モルタル部などにも、前記のパテ類や、水系のパ
テ類が用いられている。2. Description of the Related Art Unsaturated polyester patties, epoxy patties, urethane patties, lacquer patties, and the like are used as repair putties for automobile bodies and bumpers. Also,
The above-mentioned patties and water-based patties are also used for wood and mortar.
【０００３】これらの補修用パテは、凹部を平滑にする
使命があるため、塗料に比べて体質顔料を多く配合する
必要があり、そのため柔軟性に乏しく、作業しにくいと
いう問題があった。しかしながら、従来の補修用パテで
柔軟性すなわち可撓性を改善したものはなかった。[0003] Since these repair putties have a mission of smoothing the concave portions, it is necessary to incorporate a larger amount of extender pigments than paints, so that there is a problem that they have poor flexibility and are difficult to work. However, none of the conventional repair putties has improved flexibility, that is, flexibility.
【０００４】一方、特開平２−２９４３２３号公報に
は、エポキシ樹脂、熱可塑性樹脂、ジヒドラジッド硬化
剤及びフィラーよりなるマスターモデル、治工具等の作
製に適した一液型熱硬化性パテ組成物が提案されてい
る。この特許では、フィラーとして、ガラスマイクロバ
ルーン、シラスバルーン等の無機質フィラーを用いると
硬化物の熱膨張率が小さくなり、フェノール樹脂マイク
ロバルーン、フェノール樹脂粉粒体などを用いると硬化
物の切削性が改善されるとしているが、可撓性の改善を
目的とするものではない。On the other hand, Japanese Patent Application Laid-Open No. 2-294323 discloses a one-pack type thermosetting putty composition suitable for producing master models, jigs and the like comprising an epoxy resin, a thermoplastic resin, a dihydrazide curing agent and a filler. Proposed. In this patent, when an inorganic filler such as a glass microballoon or a shirasu balloon is used as a filler, the coefficient of thermal expansion of the cured product becomes small, and when a phenol resin microballoon or phenol resin powder is used, the cutability of the cured product is reduced. It is said to be improved, but not for the purpose of improving flexibility.
【０００５】また、特開平４−５９８２０号公報には、
常温液状の低粘度エポキシ樹脂とエポキシ基含有反応性
希釈剤とからなるエポキシ化合物、膨張性マイクロカプ
セル及びエポキシ樹脂硬化剤よりなるＳＭＣ等の反応射
出成形可能なエポキシ樹脂組成物が提案されている。こ
れには、膨張性マイクロカプセルを配合することによ
り、成形品の硬化収縮を低下させることに特徴がある
が、射出成形用であって用途が異なる。[0005] Also, Japanese Patent Application Laid-Open No. 4-59820 discloses that
There has been proposed an epoxy resin composition such as an epoxy compound comprising a low-viscosity epoxy resin at room temperature and an epoxy group-containing reactive diluent, and SMC comprising an expandable microcapsule and an epoxy resin curing agent, such as SMC. This is characterized in that the curing shrinkage of the molded article is reduced by blending the expandable microcapsules, but it is used for injection molding and has different uses.
【０００６】さらに、特開平６−３２２２３６号公報に
は、常温液状の低粘度エポキシ樹脂、エポキシ樹脂硬化
剤、中空微小球、特定のシリコン系界面活性剤よりなる
治工具用エポキシ樹脂組成物が提案されているが、これ
は特定のシリコン系界面活性剤を配合することにより、
治工具作成時の気泡発生を抑制するものであり、中空微
小球の配合は、盛り付け作業性、切削加工性を改善する
ためである。Further, Japanese Patent Application Laid-Open No. 6-322236 proposes an epoxy resin composition for jigs and tools composed of a low-viscosity epoxy resin at room temperature, an epoxy resin hardener, hollow microspheres, and a specific silicon-based surfactant. Although this is, by blending a specific silicon-based surfactant,
The purpose of the present invention is to suppress the generation of air bubbles at the time of producing the jig and tool, and to mix the hollow microspheres in order to improve the workability of work and the workability of cutting.
【０００７】[0007]
【発明が解決しようとする課題】したがって、本発明の
目的は、可撓性を必要とする、自動車バンパー、木部、
金属、軽量コンクリートなどの各種素地面にヘラなどで
しごき込み、平滑な表面を形成するのに好適な可撓性エ
ポキシパテ組成物を提供することにある。SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide an automobile bumper, xylem,
It is an object of the present invention to provide a flexible epoxy putty composition suitable for forming a smooth surface by squeezing with a spatula or the like on various grounds such as metal and lightweight concrete.
【０００８】[0008]
【課題を解決するための手段】本発明者は、種々検討し
た結果、エポキシ樹脂に有機質マイクロバルーンを配合
することによって可撓性を改善できることを見い出し、
本発明を完成した。As a result of various studies, the present inventors have found that the flexibility can be improved by blending an organic microballoon with an epoxy resin.
The present invention has been completed.
【０００９】すなわち、本発明は、エポキシ樹脂、硬化
剤及び体質顔料を含有するエポキシ樹脂組成物におい
て、粒径１００μm 以下の有機質マイクロバルーンを配
合したことを特徴とする可撓性エポキシパテ組成物であ
る。That is, the present invention is a flexible epoxy putty composition comprising an epoxy resin composition containing an epoxy resin, a curing agent and an extender pigment, wherein an organic microballoon having a particle size of 100 μm or less is blended. .
【００１０】本発明の可撓性エポキシパテ組成物におい
て、エポキシ樹脂と硬化剤の合計量１００重量部に対
し、密度０．１〜０．３g/cm3 の有機質中空微小球５〜
５０重量部を配合するか、あるいは密度０．０１〜０．
０５g/cm3 の有機質発泡微粉末０．５〜５重量部を配合
することがよい。また、本発明の可撓性エポキシパテ組
成物は、可撓性を必要とする素地面の補修用パテとして
用いることがよい。In the flexible epoxy putty composition of the present invention, the organic hollow microspheres having a density of 0.1 to 0.3 g / cm 3 are added to 100 parts by weight of the total amount of the epoxy resin and the curing agent.
50 parts by weight or a density of 0.01 to 0.1.
It is preferable to add 0.5 to 5 parts by weight of an organic foamed fine powder of 05 g / cm 3 . Further, the flexible epoxy putty composition of the present invention is preferably used as a putty for repairing a bare ground requiring flexibility.
【００１１】以下、本発明の可撓性エポキシパテ組成物
について詳細に説明する。本発明の可撓性エポキシパテ
組成物に用いられるエポキシ樹脂としては、例えばビス
フェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポ
キシ樹脂、ビスフェノールＡＤ型エポキシ樹脂等のグリ
シジルエーテル系エポキシ樹脂、脂環式エポキシ樹脂、
グリシジルエステル系エポキシ樹脂、グリシジルアミン
系エポキシ樹脂、複素環式エポキシ樹脂等の各種エポキ
シ樹脂が挙げられる。これらのエポキシ樹脂のうち、常
温で液状であり、その粘度が２５℃において１５，００
０cps 程度以下の低粘度のエポキシ樹脂が好ましい。こ
れらのエポキシ樹脂は、単独でもよいし、２種類以上を
併用してもよい。Hereinafter, the flexible epoxy putty composition of the present invention will be described in detail. Examples of the epoxy resin used in the flexible epoxy putty composition of the present invention include glycidyl ether-based epoxy resins such as bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, alicyclic epoxy resin,
Various epoxy resins such as a glycidyl ester-based epoxy resin, a glycidylamine-based epoxy resin, and a heterocyclic epoxy resin are exemplified. Of these epoxy resins, they are liquid at room temperature and have a viscosity of 15,000 at 25 ° C.
Epoxy resins having a low viscosity of about 0 cps or less are preferred. These epoxy resins may be used alone or in combination of two or more.
【００１２】また、必要に応じて、上記エポキシ樹脂
に、一分子中に１〜３個のエポキシ基を有する反応性希
釈剤を添加してもよい。反応性希釈剤は、一般に高粘度
の液状エポキシ樹脂と併用されて樹脂組成物の粘度を下
げると共に、その分子中にエポキシ基を有するので硬化
にも寄与する化合物である。このような反応性希釈剤と
しては、例えば、ｎ−ブチルグリシジルエーテル、アリ
ルグリシジルエーテル、２−エチルヘキシルグリシジル
エーテル、スチレンオキサイド、フェニルグリシジルエ
ーテル、クレジルグリシジルエーテル、ｐ−ｓｅｃ−ブ
チルフェニルグリシジルエーテル、グリシジルメタクリ
レート、ビニルシクロヘキセンモノエポキサイド、α−
ピネンオキサイド、三級カルボン酸グリシジルエステル
等の一分子中に１個のエポキシ基を有する化合物や、ヘ
キサンジオール、ジグリシジルエーテル、（ポリ）エチ
レングリコールジグリシジルエーテル、（ポリ）プロピ
レングリコールジグリシジルエーテル、ブタンジオール
ジグリシジルエーテル、ビニルシクロヘキセンジオキサ
イド、ネオペンチルグリコールジグリシジルエーテル、
ジグリシジルアニリン等の一分子中に２個のエポキシ基
を有する化合物や、トリメチロールプロパントリグリシ
ジルエーテル、グリセリントリグリシジルエーテル等の
一分子中に３個のエポキシ基を有する化合物などが挙げ
られる。これらの反応性希釈剤は、単独でもよいし、２
種類以上を併用してもよい。If necessary, a reactive diluent having 1 to 3 epoxy groups per molecule may be added to the epoxy resin. The reactive diluent is a compound that is generally used in combination with a high-viscosity liquid epoxy resin to lower the viscosity of the resin composition, and has an epoxy group in its molecule and thus contributes to curing. Examples of such a reactive diluent include n-butyl glycidyl ether, allyl glycidyl ether, 2-ethylhexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, cresyl glycidyl ether, p-sec-butylphenyl glycidyl ether, and glycidyl. Methacrylate, vinylcyclohexene monoepoxide, α-
Compounds having one epoxy group in one molecule such as pinene oxide, glycidyl tertiary carboxylate, hexanediol, diglycidyl ether, (poly) ethylene glycol diglycidyl ether, (poly) propylene glycol diglycidyl ether, Butanediol diglycidyl ether, vinylcyclohexene dioxide, neopentyl glycol diglycidyl ether,
Examples thereof include compounds having two epoxy groups in one molecule such as diglycidylaniline, and compounds having three epoxy groups in one molecule such as trimethylolpropane triglycidyl ether and glycerin triglycidyl ether. These reactive diluents may be used alone or 2
More than one type may be used in combination.
【００１３】本発明の可撓性エポキシパテ組成物に用い
られるエポキシ樹脂用硬化剤としては、例えばジエチレ
ントリアミン、トリエチレンテトラミン、イソフォロン
ジアミン、ｍ−キシレンジアミン等の脂肪族ポリアミン
や、メタフェニレンジアミン、ジアミノジフェニルメタ
ン、ジアミノジフェニルスルホン酸等の芳香族ポリアミ
ンや、ポリメルカプト化合物などが挙げられる。これら
の硬化剤は、単独でもよいし、２種類以上を併用しても
よい。その他、硬化促進剤として、例えば三級アミン、
有機金属などを配合することができる。The curing agent for epoxy resin used in the flexible epoxy putty composition of the present invention includes, for example, aliphatic polyamines such as diethylenetriamine, triethylenetetramine, isophoronediamine, m-xylenediamine, metaphenylenediamine, diaminodiamine and the like. Examples thereof include aromatic polyamines such as diphenylmethane and diaminodiphenylsulfonic acid, and polymercapto compounds. These curing agents may be used alone or in combination of two or more. In addition, as a curing accelerator, for example, tertiary amine,
Organic metals and the like can be blended.
【００１４】本発明の可撓性エポキシパテ組成物に用い
られる体質顔料としては、従来からパテ組成物の体質顔
料（フィラー）として用いられているものであれば特に
制限されない。このような体質顔料としては、例えば炭
酸カルシウム、クレー、タルク、カオリン、微粉マイ
カ、硫酸バリウムなどが挙げられる。これらの体質顔料
は、単独でもよいし、２種類以上を併用してもよい。体
質顔料の粒径は、平滑性の観点から１００μm 以下、好
ましくは５０μm 以下である。その配合量は、可撓性エ
ポキシパテ組成物の４０〜７０重量％程度がよい。The extender used in the flexible epoxy putty composition of the present invention is not particularly limited as long as it has been conventionally used as an extender (filler) of the putty composition. Examples of such an extender include calcium carbonate, clay, talc, kaolin, fine mica, and barium sulfate. These extenders may be used alone or in combination of two or more. The particle size of the extender is 100 μm or less, preferably 50 μm or less from the viewpoint of smoothness. The compounding amount is preferably about 40 to 70% by weight of the flexible epoxy putty composition.
【００１５】本発明の可撓性エポキシパテ組成物は、フ
ィラーとして１００μm 以下の有機質マイクロバルーン
を配合することを特徴とする。有機質マイクロバルーン
は、材質が柔軟で強度があり、加工時に割れたりひびが
入ることが少ない。このような有機質マイクロバルーン
としては、例えば密度０．１〜０．３g/cm3 の有機質中
空微小球や、密度０．０１〜０．０５g/cm3 の有機質発
泡微粉末（発泡マイクロカプセル）などが挙げられる。
有機質マイクロバルーンの粒径は、有機質中空微小球で
粒径２０〜１００μm 程度、有機質発泡微粉末で粒径４
０〜１００μm程度がよい。有機質マイクロバルーンの
粒径が１００μm を超えると、パテの触感がザラついた
ものとなり、施工表面の平滑性が損なわれる。これらの
有機質マイクロバルーンは、有機質中空微小球又は有機
質発泡微粉末を単独で用いてもよく、両者を併用しても
よい。[0015] The flexible epoxy putty composition of the present invention is characterized in that organic microballoons of 100 µm or less are blended as a filler. The organic microballoon is made of a flexible and strong material, and is hardly cracked or cracked during processing. Such organic microballoons include, for example, organic hollow microspheres having a density of 0.1 to 0.3 g / cm 3 and organic foamed fine powders (foamed microcapsules) having a density of 0.01 to 0.05 g / cm 3. Is mentioned.
The particle diameter of the organic microballoons is about 20 to 100 μm for organic hollow microspheres and 4 for organic foamed fine powder.
It is preferably about 0 to 100 μm. If the particle size of the organic microballoon exceeds 100 μm, the tactile feel of the putty becomes rough and the smoothness of the construction surface is impaired. As these organic microballoons, organic hollow microspheres or organic foamed fine powder may be used alone, or both may be used in combination.
【００１６】これらの有機質マイクロバルーンに用いら
れる有機高分子物質としては、例えば塩化ビニリデン系
樹脂、アクリロニトリル系樹脂、スチレン系樹脂、エポ
キシ樹脂、フェノール樹脂、ユリア・ホルムアルデヒド
樹脂などが挙げられる。また、その表面に炭酸カルシウ
ム、タルク、酸化チタン等の無機微粉末をコーティング
した有機質マイクロバルーンを用いると、エポキシ樹脂
や硬化剤とのなじみがよくなるため、作業性が改善され
る。Examples of the organic high molecular substance used for these organic microballoons include a vinylidene chloride resin, an acrylonitrile resin, a styrene resin, an epoxy resin, a phenol resin, and a urea-formaldehyde resin. In addition, when organic microballoons whose surfaces are coated with inorganic fine powder such as calcium carbonate, talc, and titanium oxide are used, the affinity with the epoxy resin and the curing agent is improved, so that the workability is improved.
【００１７】この有機質マイクロバルーンをエポキシ樹
脂及び／又は硬化剤に配合するが、少量配合する場合は
いずれに配合してもよく、多量に配合する場合は両方に
配合することがよい。また、有機質マイクロバルーンが
エポキシ樹脂又は硬化剤と反応する場合は、反応しない
成分に配合する。エポキシ樹脂と硬化剤の合計量１００
重量部に対する有機質マイクロバルーンの配合割合は、
密度０．１〜０．３g/cm3 の有機質中空微小球では５〜
５０重量部、密度０．０１〜０．０５g/cm3 の有機質発
泡微粉末では０．５〜５重量部で可撓性の改善が可能で
ある。なお、両者を併用する場合は、その混合割合に応
じて配合割合を決めればよい。The organic microballoon is blended with the epoxy resin and / or the curing agent. If it is blended in a small amount, it may be blended in any of them, and if it is blended in a large amount, it may be blended in both. When the organic microballoon reacts with the epoxy resin or the curing agent, it is added to a component that does not react. Total amount of epoxy resin and curing agent 100
The mixing ratio of the organic microballoon to the weight part is
5 is a organic hollow microspheres density 0.1 to 0.3 g / cm 3
In the case of 50 parts by weight and an organic foamed fine powder having a density of 0.01 to 0.05 g / cm 3 , the flexibility can be improved at 0.5 to 5 parts by weight. When both are used together, the mixing ratio may be determined according to the mixing ratio.
【００１８】本発明の可撓性エポキシパテ組成物には、
本発明の目的を損なわない範囲で、有機質マイクロバル
ーンに加えて無機質マイクロバルーンの適当量を配合す
ることができる。このような無機質マイクロバルーンと
しては、例えばシリカバルーン、シラスバルーン、ガラ
スバルーン、フライアッシュバルーンなどが挙げられ
る。これらの無機質マイクロバルーンは単独でもよい
し、２種類以上を併用してもよい。The flexible epoxy putty composition of the present invention comprises:
As long as the object of the present invention is not impaired, an appropriate amount of inorganic microballoons can be blended in addition to organic microballoons. Examples of such an inorganic microballoon include a silica balloon, a shirasu balloon, a glass balloon, a fly ash balloon, and the like. These inorganic microballoons may be used alone or in combination of two or more.
【００１９】本発明の可撓性エポキシパテ組成物には、
パテ組成物の添加剤として従来より公知の添加剤を配合
することができる。このような添加剤としては、例え
ば、高分子ポリカルボン酸系等の分散剤や、変性シリコ
ン系、アクリル酸エステル共重合体系等の消泡剤や、酸
化ポリエチレン系、アマイドワックス系、水素添加ヒマ
シ油系、有機ベントナイト系等のたれ・沈降防止剤など
の１種又は２種以上が挙げられる。The flexible epoxy putty composition of the present invention comprises:
Conventionally known additives can be blended as additives for the putty composition. Such additives include, for example, dispersants such as polymeric polycarboxylic acids, defoaming agents such as modified silicones and acrylate copolymers, polyethylene oxides, amide waxes, and hydrogenated casters. One or more kinds of anti-sagging / sedimentation agents such as oil-based and organic bentonite-based can be used.
【００２０】本発明の可撓性エポキシパテ組成物は、エ
ポキシ樹脂及び硬化剤の両者又はいずれかに有機質マイ
クロバルーン、体質顔料などを配合して、基剤及び硬化
剤の二液型として製造し、使用時に基剤と硬化剤を所定
の割合で混合すればよい。The flexible epoxy putty composition of the present invention is produced as a two-pack type of a base and a curing agent by blending an organic microballoon, an extender pigment, etc. with either or both of an epoxy resin and a curing agent, The base and the curing agent may be mixed at a predetermined ratio when used.
【００２１】本発明の可撓性エポキシパテ組成物は、自
動車バンパーを始め自動車各部や、木部、金属、モルタ
ル部など多用途に使用でき、可撓性があるために、変形
に追随でき、また振動のある箇所に使用しても剥離する
ことがない。The flexible epoxy putty composition of the present invention can be used for various purposes such as automobile bumpers, automobile parts, wood parts, metals, mortar parts, etc., and because it is flexible, it can follow deformation. It does not peel even when used in places with vibration.
【００２２】[0022]
【実施例】以下、実施例により本発明を具体的に説明す
るが、本発明はこれに限定されるものではない。以下に
おいて部は重量部を表す。EXAMPLES The present invention will be described below in detail with reference to examples, but the present invention is not limited to these examples. In the following, "part" indicates "part by weight".
【００２３】実施例１ 低粘度ビスフェノールＡ [旭電化工業社製 アデカレジ
ンＥＰ−４５２０Ｓ]３８０部、ポリアクリロニトリル
中空微粒子 [マツモト油脂製薬社製 マイクロスフェア
ーＭＦＬ−８０ＧＣＡ、粒径２０μm 、密度０．２] １
００部、ステアリン酸アルミニウム１０部及び二酸化チ
タン１０部をミキサーで混合し、 [基剤１] ５００部を
得た。変性脂肪族ポリアミン化合物 [富士化成工業社製
フジキュアー５２５０] ３３０部、変性脂肪族ポリア
ミノアミド化合物 [富士化成工業社製 トーマイドＨＲ
−１１] ６０部、ポリアクリロニトリル中空微粒子 [マ
ツモト油脂製薬社製マイクロスフェアーＭＦＬ−８０Ｇ
ＣＡ] ５０部、ステアリン酸アルミニウム１０部及び炭
酸カルシウム５０部をミキサーで混合し、 [硬化剤１]
５００部を得た。次いで、 [基剤１] と [硬化剤１] を
１：１の割合で攪拌混合して可撓性エポキシパテを調製
した。この可撓性エポキシパテを用い、プラスチック製
バンパーの曲面の凹部にへらでしごき込んだところ、素
地への付着性が良好であり、また細い傷の箇所にもパテ
を充填でき、凹部を平滑に修復できた。Example 1 Low-viscosity bisphenol A [Adeka Resin EP-4520S manufactured by Asahi Denka Kogyo Co., Ltd.] 380 parts, polyacrylonitrile hollow fine particles [Microsphere MFL-80GCA manufactured by Matsumoto Yushi Seiyaku Co., Ltd., particle size 20 μm, density 0.2] 1
00 parts, 10 parts of aluminum stearate and 10 parts of titanium dioxide were mixed with a mixer to obtain [Base 1] 500 parts. 330 parts of modified aliphatic polyamine compound [Fujicure 5250 manufactured by Fuji Kasei Kogyo Co., Ltd.], modified aliphatic polyaminoamide compound [Tomide HR manufactured by Fuji Kasei Kogyo Co., Ltd.]
-11] 60 parts, polyacrylonitrile hollow fine particles [Microsphere MFL-80G manufactured by Matsumoto Yushi-Seiyaku Co., Ltd.]
CA], 50 parts of aluminum stearate and 50 parts of calcium carbonate were mixed with a mixer.
500 parts were obtained. Then, [Base 1] and [Curing Agent 1] were stirred and mixed at a ratio of 1: 1 to prepare a flexible epoxy putty. Using this flexible epoxy putty, the spatula was squeezed into the concave part of the curved surface of the plastic bumper, and the adhesion to the substrate was good. did it.
【００２４】実施例２ 低粘度ビスフェノールＡ [旭電化工業社製 アデカレジ
ンＥＰ−４５２０Ｓ]４３５部、有機質発泡体微粉末
[日本フィライト社製 エクスパンセル５５１ＤＥ、粒
径３０〜５０μm 、密度０．０３６g/cm3 ] １５部、二
酸化チタン２５部及び溶剤２５部をミキサーで混合し、
[基剤２] ５００部を得た。変性脂肪族ポリアミン化合
物 [富士化成工業社製 フジキュアー５２５０] ３８０
部、変性脂肪族ポリアミノアミド化合物 [富士化成工業
社製 トーマイドＨＲ−１１] ６５部、ステアリン酸ア
ルミニウム１０部、炭酸カルシウム３５部及び有機ベン
トナイト１０部をミキサーで混合し、 [硬化剤２] ５０
０部を得た。次いで、 [基剤２] と [硬化剤２] を１：
１の割合で攪拌混合して可撓性エポキシパテを調製し、
実施例１と同様に、プラスチック製バンパーの曲面の凹
部にへらでしごき込んだところ、素地への付着性が良好
であり、また細い傷の箇所にもパテを充填でき、凹部を
平滑に修復できた。Example 2 435 parts of low viscosity bisphenol A [Adeka Resin EP-4520S manufactured by Asahi Denka Kogyo Co., Ltd.], fine powder of organic foam
[Nippon Philite Expancel 551DE, particle size 30-50 μm, density 0.036 g / cm 3 ] 15 parts, titanium dioxide 25 parts and solvent 25 parts were mixed with a mixer,
[Base 2] 500 parts were obtained. Modified aliphatic polyamine compound [Fuji Cure 5250 manufactured by Fuji Kasei Kogyo Co., Ltd.] 380
Parts, modified aliphatic polyaminoamide compound [Tomide HR-11 manufactured by Fuji Kasei Kogyo Co., Ltd.] 65 parts, aluminum stearate 10 parts, calcium carbonate 35 parts and organic bentonite 10 parts were mixed with a mixer, and [Curing agent 2] 50
0 parts were obtained. Then, [Base 2] and [Curing Agent 2] were added as 1:
Stir and mix at a ratio of 1 to prepare a flexible epoxy putty,
As in Example 1, when the spatula was squeezed into the concave portion of the curved surface of the plastic bumper, the adhesiveness to the base material was good, and putty could be filled even at a small scratch, and the concave portion could be repaired smoothly. Was.
【００２５】比較例１ 低粘度ビスフェノールＡ [旭電化工業社製 アデカレジ
ンＥＰ−４５２０Ｓ]２１８部、タルク１１０部、炭酸
カルシウム１１０部、亜鉛華２５部、有機ベントナイト
２５部及び添加剤１２部をミキサーで混合し、 [基剤
３] ５００部を得た。変性脂肪族ポリアミン化合物 [富
士化成工業社製 フジキュアー５２５０] １９０部、変
性脂肪族ポリアミノアミド化合物 [富士化成工業社製
トーマイドＨＲ−１１] ３３部、タルク１３５部、炭酸
カルシウム９０部、添加剤１２部及び溶剤４０部をミキ
サーで混合し、 [硬化剤３] ５００部を得た。次いで、
[基剤３] と [硬化剤３] を１：１の割合で攪拌混合し
て通常のエポキシパテを調製し、実施例１と同様に、プ
ラスチック製自動車バンパーの凹部にへらでしごき込ん
が、パテが硬くて平滑に仕上がらなかった。Comparative Example 1 Low-viscosity bisphenol A [Adeka Resin EP-4520S manufactured by Asahi Denka Kogyo Co., Ltd.] 218 parts, 110 parts of talc, 110 parts of calcium carbonate, 25 parts of zinc white, 25 parts of organic bentonite and 12 parts of additives were mixed with a mixer. By mixing, 500 parts of [Base 3] were obtained. 190 parts of modified aliphatic polyamine compound [Fujicure 5250 manufactured by Fuji Kasei Kogyo Co., Ltd.], modified aliphatic polyaminoamide compound [Fuji Kasei Kogyo Co., Ltd.
Tomide HR-11] 33 parts, talc 135 parts, calcium carbonate 90 parts, additives 12 parts and solvent 40 parts were mixed with a mixer to obtain 500 parts of [hardening agent 3]. Then
[Base 3] and [Curing agent 3] were stirred and mixed at a ratio of 1: 1 to prepare a normal epoxy putty. As in Example 1, a spatula was squeezed into the concave portion of the plastic automobile bumper. Was hard and did not finish smoothly.
【００２６】[0026]
【発明の効果】本発明の可撓性エポキシパテ組成物は、
優れた可撓性を有するため、自動車バンパーなど振動の
多い部位でも安定して付着し剥がれることがなく、また
曲面や凹凸を有する部位にもパテがきれいに充填され、
平滑な表面に仕上げることができる。また、従来のエポ
キシパテに比べて作業性、性能もなんら遜色がない。The flexible epoxy putty composition of the present invention comprises:
Because it has excellent flexibility, it does not stably adhere and peel off even in areas with a lot of vibration such as automobile bumpers, and putty is also filled neatly into parts with curved surfaces and irregularities,
It can be finished to a smooth surface. In addition, the workability and performance are not inferior to conventional epoxy putty.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｃ０９Ｄ 201/00 Ｃ０９Ｄ 201/00 Ｆターム(参考） 4J002 BC032 BD102 BG102 CC032 CC162 CD002 CD021 CD041 CD051 CD081 CD131 DE237 DG047 DJ037 DJ047 DJ057 EN026 EN036 EN046 EN076 EV026 EV216 FA102 FB072 FD012 FD097 FD146 FD200 GJ02 4J038 CC022 CD082 CG162 DA032 DA142 DB002 DB041 DB061 DB151 DB221 DB251 HA166 HA266 HA286 HA526 HA536 HA546 JA13 JB04 JB05 JB07 JC02 KA03 KA21 NA12 NA24 PB07 PB12 PC02 PC03 PC06 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification symbol FI Theme coat ゛ (Reference) C09D 201/00 C09D 201/00 F term (Reference) 4J002 BC032 BD102 BG102 CC032 CC162 CD002 CD021 CD041 CD051 CD081 CD131 DE237 DG047 DJ037 DJ047 DJ057 EN026 EN036 EN046 EN076 EV026 EV216 FA102 FB072 FD012 FD097 FD146 FD200 GJ02 4J038 CC022 CD082 CG162 DA032 DA142 DB002 DB041 DB061 DB151 DB221 DB251 HA166 HA266 HA286 HA526 HA536 HA546 JA13 JB04 JB07 J02
Claims (4)
有するエポキシ樹脂組成物において、粒径１００μm 以
下の有機質マイクロバルーンを配合したことを特徴とす
る可撓性エポキシパテ組成物。1. A flexible epoxy putty composition comprising an epoxy resin composition containing an epoxy resin, a curing agent and an extender pigment, wherein organic microballoons having a particle size of 100 μm or less are blended.
量部に対し、粒径１００μm 以下、密度０．１〜０．３
g/cm3 の有機質中空微小球５〜５０重量部を配合した請
求項１記載の可撓性エポキシパテ組成物。2. The method according to claim 1, wherein the particle size is 100 μm or less and the density is 0.1 to 0.3 with respect to 100 parts by weight of the total amount of the epoxy resin and the curing agent.
flexible epoxy putty composition of claim 1 blended with organic hollow microspheres 5-50 parts by weight of g / cm 3.
量部に対し、粒径１００μm 以下、密度０．０１〜０．
０５g/cm3 の有機質発泡微粉末０．５〜５重量部を配合
した請求項１記載の可撓性エポキシパテ組成物。3. A particle size of 100 μm or less and a density of 0.01 to 0.1 with respect to 100 parts by weight of the total amount of the epoxy resin and the curing agent.
Organic foaming claim 1 flexible epoxy putty composition according compounded with fine powder 0.5 to 5 parts by weight of 05g / cm 3.
面の補修用パテである請求項１〜３のいずれかに記載の
可撓性エポキシパテ組成物。4. The flexible epoxy putty composition according to claim 1, wherein the flexible epoxy putty composition is a putty for repairing various ground surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23713499A JP2001064481A (en) | 1999-08-24 | 1999-08-24 | Flexible epoxy putty composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23713499A JP2001064481A (en) | 1999-08-24 | 1999-08-24 | Flexible epoxy putty composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2001064481A true JP2001064481A (en) | 2001-03-13 |
Family
ID=17010918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23713499A Pending JP2001064481A (en) | 1999-08-24 | 1999-08-24 | Flexible epoxy putty composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2001064481A (en) |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003055646A (en) * | 2001-08-10 | 2003-02-26 | Sekisui Chem Co Ltd | Sealant for automobile body |
| KR100476325B1 (en) * | 2004-04-12 | 2005-03-16 | 동화특수산업주식회사 | Composition of arificial wood for wood restoration |
| JP2008094978A (en) * | 2006-10-12 | 2008-04-24 | Aica Kogyo Co Ltd | Epoxy resin composition |
| JP2008525599A (en) * | 2004-12-23 | 2008-07-17 | スリーエム イノベイティブ プロパティズ カンパニー | Flame retardant low density epoxy composition |
| DE102008013019A1 (en) * | 2008-03-07 | 2009-09-17 | Btf Produktentwicklungs- Und Vertriebs-Gmbh | Aqueous filler composition, useful for the interior insulation, preferably thermal insulation of buildings, comprises specific range of binders, heavy and light fillers, and water, where the binder is a resin and/or resin ester |
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| JP2014095068A (en) * | 2012-10-12 | 2014-05-22 | Furukawa Techno Material Co Ltd | Non-hardenable refractory putty composition |
| DE102013007917A1 (en) * | 2013-05-10 | 2014-11-13 | Mankiewicz Gebr. & Co. (Gmbh & Co. Kg) | Composition for the production of putties and method for the production and processing of putties |
| WO2015166583A1 (en) * | 2014-05-02 | 2015-11-05 | 株式会社古河テクノマテリアル | Non-curable refractory putty composition |
| JP2016117882A (en) * | 2014-12-17 | 2016-06-30 | 株式会社古河テクノマテリアル | Non-curable thermal expandable putty composition |
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-
1999
- 1999-08-24 JP JP23713499A patent/JP2001064481A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003055646A (en) * | 2001-08-10 | 2003-02-26 | Sekisui Chem Co Ltd | Sealant for automobile body |
| KR100476325B1 (en) * | 2004-04-12 | 2005-03-16 | 동화특수산업주식회사 | Composition of arificial wood for wood restoration |
| JP2008525599A (en) * | 2004-12-23 | 2008-07-17 | スリーエム イノベイティブ プロパティズ カンパニー | Flame retardant low density epoxy composition |
| JP2008094978A (en) * | 2006-10-12 | 2008-04-24 | Aica Kogyo Co Ltd | Epoxy resin composition |
| DE102008013019A1 (en) * | 2008-03-07 | 2009-09-17 | Btf Produktentwicklungs- Und Vertriebs-Gmbh | Aqueous filler composition, useful for the interior insulation, preferably thermal insulation of buildings, comprises specific range of binders, heavy and light fillers, and water, where the binder is a resin and/or resin ester |
| JP2014095068A (en) * | 2012-10-12 | 2014-05-22 | Furukawa Techno Material Co Ltd | Non-hardenable refractory putty composition |
| US10316225B2 (en) | 2012-11-05 | 2019-06-11 | 3M Innovative Properties Company | Thermoset adhesive, automotive component using thermoset adhesive, and method of manufacturing same |
| WO2014071334A2 (en) * | 2012-11-05 | 2014-05-08 | 3M Innovative Properties Company | Thermoset adhesive, automotive component using thermoset adhesive, and method of manufacturing same |
| WO2014071334A3 (en) * | 2012-11-05 | 2014-08-07 | 3M Innovative Properties Company | Thermoset adhesive, automotive component using thermoset adhesive, and method of manufacturing same |
| US11008487B2 (en) | 2012-11-05 | 2021-05-18 | 3M Innovative Properties Company | Thermoset adhesive, automotive component using thermoset adhesive, and method of manufacturing same |
| DE102013007917A1 (en) * | 2013-05-10 | 2014-11-13 | Mankiewicz Gebr. & Co. (Gmbh & Co. Kg) | Composition for the production of putties and method for the production and processing of putties |
| US10076768B2 (en) | 2013-05-10 | 2018-09-18 | Mankiewicz Gebr. & Co. Gmbh & Co. Kg | Composition for producing fillers and method for producing and processing the fillers |
| US10702886B2 (en) | 2013-05-10 | 2020-07-07 | Mankiewicz Gebr. & Co. Gmbh & Co. Kg | Composition for producing fillers and method for producing and processing the fillers |
| WO2015166583A1 (en) * | 2014-05-02 | 2015-11-05 | 株式会社古河テクノマテリアル | Non-curable refractory putty composition |
| JP2016117882A (en) * | 2014-12-17 | 2016-06-30 | 株式会社古河テクノマテリアル | Non-curable thermal expandable putty composition |
| JP2018070750A (en) * | 2016-10-28 | 2018-05-10 | アイシン化工株式会社 | Coating type reinforcing material composition |
| RU2779120C1 (en) * | 2021-05-31 | 2022-09-01 | Общество с ограниченной ответственностью "Весто" | Composition for producing a fire-resistant anti-corrosive heat insulation coating and method for the production thereof (variants) |
| WO2023090026A1 (en) * | 2021-11-17 | 2023-05-25 | 株式会社スリーボンド | Microcapsule type curable resin composition |
| CN115286972A (en) * | 2022-07-28 | 2022-11-04 | 国能(山东)能源环境有限公司 | Anticorrosive paint and preparation method of anticorrosive paint |
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