JP2001062843A - Heat-insulating mold for matte molding and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat insulating mold, for a matte molding, which is easily repaired without adversely affecting the appearance of the molding. SOLUTION: A primer layer 2, a heat insulating layer 3 made up of a heat- curable polyimide and a resin layer 4 made up of an epoxy resin cured product are sequentially formed on a main mold 1. Further, minute irregularities are formed on the surface of the resin layer 4 by sandblasting In addition, a top coat layer 5 consisting of a polymer composed mainly of a polysiloxane and an epoxy resin is formed on the surface of the resin layer 4 in such a manner that the minute irregularities on the surface of the resin layer 4 reflectively appear on the surface of the top coat layer 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-insulating mold used for molding a synthetic resin and a method for producing the same, and more particularly to a heat-insulating mold for forming a matte molded product, and a mold cavity side mold wall surface. The present invention relates to a heat-insulating mold capable of repairing damage caused in a mold and easily manufactured, and a method of manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, a heat insulating mold in which a mold cavity side wall of a metal main mold is covered with a heat insulating layer, and is used for forming a matte molded product having fine irregularities on the surface. As the mold, for example, Japanese Patent Application Laid-Open No. Hei 7-266343 discloses that a heat insulating layer made of a heat-resistant polymer such as polyimide is coated on a mold cavity side wall surface of a main mold, and the surface of the heat insulating layer is finely blasted by sandblasting. A mold having irregularities is described. WO95 / 35914 also discloses a mold in which the surface of a heat insulating layer is sandblasted, a mold in which inorganic fine powder is mixed into a heat insulating layer to form fine irregularities on the surface, and a method in which the heat insulating layer is further coated on the heat insulating layer. A mold having a metal layer formed by plating is disclosed.

On the other hand, when damage such as local dropout occurs in the heat insulating layer of the heat insulating mold, the damaged portion is filled with a polymer softer than the heat insulating layer by being raised from the surface of the heat insulating layer.
It is known that the top portion of this polymer is polished and made equal to the periphery to perform repair (Japanese Patent Laid-Open No. 7-178803).
issue).

In the above repair method, a polymer softer than the heat-insulating layer is used because the polymer portion is preferentially polished without largely shaving the surrounding heat-insulating layer during polishing after filling the polymer. This is to make it possible. In addition, as a polymer used for this repair, a polyimide soluble in a polar solvent having a boiling point of less than 200 ° C., a polyimide formed from a precursor solution, an amorphous heat-resistant polymer having an aromatic ring in a main chain, bismaleimide, etc. It is also disclosed in the above publication that reactive polyimide, epoxy resin, modified epoxy resin, epoxy modified resin, silicone resin, modified silicone resin and the like can be used.

[0005]

In the above-mentioned heat-insulating mold for matte molded products, when the heat-insulating layer or the metal layer is partially damaged such as local falling off, it is considered that the above-mentioned repairing method is applied to repair. Can be

In such a case, the above-mentioned polymer is filled in the damaged portion by being raised from the surface of the heat insulating layer, and then the top of the polymer is polished to make it surrounding, and the surface of the polymer is subjected to sandblasting. Form the same fine irregularities as the surroundings,
Alternatively, it is conceivable to repair the damaged portion by filling the damaged portion with the polymer filled with the inorganic fine powder.

However, since the hardness of the polymer filled in the damaged portion and that of the layer around the damaged portion are different, it is difficult to form the same fine irregularities on the surface of the polymer filled in the damaged portion as those already sandblasted. It is difficult, and unevenness based on the difference in hardness is transferred as repair marks on the surface of the obtained molded article. Even if the damaged portion is filled with the same material or a polymer having the same hardness as the surrounding layer, partial sandblasting in the same plane may cause unevenness in the boundary with the surrounding. However, a uniform fine uneven surface cannot be obtained. In addition, in the damaged portion, the thermal cycling resistance becomes insufficient, and cracks occur in short-term use.

Further, even when the damaged portion is filled with a polymer mixed with an inorganic fine powder, if the hardness of the polymer is different from that of a surrounding layer, the repair mark on the molded article due to the difference in the hardness is reduced. When transfer occurs and the polymer and the surrounding layer have the same hardness, problems such as cracks occur. Furthermore, the roughness of the fine irregularities on the surface of the filled polymer differs from the surrounding fine irregularities due to the polishing operation.

Further, in the case of a metal mold having a metal layer formed on the surface, it is difficult to repair the metal layer because the metal layer cannot be formed only on the damaged portion.

[0010] The present invention has been made in view of the above-mentioned conventional problems, and it is possible to repair partial damage of a heat insulating mold, and the repair does not significantly reduce the appearance of a molded article. An object of the present invention is to provide a heat-insulating mold for matte molded articles having sufficient durability after repair and a method for producing the same.

[0011]

According to the present invention, there is provided a heat-insulating mold for a matte molded article according to the present invention, in which a mold cavity-side wall surface of a main mold made of metal is covered with a heat-insulating layer. Characterized by being covered with a resin layer having a fine uneven surface due to the above.

According to a preferred embodiment of the present invention, the heat insulating layer is made of polyimide, and the resin layer having a fine uneven surface is made of a cured epoxy resin or a polymer mainly composed of polysiloxane and epoxy resin. Is included.

[0013] Further, the present invention provides that the resin layer having a fine uneven surface is further coated with a harder top coat layer than the resin layer, and the surface of the top coat layer has fine unevenness. The layer is made of polyimide, the resin layer having a fine uneven surface is made of an epoxy resin cured product,
The preferred embodiment includes that the top coat layer is composed of a polymer mainly composed of polysiloxane and epoxy resin.

Further, according to the present invention, a heat insulating layer is coated on the mold cavity side mold wall of the main metal die, and the heat insulating layer is coated with a resin layer, and then the surface of the resin layer is sandblasted. An object of the present invention is to provide a method for producing a heat-insulating mold for a mat molded product, which is characterized by forming fine irregularities.

[0015] The manufacturing method of the present invention is characterized in that a top coat layer harder than the resin layer is formed on a resin layer having fine irregularities formed on the surface so that the fine irregularities are reflected on the surface of the top coat layer. Coating is included as a preferred embodiment thereof.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A heat insulating mold and a method of manufacturing the same according to the present invention will be described with reference to FIGS.

FIGS. 1 and 2 are cross-sectional views of the vicinity of the mold cavity side wall of the main mold. In the figures, 1 is the main mold, 2 is a primer layer, 3 is a heat insulating layer, and 4 is a sand blast treatment. The resin layer (hereinafter referred to as “blast resin layer”) 5 is a top coat layer. FIG. 3 shows a manufacturing process of the heat-insulating mold shown in FIG. 2, and the reference numerals in the figure are the same as those in FIG.

The main mold 1 is made of metal. The metal constituting the main mold is a metal used for a general synthetic resin molding mold. For example, iron or a steel material containing 50% by weight or more of iron, aluminum or 50% by weight of aluminum
The alloys contained above include zinc alloys such as ZAS, copper alloys such as copper and beryllium copper.

The surface of the mold cavity side of the main mold 1 can be subjected to various surface treatments. Examples of the surface processing include metal plating such as chromium plating and nickel plating, and various chemical conversion treatments. By these surface treatments, the adhesion between the main mold 1 and the primer layer 2 and the heat insulating layer 3 described later can be improved. The surface of the main mold 1 subjected to these surface treatments may be a smooth surface or a fine uneven surface, but by providing appropriate surface unevenness, it is possible to further improve the adhesion. Can be planned.

When metal plating is performed as the surface treatment, the plating thickness is preferably 1 to 10 μm, and more preferably 2 to 3 μm.
m is suitable. If the plating thickness is too small, the improvement in the adhesion is small, and if the plating thickness is too large, the processing load increases.

In order to increase the adhesion between the main mold 1 and the heat insulating layer 3, it is preferable that a primer layer 2 is interposed between the main mold 1 and the heat insulating layer 3 (FIGS. 3A and 3A). b)). As the primer layer 2, a layer having excellent adhesion to both the metal surface of the main mold 1 and the heat insulating layer 3 and also having excellent heat resistance is selected. When a thermosetting polyimide is used as the heat insulating layer 3, the thermosetting polyimide has excellent adhesion to both the metal surface and the metal surface, and also has excellent heat resistance. SO
_A thermoplastic polyimide containing a large number of _two groups, such as a benzophenonetetracarboxylic acid-based polyimide, is preferred.

The application of the thermoplastic polyimide primer layer 2 can be performed by applying a thermoplastic polyimide precursor solution to the mold wall surface of the main mold 1 and heating to form a thermoplastic polyimide layer. As a specific example of the thermoplastic polyimide precursor solution suitable for forming the primer layer 2, "LARC-PI" manufactured by Mitsui Toatsu Chemicals, Inc. can be mentioned.

When a thermosetting polyimide is used as the heat insulating layer 3 and a thermoplastic polyimide is used as the primer layer 2, the thickness of the primer layer 2 is preferably 0.5 to 20 μm, and more preferably 1 to 10 μm. If the primer layer 2 is too thin, the improvement in the above-mentioned adhesion is small. If the primer layer 2 is excessively thick, the thermoplastic polyimide is inferior in heat resistance to the thermosetting polyimide. Properties tend to decrease.

From the viewpoint of heat resistance and durability, the heat insulating layer 3 covering the mold wall of the main mold 1 via the primer layer 2 has a glass transition point of 200 ° C. or more and a breaking elongation of 10%.
It is preferable to be composed of the above heat-resistant polymer.
The elongation at break refers to a value measured (tensile speed: 5 mm / min) according to ASTM D638.

As the heat insulating layer 3, for example, polysulfone,
A non-crystalline heat-resistant polymer soluble in a solvent such as polyethersulfone, polyallylsulfone, polyarylate, polyphenylene ether and the like can be used. However, since the heat-insulating layer 3 excellent in heat resistance and durability can be obtained, heat Curable polyimide is preferred, and linear thermosetting polyimide is particularly suitable.

The linear thermosetting polyimide can be synthesized, for example, by subjecting an aromatic diamine and an aromatic tetracarboxylic dianhydride to a ring-opening polyaddition reaction. These linear thermosetting polyimide precursors are heated to cause a dehydration cyclization reaction to form a linear thermosetting polyimide. The most preferred linear thermosetting polyimide precursor is polyamic acid. As the solvent for the precursor, tetrahydrofuran, dimethylformamide, dimethylacetamide, N-methylpyrrolidone, or the like can be used.

The heat-insulating layer 3 made of a linear thermosetting polyimide comprises:
It can be formed by applying and heating the precursor solution. When applying the precursor solution, an additive for adjusting viscosity, surface tension, thixotropy, or the like, or an additive for improving adhesion to the main mold 1 can be added. As a specific example of the precursor solution of the linear type thermosetting polyimide suitable for forming the heat insulating layer 3, "Trenice # 3000" manufactured by Toray Industries, Inc. can be mentioned.

When the heat insulating layer 3 is made of thermosetting polyimide, its thickness is preferably 50 to 200 μm, and particularly preferably 70 to 120 μm. If the heat-insulating layer 3 is too thin, the effect of improving the surface of the molded article by the heat-insulating layer 3 is poor, while if it is too thick, the cooling time of the molded article is prolonged, and the molding efficiency is likely to be reduced.

The blast resin layer 4 has a low thermal conductivity, is excellent in heat resistance, has a large tensile strength, is strong in cooling and heating cycles, has a large surface hardness, has good adhesion to the heat insulating layer 3, and has excellent wear resistance. What is necessary is just to form from the raw material which has the characteristics that sandblast processing can be performed favorably, and the epoxy resin hardened | cured material or the polymer which mainly consists of polysiloxane and an epoxy resin is used preferably.

The cured epoxy resin is a cured product obtained by crosslinking an epoxy resin with a curing agent. By selecting the epoxy resin and the curing agent, the glass transition point and the degree of crosslinking can be adjusted. It is preferable because it is hard, has excellent strength, and has good adhesion to the heat insulating layer 3.

The epoxy resin preferably has an average of two or more epoxy group bonds per molecule. These compounds are saturated or unsaturated aliphatic, aromatic or heterocyclic compounds, which may have a substituent such as halogen, hydroxy, ether and the like. Particularly preferred are glycidyl ether of polyphenol, glycidyl ether of polyphenyl ether, aromatic glycidyl compound, polynuclear aromatic glycidyl ether, and glycidyl ether glycidylbenzene.

As the epoxy resin curing agent, a compound capable of anionic or cationic ring-opening polymerization of an epoxy ring, or a polyfunctional compound capable of undergoing an addition reaction with an epoxy ring and curing can be used. Polyamine compounds, acid anhydrides, and the like can be particularly preferably used.

The cured epoxy resin that can be used in the present invention preferably has a glass transition point of 150 ° C. or higher, and has an average molecular weight between crosslinks (Mc) of 600 or less, more preferably 500 or less. , 300 or more. However, Mc is based on J.A. P. Bell; Pol
ymer Sci. , A-2, 6,417 (1970).
This is a value measured by the method described in (1).

The formation of the resin layer made of the cured epoxy resin can be carried out by applying a solution containing an epoxy resin diluted with a solvent and a curing agent, followed by heating and curing. As a specific example of such a solution containing an epoxy resin and a curing agent, “Araldite XNR / H3305” manufactured by Ciba Specialty Chemicals Inc. may be mentioned.

In the present invention, as the polymer mainly composed of polysiloxane and epoxy resin preferably used for the blast resin layer 4, a polymer mainly composed of polydiphenylsiloxane and bisphenol A epoxy resin is particularly preferably used.

The above-mentioned polymer mainly composed of polysiloxane and epoxy resin means that polysiloxane and epoxy resin are 5
A polymer containing 0% by weight or more, preferably 60% by weight or more, and more preferably 80% by weight or more. The mixing ratio of the polysiloxane and the epoxy resin is preferably in the range of 1: 5 to 5: 1 by weight.

The resin layer formed of a polymer mainly composed of polysiloxane and epoxy resin is formed by blending and applying various curing agents to a solution containing polysiloxane and epoxy resin diluted with a solvent, followed by heating and curing. It can be carried out. As a specific example of the solution mainly composed of polysiloxane and epoxy resin, “YP-932” manufactured by Toshiba Silicone Co., Ltd.
7 ".

In the present invention, fine irregularities are formed on the surface of the blast resin layer 4 by sandblasting. That is, after forming the resin layer 4 made of the above-described cured epoxy resin or a polymer mainly composed of polysiloxane and epoxy resin (FIG. 3C), the surface is subjected to sandblasting (FIG. 3D). ). The size of the fine irregularities formed on the surface of the resin layer is adjusted by the size of the sand particles to be sprayed, the material of the sand particles, the blowing air pressure (blowing speed), and the blowing time. As the blast material, for example, "FUJI RANDOM A-60" manufactured by Fuji Seisakusho is preferably used.

The surface roughness of the blast resin layer 4 is 1 preferably, the JIS B 0601 measured center line average roughness 0.1~10μm with (R _a), in maximum height (R _max)
100 μm, 1 to 100 μm in ten-point average roughness (Rz),
Surface. More preferably, _Ra is 0.5
Very fine irregularities of ５5 μm, R _max of 5-50 μm, and R _z of 5-50 μm.

The thickness of the blast resin layer 4 is preferably 2 in the case of using the above-mentioned cured epoxy resin.
0 to 60 μm, more preferably 30 to 40 μm,
When a hard resin is used, such as the above-mentioned polymer mainly composed of polysiloxane and epoxy resin, it is preferable that
It is 0 to 50 μm, and more preferably 15 to 30 μm.

In the present invention, as shown in FIG. 1, the blast resin layer 4 may be the outermost surface of the heat-insulating mold. For example, when the blast resin layer 4 is formed by using the above-mentioned cured epoxy resin. As shown in FIG. 2, by providing a top coat layer 5 which is harder than the blast resin layer 4, it is possible to improve the scratch resistance on the surface side of the blast resin layer 4 which is to be a transfer surface to a molded product. (FIG. 3E).
The top coat layer 5 is coated so as to have a fine uneven surface reflecting the fine uneven surface of the blast resin layer 4.

The top coat layer 5 is formed of the blast resin layer 4 from the viewpoints of hardness, durability, and adhesiveness to the blast resin layer 4 when the blast resin layer 4 is made of a cured epoxy resin. The polymer mainly composed of polysiloxane and epoxy resin, which has been mentioned as a constituent material, is preferably used.

The thickness of the top coat layer 5 is 1 to 50
μm is preferable, and 2 to 20 μm is particularly suitable. If the top coat layer 5 is too thin, the effect of improving the abrasion resistance on the surface side of the blast resin layer 4 is poor, and if it is too thick, the cooling / heat resistance cycle tends to decrease.

The heat-insulating mold of the present invention is a heat-insulating mold used for molding a synthetic resin.
The present invention can be applied to any molding type heat-insulating mold such as blow molding.

The heat-insulating mold of the present invention can also be applied to the molding of a molded product having a grain-like surface such as leather grain or grain grain. In this case, at least one of the protrusions of the grain is a matte surface. If one of the convex and concave portions is a matte surface and the other is a glossy surface, the grain shape is more conspicuous,
The appearance is particularly preferable. Further, it is particularly preferable that the total area of the convex portions as the matte surface is larger than the total area of the concave portions as the glossy surface.

When a molded article having the above-mentioned grain-shaped surface is formed using the heat-insulating mold of the present invention, the grain-shaped surface may be formed on either the heat-insulating layer 3 or the blast resin layer 4. The method of forming the grain-like surface is, for example, a method in which a pattern layer having irregularities formed of an ultraviolet curable resin or the like is bonded to the resin layer 4 with a thin adhesive layer interposed therebetween, and a sandblasting process is performed to form the concave portion of the pattern layer, and Is obtained by grinding and removing the thin adhesive layer until the resin layer 4 is reached, and then peeling off the pattern layer having protrusions together with the thin adhesive layer thereunder.

The heat-insulating mold of the present invention can easily repair a damaged portion which has been difficult in the past. Hereinafter, the repair method will be described with reference to FIGS. 4 and 5, taking repair of the heat insulating mold of FIG. 2 as an example.

In FIG. 4A, reference numeral 6 denotes an opening formed in at least a part of the heat insulating layer 3, the blast resin layer 4, and the top coat layer 5. The opening 6 is formed directly by damage, such as a part where a part of the heat insulating layer 3, the blast resin layer 4, and the top coat layer 5 is peeled off or a cracked part. In some cases, it is formed by removing a damaged portion, such as when the heat insulating layer 3, the blast resin layer 4, and the top coat layer 5 that have been separated and lifted up are artificially removed. In the case of partial dropout or wide cracks, repairs may be performed immediately following the procedure described below.However, since damage often extends around the dropouts and cracks, artificial It is preferable to perform repair after widening the opening 6.

First, as shown in FIG. 4B, the repair material 7 is filled in the opening 6 and cured. In the present invention, as will be described later, the repair material 7 is eventually covered with the blast resin layer 4 ′ or the blast resin layer 4 ′ and the top coat layer 5 ′. And can be used as a repair material 7. As the repair material 7, as in the past, polyimide soluble in a polar solvent having a boiling point of less than 200 ° C., such as tetrahydrofuran, dimethylacetamide, and dimethylformamide, a polyimide formed from a precursor solution, and an aromatic ring in the main chain Non-crystalline heat-resistant polymer, reactive polyimide such as bismaleimide, epoxy resin, modified epoxy resin,
Epoxy-modified resins, silicone resins, modified silicone resins and the like can be used. In addition, viscosity at application, surface tension,
Additives for adjusting thixotropy and the like can also be added.

On the other hand, in the heat insulating mold of the present invention, the heat insulating layer 3 is made of thermosetting polyimide, and the blast resin layer 4
Is preferably composed of a cured epoxy resin or a polymer mainly composed of polysiloxane and epoxy resin. In the case of this preferable heat insulating mold, it is ideal if the same thermosetting polyimide as the heat insulating layer 3 can be used as the repair material 7. However, when the repair material 7 is a thermosetting polyimide, even if the precursor is filled in the opening 6 and cured by heating, it cannot be bonded to the thermosetting polyimide constituting the heat insulating layer 3. Difficult to perform durable repair.

The repairing material 7 used in the above-mentioned preferable heat-insulating mold includes a metal constituting the main mold 1, a thermosetting polyimide constituting the heat-insulating layer 3, an epoxy resin cured product or a poly-forming material constituting the blast resin layer 4. As long as a high adhesion can be obtained to a polymer mainly composed of a siloxane and an epoxy resin, a relatively soft material may be used as described above. 100
It is preferable that the temperature is not lower than ° C. The glass transition point is based on JIS K7121.

Since the repair material 7 satisfying the above-mentioned adhesiveness and glass transition point can be easily obtained, the repair material 7 for the preferable heat insulating mold is preferably an epoxy resin. The epoxy resin has heat resistance and hardness as compared with other materials, and, in addition to the metal forming the main mold 1, the thermosetting polyimide forming the heat insulating layer 3 and the epoxy forming the blast resin layer 4. It also has good adhesion to cured resin or a polymer mainly composed of polysiloxane and epoxy resin. In addition, since the epoxy resin has excellent adhesiveness to the primer layer 2 of the thermoplastic polyimide, it can be applied to a heat-insulating mold having the primer layer 2 without any problem.

As the epoxy resin suitable as the repair material 7, the epoxy resin cured product mentioned above as a constituent material of the blast resin layer 4 is preferably used. In particular, the blast resin layer 4 of the heat insulating mold of the present invention is preferably used. In the case of using the epoxy resin cured product, it is desirable to perform repair using the same epoxy resin cured product.

The repair material 7 may be filled and cured at least up to the height of the heat insulating layer 3, but it is preferable that the repair material 7 be filled and cured until it rises on the top coat layer 5 in order to facilitate the work. .

Next, as shown in FIG. 4 (c), all the top coat layer 5 and the blast resin layer 4 in the plane including the damaged portion are removed, and the top of the repair material 7 is made to be the peripheral portion. . This work is performed by cutting, polishing, and the like the repair material 7 and its surroundings.

The blast resin layer 4 and the top coat layer 5
After completion of the removal and leveling operation, as shown in FIG. 5D, a resin layer 4 ′ is again provided over the repair material 7 in the removal area of the blast resin layer 4 and the top coat layer 5, FIG.
As shown in (e), the surface is subjected to sandblasting to form fine irregularities. Further, as shown in FIG. 5 (f), the top coat layer 5 'is coated so that fine irregularities on the surface of the resin layer 4' are reflected on the surface of the top coat layer 5 '. The blast resin layer 4 ′ and the top coat layer 5 ′ are preferably made of the same material as the blast resin layer 4 and the top coat layer 5 provided from the beginning. It is desirable to perform the processing applied to the resin layer 4 under the same conditions to form similar fine irregularities.

According to the above repair method, the blast resin layer 4 and the top coat layer 5 in the plane including the damaged portion are all removed,
Since the repair material 7 is newly provided after the repair, even if the repair material 7 is soft to some extent, the trace of the repair material 7 is prevented from being transferred to the surface of the molded product at the time of molding, and the seam becomes less noticeable in the molded product. Further, since only the thin blast resin layer 4 and the top coat layer 5 are removed, the removal operation is easy. Further, in order to remove all the blast resin layer 4 in the plane including the damaged portion and newly attach the blast resin layer 4 ′,
Partial sandblasting of only the blast resin layer 4 ′ is facilitated, and a uniform fine uneven surface is obtained. At the same time, the boundary between the new blast resin layer 4 ′ and the other blast resin layer 4 on the other surface is Since the corners of the heat-insulating mold are provided, the boundaries are less noticeable than in the case where they are in the same plane, and the appearance of the molded product is significantly prevented from being deteriorated.

[0058]

As described above, the heat-insulating mold for matte molded articles of the present invention has a fine uneven surface by sandblasting, but can be easily repaired, and its life can be greatly extended. Further, since the blast resin layer 4 and the top coat layer 5 of the heat-insulating mold of the present invention can be easily attached by applying and forming a resin, no special operation is required and the production is easy.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the vicinity of a mold cavity side mold wall surface of a main mold in a heat-insulating mold for a matte molded product of the present invention.

FIG. 2 is a sectional view showing the vicinity of a mold cavity side mold wall surface of a main mold in a heat-insulating mold for a matte molded product of the present invention having a top coat layer.

FIG. 3 is a view showing a manufacturing process of the heat insulating mold of FIG. 2;

FIG. 4 is a view showing a repairing step of the heat insulating mold of the present invention.

FIG. 5 is a view showing a repairing step of the heat insulating mold of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Main mold 2 Primer layer 3 Heat insulation layer 4, 4 'Blast resin layer 5, 5' Top coat layer 6 Opening 7 Repair material

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Kazuharu Yasuda 1-3-1 Yoko, Kawasaki-ku, Kawasaki-shi, Kanagawa Prefecture F-term in Asahi Kasei Kogyo Co., Ltd. 4F202 AF15 AJ02 AJ03 AJ09 AJ13 CB01 CD22 CK11 CN27

Claims (7)

[Claims] 1. A mold cavity-side mold wall surface of a main mold made of metal is coated with a heat insulating layer, and the heat insulating layer is coated with a resin layer having a fine uneven surface by sandblasting. Heat insulation mold for matte molded products. 2. The heat-insulating mold according to claim 1, wherein the heat-insulating layer is made of polyimide, and the resin layer having a fine uneven surface is made of an epoxy resin cured product. 3. The heat-insulating mold according to claim 1, wherein the heat-insulating layer is made of polyimide, and the resin layer having a fine uneven surface is made of a polymer mainly composed of polysiloxane and epoxy resin. 4. A resin layer having a fine uneven surface is further covered with a top coat layer harder than the resin layer,
The heat-insulating mold according to claim 1, wherein the surface of the top coat layer has fine irregularities. 5. The luster according to claim 4, wherein the heat insulating layer is made of polyimide, the resin layer having a fine uneven surface is made of a cured epoxy resin, and the top coat layer is made of a polymer mainly composed of polysiloxane and epoxy resin. Thermal insulation mold for erased molded products. 6. A heat insulating layer is coated on the mold cavity side wall of the main die made of metal, and the heat insulating layer is coated with a resin layer, and then the surface of the resin layer is sandblasted to form fine irregularities. A method for producing a heat-insulating mold for a mat molded product, comprising: 7. On a resin layer having fine irregularities on its surface,
The method for producing a heat-insulating mold for a matte molded product according to claim 6, wherein a top coat layer harder than the resin layer is coated so that the fine irregularities are reflected on the surface of the top coat layer.