JP2001060616A - Substrate treating apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treating apparatus of a structure, where the advantage of the fact that a treatment gas feeding source is arranged on the upper side of a substrate treating chamber and a heating source is arranged on the lower side of the chamber is applied, treatment gas can reach smoothly on the surface of a substrate and a holder for holding the substrate and a rotating member for supporting the holder can be exchanged, without dismounting the chamber. SOLUTION: A substrate treating apparatus is constituted into a structure such that the substrate treating apparatus is provided with a substrate treating chamber 1, a mechanism for substrate carrying in and carrying out, a substrate heating source 4 and a raw material feeding source 2 for treatment and at the time of a treatment of a substrate 6, a raw material for treatment is fed to the substrate from the surface facing opposite the treating surface of the substrate 6 and when the substrate 6 and a holder 7 for mounting the substrate 6 are carried in the home positions in the chamber 1 for treating the substrate 6, the space in the chamber 1 is roughly sectioned into an upper surface, which is used as a reaction space, and a lower space for arranging the source 4 and the like, using the substrate 6 as a boundary between the upper and lower spaces. In this case, the treater is provided with a rotary drive source 9 for holding the holder 7 in the state being levitated at a home position by a magnetic force at the treatment of the substrate 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a single-wafer type substrate processing apparatus such as a single-wafer type CVD apparatus for forming a thin film on a substrate used in a semiconductor manufacturing process and a single-wafer type etcher apparatus for thinning a substrate surface. It is about.

[0002]

2. Description of the Related Art Conventionally, a substrate processing apparatus of this kind is for forming a fine electronic circuit on a substrate, and is used for processing in a space where there is little Na ion or K ion from a dust, a human body or the atmosphere. There is a need to. In order to obtain a space with a small amount of Na ions and K ions, the substrate processing apparatus is configured as shown in FIG.
It consists of chamber groups shown in 2 and 3.

FIG. 1 is a diagram showing a configuration example of a substrate processing apparatus for the most basic single-wafer processing. In this substrate processing apparatus, a substrate to be processed is carried into the load / unload chamber 102 with the gate valve 101 opened. When loading is completed, the gate valve 101 is closed, and the load / unload chamber 102 is evacuated. At that time, robot room 1
03 is a room that is always kept in a vacuum.
After the unload chamber 102 reaches a predetermined degree of vacuum, the gate valve 104 between the load / unload chamber 102 and the robot chamber 103 is opened, and the load / unload operation is performed by the hand of the robot arranged in the robot chamber 103. The substrate in the load chamber 102 is taken out and moved to the robot chamber 103.

Thereafter, a gate valve 104 between the robot chamber 103 and the load / unload chamber 102 is closed. Next, the gate valve 106 between the processing chamber 105 and the robot chamber 103 is opened, and the hand of the robot is extended to carry the substrate into the processing chamber 105. Processing room 105
A heater (e.g., a lamp heater 108) as a reaction energy source is disposed below the substrate 107 carried in between the transparent quartz plate 109. Of course, the substrate 107 may be directly placed on the resistance heater. Above,
A processing gas supply source 112 that supplies a raw material for processing and a carrier gas G is arranged. Further, a pressure control exhaust system 110 for controlling the pressure in the processing chamber 105 is provided. Note that reference numeral 111 denotes a power supply unit for supplying power to the lamp heater 108.

FIG. 2 is a diagram showing an example of the configuration of a further advanced substrate processing apparatus. This is an example in which a processing chamber 105 is conceived to make the flow of the raw material and the carrier gas G from the processing gas supply source 112 smooth. When the substrate 107 comes to the processing position, a processing space is formed by the processing gas supply source 112 in the center of the smoothly rounded chamber wall.
In FIG. 2, reference numeral 113 denotes a bellows, and 114 denotes an elevating shaft. The elevating shaft 114 is moved up and down by an elevating mechanism (not shown) so that the lamp heater 108 and the transparent quartz plate 109 attached to the upper end of the elevating shaft 114 are moved. Move up and down. In addition, members that are obstructive to gas flow design and temperature control of the chamber wall, such as a gate valve, are separated.

FIG. 3 shows that the substrate 107 is mounted on the holder 1.
In this example, the inner space of the processing chamber 105 is roughly separated into a processing space (space A) and a space (space B) including a heating source and a transport mechanism when the processing chamber 105 comes to a processing position. Therefore, in the space A, it is easy to design a gas flow giving priority to the process. In the space B, since the transparent quartz plate 109 does not need to be fogged because it can be isolated from the processing gas, the lamp heater 1
08 for stable heating. Furthermore, even if there is a complicated mechanism, the surface of the mechanism does not come into contact with the processing gas, so that the particle generation area is reduced.

In the above example of the substrate processing apparatus, the processing gas supply source 112 is arranged on the upper side of the substrate 107, and the heating source of the lamp heater 108 is arranged on the lower side. The features will be described with reference to FIGS. FIG. 4 shows that the processing gas supply source 112 is on the upper side and the heating source 11 is on.
Reference numeral 7 denotes a configuration example arranged on the lower side. The advantage of this substrate processing apparatus is that only the substrate 107 needs to be placed in the gravitational action space, and no special fixing jig is required to fix the substrate 107. The disadvantage is that thermal convection 118 is generated and the processing gas (reaction precursor) 11 from the processing gas supply source 112 is generated.
9 is difficult to reach the surface of the substrate 107 smoothly.

FIG. 5 shows a configuration example in which the arrangement is reversed from that of FIG. 4 and the processing gas supply source 112 is arranged on the lower side and the heating source 117 is arranged on the upper side. An advantage of this substrate processing apparatus is that since the processing surface of the substrate 107 faces downward, there is no concern that the processing surface of the substrate 107 is contaminated by the gravitational drop of particles. The disadvantages are the mechanism for turning the substrate 107 upside down and the substrate 1
07 is required. In particular, since the substrate fixing jig 120 is located on the processing side,
Poor in terms of process performance.

As a countermeasure, there is an arrangement in which the processing chamber is configured as shown in FIG. Here, the processing gas supply source 112 is arranged above the substrate 107 and the heating source 117
Is disposed on the lower side, and the substrate 107 is simply placed on the holder 115. The above problem caused by the heat convection can be solved by rotating the substrate 107. That is, by rotating the substrate 107, the processing gas supply source 112
Is generated, and the processing gas flow 125 is superior to the heat convection, so that the processing gas can be smoothly supplied to the surface of the substrate 107 and can be smoothly discharged in the left-right direction.

In FIG. 6, reference numeral 115 denotes a substrate 107
And the holder 115 is mounted on the upper surface of the turntable 121. The rotating table 121 has bearings 122, 12 on the stationary side 126.
2, a rotary drive source 123 is disposed on the stationary side 126, a rotary target 124 is disposed on the outer peripheral surface of the rotary table 121, and a rotary magnetic force is transmitted from the rotary drive source 123 to the rotary target 124. Then, the turntable 121 rotates.

When the substrate processing chamber is configured as shown in FIG. 6, the above-described advantages are obtained. On the other hand, in order to replace the rotary table 121 which is a rotary member on which the holder 115 is mounted,
Work to stop and disassemble the device is required. Therefore, a long life is required for the rotary table, and cleaning for removing the deposits is required.

As a device for rotating the substrate, there is a device disclosed in Japanese Patent Application Laid-Open No. 5-152207 and a device disclosed in Japanese Patent Application Laid-Open No. 7-58036, both of which are shown in FIG. There are similar disadvantages.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and takes advantage of the advantage that the processing gas supply source is disposed on the upper side and the heating source is disposed on the lower side. This eliminates the problem that the processing gas does not reach the substrate surface smoothly, and disassembles the substrate processing chamber so that the processing gas can reach the substrate surface smoothly, and the holder that holds the substrate and the rotating member that supports the holder are removed. It is an object of the present invention to provide a substrate processing apparatus that can be replaced without performing the replacement.

[0014]

According to a first aspect of the present invention, there is provided a substrate processing chamber, a substrate loading / unloading mechanism, a substrate heating source, a holder for holding a substrate, and a processing raw material supply source. The substrate processing apparatus includes a magnetic force source for floatingly holding the holder at a fixed position by a magnetic force when processing the substrate.

According to a second aspect of the present invention, there is provided a substrate processing chamber, a substrate loading / unloading mechanism, a substrate heating source, and a processing raw material supply source. When the raw material for processing is supplied, and the substrate and the holder for mounting the substrate are carried into a fixed position in the processing chamber for processing the substrate, the space in the processing chamber becomes a reaction space with the substrate as a boundary and the heating source. And the like, in which a magnetic force source for holding and floating a holder at a fixed position by a magnetic force when processing a substrate is provided.

As described above, in a special atmosphere such as a substrate processing chamber (in a vacuum, a reaction space in which a processing gas is present), the substrate is subjected to a floating treatment with a magnetic force source during the processing of the substrate. In addition, since the holder can be held and released by the presence or absence of the magnetism from the magnetic force source, the holder can be easily held and released, and can be easily carried into and out of the substrate processing chamber. Therefore, replacement of the holder, cleaning for removing deposits and the like are facilitated.

The invention described in claim 3 is the same as the invention in claim 2
Wherein the holder is configured to be rotated by a magnetic force source.

As described above, the holder is levitated by the magnetic force source and rotated, whereby the flow of the processing gas descending toward the substrate is changed into an air flow (thermal convection) which rises by heating due to the pumping effect of the rotation. As a result, the processing gas reaches the substrate surface smoothly.

The invention described in claim 4 is the same as the invention described in claim 2.
Or in the substrate processing apparatus according to 3, the holder is supported by a magnetic levitation body formed in an annular shape, the magnetic levitation body only when the holder is held at a fixed position during processing of the substrate,
It is characterized by being magnetically coupled to a magnetic force source.

As described above, the magnetic levitation body supporting the holder is magnetically coupled to the magnetic force source only when it is held at a fixed position during processing of the substrate. Being able to move inside or outside the substrate processing chamber facilitates loading and unloading of substrates and replacement and cleaning of holders and floating bodies.

The invention described in claim 5 is the same as the invention in claim 4.
Wherein the magnetic force source includes a magnetic bearing and a rotary drive source, and the magnetic levitation body is levitated and supported by the magnetic bearing, and is configured to rotate with a magnetic force from the rotary drive source. It is characterized by having.

As described above, the levitation support of the magnetic levitation body is performed by the magnetic bearing, and the rotation is performed by the rotation drive source. Therefore, the levitation support control and the rotation control of the magnetic levitation body having a large diameter and a high peripheral speed are stably performed. be able to.

[0023]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 7 is a diagram illustrating a configuration example of a substrate processing apparatus according to the present invention, and FIG. 8 is a diagram illustrating a planar arrangement configuration example of the substrate processing apparatus. In FIG. 7, reference numeral 1 denotes a substrate processing chamber, and a processing gas supply unit 2 for supplying a raw material and other gases G is disposed in an upper part of the substrate processing chamber 1, and a processing gas supply unit 2 is attached to an upper end of a lifting shaft 3 in a lower part. Lamp heater 4 is disposed. The lamp heater 4 is moved up and down by raising and lowering the lifting shaft 3 by a lifting mechanism (not shown). A transparent quartz plate 5 is provided above the lamp heater 4.
Is arranged. On the upper surface of the transparent quartz plate 5, a plurality of pins 5a for supporting the substrate 6 when the substrate 6 is carried in and out are provided.

Reference numeral 7 denotes a holder on which a substrate is placed. A rotating member (corresponding to a rotor) 8 formed in an annular shape is attached to the outer peripheral portion of the lower surface of the holder 7. 10 is a substrate processing chamber 1
Fixed body 10 arranged on the outer periphery of the fixed body 10
Is provided with a rotary drive source 9 (corresponding to a stator). The holder 7 and the substrate 6 are positioned at predetermined positions (the fixed body 10 in the figure) by the magnetic coupling between the rotary drive source 9 and the target 8a of the rotary member 8 by the static magnetic force generated by the rotary drive source 9.
(The position where the upper surface of the substrate 6 and the processing surface of the substrate 6 coincide with each other). Further, the rotating member 8 can be rotated by the rotating magnetism generated by the rotating drive source 9.

Reference numeral 11 denotes a holder elevating mechanism for raising and lowering the holder 7. The holder elevating mechanism 11 is provided in a plurality, although not shown in the figure, so as to support the rotating member 8 at a plurality of points so that the rotating member 8 can be raised and lowered synchronously. Has become. Reference numeral 12 denotes a bellows, which is arranged on the outer peripheral portion of the elevating shaft 3, expands and contracts following the elevating shaft 3, and positions the elevating shaft 3 outside the substrate processing chamber 1. Further, an exhaust system 13 is connected to the substrate processing chamber 1. Reference numeral 14 denotes a load / unload chamber, 15 denotes a robot chamber, and 16, 17, and 18 denote gate valves.

When the substrate 6 is carried into the substrate processing chamber 1,
The elevating shaft 3 is lowered to lower the upper surface of the transparent quartz plate 5 to a level L or lower in the figure. Subsequently, the holder 7 is lowered by the holder raising / lowering mechanism 11, and its upper surface (substrate receiving surface) is lowered to the level L position for receiving the substrate 6 carried in by the robot. At this time, the pins 5a provided on the upper surface of the transparent quartz plate 5
Is located a predetermined amount above the level L. The substrate to be processed is carried into the load / unload chamber 14 by opening the gate valve 16. When the loading is completed, the gate valve 16
Is closed, and the load / unload chamber 14 is evacuated. At this time, the robot room 15 is a room that is always kept in a vacuum.

After the load / unload chamber 14 reaches a predetermined degree of vacuum, the gate valve 17 between the load / unload chamber 14 and the robot chamber 15 is opened, and the robot disposed in the robot chamber 15 is opened. The substrate 6 in the loading / unloading chamber 14 is taken out by hand and moved to the robot chamber 15. Thereafter, the gate valve 17 between the robot chamber 15 and the load / unload chamber 14 is closed.

Next, the gate valve 18 between the substrate processing chamber 1 and the robot chamber 15 is opened, the hand of the robot is extended, and the substrate 6 is loaded into the substrate processing chamber 1 and provided on the upper surface of the transparent quartz plate 5. Place on the pin 5a. The robot hand returns to the robot room 15 and the gate valve 18 closes. When the holder 7 is raised by the holder raising mechanism 11 in this state, the substrate 6 is placed on the holder 7, and the substrate 6 is further raised together with the holder 7 to a position shown in the figure. Here, the rotary member 8 formed in an annular shape is held by the static magnetic force of the rotary drive source 9. When held, the holder elevating mechanism 11 is lowered by a predetermined amount, and is separated from the rotating member 8. Further, the lamp heater 4 is raised to the position shown in the figure, and the lamp is turned on to heat the substrate 6.

The substrate 6 is rotated together with the holder 7 by generating a rotating magnetic force by the rotating drive source 9 and rotating the rotating member 8. In this state, a raw material and other gases G are supplied from the processing gas supply unit 2. Heated substrate 6 and holder 7
Convection rising from the substrate 6 and the holder 7
Are rotated, the processing gas supply unit 2 sends the substrate 6
The flow of the raw material and the other processing gas G descending toward the surface prevails, and the processing gas can be smoothly supplied to the surface of the substrate 6.
Exhaust is smoothly exhausted by the exhaust systems 13 from the left and right directions.

When a predetermined number of substrates 6 are processed in the substrate processing chamber 1, the holder 7 on which the reactant of the processing gas G is deposited is replaced. This holder replacement operation will be described with reference to FIG. A clean gas (inert gas) is supplied from a clean gas supply source (not shown) to the substrate processing chamber 1 and the robot chamber 15 in a vacuum state.
And the robot chamber 15 are filled with clean gas of the same pressure.
Then, the gate valve 18 is opened, the holder 7 in the substrate processing chamber 1 is picked up by a robot hand provided in the robot chamber 15 and transferred from the substrate processing chamber 1 to the robot chamber 15, and then the gate valve 18 is closed. Here, the holder 7 is in a state of being mounted without being fixed to the rotating member 8.

Thereafter, clean gas (inert gas) from the clean gas supply source is supplied to the robot chamber 15 and the jig receiving chamber 2.
5 and both chambers are filled with this clean gas. Then, the gate valve 26 is opened, the holder 7 is moved from the robot chamber 15 to the jig receiving chamber 25 by the hand of the robot provided in the robot chamber 15, and a new holder 7 is removed from the jig receiving chamber 25 by the robot. After the transfer to the chamber 15, the gate valve 26 is closed.

Next, a clean gas (inert gas) is supplied from the clean gas supply source to the robot chamber 15 and the substrate processing chamber 1 so as to have the same pressure. Thereafter, the gate valve 18 is opened, and the new holder 7 is placed in the holder. It is supported by the elevating mechanism 11 and is placed at a predetermined position of the rotating member 8 at a predetermined position. The processing of the substrate 6 carried into the substrate processing chamber 1 is performed after the interior of the substrate processing chamber 1 is evacuated to a predetermined vacuum level by the exhaust systems 13, 13. On the other hand, the holder 7 in the jig receiving chamber 25
Is taken out of the jig receiving chamber 25 through the gate valve 17 and washed for reuse.

The rotating member 8 can also be carried in and out by a separately provided carrying-in / out mechanism (not shown), so that the rotating member 8 carried out of the substrate processing chamber 1 can be washed. Also,
As described above, the rotating member 8 is formed in an annular shape, and the center of the rotating member 8 is supported on the holder 7, so that the center of the rotating member 8 and the holder 7 becomes hollow, and the rotating member 8 below the substrate 6 is heated. The lamp heater 4 serving as a source can be arranged in parallel with the lower surface of the substrate, and the pins 5a for placing the substrate 6 on the transparent quartz plate 5 at the time of transporting the substrate can be arranged.

FIG. 9 is a view showing another configuration example of the holding and rotating mechanism for holding and rotating the holder 7 of the substrate processing apparatus according to the present invention. The holding and rotating mechanism is a magnetic levitation body 1 made of a magnetic material.
9 (corresponding to the rotating member 8 in FIG. 7), and the holder 7 is incorporated above the magnetic levitation body 19. The magnetic levitation body 19 is cylindrical and has a flange portion 19 extending horizontally outward at the lower end.
a is formed. Radial magnetic bearings 21, 2 are positioned vertically at positions facing the outer periphery of the magnetic levitation body 19 of the fixed body 10.
2 are arranged, and the rotary drive source 9 is arranged between them. An axial magnetic bearing 20 is disposed at a position facing the upper surface of the flange portion 19a.

The radial magnetic bearings 21 and 22 are composed of electromagnets 21a and 22a and displacement sensors 21b and 22b, respectively, and the axial magnetic bearing 20 is composed of an electromagnet 20a and displacement sensor 20b. Also, the radial magnetic bearing 21
21a, displacement sensor 21b, rotary drive source 9, electromagnet 22a of radial magnetic bearing 22, displacement sensor 22b
The surfaces of the electromagnet 20a and the displacement sensor 20b of the axial magnetic bearing 20 are covered with a can 23 made of a non-magnetic material. Thereby, the electromagnets 21a, 22a, 20
a, displacement sensors 21b, 22b, 20b, rotation drive source 9
The surface does not come into contact with the processing gas and does not corrode. The surface of the fixed body 10 exposed inside the substrate processing chamber 1 is covered with a quartz cover 24.

In the holding and rotating mechanism having the above structure, the assembly of the magnetic levitation body 19 and the holder 7 can be moved up and down by a holder elevating mechanism (not shown) as in the case of FIG. When the assembly of the magnetic levitation body 19 and the holder 7 is raised to the position shown in FIG. 9 by the holder elevating mechanism, the radial magnetic bearings 21 and 22 and the axial magnetic bearing 20
Operates to levitate and support the magnetic levitation body 19 at the position shown.

In a normal axial magnetic bearing, electromagnets are arranged above and below a flange portion 19a of a magnetic levitation body 19. In this axial magnetic bearing 20, an electromagnet 20a is arranged only on the upper side. The holder 7 and the magnetic levitation body 19 are levitation supported by the balance of gravity. Thus, the electromagnets 21a, 2a of the radial magnetic bearings 21, 22
2a, when the magnetic force of the rotary drive source 9 and the electromagnet 20a of the axial magnetic bearing 20 is lost, the assembly of the holder 7 and the magnetic levitation body 19 can be lowered by the holder lifting mechanism.

The distance between the fixed body 10 and the magnetic levitation body 19 is detected by the displacement sensors 21b and 22b of the radial magnetic bearings 21 and 22 and the displacement sensor 20b of the axial magnetic bearing 20, and the outputs of the magnets 21a, 22a and 20a are detected. This is similar to a normal magnetic bearing in that the exciting current is controlled and the assembly of the holder 7 and the magnetic levitation body 19 is levitated and supported at a predetermined position. The magnetic levitation body 19 is supported by a magnetic bearing, and the holder 7 rotates together with the substrate by rotating the magnetic levitation body 19 with the rotational magnetic force generated from the rotary drive source 9. Loading and unloading of the substrate are the same as in the substrate processing apparatus of FIG.

The degree of heat convection generated by heating by the lamp heater 4 as a heating source varies depending on process parameters such as temperature, molecular weight, and pressure. In addition, the uniformity and the processing speed of the processing surface of the substrate 6 are different due to the pumping effect by rotating the substrate 6 and the holder 7. Further, the processing speed varies depending on the type of the reaction precursor. Accordingly, the number of rotations at which the above-described effect can be obtained by rotating the substrate 6 and the holder 7 is different, but in the semiconductor manufacturing, the substrate 6
Is proportional to the processing gas flow rate.
In consideration of the fact that the pumping effect due to the rotation of the holder 7 and the size of the substrate 6 are also in a proportional relationship, the countermeasures against ascending airflow (thermal convection) generated on the upper surface of the substrate 6 are approximately 50 to 1
The substrate 6 may be rotated at 50 rpm.

In FIG. 9, a lamp heater (not shown) is disposed as a heating source in the hollow portion of the magnetic levitation body 19, so that its diameter increases, and when it is rotated, the peripheral speed of the outer peripheral portion increases. Supporting the magnetic levitation body 19 with magnetic bearings (radial magnetic bearings 21, 22 and axial magnetic bearings 20) is advantageous from the viewpoint of preventing generation of particles.

[0041]

As described above, according to the invention described in each claim, the following excellent effects can be obtained.

According to the first and second aspects of the present invention, the substrate is floated by a magnetic force source during the substrate processing in a special atmosphere (a vacuum, a reaction space in which a processing gas is present) such as a substrate processing chamber. By doing so, it is possible to hold and release the holder with and without the problem of particle generation and the presence or absence of magnetism from the magnetic force source, making it easier to hold and release the holder and carrying it into and out of the substrate processing chamber. Also becomes easier. Therefore, replacement of the holder, cleaning for removing deposits and the like are facilitated.

According to the third aspect of the present invention, the holder is floated by the magnetic force source and rotated, whereby
Due to the pumping effect by this rotation, the flow of the processing gas descending toward the substrate overcomes the airflow (thermal convection) rising by heating, the processing gas reaches the substrate surface smoothly, and efficient substrate processing is achieved. realizable.

According to the fourth aspect of the present invention, the magnetic levitation body supporting the holder is magnetically coupled to the magnetic force source only when the magnetic levitation body is held at a fixed position during processing of the substrate.
Since the substrate can be moved freely into or out of the substrate processing chamber except during processing, loading and unloading of the substrate, and replacement and cleaning of the holder and the floating body are facilitated.

According to the fifth aspect of the present invention, the levitation support of the magnetic levitation body is performed by a magnetic bearing, and rotation is performed by a rotary drive source. Therefore, the levitation support of the magnetic levitation body having a large diameter and a high peripheral speed is provided. Control and rotation control can be performed stably.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration example of a conventional substrate processing apparatus.

FIG. 2 is a diagram illustrating a configuration example of a conventional substrate processing apparatus.

FIG. 3 is a diagram illustrating a configuration example of a conventional substrate processing apparatus.

FIG. 4 is a diagram for explaining an operation of a substrate processing chamber in which a processing gas supply source is disposed on an upper side and a heating source is disposed on a lower side.

FIG. 5 is a diagram for explaining an operation of a substrate processing chamber in which a processing gas supply source is arranged on a lower side and a heating source is arranged on an upper side.

FIG. 6 is a diagram illustrating a configuration example of a conventional substrate processing apparatus.

FIG. 7 is a diagram showing a configuration example of a substrate processing apparatus according to the present invention.

8 is a diagram showing an example of a planar arrangement configuration of the substrate processing apparatus shown in FIG.

FIG. 9 is a diagram illustrating a configuration example of a holding and rotating mechanism that holds and rotates a holder of the substrate processing apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate processing chamber 2 Processing gas supply part 3 Elevating shaft 4 Lamp heater 5 Transparent quartz plate 6 Substrate 7 Holder 8 Rotating member 9 Rotary drive source 10 Fixed body 11 Holder elevating mechanism 12 Bellows 13 Exhaust system 14 Load / unload chamber 15 Robot Chamber 16 Gate valve 17 Gate valve 18 Gate valve 19 Magnetic levitation body 20 Axial magnetic bearing 21 Radial magnetic bearing 22 Radial magnetic bearing 23 Can 24 Quartz cover 25 Jig receiving chamber 26 Gate valve 27 Gate valve

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI theme coat ゛ (Reference) C23C 16/458 H01L 21/302 B

Claims (5)

[Claims] 1. A substrate processing apparatus comprising: a substrate processing chamber; a substrate loading / unloading mechanism; a substrate heating source; a holder for holding the substrate; and a processing source supply source. A substrate processing apparatus comprising a magnetic force source for levitating and holding at a fixed position. 2. A substrate processing chamber, a substrate loading / unloading mechanism, a substrate heating source, and a processing source supply source, wherein during processing of the substrate, the processing source is supplied from a surface facing the processing surface of the substrate;
When the substrate and the holder for mounting the substrate are carried into a fixed position in the processing chamber for processing the substrate, a space inside the processing chamber becomes a reaction space with the substrate as a boundary, and a heating source and the like are arranged. A substrate processing apparatus having a configuration roughly divided into a lower space and a magnetic force source for floatingly holding the holder at a fixed position by a magnetic force when processing the substrate. . 3. The substrate processing apparatus according to claim 2, wherein the holder is configured to rotate by the magnetic force source. 4. The substrate processing apparatus according to claim 2, wherein the holder is supported by a magnetic levitation body formed in an annular shape, and the magnetic levitation body is in a fixed position when the holder processes a substrate. A substrate processing apparatus that is magnetically coupled to the magnetic force source only when the substrate is held. 5. The substrate processing apparatus according to claim 4, wherein the magnetic force source includes a magnetic bearing and a rotary drive source, and the magnetic levitation body is levitated and supported by the magnetic bearing, and a rotary drive source. A substrate processing apparatus characterized in that it is configured to rotate with a magnetic force from the substrate.